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品牌是'Microsemi' (5267)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 输出的数量 | 资历状况 | 电源 | 内存大小 | 内存大小 | 传播延迟 | 接通延迟时间 | 电流源 | 输入数量 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | LABs数量/ CLBs数量 | 筛选水平 | 逻辑块数(LABs) | 速度等级 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 电压 - 供电 （最大值） | 电压 - 供电 （最小值） | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | M1A3P1000L-FG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 177 | -40°C~100°C TJ | Tray | 2013 | ProASIC3L | 活跃 | 3 (168 Hours) | 256 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 225 | 1mm | 30 | M1A3P1000L | 177 | 1.5/3.3V | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 781.25MHz | 24576 | 1.2mm | 17mm | 17mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||
 | AX250-FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 22 Weeks | IN PRODUCTION (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 248 | 0°C~70°C TA | Tray | 2005 | Axcelerator | e1 | 活跃 | 3 (168 Hours) | 484 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.5V | BOTTOM | BALL | 250 | 1mm | 649MHz | 40 | AX250 | 248 | 1.51.5/3.32.5/3.3V | 6.8kB | 6.8kB | 990 ps | 990 ps | 现场可编程门阵列 | 55296 | 250000 | 4224 | 2816 | 0.99 ns | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||
 | AGLE3000V5-FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 22 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 341 | -40°C~85°C TA | Tray | 2012 | IGLOOe | e0 | 活跃 | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.5V | BOTTOM | BALL | 230 | 1mm | 30 | AGLE3000 | 341 | 63kB | 现场可编程门阵列 | 75264 | 516096 | 3000000 | 892.86MHz | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||
 | A42MX36-2BG272 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 272-BBGA | 272 | 272-PBGA (27x27) | 202 | 0°C~70°C TA | Tray | MX | 活跃 | 3 (168 Hours) | 70°C | 0°C | 5V | A42MX36 | 320B | 1184 | 2560 | 54000 | 164MHz | 1184 | 2 | 1822 | 5.25V | 3V | 1.73mm | 27mm | 27mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||
 | A3PE3000L-FG324I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 9 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 324-BGA | 324 | 400.011771mg | 221 | -40°C~100°C TJ | Tray | 2017 | ProASIC3L | e0 | 活跃 | 3 (168 Hours) | 324 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | 1.14V~1.575V | BOTTOM | BALL | 225 | 1mm | 30 | A3PE3000L | 221 | 1.2/1.51.2/3.3V | 63kB | 现场可编程门阵列 | 516096 | 3000000 | 781.25MHz | 75264 | 1.25mm | 19mm | 19mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||
| AX250-FG256M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 22 Weeks | IN PRODUCTION (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 138 | Military grade | -55°C~125°C TA | Tray | 2005 | Axcelerator | 活跃 | 3 (168 Hours) | 256 | 3A001.A.2.C | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | 1.5V | BOTTOM | BALL | 225 | 1mm | 30 | AX250 | 248 | 1.51.5/3.32.5/3.3V | 6.8kB | 990 ps | 现场可编程门阵列 | 2816 | 55296 | 250000 | 649MHz | 4224 | MIL-STD-883 Class B | 0.99 ns | 1.2mm | 17mm | 17mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||
 | A42MX24-TQG176I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 14 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 176-LQFP | 176 | 150 | -40°C~85°C TA | Tray | MX | e3 | 活跃 | 3 (168 Hours) | 176 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | 5V | QUAD | 鸥翼 | 260 | 0.5mm | 40 | A42MX24 | 现场可编程门阵列 | 36000 | 250MHz | 912 | 1410 | 2.5 ns | 1890 | 1.4mm | 24mm | 24mm | 无 | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||
| AFS1500-FGG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 400.011771mg | 119 | 0°C~85°C TJ | Tray | 2009 | Fusion® | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | 1.0989GHz | AFS1500 | 33.8kB | 276480 | 1500000 | 1.0989GHz | 38400 | 1.575V | 1.425V | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||
 | M2GL150T-1FC1152I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 1152-BBGA, FCBGA | YES | 1152 | 574 | -40°C~100°C TJ | Tray | 2013 | IGLOO2 | 活跃 | 4 (72 Hours) | 1.2V | BOTTOM | BALL | 240 | 20 | M2GL150T | 574 | 不合格 | 625kB | 现场可编程门阵列 | 146124 | 5120000 | 1 | 2.9mm | 35mm | 35mm | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||||||||
 | AX2000-1FG896 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 896-BGA | 896 | 400.011771mg | 586 | 0°C~70°C TA | Tray | 2005 | Axcelerator | e0 | 活跃 | 3 (168 Hours) | 896 | 锡铅 | 1.5V | BOTTOM | BALL | 225 | 763MHz | 30 | AX2000 | 684 | 36kB | 850 ps | 850 ps | 现场可编程门阵列 | 294912 | 2000000 | 32256 | 1 | 21504 | 0.84 ns | 1.73mm | 31mm | 31mm | 无 | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||
 | AGL1000V5-FGG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 144-LBGA | YES | 144 | 400.011771mg | 97 | -40°C~85°C TA | Tray | 2008 | IGLOO | e1 | 活跃 | 3 (168 Hours) | 144 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.5V | BOTTOM | BALL | 260 | 1mm | 40 | AGL1000 | 不合格 | 18kB | 现场可编程门阵列 | 24576 | 147456 | 1000000 | 892.86MHz | 1.05mm | 13mm | 13mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||
 | AGL1000V2-CSG281 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 22 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 281-TFBGA, CSBGA | 281 | 281-CSP (10x10) | 215 | 0°C~70°C TA | Tray | 2009 | IGLOO | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | AGL1000 | 18kB | 44μA | 24576 | 147456 | 1000000 | 250MHz | 1.575V | 1.14V | 710μm | 10mm | 10mm | 无 | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||||||
| M1AGL1000V2-FGG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 97 | -40°C~85°C TA | Tray | IGLOO | e1 | 活跃 | 3 (168 Hours) | 144 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 260 | 1mm | 40 | M1AGL1000 | 不合格 | 18kB | 127μA | 现场可编程门阵列 | 24576 | 147456 | 1000000 | 250MHz | 1.55mm | 13mm | 13mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||
