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品牌是'Microsemi' (5267)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 输出的数量 | 工作电源电压 | 电源 | 最大电源电压 | 最小电源电压 | 工作电源电流 | 内存大小 | 传播延迟 | 接通延迟时间 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | LABs数量/ CLBs数量 | 筛选水平 | 逻辑块数(LABs) | 速度等级 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 高度 | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | M1A3P1000L-1FG256I | Microsemi Corporation | 数据表 | 100 In Stock | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 177 | -40°C~100°C TJ | Tray | 2013 | ProASIC3L | e0 | 活跃 | 3 (168 Hours) | 256 | TIN LEAD/TIN LEAD SILVER | 1.14V~1.575V | BOTTOM | BALL | 225 | 1.2V | 30 | M1A3P1000L | 177 | 1.2V | 8mA | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 892.86MHz | 1 | 24576 | 1.2mm | 17mm | 17mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||
 | A42MX09-1TQG176I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 176-LQFP | 176 | 104 | -40°C~85°C TA | Tray | 2009 | MX | e3 | 活跃 | 3 (168 Hours) | 176 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 3V~3.6V 4.5V~5.5V | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | A42MX09 | 5V | 现场可编程门阵列 | 14000 | 247MHz | 336 | 1 | 516 | 684 | 1.4mm | 24mm | 24mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||
 | M1AFS600-FGG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 119 | -40°C~100°C TJ | Tray | 2013 | Fusion® | e1 | 活跃 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 260 | 1.5V | 1mm | 1.0989GHz | 40 | M1AFS600 | 1.5V | 13.5kB | 现场可编程门阵列 | 110592 | 600000 | 13824 | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||
 | M1A3PE1500-FG676I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 676-BGA | 676 | 400.011771mg | 444 | -40°C~100°C TJ | Tray | ProASIC3E | e0 | 活跃 | 3 (168 Hours) | 676 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | 30 | M1A3PE1500 | 444 | 1.5V | 1.5/3.3V | 33.8kB | 现场可编程门阵列 | 276480 | 1500000 | 231MHz | 38400 | 1.73mm | 27mm | 27mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||
 | A3P1000-FG484T | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | Lead, Tin | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 400.011771mg | 300 | -40°C~125°C TA | Tray | 2009 | Automotive, AEC-Q100, ProASIC3 | 活跃 | 3 (168 Hours) | 125°C | 0°C | 1.425V~1.575V | A3P1000 | 1.5V | 1.575V | 1.425V | 8mA | 18kB | 147456 | 1000000 | 231MHz | 24576 | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
| AFS600-1FG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 119 | -40°C~100°C TJ | Tray | 2013 | Fusion® | 活跃 | 3 (168 Hours) | 256 | TIN LEAD/TIN LEAD SILVER | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 30 | AFS600 | 1.5V | 13.5kB | 现场可编程门阵列 | 110592 | 600000 | 1.28205GHz | 1 | 13824 | 1.2mm | 17mm | 17mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||
| AX250-2FG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 400.011771mg | 138 | 0°C~70°C TA | Tray | 2005 | Axcelerator | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | 870MHz | AX250 | 1.5V | 1.575V | 1.425V | 6.8kB | 740 ps | 740 ps | 2816 | 55296 | 250000 | 870MHz | 4224 | 2816 | 2 | 2816 | 1.2mm | 17mm | 17mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||
| M1A3PE1500-2FG676I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 676-BGA | 676 | 400.011771mg | 444 | -40°C~100°C TJ | Tray | 2015 | ProASIC3E | e0 | 活跃 | 3 (168 Hours) | 676 | 锡铅 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | 30 | M1A3PE1500 | 444 | 1.5V | 1.5/3.3V | 33.8kB | 现场可编程门阵列 | 276480 | 1500000 | 310MHz | 2 | 38400 | 1.73mm | 27mm | 27mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||
 | AFS600-2FGG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 119 | -40°C~100°C TJ | Tray | 2000 | Fusion® | e1 | 活跃 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 260 | 1.5V | 1mm | 40 | AFS600 | 1.5V | 13.5kB | 现场可编程门阵列 | 110592 | 600000 | 1.47059GHz | 2 | 13824 | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||
