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品牌是'Microsemi' (5267)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 端子表面处理 | 最高工作温度 | 最小工作温度 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 最大电源电压 | 最小电源电压 | 内存大小 | 工作电源电流 | 内存大小 | 时钟频率 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | 速度等级 | 寄存器数量 | 逻辑块数量 | 逻辑单元数 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | A3P125-2FG144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 144-FPBGA (13x13) | 400.011771mg | 97 | 0°C~85°C TJ | Tray | 2009 | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | A3P125 | 1.5V | 1.575V | 1.425V | 4.5kB | 36864 | 125000 | 310MHz | 2 | 3072 | 1.05mm | 13mm | 13mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||
 | A3P125-2VQ100I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 71 | -40°C~100°C TJ | Tray | 2009 | ProASIC3 | e0 | 活跃 | 3 (168 Hours) | 100 | 锡铅 | 1.425V~1.575V | QUAD | 鸥翼 | 225 | 1.5V | 0.5mm | 30 | A3P125 | 1.5V | 4.5kB | 现场可编程门阵列 | 36864 | 125000 | 310MHz | 2 | 3072 | 1mm | 14mm | 14mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||
| A3P125-2FG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | -40°C~100°C TJ | Tray | 2009 | ProASIC3 | e0 | 活跃 | 3 (168 Hours) | 144 | 锡铅银 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | 310MHz | 30 | A3P125 | 1.5V | 4.5kB | 现场可编程门阵列 | 36864 | 125000 | 2 | 3072 | 1.05mm | 13mm | 13mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||
 | M2GL005-1VF256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 256-LFBGA | YES | 161 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 256 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 0.8mm | 20 | S-PBGA-B256 | 现场可编程门阵列 | 6060 | 719872 | 1.56mm | 14mm | 14mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||
| M2GL005-1VFG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 256-LFBGA | YES | 161 | 0°C~85°C TJ | Tray | IGLOO2 | 活跃 | 3 (168 Hours) | 256 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 0.8mm | 30 | S-PBGA-B256 | 现场可编程门阵列 | 6060 | 719872 | 1.56mm | 14mm | 14mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||
| A3P250-2VQ100 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 100-VQFP (14x14) | 68 | 0°C~85°C TJ | Tray | 2009 | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | A3P250 | 1.5V | 1.575V | 1.425V | 4.5kB | 36864 | 250000 | 310MHz | 2 | 6144 | 1mm | 14mm | 14mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||
| M1A3P250-1FG144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 144-FPBGA (13x13) | 400.011771mg | 97 | 0°C~85°C TJ | Tray | 2012 | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | 272MHz | M1A3P250 | 1.5V | 1.575V | 1.425V | 4.5kB | 36864 | 250000 | 272MHz | 1 | 6144 | 1.05mm | 13mm | 13mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||
| M2GL005S-VF256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 256-LFBGA | YES | 161 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 256 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 0.8mm | 20 | S-PBGA-B256 | 现场可编程门阵列 | 6060 | 719872 | 1.56mm | 14mm | 14mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||
| M2GL005-1VFG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 256-LFBGA | YES | 161 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 256 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 0.8mm | 30 | S-PBGA-B256 | 现场可编程门阵列 | 6060 | 719872 | 1.56mm | 14mm | 14mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||
| M2GL005S-VFG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 256-LFBGA | YES | 161 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 256 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 0.8mm | 30 | S-PBGA-B256 | 现场可编程门阵列 | 6060 | 719872 | 1.56mm | 14mm | 14mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||
| M1A3P250-VQG100I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 68 | -40°C~100°C TJ | Tray | 2013 | ProASIC3 | e3 | 活跃 | 3 (168 Hours) | 100 | Matte Tin (Sn) | 8542.39.00.01 | 1.425V~1.575V | QUAD | 鸥翼 | 260 | 1.5V | 0.5mm | 40 | M1A3P250 | 1.5V | 4.5kB | 现场可编程门阵列 | 36864 | 250000 | 231MHz | 6144 | 1mm | 14mm | 14mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||
| M1A3P250-FG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | -40°C~100°C TJ | Tray | 2013 | ProASIC3 | e0 | 活跃 | 3 (168 Hours) | 144 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | 30 | M1A3P250 | 1.5V | 4.5kB | 现场可编程门阵列 | 36864 | 250000 | 231MHz | 6144 | 1.05mm | 13mm | 13mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||
| A3P250-2FG144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 144-FPBGA (13x13) | 400.011771mg | 97 | 0°C~85°C TJ | Tray | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | A3P250 | 1.5V | 1.575V | 1.425V | 4.5kB | 36864 | 250000 | 310MHz | 2 | 6144 | 1.05mm | 13mm | 13mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||
| M1A3P250-2FG144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 144-FPBGA (13x13) | 400.011771mg | 97 | 0°C~85°C TJ | Tray | 2013 | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | 310MHz | M1A3P250 | 1.5V | 1.575V | 1.425V | 4.5kB | 36864 | 250000 | 310MHz | 2 | 6144 | 1.05mm | 13mm | 13mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||
| A3P250-1FG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | -40°C~100°C TJ | Tray | ProASIC3 | e0 | 活跃 | 3 (168 Hours) | 144 | 锡铅银 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 272MHz | 30 | A3P250 | 1.5V | 4.5kB | 现场可编程门阵列 | 36864 | 250000 | 1 | 6144 | 1.05mm | 13mm | 13mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||
