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品牌是'Microsemi' (5267)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 最大电源电压 | 最小电源电压 | 工作电源电流 | 内存大小 | 传播延迟 | 接通延迟时间 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | LABs数量/ CLBs数量 | 筛选水平 | 逻辑块数(LABs) | 速度等级 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | M2GL025T-1VFG400I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 400-LFBGA | YES | 400 | 207 | -40°C~100°C TJ | Tray | 2013 | IGLOO2 | 活跃 | 3 (168 Hours) | 400 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 0.8mm | 30 | M2GL025T | 207 | 不合格 | 1.2V | 138kB | 现场可编程门阵列 | 27696 | 1130496 | 1.51mm | 17mm | 17mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||
 | M2GL025-1FGG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 9 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 484-BGA | YES | 484 | 267 | -40°C~100°C TJ | Tray | 2013 | IGLOO2 | 活跃 | 3 (168 Hours) | 484 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 30 | M2GL025 | 267 | 不合格 | 现场可编程门阵列 | 27696 | 1130496 | 1 | 2.44mm | 23mm | 23mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||
 | M1A3P1000-2FG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 400.011771mg | 177 | 0°C~85°C TJ | Tray | 2003 | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | M1A3P1000 | 1.5V | 1.575V | 1.425V | 18kB | 147456 | 1000000 | 310MHz | 2 | 24576 | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||
| M1A3P1000-1FG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 177 | -40°C~100°C TJ | Tray | 2003 | ProASIC3 | e0 | 活跃 | 3 (168 Hours) | 256 | TIN LEAD/TIN LEAD SILVER | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 30 | M1A3P1000 | 1.5V | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 272MHz | 1 | 24576 | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||
| M2GL050-VF400 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 25 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 400-LFBGA | YES | 400 | 207 | 0°C~85°C TJ | Tray | 2013 | IGLOO2 | 活跃 | 3 (168 Hours) | 400 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 0.8mm | 20 | M2GL050 | 207 | 不合格 | 1.2V | 228.3kB | 现场可编程门阵列 | 56340 | 1869824 | 1.51mm | 17mm | 17mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||
| M1A3P1000L-FG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 400.011771mg | 177 | 0°C~85°C TJ | Tray | 2013 | ProASIC3L | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.14V~1.575V | M1A3P1000L | 1.2V | 1.26V | 1.14V | 18kB | 147456 | 1000000 | 781.25MHz | 24576 | 1.2mm | 17mm | 17mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
 | AFS250-1FGG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 400.011771mg | 114 | 0°C~85°C TJ | Tray | Fusion® | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | AFS250 | 1.5V | 1.575V | 1.425V | 4.5kB | 36864 | 250000 | 1.28205GHz | 1 | 6144 | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||
 | AX500-1FG676I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 676-BGA | 676 | 400.011771mg | 336 | -40°C~85°C TA | Tray | 2012 | Axcelerator | e0 | 活跃 | 3 (168 Hours) | 676 | 锡铅 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 763MHz | 30 | AX500 | 336 | 1.5V | 9kB | 850 ps | 850 ps | 现场可编程门阵列 | 73728 | 500000 | 8064 | 1 | 5376 | 0.84 ns | 1.73mm | 27mm | 27mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||
| M1AFS1500-2FGG676 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 676-BGA | 676 | 676-FBGA (27x27) | 400.011771mg | 252 | 0°C~85°C TJ | Tray | 2013 | Fusion® | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | M1AFS1500 | 1.5V | 1.575V | 1.425V | 33.8kB | 276480 | 1500000 | 1.47059GHz | 2 | 38400 | 1.73mm | 27mm | 27mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||
| A54SX72A-2FG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-BGA | 256 | 400.011771mg | 203 | -40°C~85°C TA | Tray | 2007 | SX-A | e0 | 活跃 | 3 (168 Hours) | 256 | 锡铅 | 2.25V~5.25V | BOTTOM | BALL | 225 | 2.5V | 1mm | 294MHz | 20 | A54SX72A | 203 | 2.5V | 1.1 ns | 1.1 ns | 现场可编程门阵列 | 6036 | 108000 | 2 | 4024 | 1.2mm | 17mm | 17mm | 无 | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||