| AGL1000V5-FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 400.011771mg | 300 | 0°C~70°C TA | Tray | 2009 | IGLOO | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | AGL1000 | 18kB | 24576 | 147456 | 1000000 | 892.86MHz | 1.575V | 1.425V | 1.73mm | 23mm | 23mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||||
| M2GL010-VF400I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 400-LFBGA | YES | 195 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 400 | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 240 | 0.8mm | 20 | S-PBGA-B400 | 195 | 不合格 | 1.2V | 195 | 现场可编程门阵列 | 12084 | 933888 | 1.51mm | 17mm | 17mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||
| M2GL010TS-VFG400 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 400-LFBGA | YES | 195 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 400 | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 260 | 0.8mm | 30 | S-PBGA-B400 | 195 | 不合格 | 1.2V | 195 | 现场可编程门阵列 | 12084 | 933888 | 1.51mm | 17mm | 17mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||
| AGLP060V2-VQG176I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 176-TQFP | 176 | 176-VQFP (20x20) | 137 | -40°C~100°C TJ | Tray | 2015 | IGLOO PLUS | 活跃 | 3 (168 Hours) | 85°C | -40°C | 1.5V | AGLP060 | 2.3kB | 20μA | 1584 | 18432 | 60000 | 892.86MHz | 512 | 1584 | 1.575V | 1.14V | 20mm | 20mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||
| M2GL010-FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BGA | YES | 233 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 484 | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 240 | 1mm | 20 | S-PBGA-B484 | 233 | 不合格 | 1.2V | 233 | 现场可编程门阵列 | 12084 | 933888 | 2.44mm | 23mm | 23mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||
| A3P400-2FG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 178 | -40°C~100°C TJ | Tray | ProASIC3 | 活跃 | 3 (168 Hours) | 256 | TIN LEAD/TIN LEAD SILVER | 1.5V | BOTTOM | BALL | 225 | 1mm | 310MHz | 30 | A3P400 | 6.8kB | 现场可编程门阵列 | 55296 | 400000 | 2 | 9216 | 1.2mm | 17mm | 17mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
| M2GL010TS-1FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BGA | YES | 233 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 484 | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 260 | 1mm | 30 | S-PBGA-B484 | 233 | 不合格 | 1.2V | 233 | 现场可编程门阵列 | 12084 | 933888 | 2.44mm | 23mm | 23mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||
| M2GL025T-1FCS325 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 325-TFBGA | YES | 180 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 325 | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 240 | 20 | S-PBGA-B325 | 180 | 不合格 | 1.2V | 180 | 现场可编程门阵列 | 27696 | 1130496 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||
| A3P600-1FG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 400.011771mg | 235 | 0°C~85°C TJ | Tray | 2009 | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | A3P600 | 13.5kB | 110592 | 600000 | 272MHz | 1 | 13824 | 1.575V | 1.425V | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||
| A3P600-2FG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 2 days ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 177 | -40°C~100°C TJ | Tray | 2009 | ProASIC3 | e0 | 活跃 | 3 (168 Hours) | 256 | TIN LEAD/TIN LEAD SILVER | 1.5V | BOTTOM | BALL | 225 | 1mm | 30 | A3P600 | 13.5kB | 现场可编程门阵列 | 110592 | 600000 | 310MHz | 2 | 13824 | 1.2mm | 17mm | 17mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||
| A3PE600-FG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 22 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 400.011771mg | 165 | 0°C~85°C TJ | Tray | 2009 | ProASIC3E | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | A3PE600 | 13.5kB | 110592 | 600000 | 231MHz | 13824 | 1.575V | 1.425V | 1.2mm | 17mm | 17mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||
 | M1AGL250V5-VQG100 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 100-VQFP (14x14) | 68 | 0°C~70°C TA | Tray | 2013 | IGLOO | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | M1AGL250 | 4.5kB | 6144 | 36864 | 250000 | 1.575V | 1.425V | 1mm | 14mm | 14mm | 符合RoHS标准 |
-
M1A3P1000L-FG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX250-FGG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGLE3000V5-FG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A42MX36-2BG272
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3PE3000L-FG324I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX250-FG256M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A42MX24-TQG176I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AFS1500-FGG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL150T-1FC1152I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX2000-1FG896
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGL1000V5-FGG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGL1000V2-CSG281
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1AGL1000V2-FGG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGL1000V5-FGG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL010-VF400I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL010TS-VFG400
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGLP060V2-VQG176I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL010-FG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P400-2FG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL010TS-1FGG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL025T-1FCS325
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P600-1FG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P600-2FG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3PE600-FG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1AGL250V5-VQG100
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)