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品牌是'Microsemi' (5267)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 内存大小 | 工作电源电流 | 内存大小 | 时钟频率 | 输入数量 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | 寄存器数量 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | A3P250L-VQ100I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 68 | -40°C~100°C TJ | Tray | 2009 | ProASIC3L | e0 | Obsolete | 3 (168 Hours) | 100 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.14V~1.575V | QUAD | 鸥翼 | 225 | 1.2V | 0.5mm | 30 | A3P250L | 68 | 1.2V | 1.5/3.3V | 3mA | 4.5kB | 现场可编程门阵列 | 36864 | 250000 | 781.25MHz | 6144 | 1mm | 14mm | 14mm | 无 | Non-RoHS Compliant | ||||||||||||||||
 | AGL125V2-FGG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | Copper, Silver, Tin | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | -40°C~85°C TA | Tray | 2013 | IGLOO | e1 | 活跃 | 3 (168 Hours) | 144 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.14V~1.575V | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | AGL125 | 1.5V | 4.5kB | 现场可编程门阵列 | 3072 | 36864 | 125000 | 892.86MHz | 1.05mm | 13mm | 13mm | 无 | 符合RoHS标准 | ||||||||||||||||
| M1AGL1000V2-FG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 97 | -40°C~85°C TA | Tray | 2013 | IGLOO | e0 | 活跃 | 3 (168 Hours) | 144 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | 1.14V~1.575V | BOTTOM | BALL | 225 | 1.2V | 1mm | 30 | M1AGL1000 | 不合格 | 18kB | 108MHz | 现场可编程门阵列 | 24576 | 147456 | 1000000 | 1.55mm | 13mm | 13mm | Non-RoHS Compliant | |||||||||||||||||||||
 | APA450-FG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | IN PRODUCTION (Last Updated: 3 days ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 100 | -40°C~85°C TA | Tray | 2009 | ProASICPLUS | e0 | 活跃 | 3 (168 Hours) | 144 | 3A001.A.7.A | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | 2.3V~2.7V | BOTTOM | BALL | 240 | 2.5V | 1mm | 180MHz | 30 | APA450 | 100 | 2.5V | 2.52.5/3.3V | 13.5kB | 现场可编程门阵列 | 110592 | 450000 | 12288 | 1.05mm | 13mm | 13mm | 无 | Non-RoHS Compliant | |||||||||||||||
 | AGL400V2-CSG196I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 196-TFBGA, CSBGA | 196 | 143 | -40°C~85°C TA | Tray | IGLOO | 活跃 | 3 (168 Hours) | 196 | 8542.39.00.01 | 1.14V~1.575V | BOTTOM | BALL | 1.2V | 0.5mm | AGL400 | 1.5V | 27μA | 6.8kB | 现场可编程门阵列 | 9216 | 55296 | 400000 | 250MHz | 700μm | 8mm | 8mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||
 | M2GL010T-1FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 484-BGA | YES | 484 | 233 | 0°C~85°C TJ | Tray | IGLOO2 | 活跃 | 3 (168 Hours) | 484 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 1mm | 30 | M2GL010T | 233 | 1.2V | 114kB | 现场可编程门阵列 | 12084 | 933888 | 2.44mm | 23mm | 23mm | 无 | 符合RoHS标准 | 无铅 | |||||||||||||||||||||
 | A3P125-FG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 15 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | Lead, Silver, Tin | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | -40°C~100°C TJ | Tray | 2009 | ProASIC3 | e0 | 活跃 | 3 (168 Hours) | 144 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | 231MHz | 30 | A3P125 | 1.5V | 4.5kB | 现场可编程门阵列 | 36864 | 125000 | 3072 | 1.05mm | 13mm | 13mm | 无 | Non-RoHS Compliant | ||||||||||||||||
 | M2GL005-1TQG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 144-LQFP | YES | 84 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 144 | 8542.39.00.01 | 1.14V~2.625V | QUAD | 鸥翼 | 260 | 1.2V | 0.5mm | 30 | S-PQFP-G144 | 现场可编程门阵列 | 6060 | 719872 | 1.6mm | 20mm | 20mm | 符合RoHS标准 | ||||||||||||||||||||||||||
 | M2GL005-1VFG400I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 400-LFBGA | YES | 400 | 169 | -40°C~100°C TJ | Tray | 2013 | IGLOO2 | 活跃 | 3 (168 Hours) | 400 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 0.8mm | 30 | M2GL005 | 171 | 不合格 | 1.2V | 87.9kB | 现场可编程门阵列 | 6060 | 719872 | 1.51mm | 17mm | 17mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||
