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品牌是'Microsemi' (5267)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 最大电源电压 | 最小电源电压 | 工作电源电流 | 内存大小 | 时钟频率 | 传播延迟 | 接通延迟时间 | 输入数量 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | LABs数量/ CLBs数量 | 筛选水平 | 逻辑块数(LABs) | 速度等级 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | 等效门数 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | AFS090-QNG108 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 108-WFQFN | 108-QFN (8x8) | 37 | 0°C~85°C TJ | Tray | 2013 | Fusion® | Obsolete | 3 (168 Hours) | 1.425V~1.575V | AFS090 | 27648 | 90000 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A3P060-2QNG132 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 132-WFQFN | 132-QFN (8x8) | 80 | 0°C~85°C TJ | Tray | 2013 | ProASIC3 | Obsolete | 3 (168 Hours) | 1.425V~1.575V | A3P060 | 18432 | 60000 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A3P125-1QNG132I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 132-WFQFN | YES | 84 | -40°C~100°C TJ | Tray | 2013 | ProASIC3 | Obsolete | 3 (168 Hours) | 132 | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BUTT | 260 | 1.5V | 0.5mm | compliant | 30 | A3P125 | S-XBCC-B132 | 不合格 | 350MHz | 现场可编程门阵列 | 36864 | 125000 | 3072 | 0.8mm | 8mm | 8mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||
| AFS090-1QNG108 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 108-WFQFN | 108-QFN (8x8) | 37 | 0°C~85°C TJ | Tray | 2013 | Fusion® | Obsolete | 3 (168 Hours) | 1.425V~1.575V | AFS090 | 27648 | 90000 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A3P030-2QNG132 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 132-WFQFN | 132-QFN (8x8) | 81 | 0°C~85°C TJ | Tray | 2013 | ProASIC3 | Obsolete | 3 (168 Hours) | 1.425V~1.575V | A3P030 | 30000 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AFS250-1QNG180I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 180-WFQFN Dual Rows, Exposed Pad | YES | 65 | -40°C~100°C TJ | Tray | 2013 | Fusion® | Obsolete | 3 (168 Hours) | 180 | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BUTT | 未说明 | 1.5V | 0.5mm | compliant | 未说明 | AFS250 | S-XBCC-B180 | 65 | 不合格 | 1.53.3V | 350MHz | 65 | 现场可编程门阵列 | 36864 | 250000 | 6144 | 6144 | 0.8mm | 10mm | 10mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||
| AX125-FGG324I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 324-BGA | 324 | 400.011771mg | 168 | -40°C~85°C TA | Tray | 2005 | Axcelerator | e1 | Obsolete | 3 (168 Hours) | 324 | 锡银铜 | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 260 | 1.5V | 1mm | 649MHz | 40 | AX125 | 168 | 1.5V | 1.51.5/3.32.5/3.3V | 2.3kB | 990 ps | 990 ps | 现场可编程门阵列 | 18432 | 125000 | 2016 | 1344 | 0.99 ns | 1.25mm | 19mm | 19mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||
| AX1000-2FGG896I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 896-BGA | 896 | 400.011771mg | 516 | -40°C~85°C TA | Tray | Axcelerator | e1 | Obsolete | 3 (168 Hours) | 896 | 锡银铜 | 1.425V~1.575V | BOTTOM | BALL | 250 | 1.5V | 870MHz | 40 | AX1000 | 516 | 1.5V | 20.3kB | 740 ps | 740 ps | 现场可编程门阵列 | 165888 | 1000000 | 18144 | 2 | 12096 | 0.74 ns | 1.73mm | 31mm | 31mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||
| AX1000-2FGG896 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 896-BGA | 896 | 896-FBGA (31x31) | 400.011771mg | 516 | 0°C~70°C TA | Tray | Axcelerator | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | 870MHz | AX1000 | 1.5V | 1.575V | 1.425V | 20.3kB | 740 ps | 740 ps | 12096 | 165888 | 1000000 | 870MHz | 18144 | 12096 | 2 | 12096 | 1.73mm | 31mm | 31mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||
| A54SX08-2PL84 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 84-LCC (J-Lead) | 84 | 6.777889g | 69 | 0°C~70°C TA | Tray | SX | e0 | Obsolete | 3 (168 Hours) | 84 | Tin/Lead (Sn/Pb) | 3V~3.6V 4.75V~5.25V | QUAD | J BEND | 225 | 3.3V | 320MHz | 30 | A54SX08 | 5V | 700 ps | 700 ps | 现场可编程门阵列 | 768 | 12000 | 2 | 256 | 0.7 ns | 768 | 8000 | 3.68mm | 29.31mm | 29.31mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||
| A1020B-1PLG84M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 84-LCC (J-Lead) | 84 | 69 | -55°C~125°C TC | Tube | ACT™ 1 | e3 | Obsolete | 3 (168 Hours) | 84 | 哑光锡 | 4.5V~5.5V | QUAD | J BEND | 245 | 5V | 57MHz | 40 | A1020 | 69 | 5V | 5V | 3.8 ns | 现场可编程门阵列 | 547 | 2000 | 1 | 273 | 547 | 547 | 4.572mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||
| A54SX08-2PLG84I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 84-LCC (J-Lead) | 84 | 6.777889g | 69 | -40°C~85°C TA | Tube | 2006 | SX | e3 | Obsolete | 3 (168 Hours) | 84 | 哑光锡 | 3V~3.6V 4.75V~5.25V | QUAD | J BEND | 245 | 3.3V | 320MHz | 40 | A54SX08 | 5V | 700 ps | 700 ps | 现场可编程门阵列 | 768 | 12000 | 2 | 256 | 0.7 ns | 768 | 8000 | 3.68mm | 29.31mm | 29.31mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||
| A14100A-1BG313C | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 313-BBGA | 313 | 228 | 0°C~70°C TA | Tray | 2012 | ACT™ 3 | Obsolete | 3 (168 Hours) | 313 | 4.5V~5.5V | BOTTOM | BALL | 5V | 125MHz | A14100 | 5V | 2.6 ns | 2.6 ns | 现场可编程门阵列 | 1377 | 10000 | 1 | 1153 | 2.52mm | 35mm | 35mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||
| A1020B-1PG84C | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 通孔 | 通孔 | 84-BCPGA | 84 | 69 | 0°C~70°C TA | Tray | 2000 | ACT™ 1 | Obsolete | 3 (168 Hours) | 84 | 4.5V~5.5V | PERPENDICULAR | PIN/PEG | 5V | 2.54mm | 57MHz | A1020 | 69 | 5V | 5V | 3.8 ns | 现场可编程门阵列 | 547 | 2000 | 1 | 273 | 4.7 ns | 547 | 547 | 27.94mm | 27.94mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||
