我的订单
会员中心 
在线咨询
0755-83328606
品牌是'Microsemi' (5267)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 工作电源电流 | 内存大小 | 时钟频率 | 传播延迟 | 接通延迟时间 | 输入数量 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | LABs数量/ CLBs数量 | 筛选水平 | 速度等级 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | A3P250-1QNG132I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 132-WFQFN | YES | 87 | -40°C~100°C TJ | Tray | 2013 | ProASIC3 | Obsolete | 3 (168 Hours) | 132 | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BUTT | 260 | 1.5V | 0.5mm | compliant | 30 | A3P250 | S-XBCC-B132 | 不合格 | 350MHz | 现场可编程门阵列 | 36864 | 250000 | 6144 | 0.8mm | 8mm | 8mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||
| A3P030-2QNG132I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 132-WFQFN | YES | 81 | -40°C~100°C TJ | Tray | 2013 | ProASIC3 | Obsolete | 3 (168 Hours) | 132 | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BUTT | 260 | 1.5V | 0.5mm | compliant | 30 | A3P030 | S-XBCC-B132 | 不合格 | 350MHz | 现场可编程门阵列 | 30000 | 768 | 0.8mm | 8mm | 8mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||
| A3P125-2QNG132I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 132-WFQFN | YES | 84 | -40°C~100°C TJ | Tray | 2013 | ProASIC3 | Obsolete | 3 (168 Hours) | 132 | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BUTT | 260 | 1.5V | 0.5mm | compliant | 30 | A3P125 | S-XBCC-B132 | 不合格 | 现场可编程门阵列 | 36864 | 125000 | 3072 | 0.8mm | 8mm | 8mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||
| A3P060-1QNG132I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 132-WFQFN | YES | 80 | -40°C~100°C TJ | Tray | 2013 | ProASIC3 | Obsolete | 3 (168 Hours) | 132 | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BUTT | 260 | 1.5V | 0.5mm | compliant | 30 | A3P060 | S-XBCC-B132 | 不合格 | 现场可编程门阵列 | 18432 | 60000 | 1536 | 0.8mm | 8mm | 8mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||
| A3P125-QNG132I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 132-WFQFN | 132 | 84 | -40°C~100°C TJ | Tray | 2013 | ProASIC3 | Obsolete | 3 (168 Hours) | 132 | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BUTT | 260 | 1.5V | 0.5mm | 30 | A3P125 | 1.5V | 4.5kB | 350MHz | 现场可编程门阵列 | 36864 | 125000 | 3072 | 0.8mm | 8mm | 8mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||
| AFS090-1QNG108I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 108-WFQFN | YES | 37 | -40°C~100°C TJ | Tray | 2013 | Fusion® | Obsolete | 3 (168 Hours) | 108 | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BUTT | 未说明 | 1.5V | 0.5mm | compliant | 未说明 | AFS090 | S-XBCC-B108 | 37 | 不合格 | 1.53.3V | 350MHz | 37 | 现场可编程门阵列 | 27648 | 90000 | 2304 | 2304 | 0.8mm | 8mm | 8mm | 符合RoHS标准 | |||||||||||||||||||||||||||||
| A3P250-1QNG132 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 132-WFQFN | 132-QFN (8x8) | 87 | 0°C~85°C TJ | Tray | 2013 | ProASIC3 | Obsolete | 3 (168 Hours) | 1.425V~1.575V | A3P250 | 36864 | 250000 | |||||||||||||||||||||||||||||||||||||||||||||||||||
| AX125-1FGG324 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 324-BGA | 324 | 400.011771mg | 168 | 0°C~70°C TA | Tray | 2005 | Axcelerator | e1 | Obsolete | 3 (168 Hours) | 324 | 锡银铜 | 1.425V~1.575V | BOTTOM | BALL | 260 | 1.5V | 763MHz | 40 | AX125 | 168 | 1.5V | 2.3kB | 850 ps | 850 ps | 现场可编程门阵列 | 18432 | 125000 | 2016 | 1 | 1344 | 0.84 ns | 1.25mm | 19mm | 19mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||
| AX1000-1FG896 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 896-BGA | 896-FBGA (31x31) | 516 | 0°C~70°C TA | Tray | 2012 | Axcelerator | Obsolete | 3 (168 Hours) | 1.425V~1.575V | AX1000 | 165888 | 1000000 | 18144 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
| A1020B-PLG84M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 84-LCC (J-Lead) | 84 | 69 | -55°C~125°C TC | Tube | ACT™ 1 | e3 | Obsolete | 3 (168 Hours) | 84 | 3A001.A.2.C | 哑光锡 | 8542.39.00.01 | 4.5V~5.5V | QUAD | J BEND | 245 | 5V | 1.27mm | 48MHz | 40 | A1020 | 不合格 | 5V | 4.5 ns | 现场可编程门阵列 | 547 | 2000 | 273 | 547 | 4.572mm | 29.3116mm | 29.3116mm | 符合RoHS标准 | |||||||||||||||||||||||||||||
| A1020B-PL84M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 84-LCC (J-Lead) | 84 | 69 | -55°C~125°C TC | Tray | ACT™ 1 | e0 | Obsolete | 3 (168 Hours) | 84 | 3A001.A.2.C | 锡铅 | 8542.39.00.01 | 4.5V~5.5V | QUAD | J BEND | 225 | 5V | 1.27mm | 48MHz | 30 | A1020 | 不合格 | 5V | 4.5 ns | 现场可编程门阵列 | 547 | 2000 | 273 | 547 | 4.572mm | 29.3116mm | 29.3116mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||
| A1010B-1PG84M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 通孔 | 通孔 | 84-BCPGA | 84 | 57 | -55°C~125°C TC | Tray | ACT™ 1 | Obsolete | 3 (168 Hours) | 84 | 4.5V~5.5V | PERPENDICULAR | PIN/PEG | 5V | 2.54mm | 57MHz | A1010 | 57 | 5V | 5V | 3.8 ns | 现场可编程门阵列 | 295 | 1200 | 1 | 147 | 295 | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||
| A1020B-1PG84B | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 通孔 | 通孔 | 84-BCPGA | 84 | 69 | Military grade | -55°C~125°C TJ | Tray | ACT™ 1 | Obsolete | 3 (168 Hours) | 84 | 4.5V~5.5V | PERPENDICULAR | PIN/PEG | 5V | 2.54mm | unknown | A1020 | 69 | 不合格 | 5V | 5V | 44MHz | 3.8 ns | 现场可编程门阵列 | 2000 | 547 | 38535Q/M;38534H;883B | 1 | 273 | 547 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
| A1020B-PG84M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 通孔 | 通孔 | 84-BCPGA | 84 | 69 | -55°C~125°C TC | Tray | 2014 | ACT™ 1 | e0 | Obsolete | 3 (168 Hours) | 84 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 4.5V~5.5V | PERPENDICULAR | PIN/PEG | 225 | 5V | 2.54mm | 48MHz | 20 | A1020 | 5V | 4.5 ns | 现场可编程门阵列 | 547 | 2000 | 273 | 5.5 ns | 547 | 547 | 4.318mm | 27.94mm | 27.94mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||
