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品牌是'Microsemi' (5267)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 最大电源电压 | 最小电源电压 | 内存大小 | 时钟频率 | 传播延迟 | 接通延迟时间 | 输入数量 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | LABs数量/ CLBs数量 | 逻辑块数(LABs) | 速度等级 | 寄存器数量 | CLB-Max的组合延时 | 逻辑单元数 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | APA450-FG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 14 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | Lead, Silver, Tin | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 186 | 0°C~70°C TA | Tray | 2009 | ProASICPLUS | 活跃 | 3 (168 Hours) | 256 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | 2.3V~2.7V | BOTTOM | BALL | 225 | 2.5V | 1mm | 180MHz | 30 | APA450 | 186 | 2.5V | 2.52.5/3.3V | 13.5kB | 现场可编程门阵列 | 110592 | 450000 | 12288 | 1.2mm | 17mm | 17mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||
 | M1AFS1500-FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 400.011771mg | 223 | 0°C~85°C TJ | Tray | 2009 | Fusion® | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | 1.0989GHz | M1AFS1500 | 1.5V | 1.575V | 1.425V | 33.8kB | 276480 | 1500000 | 1.0989GHz | 38400 | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||
| APA450-FG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | 256-LBGA | YES | 186 | -40°C~85°C TA | Tray | 2009 | ProASICPLUS | 活跃 | 3 (168 Hours) | 256 | 3A001.A.7.A | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | 2.3V~2.7V | BOTTOM | BALL | 225 | 2.5V | 1mm | 30 | APA450 | S-PBGA-B256 | 186 | 不合格 | 2.52.5/3.3V | 180MHz | 186 | 现场可编程门阵列 | 110592 | 450000 | 12288 | 1.8mm | 17mm | 17mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||
 | M1AFS1500-1FGG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 400.011771mg | 119 | 0°C~85°C TJ | Tray | 2013 | Fusion® | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | M1AFS1500 | 1.5V | 1.575V | 1.425V | 33.8kB | 276480 | 1500000 | 1.28205GHz | 1 | 38400 | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||
| AFS1500-1FG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 400.011771mg | 119 | 0°C~85°C TJ | Tray | 2013 | Fusion® | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | AFS1500 | 1.5V | 1.575V | 1.425V | 33.8kB | 276480 | 1500000 | 1.28205GHz | 1 | 38400 | 1.2mm | 17mm | 17mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
 | A54SX72A-FG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 2 days ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (27X27) | 400.011771mg | 360 | 0°C~70°C TA | Tray | SX-A | 活跃 | 3 (168 Hours) | 70°C | 0°C | 2.25V~5.25V | 217MHz | A54SX72A | 2.5V | 2.75V | 2.25V | 1.5 ns | 1.5 ns | 6036 | 108000 | 217MHz | 6036 | 6036 | 4024 | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||
 | M2GL150-1FC1152I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 1152-BBGA, FCBGA | YES | 574 | -40°C~100°C TJ | Tray | 2013 | IGLOO2 | 活跃 | 3 (168 Hours) | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 1mm | 20 | M2GL150 | S-PBGA-B1152 | 574 | 不合格 | 1.2V | 625kB | 574 | 现场可编程门阵列 | 146124 | 5120000 | 2.9mm | 35mm | 35mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||
 | M1AFS1500-FGG676 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 676-BGA | 676 | 676-FBGA (27x27) | 400.011771mg | 252 | 0°C~85°C TJ | Tray | 2013 | Fusion® | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | 1.0989GHz | M1AFS1500 | 1.5V | 1.575V | 1.425V | 33.8kB | 276480 | 1500000 | 1.0989GHz | 38400 | 1.73mm | 27mm | 27mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||
| M1AFS1500-2FG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 400.011771mg | 119 | 0°C~85°C TJ | Tray | 2013 | Fusion® | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | M1AFS1500 | 1.5V | 1.575V | 1.425V | 33.8kB | 276480 | 1500000 | 1.47059GHz | 2 | 38400 | 1.2mm | 17mm | 17mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||
| A54SX72A-FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (27X27) | 400.011771mg | 360 | -40°C~85°C TA | Tray | 2007 | SX-A | 活跃 | 3 (168 Hours) | 85°C | -40°C | 2.25V~5.25V | 217MHz | A54SX72A | 2.5V | 2.75V | 2.25V | 1.5 ns | 1.5 ns | 6036 | 108000 | 217MHz | 6036 | 6036 | 4024 | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||
 | M2GL090T-1FG484M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BGA | YES | 267 | -55°C~125°C TJ | Tray | IGLOO2 | 活跃 | 3 (168 Hours) | 484 | 3A001.A.2.C | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 1mm | 20 | S-PBGA-B484 | 267 | 不合格 | 1.2V | 267 | 现场可编程门阵列 | 86184 | 2648064 | 86316 | 2.44mm | 23mm | 23mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||
| AX1000-FG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 317 | 0°C~70°C TA | Tray | 2012 | Axcelerator | e0 | 活跃 | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | 649MHz | 30 | AX1000 | 516 | 1.5V | 1.51.5/3.32.5/3.3V | 20.3kB | 990 ps | 990 ps | 现场可编程门阵列 | 165888 | 1000000 | 18144 | 12096 | 0.99 ns | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||
 | AFS1500-1FG676 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 676-BGA | 676 | 676-FBGA (27x27) | 400.011771mg | 252 | 0°C~85°C TJ | Tray | 2013 | Fusion® | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | AFS1500 | 1.5V | 1.575V | 1.425V | 33.8kB | 276480 | 1500000 | 1.28205GHz | 1 | 38400 | 1.73mm | 27mm | 27mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
 | M2GL025T-1FCSG325I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 324-LFBGA, CSPBGA | YES | 180 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 325 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 30 | S-PBGA-B325 | 180 | 不合格 | 1.2V | 180 | 现场可编程门阵列 | 27696 | 1130496 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||
