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品牌是'Microsemi' (5267)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 最大电源电压 | 最小电源电压 | 工作电源电流 | 内存大小 | 传播延迟 | 接通延迟时间 | 输入数量 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | LABs数量/ CLBs数量 | 筛选水平 | 逻辑块数(LABs) | 速度等级 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | AX2000-FG896M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 896-BGA | 896 | 400.011771mg | 586 | Military grade | -55°C~125°C TA | Tray | 2012 | Axcelerator | e0 | 活跃 | 3 (168 Hours) | 896 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 30 | AX2000 | 684 | 1.5V | 1.51.5/3.32.5/3.3V | 36kB | 990 ps | 现场可编程门阵列 | 21504 | 294912 | 2000000 | 649MHz | 32256 | MIL-STD-883 Class B | 0.99 ns | 1.73mm | 31mm | 31mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||
 | AX2000-FG1152M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 1152-BGA | 1152 | 400.011771mg | 684 | Military grade | -55°C~125°C TA | Tray | 2012 | Axcelerator | 活跃 | 3 (168 Hours) | 3A001.A.2.C | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | 20 | AX2000 | 684 | 1.5V | 1.51.5/3.32.5/3.3V | 36kB | 990 ps | 现场可编程门阵列 | 21504 | 294912 | 2000000 | 649MHz | 32256 | MIL-STD-883 Class B | 0.99 ns | 1.73mm | 35mm | 35mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||
 | AGLE600V2-FG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 14 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 165 | -40°C~85°C TA | Tray | 2012 | IGLOOe | e0 | 活跃 | 3 (168 Hours) | 256 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | 1.14V~1.575V | BOTTOM | BALL | 230 | 1.2V | 1mm | 30 | AGLE600 | 165 | 1.5V | 13.5kB | 现场可编程门阵列 | 13824 | 110592 | 600000 | 892.86MHz | 1.2mm | 17mm | 17mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||
| AGLE600V2-FGG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 14 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 165 | -40°C~85°C TA | Tray | 2012 | IGLOOe | e1 | 活跃 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.14V~1.575V | BOTTOM | BALL | 250 | 1.2V | 1mm | 40 | AGLE600 | 165 | 1.5V | 13.5kB | 现场可编程门阵列 | 13824 | 110592 | 600000 | 892.86MHz | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||
| M2GL050T-1FGG896 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 896-BGA | YES | 377 | 0°C~85°C TJ | Tray | 2013 | IGLOO2 | 活跃 | 3 (168 Hours) | 896 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 1mm | 30 | M2GL050T | S-PBGA-B896 | 377 | 不合格 | 1.2V | 228.3kB | 377 | 现场可编程门阵列 | 56340 | 1869824 | 2.44mm | 31mm | 31mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||
| M2GL050T-1FG896 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 896-BGA | YES | 377 | 0°C~85°C TJ | Tray | 2013 | IGLOO2 | 活跃 | 3 (168 Hours) | 896 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 1mm | 20 | M2GL050T | S-PBGA-B896 | 377 | 不合格 | 1.2V | 228.3kB | 377 | 现场可编程门阵列 | 56340 | 1869824 | 2.44mm | 31mm | 31mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
| A3P060-FG144T | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 144-FPBGA (13x13) | 400.011771mg | 96 | -40°C~125°C TA | Tray | 2008 | Automotive, AEC-Q100, ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | -40°C | 1.425V~1.575V | A3P060 | 1.5V | 1.575V | 1.425V | 2.3kB | 18432 | 60000 | 231MHz | 1536 | 1.05mm | 13mm | 13mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||
 | A3P400-1FGG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | -40°C~100°C TJ | Tray | 2008 | ProASIC3 | e1 | 活跃 | 3 (168 Hours) | 144 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 260 | 1.5V | 272MHz | 40 | A3P400 | 1.5V | 6.8kB | 现场可编程门阵列 | 55296 | 400000 | 1 | 9216 | 1.05mm | 13mm | 13mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||
| AGLP060V2-CSG201I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 201-VFBGA, CSBGA | 201 | 201-CSP (8x8) | 157 | -40°C~100°C TJ | Tray | 2012 | IGLOO PLUS | 活跃 | 3 (168 Hours) | 85°C | -40°C | 1.14V~1.575V | AGLP060 | 1.5V | 1.575V | 1.14V | 2.3kB | 1584 | 18432 | 60000 | 892.86MHz | 512 | 1584 | 660μm | 8mm | 8mm | 无 | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||
