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品牌是'Microsemi' (5267)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 输出的数量 | 资历状况 | 电源 | 内存大小 | 内存大小 | 传播延迟 | 接通延迟时间 | 电流源 | 输入数量 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | 逻辑块数(LABs) | 速度等级 | 寄存器数量 | 逻辑块数量 | 逻辑单元数 | 电压 - 供电 （最大值） | 电压 - 供电 （最小值） | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | M2GL025T-1VFG400 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 400-LFBGA | 400 | 207 | 0°C~85°C TJ | Tray | 2013 | IGLOO2 | 活跃 | 3 (168 Hours) | 400 | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 260 | 0.8mm | 30 | M2GL025T | 207 | 不合格 | 1.2V | 138kB | 现场可编程门阵列 | 27696 | 1130496 | 1.51mm | 17mm | 17mm | 符合RoHS标准 | ||||||||||||||||||||||||||||
 | A3P250-1FG144T | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | -40°C~125°C TA | Tray | 2009 | Automotive, AEC-Q100, ProASIC3 | e0 | 活跃 | 3 (168 Hours) | 144 | 锡铅银 | 1.5V | BOTTOM | BALL | 235 | 20 | A3P250 | 97 | 4.5kB | 现场可编程门阵列 | 36864 | 250000 | 272MHz | 1 | 6144 | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||
 | A54SX08A-1TQG100 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 100-LQFP | 100 | 657.000198mg | 81 | 0°C~70°C TA | Tray | 2007 | SX-A | e3 | 活跃 | 3 (168 Hours) | 100 | Matte Tin (Sn) | 8000 TYPICAL GATES AVAILABLE | 2.5V | QUAD | 鸥翼 | 260 | 0.5mm | 278MHz | 40 | A54SX08A | 127 | 2.53.3/5V | 1.1 ns | 1.1 ns | 现场可编程门阵列 | 768 | 12000 | 1 | 512 | 768 | 768 | 1.4mm | 14mm | 14mm | 无 | 符合RoHS标准 | |||||||||||||||||||
| M2GL025-1VFG400I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 9 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 400-LFBGA | YES | 400 | 207 | -40°C~100°C TJ | Tray | 2013 | IGLOO2 | 活跃 | 3 (168 Hours) | 400 | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 260 | 0.8mm | 30 | M2GL025 | 207 | 不合格 | 1.2V | 138kB | 现场可编程门阵列 | 27696 | 1130496 | 1.51mm | 17mm | 17mm | 符合RoHS标准 | ||||||||||||||||||||||||||||
 | A3P250-FG256T | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 157 | -40°C~125°C TA | Tray | 2002 | Automotive, AEC-Q100, ProASIC3 | e0 | 活跃 | 3 (168 Hours) | 256 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | 1.5V | BOTTOM | BALL | 225 | 1mm | 20 | A3P250 | 157 | 1.5/3.3V | 4.5kB | 现场可编程门阵列 | 36864 | 250000 | 231MHz | 6144 | 1.2mm | 17mm | 17mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||
| A3P1000L-FG144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 144-FPBGA (13x13) | 400.011771mg | 97 | 0°C~85°C TJ | Tray | 2009 | ProASIC3L | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.2V | A3P1000L | 18kB | 147456 | 1000000 | 781.25MHz | 24576 | 1.26V | 1.14V | 1.05mm | 13mm | 13mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||
| M1AFS250-FGG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 400.011771mg | 114 | 0°C~85°C TJ | Tray | 2013 | Fusion® | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | 1.0989GHz | M1AFS250 | 4.5kB | 36864 | 250000 | 1.0989GHz | 6144 | 1.575V | 1.425V | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||
 | M2GL025T-1FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 484-BGA | YES | 267 | 0°C~85°C TJ | Tray | 2012 | IGLOO2 | 活跃 | 3 (168 Hours) | 484 | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 260 | 1mm | 30 | M2GL025T | S-PBGA-B484 | 267 | 不合格 | 1.2V | 138kB | 267 | 现场可编程门阵列 | 27696 | 1130496 | 2.44mm | 23mm | 23mm | 符合RoHS标准 | |||||||||||||||||||||||||||
| M1A3P1000-2FG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | -40°C~100°C TJ | Tray | 2003 | ProASIC3 | e0 | 活跃 | 3 (168 Hours) | 144 | 锡铅银 | 1.5V | BOTTOM | BALL | 225 | 1mm | 30 | M1A3P1000 | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 310MHz | 2 | 24576 | 1.55mm | 13mm | 13mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||
