品牌是'Microsemi' (5267)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 最大电源电压 | 最小电源电压 | 内存大小 | 工作电源电流 | 内存大小 | 时钟频率 | 传播延迟 | 接通延迟时间 | 输入数量 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | 逻辑块数(LABs) | 速度等级 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | EX64-PTQG64I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 64-LQFP | 64 | 360.605934mg | 41 | -40°C~85°C TA | Tray | 2006 | EX | e3 | 活跃 | 1 (Unlimited) | 64 | Matte Tin (Sn) | LG-MIN; WD-MIN; TERM PITCH-MIN | 8542.39.00.01 | 2.3V~2.7V | QUAD | 鸥翼 | 260 | 2.5V | 0.5mm | 40 | EX64 | 2.5V | 357MHz | 现场可编程门阵列 | 128 | 3000 | 0.7 ns | 1.4mm | 10mm | 10mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||
![]() | AGLP030V2-CS201I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 201-VFBGA, CSBGA | 201 | 201-CSP (8x8) | 120 | -40°C~100°C TJ | Tray | 2015 | IGLOO PLUS | 活跃 | 3 (168 Hours) | 85°C | -40°C | 1.14V~1.575V | AGLP030 | 1.5V | 1.575V | 1.14V | 792 | 30000 | 892.86MHz | 792 | 660μm | 8mm | 8mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||
![]() | AGLP125V5-CS281 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 22 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 281-TFBGA, CSBGA | 281 | 281-CSP (10x10) | 212 | 0°C~85°C TJ | Tray | 2015 | IGLOO PLUS | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | AGLP125 | 1.5V | 1.575V | 1.425V | 4.5kB | 3120 | 36864 | 125000 | 892.86MHz | 1024 | 3120 | 710μm | 10mm | 10mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||
![]() | AGLP060V5-CSG201I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | Copper, Silver, Tin | 表面贴装 | 表面贴装 | 201-VFBGA, CSBGA | 201 | 201-CSP (8x8) | 157 | -40°C~100°C TJ | Tray | 2015 | IGLOO PLUS | 活跃 | 3 (168 Hours) | 85°C | -40°C | 1.425V~1.575V | AGLP060 | 1.5V | 1.575V | 1.425V | 2.3kB | 1584 | 18432 | 60000 | 892.86MHz | 512 | 1584 | 660μm | 8mm | 8mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||
![]() | APA300-PQG208I | Microsemi Corporation | 数据表 | 43 In Stock | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 158 | -40°C~85°C TA | Tray | 2004 | ProASICPLUS | e3 | 活跃 | 3 (168 Hours) | 208 | 哑光锡 | 8542.39.00.01 | 2.3V~2.7V | QUAD | 鸥翼 | 245 | 2.5V | 0.5mm | 180MHz | 40 | APA300 | 158 | 2.5V | 2.52.5/3.3V | 9kB | 5mA | 9kB | 现场可编程门阵列 | 73728 | 300000 | 8192 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||
![]() | M2GL025T-1VFG400 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 400-LFBGA | 400 | 207 | 0°C~85°C TJ | Tray | 2013 | IGLOO2 | 活跃 | 3 (168 Hours) | 400 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 0.8mm | 30 | M2GL025T | 207 | 不合格 | 1.2V | 138kB | 现场可编程门阵列 | 27696 | 1130496 | 1.51mm | 17mm | 17mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||
![]() | A3P250-1FG144T | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | -40°C~125°C TA | Tray | 2009 | Automotive, AEC-Q100, ProASIC3 | e0 | 活跃 | 3 (168 Hours) | 144 | 锡铅银 | 1.425V~1.575V | BOTTOM | BALL | 235 | 1.5V | 20 | A3P250 | 97 | 1.5V | 4.5kB | 现场可编程门阵列 | 36864 | 250000 | 272MHz | 1 | 6144 | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
![]() | A54SX08A-1TQG100 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 100-LQFP | 100 | 657.000198mg | 81 | 0°C~70°C TA | Tray | 2007 | SX-A | e3 | 活跃 | 3 (168 Hours) | 100 | Matte Tin (Sn) | 8000 TYPICAL GATES AVAILABLE | 2.25V~5.25V | QUAD | 鸥翼 | 260 | 2.5V | 0.5mm | 278MHz | 40 | A54SX08A | 127 | 2.5V | 2.53.3/5V | 1.1 ns | 1.1 ns | 现场可编程门阵列 | 768 | 12000 | 1 | 512 | 768 | 768 | 1.4mm | 14mm | 14mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||
![]() | M2GL025-1VFG400I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 9 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 400-LFBGA | YES | 400 | 207 | -40°C~100°C TJ | Tray | 2013 | IGLOO2 | 活跃 | 3 (168 Hours) | 400 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 0.8mm | 30 | M2GL025 | 207 | 不合格 | 1.2V | 138kB | 现场可编程门阵列 | 27696 | 1130496 | 1.51mm | 17mm | 17mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||