 | AGLP030V5-CSG289I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 15 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 289-TFBGA, CSBGA | 289 | 289-CSP (14x14) | 120 | -40°C~100°C TJ | Tray | IGLOO PLUS | 活跃 | 3 (168 Hours) | 85°C | -40°C | 1.425V~1.575V | AGLP030 | 1.5V | 1.575V | 1.425V | 792 | 30000 | 892.86MHz | 256 | 792 | 810μm | 14mm | 14mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||
| A3P060-1FG144T | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 96 | -40°C~125°C TA | Tray | Automotive, AEC-Q100, ProASIC3 | e0 | 活跃 | 3 (168 Hours) | 144 | 锡铅银 | 1.425V~1.575V | BOTTOM | BALL | 235 | 1.5V | 20 | A3P060 | 96 | 1.5V | 2.3kB | 现场可编程门阵列 | 18432 | 60000 | 272MHz | 1 | 1536 | 1.05mm | 13mm | 13mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||
 | EX128-TQG64A | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 64-LQFP | 64 | 360.605934mg | 46 | -40°C~125°C TA | Tray | 2012 | EX | e3 | 活跃 | 1 (Unlimited) | 64 | Matte Tin (Sn) | LG-MIN; WD-MIN; TERM PITCH-MIN | 8542.39.00.01 | 2.3V~2.7V | QUAD | 鸥翼 | 260 | 0.5mm | 40 | EX128 | 2.5V | 1.1 ns | 现场可编程门阵列 | 256 | 6000 | 250MHz | 1.4mm | 10mm | 10mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||
| M1A3P400-1FG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 178 | -40°C~100°C TJ | Tray | 2003 | ProASIC3 | e0 | 活跃 | 3 (168 Hours) | 256 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | 30 | M1A3P400 | 不合格 | 6.8kB | 现场可编程门阵列 | 55296 | 400000 | 9216 | 1.8mm | 17mm | 17mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
| AGLP030V2-CS289I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 289-TFBGA, CSBGA | 289 | 289-CSP (14x14) | 120 | -40°C~100°C TJ | Tray | 2015 | IGLOO PLUS | 活跃 | 3 (168 Hours) | 85°C | -40°C | 1.14V~1.575V | AGLP030 | 1.5V | 1.575V | 1.14V | 792 | 30000 | 892.86MHz | 256 | 792 | 810μm | 14mm | 14mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||
| AGLP060V5-CS289I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 289-TFBGA, CSBGA | 289 | 289-CSP (14x14) | 157 | -40°C~100°C TJ | Tray | 2012 | IGLOO PLUS | 活跃 | 3 (168 Hours) | 85°C | -40°C | 1.425V~1.575V | AGLP060 | 1.5V | 1.575V | 1.425V | 2.3kB | 1584 | 18432 | 60000 | 892.86MHz | 512 | 1584 | 810μm | 14mm | 14mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||
| AGLP030V2-CSG289I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 289-TFBGA, CSBGA | 289 | 289-CSP (14x14) | 120 | -40°C~100°C TJ | Tray | IGLOO PLUS | 活跃 | 3 (168 Hours) | 85°C | -40°C | 1.14V~1.575V | AGLP030 | 1.5V | 1.575V | 1.14V | 792 | 30000 | 892.86MHz | 792 | 810μm | 14mm | 14mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||
| AGLP060V5-CSG289I | Microsemi Corporation | 数据表 | 10143 In Stock | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 289-TFBGA, CSBGA | 289 | 289-CSP (14x14) | 157 | -40°C~100°C TJ | Tray | 2015 | IGLOO PLUS | 活跃 | 3 (168 Hours) | 85°C | -40°C | 1.425V~1.575V | AGLP060 | 1.5V | 1.575V | 1.425V | 2.3kB | 1584 | 18432 | 60000 | 892.86MHz | 512 | 1584 | 810μm | 14mm | 14mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||
 | M2GL010T-1FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 484-BGA | YES | 233 | -40°C~100°C TJ | Tray | 2013 | IGLOO2 | 活跃 | 3 (168 Hours) | 484 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 1mm | 20 | M2GL010T | S-PBGA-B484 | 233 | 不合格 | 1.2V | 114kB | 233 | 现场可编程门阵列 | 12084 | 933888 | 2.44mm | 23mm | 23mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
| M1A3P600L-FGG144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 144-FPBGA (13x13) | 400.011771mg | 177 | 0°C~85°C TJ | Tray | ProASIC3L | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.14V~1.575V | M1A3P600L | 1.2V | 1.26V | 1.14V | 13.5kB | 110592 | 600000 | 781.25MHz | 13824 | 1.05mm | 13mm | 13mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||