| AGL250V5-VQ100I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 68 | -40°C~85°C TA | Tray | 2013 | IGLOO | e0 | 活跃 | 3 (168 Hours) | 100 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.425V~1.575V | QUAD | 鸥翼 | 230 | 1.5V | 0.5mm | 30 | AGL250 | 不合格 | 1.5V | 4.5kB | 现场可编程门阵列 | 6144 | 36864 | 250000 | 892.86MHz | 1mm | 14mm | 14mm | Non-RoHS Compliant | ||||||||||||||||||
| M2GL025T-VFG400I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 400-LFBGA | YES | 195 | -40°C~100°C TJ | Tray | 2013 | IGLOO2 | 活跃 | 3 (168 Hours) | 400 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 0.8mm | 30 | S-PBGA-B400 | 207 | 不合格 | 1.2V | 207 | 现场可编程门阵列 | 27696 | 1130496 | 1.51mm | 17mm | 17mm | 符合RoHS标准 | ||||||||||||||||||||||
| M1AGL250V5-FG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | -40°C~85°C TA | Tray | 2013 | IGLOO | e0 | 活跃 | 3 (168 Hours) | 144 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | 30 | M1AGL250 | 不合格 | 1.5V | 4.5kB | 108MHz | 现场可编程门阵列 | 6144 | 36864 | 250000 | 1.05mm | 13mm | 13mm | Non-RoHS Compliant | |||||||||||||||||
| AGL250V5-FG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 22 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | -40°C~85°C TA | Tray | IGLOO | e0 | 活跃 | 3 (168 Hours) | 144 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | 30 | AGL250 | 不合格 | 1.5V | 4.5kB | 现场可编程门阵列 | 6144 | 36864 | 250000 | 892.86MHz | 1.05mm | 13mm | 13mm | Non-RoHS Compliant | ||||||||||||||||||
| AGL250V2-FG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 22 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | -40°C~85°C TA | Tray | IGLOO | e0 | 活跃 | 3 (168 Hours) | 144 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | 1.14V~1.575V | BOTTOM | BALL | 230 | 1.2V | 1mm | 30 | AGL250 | 不合格 | 1.5V | 4.5kB | 现场可编程门阵列 | 6144 | 36864 | 250000 | 892.86MHz | 1.05mm | 13mm | 13mm | Non-RoHS Compliant | ||||||||||||||||||
| A3P1000-FG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | Lead, Silver, Tin | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | -40°C~100°C TJ | Tray | 2013 | ProASIC3 | e0 | 活跃 | 3 (168 Hours) | 144 | 3A001.A.7.A | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | 231MHz | 30 | A3P1000 | 1.5V | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 24576 | 1.55mm | 13mm | 13mm | 无 | Non-RoHS Compliant | 含铅 | ||||||||||||||
| AGL600V5-FGG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 17 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | -40°C~85°C TA | Tray | 2009 | IGLOO | e1 | 活跃 | 3 (168 Hours) | 144 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 260 | 1.5V | 1mm | 40 | AGL600 | 1.5V | 13.5kB | 现场可编程门阵列 | 13824 | 110592 | 600000 | 892.86MHz | 1.05mm | 13mm | 13mm | 无 | 符合RoHS标准 | 无铅 | ||||||||||||||||
 | A3P1000-FG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | Lead, Silver, Tin | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 177 | -40°C~100°C TJ | Tray | 2000 | ProASIC3 | e0 | 活跃 | 3 (168 Hours) | 256 | 3A001.A.7.A | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | 231MHz | 30 | A3P1000 | 1.5V | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 24576 | 1.8mm | 17mm | 17mm | 无 | Non-RoHS Compliant | |||||||||||||||
| A3P1000-FG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 177 | 0°C~85°C TJ | Tray | 2000 | ProASIC3 | 活跃 | 3 (168 Hours) | 256 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | 231MHz | 30 | A3P1000 | 1.5V | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 24576 | 1.8mm | 17mm | 17mm | 无 | Non-RoHS Compliant | ||||||||||||||||||
| M2GL025-1VF400I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 9 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 400-LFBGA | YES | 400 | 207 | -40°C~100°C TJ | Tray | IGLOO2 | 活跃 | 3 (168 Hours) | 400 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 0.8mm | 20 | M2GL025 | 207 | 不合格 | 1.2V | 138kB | 现场可编程门阵列 | 27696 | 1130496 | 1.51mm | 17mm | 17mm | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||
