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品牌是'Microsemi' (5267)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 输出的数量 | 资历状况 | 电源 | 内存大小 | 传播延迟 | 接通延迟时间 | 电流源 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | LABs数量/ CLBs数量 | 筛选水平 | 速度等级 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | 电压 - 供电 （最大值） | 电压 - 供电 （最小值） | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | A3P1000-2FG484M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BGA | 256 | 484-FPBGA (23x23) | 300 | -55°C~125°C TJ | Tray | ProASIC3 | 活跃 | 3 (168 Hours) | 125°C | -55°C | 1.14V~1.575V | 4kB | 147456 | 1000000 | 2 | 24576 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||
| A3P1000-2FGG256M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 256-LBGA | 256 | 256-FBGA (17x17) | 177 | -55°C~125°C TJ | Tray | ProASIC3 | 活跃 | 3 (168 Hours) | 125°C | -55°C | 1.14V~1.575V | 4kB | 147456 | 1000000 | 2 | 24576 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||
| M2GL150T-FCS536I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 536-LFBGA, CSPBGA | 536-CSPBGA (16x16) | 293 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 1.14V~2.625V | 146124 | 5120000 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
| AX1000-1FG896 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 896-BGA | 896-FBGA (31x31) | 516 | 0°C~70°C TA | Tray | 2012 | Axcelerator | Obsolete | 3 (168 Hours) | 1.425V~1.575V | AX1000 | 165888 | 1000000 | 18144 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
| AFS090-1QNG180 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 180-WFQFN Dual Rows, Exposed Pad | 180-QFN (10x10) | 60 | 0°C~85°C TJ | Tray | 2013 | Fusion® | Obsolete | 3 (168 Hours) | 1.425V~1.575V | AFS090 | 27648 | 90000 | |||||||||||||||||||||||||||||||||||||||||||||||||
| AFS250-1QNG180 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 180-WFQFN Dual Rows, Exposed Pad | 180-QFN (10x10) | 65 | 0°C~85°C TJ | Tray | 2013 | Fusion® | Obsolete | 3 (168 Hours) | 1.425V~1.575V | AFS250 | 36864 | 250000 | |||||||||||||||||||||||||||||||||||||||||||||||||
| AFS090-2QNG180 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 180-WFQFN Dual Rows, Exposed Pad | 180-QFN (10x10) | 60 | 0°C~85°C TJ | Tray | 2013 | Fusion® | Obsolete | 3 (168 Hours) | 1.425V~1.575V | AFS090 | 27648 | 90000 | |||||||||||||||||||||||||||||||||||||||||||||||||
| AFS090-2QNG108 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 108-WFQFN | 108-QFN (8x8) | 37 | 0°C~85°C TJ | Tray | 2013 | Fusion® | Obsolete | 3 (168 Hours) | 1.425V~1.575V | AFS090 | 27648 | 90000 | |||||||||||||||||||||||||||||||||||||||||||||||||
| A3P125-1QNG132 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 132-WFQFN | 132-QFN (8x8) | 84 | 0°C~85°C TJ | Tray | 2013 | ProASIC3 | Obsolete | 3 (168 Hours) | 1.425V~1.575V | A3P125 | 36864 | 125000 | |||||||||||||||||||||||||||||||||||||||||||||||||
| A3P030-QNG132 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 132-WFQFN | 132-QFN (8x8) | 81 | 0°C~85°C TJ | Tray | 2013 | ProASIC3 | Obsolete | 3 (168 Hours) | 1.425V~1.575V | A3P030 | 30000 | ||||||||||||||||||||||||||||||||||||||||||||||||||
| A3P250-1QNG132 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 132-WFQFN | 132-QFN (8x8) | 87 | 0°C~85°C TJ | Tray | 2013 | ProASIC3 | Obsolete | 3 (168 Hours) | 1.425V~1.575V | A3P250 | 36864 | 250000 | |||||||||||||||||||||||||||||||||||||||||||||||||
| M1A3P1000-1FG144M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | -55°C~125°C TJ | Tray | 2014 | ProASIC3 | e0 | 活跃 | 3 (168 Hours) | 144 | 3A001.A.2.C | 锡铅银 | 8542.39.00.01 | 1.5V | BOTTOM | BALL | 225 | 1mm | 30 | M1A3P1000 | 97 | 不合格 | 1.51.5/3.3V | 18kB | 8mA | 现场可编程门阵列 | 147456 | 1000000 | 350MHz | 24576 | 24576 | 1.55mm | 13mm | 13mm | Non-RoHS Compliant | ||||||||||||||||||||||
| AX250-1FGG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 22 Weeks | IN PRODUCTION (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 138 | -40°C~85°C TA | Tray | 2005 | Axcelerator | e1 | 活跃 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.5V | BOTTOM | BALL | 260 | 763MHz | 40 | AX250 | 248 | 6.8kB | 850 ps | 850 ps | 现场可编程门阵列 | 55296 | 250000 | 4224 | 1 | 2816 | 0.84 ns | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||
| M2GL060T-1FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BGA | YES | 484 | 267 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | e0 | 活跃 | 3 (168 Hours) | 484 | Tin/Lead (Sn63Pb37) | 1.2V | BOTTOM | BALL | 240 | not_compliant | 20 | 228.3kB | 现场可编程门阵列 | 56520 | 1869824 | 1 | 2.44mm | 23mm | 23mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
| M2GL060TS-1FG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BGA | YES | 267 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | e0 | 活跃 | 3 (168 Hours) | 484 | Tin/Lead (Sn63Pb37) | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 240 | 1mm | not_compliant | 20 | S-PBGA-B484 | 现场可编程门阵列 | 56520 | 1869824 | 2.44mm | 23mm | 23mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
| A3P250-VQG100M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 100-TQFP | 68 | -55°C~125°C TJ | Tray | 2014 | ProASIC3 | 活跃 | 3 (168 Hours) | 100 | 8542.39.00.01 | 1.5V | QUAD | 鸥翼 | 0.5mm | A3P250 | S-PQFP-G100 | 4.5kB | 现场可编程门阵列 | 36864 | 250000 | 6144 | 1.2mm | 14mm | 14mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||