 | M1AFS600-1FGG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 172 | -40°C~100°C TJ | Tray | 2013 | Fusion® | e1 | 活跃 | 3 (168 Hours) | 484 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 250 | 1.5V | 40 | M1AFS600 | 1.5V | 13.5kB | 现场可编程门阵列 | 110592 | 600000 | 1.28205GHz | 1 | 13824 | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||
 | AX500-FG676 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 676-BGA | 676 | 400.011771mg | 336 | 0°C~70°C TA | Tray | 2012 | Axcelerator | e0 | 活跃 | 3 (168 Hours) | 676 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | 649MHz | 30 | AX500 | 336 | 1.5V | 1.51.5/3.32.5/3.3V | 9kB | 990 ps | 990 ps | 现场可编程门阵列 | 73728 | 500000 | 8064 | 5376 | 0.99 ns | 1.73mm | 27mm | 27mm | 无 | Non-RoHS Compliant | |||||||||||||||||||
| AX1000-FG484M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 317 | Military grade | -55°C~125°C TA | Tray | 2012 | Axcelerator | e0 | 活跃 | 3 (168 Hours) | 484 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | 30 | AX1000 | 516 | 1.5V | 1.51.5/3.32.5/3.3V | 20.3kB | 990 ps | 现场可编程门阵列 | 12096 | 165888 | 1000000 | 649MHz | 18144 | MIL-STD-883 Class B | 0.99 ns | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant | |||||||||||||||||
 | APA1000-BGG456I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 22 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 456-BBGA | 456 | 356 | -40°C~85°C TA | Tray | 2009 | ProASICPLUS | 活跃 | 3 (168 Hours) | 456 | 8542.39.00.01 | 2.3V~2.7V | BOTTOM | BALL | 245 | 2.5V | 1.27mm | 40 | APA1000 | 356 | 2.5V | 2.52.5/3.3V | 24.8kB | 现场可编程门阵列 | 202752 | 1000000 | 180MHz | 56320 | 1.73mm | 35mm | 35mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||
| AX1000-1FG896M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 896-BGA | 896 | 400.011771mg | 516 | Military grade | -55°C~125°C TA | Tray | 2012 | Axcelerator | e0 | 活跃 | 3 (168 Hours) | 896 | 锡铅 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 30 | AX1000 | 516 | 1.5V | 20.3kB | 850 ps | 现场可编程门阵列 | 12096 | 165888 | 1000000 | 763MHz | 18144 | MIL-STD-883 Class B | 1 | 0.84 ns | 1.73mm | 31mm | 31mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||
 | AX500-1CQ208M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 208-BFCQFP with Tie Bar | 208 | 10.567001g | 115 | Military grade | -55°C~125°C TA | Tray | Axcelerator | e0 | 活跃 | 3 (168 Hours) | 208 | 锡铅 | 1.425V~1.575V | QUAD | FLAT | 225 | 1.5V | 0.5mm | 20 | AX500 | 336 | 1.5V | 6.8kB | 850 ps | 现场可编程门阵列 | 2816 | 73728 | 500000 | 763MHz | 8064 | MIL-STD-883 Class B | 1 | 5376 | 0.84 ns | 2.8mm | 29.21mm | 29.21mm | 无 | Non-RoHS Compliant | |||||||||||||||||||
| AFS600-1FG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 400.011771mg | 119 | 0°C~85°C TJ | Tray | 2013 | Fusion® | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | AFS600 | 1.5V | 1.575V | 1.425V | 13.5kB | 110592 | 600000 | 1.28205GHz | 1 | 13824 | 1.2mm | 17mm | 17mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||
| APA300-BG456I | Microsemi Corporation | 数据表 | 24 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 456-BBGA | 456 | 290 | -40°C~85°C TA | Tray | 2009 | ProASICPLUS | 活跃 | 3 (168 Hours) | 456 | 3A001.A.7.A | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | 2.3V~2.7V | BOTTOM | BALL | 225 | 2.5V | 1.27mm | 30 | APA300 | 290 | 2.5V | 2.52.5/3.3V | 9kB | 现场可编程门阵列 | 73728 | 300000 | 180MHz | 8192 | 1.73mm | 35mm | 35mm | 无 | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||
| AFS600-2FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 172 | -40°C~100°C TJ | Tray | Fusion® | e0 | 活跃 | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | 30 | AFS600 | 1.5V | 13.5kB | 现场可编程门阵列 | 110592 | 600000 | 1.47059GHz | 2 | 13824 | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||
 | APA450-FG144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 14 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 100 | 0°C~70°C TA | Tray | 2009 | ProASICPLUS | e0 | 活跃 | 3 (168 Hours) | 144 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | 2.3V~2.7V | BOTTOM | BALL | 225 | 2.5V | 1mm | 180MHz | 30 | APA450 | 100 | 2.5V | 2.52.5/3.3V | 13.5kB | 现场可编程门阵列 | 110592 | 450000 | 12288 | 1.05mm | 13mm | 13mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||