| AGLP060V2-CS289I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 289-TFBGA, CSBGA | 289 | 289-CSP (14x14) | 157 | -40°C~100°C TJ | Tray | 2015 | IGLOO PLUS | 活跃 | 3 (168 Hours) | 85°C | -40°C | 1.14V~1.575V | AGLP060 | 1.5V | 1.575V | 1.14V | 2.3kB | 1584 | 18432 | 60000 | 892.86MHz | 512 | 1584 | 810μm | 14mm | 14mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||
| M2GL010TS-1FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 484-BGA | YES | 233 | -40°C~100°C TJ | Tray | IGLOO2 | 活跃 | 3 (168 Hours) | 484 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 1mm | 20 | M2GL010TS | S-PBGA-B484 | 233 | 不合格 | 1.2V | 114kB | 233 | 现场可编程门阵列 | 12084 | 933888 | 2.44mm | 23mm | 23mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||
| A3P250-FG144T | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | -40°C~125°C TA | Tray | 2009 | Automotive, AEC-Q100, ProASIC3 | e0 | 活跃 | 3 (168 Hours) | 144 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 235 | 1.5V | 1mm | 20 | A3P250 | 97 | 1.5V | 1.5/3.3V | 4.5kB | 现场可编程门阵列 | 36864 | 250000 | 231MHz | 6144 | 1.55mm | 13mm | 13mm | 无 | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||
 | M2GL025T-VF400 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 400-LFBGA | YES | 400 | 207 | 0°C~85°C TJ | Tray | 2013 | IGLOO2 | 活跃 | 3 (168 Hours) | 400 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 0.8mm | 20 | M2GL025T | 207 | 不合格 | 1.2V | 138kB | 现场可编程门阵列 | 27696 | 1130496 | 1.51mm | 17mm | 17mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||
| EX64-TQG64 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 64-LQFP | 64 | 360.605934mg | 41 | 0°C~70°C TA | Tray | 2006 | EX | e3 | 活跃 | 1 (Unlimited) | 64 | Matte Tin (Sn) | LG-MIN; WD-MIN; TERM PITCH-MIN | 8542.39.00.01 | 2.3V~2.7V | QUAD | 鸥翼 | 260 | 2.5V | 0.5mm | 250MHz | 40 | EX64 | 2.5V | 1.1 ns | 1.1 ns | 现场可编程门阵列 | 3000 | 128 | 1.4mm | 10mm | 10mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||
 | A3PN250-1VQG100I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 68 | -40°C~100°C TJ | Tray | 2009 | ProASIC3 nano | 活跃 | 3 (168 Hours) | 100 | 1.425V~1.575V | QUAD | 鸥翼 | 260 | 1.5V | 0.5mm | 40 | A3PN250 | 1.5V | 3mA | 4.5kB | 现场可编程门阵列 | 36864 | 250000 | 350MHz | 1 | 6144 | 1mm | 14mm | 14mm | 无 | 符合RoHS标准 |
-
AX2000-FG896M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX2000-FG1152M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGLE600V2-FG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGLE600V2-FGG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL050T-1FGG896
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL050T-1FG896
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P060-FG144T
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P400-1FGG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGLP060V2-CSG201I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGLP030V5-CSG289I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P060-1FG144T
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
EX128-TQG64A
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P400-1FG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGLP030V2-CS289I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGLP060V5-CS289I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGLP030V2-CSG289I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGLP060V5-CSG289I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL010T-1FG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P600L-FGG144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGLP060V2-CS289I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL010TS-1FG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P250-FG144T
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL025T-VF400
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
EX64-TQG64
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3PN250-1VQG100I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)