![]() | A3P250-FG256T | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 157 | -40°C~125°C TA | Tray | 2002 | Automotive, AEC-Q100, ProASIC3 | e0 | 活跃 | 3 (168 Hours) | 256 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | 20 | A3P250 | 157 | 1.5V | 1.5/3.3V | 4.5kB | 现场可编程门阵列 | 36864 | 250000 | 231MHz | 6144 | 1.2mm | 17mm | 17mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||
![]() | A3P1000L-FG144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 144-FPBGA (13x13) | 400.011771mg | 97 | 0°C~85°C TJ | Tray | 2009 | ProASIC3L | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.14V~1.575V | A3P1000L | 1.2V | 1.26V | 1.14V | 18kB | 147456 | 1000000 | 781.25MHz | 24576 | 1.05mm | 13mm | 13mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||
![]() | M1AFS250-FGG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 400.011771mg | 114 | 0°C~85°C TJ | Tray | 2013 | Fusion® | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | 1.0989GHz | M1AFS250 | 1.5V | 1.575V | 1.425V | 4.5kB | 36864 | 250000 | 1.0989GHz | 6144 | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||
![]() | M2GL025T-1FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 484-BGA | YES | 267 | 0°C~85°C TJ | Tray | 2012 | IGLOO2 | 活跃 | 3 (168 Hours) | 484 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 1mm | 30 | M2GL025T | S-PBGA-B484 | 267 | 不合格 | 1.2V | 138kB | 267 | 现场可编程门阵列 | 27696 | 1130496 | 2.44mm | 23mm | 23mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||
![]() | M1A3P1000-2FG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | -40°C~100°C TJ | Tray | 2003 | ProASIC3 | e0 | 活跃 | 3 (168 Hours) | 144 | 锡铅银 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | 30 | M1A3P1000 | 1.5V | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 310MHz | 2 | 24576 | 1.55mm | 13mm | 13mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||
![]() | A54SX08A-1TQG144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 144-LQFP | 144 | 1.319103g | 113 | 0°C~70°C TA | Tray | 2007 | SX-A | e3 | 活跃 | 3 (168 Hours) | 144 | Matte Tin (Sn) | 8000 TYPICAL GATES AVAILABLE | 2.25V~5.25V | QUAD | 鸥翼 | 260 | 2.5V | 0.5mm | 278MHz | 40 | A54SX08A | 113 | 2.5V | 2.53.3/5V | 1.1 ns | 1.1 ns | 现场可编程门阵列 | 768 | 12000 | 1 | 512 | 768 | 768 | 1.4mm | 20mm | 20mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||
![]() | M2GL025TS-1VFG400I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 400-LFBGA | YES | 400 | 207 | -40°C~100°C TJ | Tray | IGLOO2 | 活跃 | 3 (168 Hours) | 400 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 0.8mm | 30 | M2GL025TS | 207 | 不合格 | 1.2V | 138kB | 现场可编程门阵列 | 27696 | 1130496 | 1.51mm | 17mm | 17mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||
![]() | M2GL025TS-1VF400I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 400-LFBGA | YES | 400 | 207 | -40°C~100°C TJ | Tray | IGLOO2 | 活跃 | 3 (168 Hours) | 400 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 0.8mm | 20 | M2GL025TS | 207 | 不合格 | 1.2V | 138kB | 现场可编程门阵列 | 27696 | 1130496 | 1.51mm | 17mm | 17mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||
![]() | M2GL025T-1FGG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 484-BGA | YES | 484 | 267 | -40°C~100°C TJ | Tray | IGLOO2 | 活跃 | 3 (168 Hours) | 484 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 30 | M2GL025T | 267 | 不合格 | 1.2V | 138kB | 现场可编程门阵列 | 27696 | 1130496 | 1 | 2.44mm | 23mm | 23mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||
![]() | M1A3P1000L-FGG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 400.011771mg | 177 | 0°C~85°C TJ | Tray | 2013 | ProASIC3L | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.14V~1.575V | M1A3P1000L | 1.2V | 1.26V | 1.14V | 18kB | 147456 | 1000000 | 781.25MHz | 24576 | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||