| A3PE3000-2FGG896 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 表面贴装 | 表面贴装 | 896-BGA | 896 | 896-FBGA (31x31) | 400.011771mg | 620 | 0°C~85°C TJ | Tray | 2009 | ProASIC3E | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | A3PE3000 | 63kB | 516096 | 3000000 | 310MHz | 2 | 75264 | 1.575V | 1.425V | 1.73mm | 31mm | 31mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||
| AX2000-1FGG1152M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 1152-BGA | 1152 | 400.011771mg | 684 | Military grade | -55°C~125°C TA | Tray | 2005 | Axcelerator | e1 | 活跃 | 3 (168 Hours) | Tin/Silver/Copper (Sn/Ag/Cu) | 1.5V | BOTTOM | BALL | 245 | 40 | AX2000 | 684 | 36kB | 850 ps | 现场可编程门阵列 | 21504 | 294912 | 2000000 | 763MHz | 32256 | MIL-STD-883 Class B | 1 | 0.84 ns | 1.73mm | 35mm | 35mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||
| M2GL150TS-FCVG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 484-BFBGA | YES | 248 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 484 | 1.2V | BOTTOM | BALL | 260 | 0.8mm | 30 | S-PBGA-B484 | 现场可编程门阵列 | 146124 | 5120000 | 3.15mm | 19mm | 19mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||
| M2GL150T-1FCS536 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 536-LFBGA, CSPBGA | YES | 293 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 536 | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 240 | 20 | S-PBGA-B536 | 现场可编程门阵列 | 146124 | 5120000 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||
| M2GL150-1FCSG536I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 536-LFBGA, CSPBGA | YES | 293 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 536 | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 260 | 30 | S-PBGA-B536 | 现场可编程门阵列 | 146124 | 5120000 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||
| M2GL150TS-FCV484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 484-BFBGA | YES | 248 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 484 | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 240 | 0.8mm | 20 | S-PBGA-B484 | 现场可编程门阵列 | 146124 | 5120000 | 3.15mm | 19mm | 19mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||
| M2GL150TS-1FCSG536 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 536-LFBGA, CSPBGA | YES | 293 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 536 | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 260 | 30 | S-PBGA-B536 | 现场可编程门阵列 | 146124 | 5120000 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||
| A3PE3000-2FGG324 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 表面贴装 | 表面贴装 | 324-BGA | 324 | 324-FBGA (19x19) | 400.011771mg | 221 | 0°C~85°C TJ | Tray | 2009 | ProASIC3E | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | 310MHz | A3PE3000 | 63kB | 25mA | 516096 | 3000000 | 310MHz | 2 | 75264 | 1.575V | 1.425V | 1.25mm | 19mm | 19mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||
| A3PE3000-1FGG324I | Microsemi Corporation | 数据表 | 4 In Stock | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 表面贴装 | 表面贴装 | 324-BGA | 324 | 400.011771mg | 221 | -40°C~100°C TJ | Tray | 2009 | ProASIC3E | e1 | 活跃 | 3 (168 Hours) | 324 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.5V | BOTTOM | BALL | 260 | 272MHz | 40 | A3PE3000 | 63kB | 25mA | 现场可编程门阵列 | 516096 | 3000000 | 1 | 75264 | 1.25mm | 19mm | 19mm | 无 | 符合RoHS标准 |
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A3P1000-2FG484M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P1000-2FGG256M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL150T-FCS536I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX1000-1FG896
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AFS090-1QNG180
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AFS250-1QNG180
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AFS090-2QNG180
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AFS090-2QNG108
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P125-1QNG132
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P030-QNG132
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P250-1QNG132
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P1000-1FG144M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX250-1FGG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL060T-1FG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL060TS-1FG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P250-VQG100M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3PE3000-2FGG896
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX2000-1FGG1152M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL150TS-FCVG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL150T-1FCS536
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL150-1FCSG536I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL150TS-FCV484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL150TS-1FCSG536
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3PE3000-2FGG324
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3PE3000-1FGG324I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)