 | A54SX08A-1TQG144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 144-LQFP | 144 | 1.319103g | 113 | 0°C~70°C TA | Tray | 2007 | SX-A | e3 | 活跃 | 3 (168 Hours) | 144 | Matte Tin (Sn) | 8000 TYPICAL GATES AVAILABLE | 2.5V | QUAD | 鸥翼 | 260 | 0.5mm | 278MHz | 40 | A54SX08A | 113 | 2.53.3/5V | 1.1 ns | 1.1 ns | 现场可编程门阵列 | 768 | 12000 | 1 | 512 | 768 | 768 | 1.4mm | 20mm | 20mm | 无 | 符合RoHS标准 | |||||||||||||||||||
| M2GL025TS-1VFG400I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 400-LFBGA | YES | 400 | 207 | -40°C~100°C TJ | Tray | IGLOO2 | 活跃 | 3 (168 Hours) | 400 | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 260 | 0.8mm | 30 | M2GL025TS | 207 | 不合格 | 1.2V | 138kB | 现场可编程门阵列 | 27696 | 1130496 | 1.51mm | 17mm | 17mm | 符合RoHS标准 | |||||||||||||||||||||||||||||
| M2GL025TS-1VF400I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 400-LFBGA | YES | 400 | 207 | -40°C~100°C TJ | Tray | IGLOO2 | 活跃 | 3 (168 Hours) | 400 | 1.2V | BOTTOM | BALL | 240 | 0.8mm | 20 | M2GL025TS | 207 | 不合格 | 1.2V | 138kB | 现场可编程门阵列 | 27696 | 1130496 | 1.51mm | 17mm | 17mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||
| M2GL025T-1FGG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 484-BGA | YES | 484 | 267 | -40°C~100°C TJ | Tray | IGLOO2 | 活跃 | 3 (168 Hours) | 484 | 1.2V | BOTTOM | BALL | 260 | 30 | M2GL025T | 267 | 不合格 | 138kB | 现场可编程门阵列 | 27696 | 1130496 | 1 | 2.44mm | 23mm | 23mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||
| M1A3P1000L-FGG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 400.011771mg | 177 | 0°C~85°C TJ | Tray | 2013 | ProASIC3L | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.2V | M1A3P1000L | 18kB | 147456 | 1000000 | 781.25MHz | 24576 | 1.26V | 1.14V | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||
 | A3P1000L-1FGG144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | 0°C~85°C TJ | Tray | 2009 | ProASIC3L | e1 | 活跃 | 3 (168 Hours) | 144 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.2V | BOTTOM | BALL | 260 | 40 | A3P1000L | 97 | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 892.86MHz | 1 | 24576 | 1.05mm | 13mm | 13mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||
 | M1A3P1000L-1FG144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 144-FPBGA (13x13) | 400.011771mg | 97 | 0°C~85°C TJ | Tray | 2013 | ProASIC3L | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.2V | M1A3P1000L | 18kB | 147456 | 1000000 | 892.86MHz | 1 | 24576 | 1.26V | 1.14V | 1.05mm | 13mm | 13mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||
| M1AFS250-1FGG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 400.011771mg | 114 | 0°C~85°C TJ | Tray | 2013 | Fusion® | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | M1AFS250 | 4.5kB | 36864 | 250000 | 1.28205GHz | 1 | 6144 | 1.575V | 1.425V | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||
 | A3P1000L-1FG144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 144-FPBGA (13x13) | 400.011771mg | 97 | 0°C~85°C TJ | Tray | 2009 | ProASIC3L | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.2V | A3P1000L | 18kB | 147456 | 1000000 | 892.86MHz | 1 | 24576 | 1.26V | 1.14V | 1.05mm | 13mm | 13mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||
 | A3PN020-2QNG68 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 68-VFQFN Exposed Pad | 68 | 49 | -20°C~85°C TJ | Tray | 2009 | ProASIC3 nano | 活跃 | 3 (168 Hours) | 68 | 1.5V | QUAD | 无铅 | 260 | 0.4mm | 30 | A3PN020 | 不合格 | 1mA | 现场可编程门阵列 | 20000 | 350MHz | 2 | 520 | 520 | 880μm | 8mm | 8mm | 符合RoHS标准 | ||||||||||||||||||||||||||||