| M2GL005S-1VFG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 256-LFBGA | YES | 484 | 161 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 256 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 0.8mm | 30 | S-PBGA-B256 | 1.2V | 87.9kB | 现场可编程门阵列 | 6060 | 719872 | 1 | 56340 | 符合RoHS标准 | ||||||||||||||||||||||||||||||
 | A3P250-1FGG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | -40°C~100°C TJ | Tray | 2008 | ProASIC3 | e1 | 活跃 | 3 (168 Hours) | 144 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 260 | 1.5V | 272MHz | 40 | A3P250 | 1.5V | 4.5kB | 现场可编程门阵列 | 36864 | 250000 | 1 | 6144 | 1.05mm | 13mm | 13mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||
| M1AGL250V5-VQ100I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 68 | -40°C~85°C TA | Tray | 2013 | IGLOO | e0 | 活跃 | 3 (168 Hours) | 100 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.425V~1.575V | QUAD | 鸥翼 | 225 | 1.5V | 0.5mm | 30 | M1AGL250 | 不合格 | 1.5V | 4.5kB | 108MHz | 现场可编程门阵列 | 6144 | 36864 | 250000 | 1mm | 14mm | 14mm | Non-RoHS Compliant | |||||||||||||||||||||||
| AGL250V5-FG144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 144-FPBGA (13x13) | 400.011771mg | 97 | 0°C~70°C TA | Tray | 2013 | IGLOO | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | AGL250 | 1.5V | 1.575V | 1.425V | 4.5kB | 6144 | 36864 | 250000 | 892.86MHz | 1.05mm | 13mm | 13mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||
 | AGL250V5-CS196 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 22 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 196-TFBGA, CSBGA | 196 | 196-CSP (8x8) | 143 | 0°C~70°C TA | Tray | 2016 | IGLOO | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | AGL250 | 1.5V | 1.575V | 1.425V | 20μA | 4.5kB | 6144 | 36864 | 250000 | 250MHz | 700μm | 8mm | 8mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||
 | A3PN015-2QNG68 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 68-VFQFN Exposed Pad | 68 | 49 | -20°C~85°C TJ | Tray | ProASIC3 nano | 活跃 | 3 (168 Hours) | 68 | 1.425V~1.575V | QUAD | 260 | 1.5V | 0.4mm | 30 | A3PN015 | 49 | 1.5V | 1.51.5/3.3V | 1mA | 现场可编程门阵列 | 15000 | 350MHz | 2 | 384 | 384 | 384 | 880μm | 8mm | 8mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||
| A3PN015-2QNG68I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 68-VFQFN Exposed Pad | 68 | 49 | -40°C~100°C TJ | Tray | 2009 | ProASIC3 nano | 活跃 | 3 (168 Hours) | 68 | 1.425V~1.575V | QUAD | 260 | 1.5V | 0.4mm | 30 | A3PN015 | 49 | 1.5V | 1.51.5/3.3V | 1mA | 现场可编程门阵列 | 15000 | 350MHz | 2 | 384 | 384 | 384 | 880μm | 8mm | 8mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||
 | AGLN010V5-QNG48 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 5 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 48-VFQFN Exposed Pad | 48 | 48-QFN (6x6) | 34 | -20°C~85°C TJ | Tray | 2013 | IGLOO nano | 活跃 | 3 (168 Hours) | 70°C | -20°C | 1.425V~1.575V | AGLN010 | 1.5V | 1.575V | 1.425V | 3μA | 260 | 10000 | 250MHz | 880μm | 6mm | 6mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||
| A3PN060-VQG100 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 100-VQFP (14x14) | 71 | -20°C~85°C TJ | Tray | ProASIC3 nano | 活跃 | 3 (168 Hours) | 70°C | -20°C | 1.425V~1.575V | A3PN060 | 1.5V | 1.575V | 1.425V | 2.3kB | 2mA | 2.3kB | 660 | 18432 | 60000 | 350MHz | 1536 | 1mm | 14mm | 14mm | 无 | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||
| AGLN015V2-QNG68 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 68-VFQFN Exposed Pad | 68 | 68-QFN (8x8) | 49 | -20°C~85°C TJ | Tray | IGLOO nano | 活跃 | 3 (168 Hours) | 70°C | -20°C | 1.14V~1.575V | AGLN015 | 1.5V | 1.575V | 1.14V | 6μA | 384 | 15000 | 250MHz | 880μm | 8mm | 8mm | 符合RoHS标准 |
-
A3P125-2FG144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P125-2VQ100I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P125-2FG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL005-1VF256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL005-1VFG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P250-2VQ100
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P250-1FG144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL005S-VF256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL005-1VFG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL005S-VFG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P250-VQG100I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P250-FG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P250-2FG144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P250-2FG144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P250-1FG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL005S-1VFG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P250-1FGG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1AGL250V5-VQ100I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGL250V5-FG144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGL250V5-CS196
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3PN015-2QNG68
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3PN015-2QNG68I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGLN010V5-QNG48
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3PN060-VQG100
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGLN015V2-QNG68
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)