 | M2GL025T-FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 4 weeks ago) | 表面贴装 | 484-BGA | YES | 267 | -40°C~100°C TJ | Tray | 2013 | IGLOO2 | 活跃 | 3 (168 Hours) | 484 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 1mm | 20 | S-PBGA-B484 | 267 | 不合格 | 1.2V | 267 | 现场可编程门阵列 | 27696 | 1130496 | 2.44mm | 23mm | 23mm | Non-RoHS Compliant | 无铅 | |||||||||||||||||||||
| AGL600V2-FG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 17 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 144-LBGA | YES | 144 | 400.011771mg | 97 | -40°C~85°C TA | Tray | 2013 | IGLOO | e0 | 活跃 | 3 (168 Hours) | 144 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | 1.14V~1.575V | BOTTOM | BALL | 230 | 1.2V | 1mm | 30 | AGL600 | 不合格 | 1.5V | 13.5kB | 现场可编程门阵列 | 13824 | 110592 | 600000 | 892.86MHz | 1.05mm | 13mm | 13mm | Non-RoHS Compliant | |||||||||||||||||
| M2GL050-FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 25 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 484-BGA | YES | 484 | 267 | 0°C~85°C TJ | Tray | 2013 | IGLOO2 | 活跃 | 3 (168 Hours) | 484 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 1mm | 30 | M2GL050 | 267 | 不合格 | 1.2V | 228.3kB | 现场可编程门阵列 | 56340 | 1869824 | 2.44mm | 23mm | 23mm | 符合RoHS标准 | |||||||||||||||||||||
| M2GL010-FGG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BGA | YES | 233 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 484 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 1mm | 30 | S-PBGA-B484 | 233 | 不合格 | 1.2V | 233 | 现场可编程门阵列 | 12084 | 933888 | 2.44mm | 23mm | 23mm | 符合RoHS标准 | ||||||||||||||||||||||
| M2GL005-TQG144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 11 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 144-LQFP | YES | 144 | 84 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 144 | 8542.39.00.01 | 1.14V~2.625V | QUAD | 鸥翼 | 260 | 1.2V | 0.5mm | 30 | 1.2V | 87.9kB | 现场可编程门阵列 | 6060 | 719872 | 1.6mm | 20mm | 20mm | 符合RoHS标准 | ||||||||||||||||||||||||
| M2GL005-FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 11 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 484-BGA | YES | 484 | 209 | 0°C~85°C TJ | Tray | IGLOO2 | 活跃 | 3 (168 Hours) | 484 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 1mm | 30 | M2GL005 | 209 | 不合格 | 1.2V | 87.9kB | 87.9kB | 现场可编程门阵列 | 6060 | 719872 | 2.44mm | 23mm | 23mm | 符合RoHS标准 |
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A3P250L-VQ100I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGL125V2-FGG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1AGL1000V2-FG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
APA450-FG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGL400V2-CSG196I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL010T-1FGG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P125-FG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL005-1TQG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL005-1VFG400I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGL250V5-VQ100I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL025T-VFG400I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1AGL250V5-FG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGL250V5-FG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGL250V2-FG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P1000-FG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGL600V5-FGG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P1000-FG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P1000-FG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL025-1VF400I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL025T-FG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGL600V2-FG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL050-FGG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL010-FGG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL005-TQG144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL005-FGG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)