| M1A3P1000-FG144M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | -55°C~125°C TJ | Tray | 2014 | ProASIC3 | e0 | 活跃 | 3 (168 Hours) | 144 | 3A001.A.2.C | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | 30 | M1A3P1000 | 97 | 不合格 | 1.5V | 1.51.5/3.3V | 8mA | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 350MHz | 24576 | 24576 | 1.55mm | 13mm | 13mm | Non-RoHS Compliant | ||||||||||||||||||||||||||
| A3P1000-FGG256M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 256-LBGA | 256 | 256-FBGA (17x17) | 177 | -55°C~125°C TJ | Tray | 2014 | ProASIC3 | 活跃 | 3 (168 Hours) | 125°C | -55°C | 1.14V~1.575V | 4kB | 147456 | 1000000 | 24576 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||
| M2GL150-FCVG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BFBGA | YES | 248 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 484 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 0.8mm | 30 | S-PBGA-B484 | 现场可编程门阵列 | 146124 | 5120000 | 3.15mm | 19mm | 19mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||
| AX2000-1FGG896M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 896-BGA | 896 | 400.011771mg | 586 | Military grade | -55°C~125°C TA | Tray | 2005 | Axcelerator | e1 | 活跃 | 3 (168 Hours) | 896 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 250 | 1.5V | 763MHz | 40 | AX2000 | 684 | 1.5V | 36kB | 850 ps | 850 ps | 现场可编程门阵列 | 294912 | 2000000 | 32256 | MIL-STD-883 Class B | 1 | 21504 | 0.84 ns | 1.73mm | 31mm | 31mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||
| M2GL150T-FCVG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BFBGA | YES | 248 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 484 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 0.8mm | 30 | S-PBGA-B484 | 现场可编程门阵列 | 146124 | 5120000 | 3.15mm | 19mm | 19mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||
| M2GL060T-1VFG400 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 400-LFBGA | YES | 207 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 400 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 0.8mm | 30 | S-PBGA-B400 | 现场可编程门阵列 | 56520 | 1869824 | 1.51mm | 17mm | 17mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||
| M2GL060TS-VF400 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 400-LFBGA | YES | 207 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 400 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 0.8mm | 20 | S-PBGA-B400 | 现场可编程门阵列 | 56520 | 1869824 | 1.51mm | 17mm | 17mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||
| M2GL060TS-VF400I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 400-LFBGA | YES | 207 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 400 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 0.8mm | 20 | S-PBGA-B400 | 现场可编程门阵列 | 56520 | 1869824 | 1.51mm | 17mm | 17mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||
| M2GL150T-FCSG536 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 536-LFBGA, CSPBGA | YES | 293 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 536 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 30 | S-PBGA-B536 | 现场可编程门阵列 | 146124 | 5120000 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||
| M2GL150T-1FCS536I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 536-LFBGA, CSPBGA | YES | 293 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 536 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 20 | S-PBGA-B536 | 现场可编程门阵列 | 146124 | 5120000 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||
| A3P250-VQG100M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 100-TQFP | 68 | -55°C~125°C TJ | Tray | 2014 | ProASIC3 | 活跃 | 3 (168 Hours) | 100 | 8542.39.00.01 | 1.425V~1.575V | QUAD | 鸥翼 | 1.5V | 0.5mm | A3P250 | S-PQFP-G100 | 4.5kB | 现场可编程门阵列 | 36864 | 250000 | 6144 | 1.2mm | 14mm | 14mm | 符合RoHS标准 |
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AFS090-QNG108
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P060-2QNG132
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P125-1QNG132I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AFS090-1QNG108
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P030-2QNG132
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AFS250-1QNG180I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX125-FGG324I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX1000-2FGG896I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX1000-2FGG896
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A54SX08-2PL84
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A1020B-1PLG84M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A54SX08-2PLG84I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A14100A-1BG313C
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A1020B-1PG84C
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P1000-FG144M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P1000-FGG256M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL150-FCVG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX2000-1FGG896M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL150T-FCVG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL060T-1VFG400
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL060TS-VF400
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL060TS-VF400I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL150T-FCSG536
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL150T-1FCS536I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P250-VQG100M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)