 | M2GL025-1VFG400 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 9 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 400-LFBGA | YES | 400 | 207 | 0°C~85°C TJ | Tray | 2013 | IGLOO2 | 活跃 | 3 (168 Hours) | 400 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 0.8mm | 30 | M2GL025 | 207 | 不合格 | 1.2V | 138kB | 现场可编程门阵列 | 27696 | 1130496 | 1.51mm | 17mm | 17mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||
| M2GL025-VF400I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 9 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 400-LFBGA | YES | 207 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 400 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 0.8mm | 20 | S-PBGA-B400 | 207 | 不合格 | 1.2V | 207 | 现场可编程门阵列 | 27696 | 1130496 | 1.51mm | 17mm | 17mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
| M1A3P600-1FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 235 | -40°C~100°C TJ | Tray | 2003 | ProASIC3 | e0 | 活跃 | 3 (168 Hours) | 484 | 锡铅 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 30 | M1A3P600 | 1.5V | 13.5kB | 现场可编程门阵列 | 110592 | 600000 | 272MHz | 1 | 13824 | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||
 | AGL600V5-FG144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 17 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 144-LBGA | 144 | 144-FPBGA (13x13) | 400.011771mg | 97 | 0°C~70°C TA | Tray | 2013 | IGLOO | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | AGL600 | 1.5V | 1.575V | 1.425V | 13.5kB | 13824 | 110592 | 600000 | 892.86MHz | 1.05mm | 13mm | 13mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||
| M2GL050-FCS325 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 25 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 325-TFBGA | YES | 200 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 325 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 20 | S-PBGA-B325 | 200 | 不合格 | 1.2V | 200 | 现场可编程门阵列 | 56340 | 1869824 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||
| M2GL025TS-VF400 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 400-LFBGA | YES | 207 | 0°C~85°C TJ | Tray | IGLOO2 | 活跃 | 3 (168 Hours) | 400 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 0.8mm | 20 | S-PBGA-B400 | 207 | 不合格 | 1.2V | 207 | 现场可编程门阵列 | 27696 | 1130496 | 1.51mm | 17mm | 17mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||
| M2GL025TS-VFG400 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 400-LFBGA | YES | 207 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 400 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 0.8mm | 30 | S-PBGA-B400 | 207 | 不合格 | 1.2V | 207 | 现场可编程门阵列 | 27696 | 1130496 | 1.51mm | 17mm | 17mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||
| M2GL025-1FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 9 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 484-BGA | YES | 267 | 0°C~85°C TJ | Tray | 2013 | IGLOO2 | 活跃 | 3 (168 Hours) | 484 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 1mm | 30 | M2GL025 | S-PBGA-B484 | 267 | 不合格 | 1.2V | 138kB | 267 | 现场可编程门阵列 | 27696 | 1130496 | 2.44mm | 23mm | 23mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||
| A3P1000-2FG144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | 0°C~85°C TJ | Tray | 2009 | ProASIC3 | e0 | 活跃 | 3 (168 Hours) | 144 | 锡铅银 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | 30 | A3P1000 | 1.5V | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 310MHz | 2 | 24576 | 1.55mm | 13mm | 13mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||
| M1A3P600L-FG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 400.011771mg | 235 | 0°C~85°C TJ | Tray | 2015 | ProASIC3L | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.14V~1.575V | M1A3P600L | 1.2V | 1.26V | 1.14V | 13.5kB | 110592 | 600000 | 781.25MHz | 13824 | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||
| AGL600V2-FG144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 17 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 144-LBGA | 144 | 144-FPBGA (13x13) | 400.011771mg | 97 | 0°C~70°C TA | Tray | 2013 | IGLOO | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.14V~1.575V | AGL600 | 1.5V | 1.575V | 1.14V | 13.5kB | 13824 | 110592 | 600000 | 892.86MHz | 1.05mm | 13mm | 13mm | Non-RoHS Compliant |
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APA450-FG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1AFS1500-FGG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
APA450-FG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1AFS1500-1FGG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AFS1500-1FG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A54SX72A-FG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL150-1FC1152I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1AFS1500-FGG676
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1AFS1500-2FG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A54SX72A-FG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL090T-1FG484M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX1000-FG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AFS1500-1FG676
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL025T-1FCSG325I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL025-1VFG400
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL025-VF400I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P600-1FG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGL600V5-FG144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL050-FCS325
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL025TS-VF400
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL025TS-VFG400
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL025-1FGG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P1000-2FG144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P600L-FG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGL600V2-FG144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)