| M7AFS600-1FGG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 17 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 119 | -40°C~85°C TA | Tray | Fusion® | e1 | 活跃 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 260 | 1.5V | 40 | M7AFS600 | 1.5V | 13.5kB | 现场可编程门阵列 | 110592 | 600000 | 1.28205GHz | 1 | 13824 | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||
| AFS600-2FGG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 172 | -40°C~100°C TJ | Tray | 2013 | Fusion® | e1 | 活跃 | 3 (168 Hours) | 484 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 250 | 1.5V | 1mm | 40 | AFS600 | 1.5V | 13.5kB | 现场可编程门阵列 | 110592 | 600000 | 1.47059GHz | 2 | 13824 | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||
| A54SX72A-FG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-BGA | 256 | 256-FPBGA (17x17) | 400.011771mg | 203 | 0°C~70°C TA | Tray | 2000 | SX-A | 活跃 | 3 (168 Hours) | 70°C | 0°C | 2.25V~5.25V | 217MHz | A54SX72A | 2.5V | 2.75V | 2.25V | 1.5 ns | 1.5 ns | 6036 | 108000 | 217MHz | 6036 | 6036 | 4024 | 1.2mm | 17mm | 17mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||
| M7AFS600-FGG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 17 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 172 | -40°C~85°C TA | Tray | Fusion® | e1 | 活跃 | 3 (168 Hours) | 484 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 250 | 1.5V | 1mm | 40 | M7AFS600 | 1.5V | 13.5kB | 现场可编程门阵列 | 110592 | 600000 | 1.0989GHz | 13824 | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||
| AX500-1FG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 317 | 0°C~70°C TA | Tray | 2012 | Axcelerator | e0 | 活跃 | 3 (168 Hours) | 484 | 锡铅 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 763MHz | 30 | AX500 | 336 | 1.5V | 9kB | 850 ps | 850 ps | 现场可编程门阵列 | 73728 | 500000 | 8064 | 1 | 5376 | 0.84 ns | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||
| AX500-FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 317 | -40°C~85°C TA | Tray | 2012 | Axcelerator | e0 | 活跃 | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | 649MHz | 30 | AX500 | 336 | 1.5V | 1.51.5/3.32.5/3.3V | 9kB | 990 ps | 990 ps | 现场可编程门阵列 | 73728 | 500000 | 8064 | 5376 | 0.99 ns | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant |
-
M1A3P1000L-1FG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A42MX09-1TQG176I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1AFS600-FGG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3PE1500-FG676I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P1000-FG484T
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AFS600-1FG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX250-2FG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3PE1500-2FG676I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AFS600-2FGG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1AFS600-1FGG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX500-FG676
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX1000-FG484M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
APA1000-BGG456I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX1000-1FG896M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX500-1CQ208M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AFS600-1FG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
APA300-BG456I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AFS600-2FG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
APA450-FG144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M7AFS600-1FGG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AFS600-2FGG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A54SX72A-FG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M7AFS600-FGG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX500-1FG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX500-FG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)