| M1A3P1000-1FG144M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | -55°C~125°C TJ | Tray | 2014 | ProASIC3 | e0 | 活跃 | 3 (168 Hours) | 144 | 3A001.A.2.C | 锡铅银 | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | 30 | M1A3P1000 | 97 | 不合格 | 1.5V | 1.51.5/3.3V | 8mA | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 350MHz | 24576 | 24576 | 1.55mm | 13mm | 13mm | Non-RoHS Compliant | ||||||||||||||||||||||
| AX250-1FGG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 22 Weeks | IN PRODUCTION (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 138 | -40°C~85°C TA | Tray | 2005 | Axcelerator | e1 | 活跃 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 260 | 1.5V | 763MHz | 40 | AX250 | 248 | 1.5V | 6.8kB | 850 ps | 850 ps | 现场可编程门阵列 | 55296 | 250000 | 4224 | 1 | 2816 | 0.84 ns | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||
| A3P1000-2FGG256M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 256-LBGA | 256 | 256-FBGA (17x17) | 177 | -55°C~125°C TJ | Tray | ProASIC3 | 活跃 | 3 (168 Hours) | 125°C | -55°C | 1.14V~1.575V | 4kB | 147456 | 1000000 | 2 | 24576 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||
| M2GL060T-1FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BGA | YES | 484 | 267 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | e0 | 活跃 | 3 (168 Hours) | 484 | Tin/Lead (Sn63Pb37) | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | not_compliant | 20 | 1.2V | 228.3kB | 现场可编程门阵列 | 56520 | 1869824 | 1 | 2.44mm | 23mm | 23mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
| M2GL060TS-1FG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BGA | YES | 267 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | e0 | 活跃 | 3 (168 Hours) | 484 | Tin/Lead (Sn63Pb37) | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 1mm | not_compliant | 20 | S-PBGA-B484 | 现场可编程门阵列 | 56520 | 1869824 | 2.44mm | 23mm | 23mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||
| A3P1000-2FG484M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BGA | 256 | 484-FPBGA (23x23) | 300 | -55°C~125°C TJ | Tray | ProASIC3 | 活跃 | 3 (168 Hours) | 125°C | -55°C | 1.14V~1.575V | 4kB | 147456 | 1000000 | 2 | 24576 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||
| M2GL150TS-FCVG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 484-BFBGA | YES | 248 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 484 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 0.8mm | 30 | S-PBGA-B484 | 现场可编程门阵列 | 146124 | 5120000 | 3.15mm | 19mm | 19mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||
| M2GL150T-1FCS536 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 536-LFBGA, CSPBGA | YES | 293 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 536 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 20 | S-PBGA-B536 | 现场可编程门阵列 | 146124 | 5120000 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||
| M2GL150-1FCSG536I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 536-LFBGA, CSPBGA | YES | 293 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 536 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 30 | S-PBGA-B536 | 现场可编程门阵列 | 146124 | 5120000 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||
| M2GL150T-FCS536I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 536-LFBGA, CSPBGA | 536-CSPBGA (16x16) | 293 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 1.14V~2.625V | 146124 | 5120000 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
| M2GL150TS-FCV484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 484-BFBGA | YES | 248 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 484 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 0.8mm | 20 | S-PBGA-B484 | 现场可编程门阵列 | 146124 | 5120000 | 3.15mm | 19mm | 19mm | Non-RoHS Compliant |
-
A3P250-1QNG132I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P030-2QNG132I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P125-2QNG132I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P060-1QNG132I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P125-QNG132I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AFS090-1QNG108I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P250-1QNG132
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX125-1FGG324
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX1000-1FG896
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A1020B-PLG84M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A1020B-PL84M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A1010B-1PG84M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A1020B-1PG84B
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A1020B-PG84M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P1000-1FG144M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX250-1FGG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P1000-2FGG256M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL060T-1FG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL060TS-1FG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P1000-2FG484M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL150TS-FCVG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL150T-1FCS536
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL150-1FCSG536I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL150T-FCS536I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL150TS-FCV484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)