![]() | A3P1000L-1FGG144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | 0°C~85°C TJ | Tray | 2009 | ProASIC3L | e1 | 活跃 | 3 (168 Hours) | 144 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.14V~1.575V | BOTTOM | BALL | 260 | 1.2V | 40 | A3P1000L | 97 | 1.2V | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 892.86MHz | 1 | 24576 | 1.05mm | 13mm | 13mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||
![]() | M1A3P1000L-1FG144 | Microsemi Corporation | 数据表 | 100 In Stock | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 144-FPBGA (13x13) | 400.011771mg | 97 | 0°C~85°C TJ | Tray | 2013 | ProASIC3L | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.14V~1.575V | M1A3P1000L | 1.2V | 1.26V | 1.14V | 18kB | 147456 | 1000000 | 892.86MHz | 1 | 24576 | 1.05mm | 13mm | 13mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||
![]() | M1AFS250-1FGG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 400.011771mg | 114 | 0°C~85°C TJ | Tray | 2013 | Fusion® | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | M1AFS250 | 1.5V | 1.575V | 1.425V | 4.5kB | 36864 | 250000 | 1.28205GHz | 1 | 6144 | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||
![]() | A3P1000L-1FG144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 144-FPBGA (13x13) | 400.011771mg | 97 | 0°C~85°C TJ | Tray | 2009 | ProASIC3L | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.14V~1.575V | A3P1000L | 1.2V | 1.26V | 1.14V | 18kB | 147456 | 1000000 | 892.86MHz | 1 | 24576 | 1.05mm | 13mm | 13mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||
![]() | A3P250-1FG256T | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 157 | -40°C~125°C TA | Tray | 2013 | Automotive, AEC-Q100, ProASIC3 | e0 | 活跃 | 3 (168 Hours) | 256 | 锡铅银 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 20 | A3P250 | 157 | 1.5V | 3mA | 4.5kB | 现场可编程门阵列 | 36864 | 250000 | 272MHz | 1 | 6144 | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||
![]() | M1A3P600L-FG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 177 | -40°C~100°C TJ | Tray | 2013 | ProASIC3L | e0 | 活跃 | 3 (168 Hours) | 144 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | 1.14V~1.575V | BOTTOM | BALL | 225 | 1.2V | 1mm | 30 | M1A3P600L | 97 | 1.2V | 1.5/3.3V | 13.5kB | 现场可编程门阵列 | 110592 | 600000 | 781.25MHz | 13824 | 1.05mm | 13mm | 13mm | 无 | Non-RoHS Compliant |
EX64-PTQG64I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
AGLP030V2-CS201I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
AGLP125V5-CS281
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
AGLP060V5-CSG201I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
APA300-PQG208I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL025T-1VFG400
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3P250-1FG144T
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX08A-1TQG100
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL025-1VFG400I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3P250-FG256T
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3P1000L-FG144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M1AFS250-FGG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL025T-1FGG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M1A3P1000-2FG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
A54SX08A-1TQG144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL025TS-1VFG400I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL025TS-1VF400I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL025T-1FGG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M1A3P1000L-FGG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3P1000L-1FGG144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M1A3P1000L-1FG144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M1AFS250-1FGG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3P1000L-1FG144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3P250-1FG256T
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M1A3P600L-FG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