 | EX64-TQG64A | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 64-LQFP | 64 | 360.605934mg | 41 | -40°C~125°C TA | Tray | 2006 | EX | e3 | 活跃 | 1 (Unlimited) | 64 | Matte Tin (Sn) | LG-MIN; WD-MIN; TERM PITCH-MIN | 8542.39.00.01 | 2.5V | QUAD | 鸥翼 | 260 | 0.5mm | 40 | EX64 | 1.1 ns | 现场可编程门阵列 | 128 | 3000 | 250MHz | 1.4mm | 10mm | 10mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||
| M2GL005-1FGG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 484-BGA | YES | 484 | 209 | -40°C~100°C TJ | Tray | 2013 | IGLOO2 | 活跃 | 3 (168 Hours) | 484 | 1.2V | BOTTOM | BALL | 260 | 30 | M2GL005 | 209 | 不合格 | 87.9kB | 87.9kB | 现场可编程门阵列 | 6060 | 719872 | 1 | 2.44mm | 23mm | 23mm | 符合RoHS标准 | |||||||||||||||||||||||||||||
| M2GL005S-1VFG400I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 400-LFBGA | YES | 400 | 171 | -40°C~100°C TJ | Tray | IGLOO2 | 活跃 | 3 (168 Hours) | 400 | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 260 | 0.8mm | 30 | M2GL005S | 171 | 不合格 | 1.2V | 87.9kB | 现场可编程门阵列 | 6060 | 719872 | 1.51mm | 17mm | 17mm | 符合RoHS标准 | |||||||||||||||||||||||||||||
 | AGLP030V5-CS289 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 15 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 289-TFBGA, CSBGA | 289 | 289-CSP (14x14) | 120 | 0°C~85°C TJ | Tray | 2012 | IGLOO PLUS | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | AGLP030 | 792 | 30000 | 892.86MHz | 792 | 1.575V | 1.425V | 810μm | 14mm | 14mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
| AGLP030V5-CS201I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 15 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 201-VFBGA, CSBGA | 201 | 201-CSP (8x8) | 120 | -40°C~100°C TJ | Tray | 2015 | IGLOO PLUS | 活跃 | 3 (168 Hours) | 85°C | -40°C | 1.5V | AGLP030 | 792 | 30000 | 892.86MHz | 256 | 792 | 1.575V | 1.425V | 660μm | 8mm | 8mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||
| A3P400-1FGG144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 144-FPBGA (13x13) | 400.011771mg | 97 | 0°C~85°C TJ | Tray | 2013 | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | 272MHz | A3P400 | 6.8kB | 55296 | 400000 | 272MHz | 1 | 9216 | 1.575V | 1.425V | 1.05mm | 13mm | 13mm | 无 | 符合RoHS标准 |
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M2GL025T-1VFG400
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P250-1FG144T
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A54SX08A-1TQG100
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL025-1VFG400I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P250-FG256T
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P1000L-FG144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1AFS250-FGG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL025T-1FGG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P1000-2FG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A54SX08A-1TQG144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL025TS-1VFG400I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL025TS-1VF400I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL025T-1FGG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P1000L-FGG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P1000L-1FGG144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P1000L-1FG144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1AFS250-1FGG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P1000L-1FG144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3PN020-2QNG68
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
EX64-TQG64A
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL005-1FGG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL005S-1VFG400I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGLP030V5-CS289
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGLP030V5-CS201I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P400-1FGG144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)