| M1A3PE3000L-1FGG896 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 896-BGA | 896 | 896-FBGA (31x31) | 400.011771mg | 620 | 0°C~85°C TJ | Tray | 2013 | ProASIC3L | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.14V~1.575V | M1A3PE3000L | 1.2V | 1.26V | 1.14V | 25mA | 63kB | 516096 | 3000000 | 892.86MHz | 1 | 75264 | 1.73mm | 31mm | 31mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||
| M1AFS1500-FG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 119 | -40°C~100°C TJ | Tray | 2013 | Fusion® | 活跃 | 3 (168 Hours) | 256 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | 1.0989GHz | 30 | M1AFS1500 | 1.5V | 33.8kB | 现场可编程门阵列 | 276480 | 1500000 | 38400 | 1.2mm | 17mm | 17mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||
 | AX1000-1FG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 317 | 0°C~70°C TA | Tray | 2012 | Axcelerator | e0 | 活跃 | 3 (168 Hours) | 484 | 锡铅 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 763MHz | 30 | AX1000 | 516 | 1.5V | 20.3kB | 850 ps | 850 ps | 现场可编程门阵列 | 165888 | 1000000 | 18144 | 1 | 12096 | 0.84 ns | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||
| AFS1500-FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 223 | -40°C~100°C TJ | Tray | 2013 | Fusion® | e0 | 活跃 | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | 1.0989GHz | 30 | AFS1500 | 1.5V | 33.8kB | 现场可编程门阵列 | 276480 | 1500000 | 38400 | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||
| AFS1500-1FGG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 119 | -40°C~100°C TJ | Tray | 2013 | Fusion® | e1 | 活跃 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 260 | 1.5V | 40 | AFS1500 | 1.5V | 33.8kB | 现场可编程门阵列 | 276480 | 1500000 | 1.28205GHz | 1 | 38400 | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||
| AFS1500-1FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 223 | -40°C~100°C TJ | Tray | 2013 | Fusion® | e0 | 活跃 | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 30 | AFS1500 | 1.5V | 33.8kB | 现场可编程门阵列 | 276480 | 1500000 | 1.28205GHz | 1 | 38400 | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||
| AFS1500-FG676I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 表面贴装 | 表面贴装 | 676-BGA | 676 | 400.011771mg | 252 | -40°C~100°C TJ | Tray | Fusion® | e0 | 活跃 | 3 (168 Hours) | 676 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | 1.0989GHz | 30 | AFS1500 | 1.5V | 33.8kB | 现场可编程门阵列 | 276480 | 1500000 | 38400 | 1.73mm | 27mm | 27mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||
| M1AFS1500-FGG676I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 676-BGA | 676 | 400.011771mg | 252 | -40°C~100°C TJ | Tray | 2013 | Fusion® | e1 | 活跃 | 3 (168 Hours) | 676 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 250 | 1.5V | 1mm | 1.0989GHz | 40 | M1AFS1500 | 1.5V | 33.8kB | 现场可编程门阵列 | 276480 | 1500000 | 38400 | 1.73mm | 27mm | 27mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||
| M1AFS1500-FG676I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 676-BGA | 676 | 400.011771mg | 252 | -40°C~100°C TJ | Tray | 2013 | Fusion® | e0 | 活跃 | 3 (168 Hours) | 676 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | 1.0989GHz | 30 | M1AFS1500 | 1.5V | 33.8kB | 现场可编程门阵列 | 276480 | 1500000 | 38400 | 1.73mm | 27mm | 27mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||
| AFS1500-1FGG676I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 676-BGA | 676 | 400.011771mg | 252 | -40°C~100°C TJ | Tray | 2013 | Fusion® | e1 | 活跃 | 3 (168 Hours) | 676 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 250 | 1.5V | 40 | AFS1500 | 1.5V | 33.8kB | 现场可编程门阵列 | 276480 | 1500000 | 1.28205GHz | 1 | 38400 | 1.73mm | 27mm | 27mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||
 | A42MX36-BGG272I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 表面贴装 | 表面贴装 | 272-BBGA | 272 | 202 | -40°C~85°C TA | Tray | MX | e1 | 活跃 | 3 (168 Hours) | 272 | Tin/Silver/Copper (Sn/Ag/Cu) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | 3V~3.6V 4.5V~5.5V | BOTTOM | BALL | 250 | 3.3V | 40 | A42MX36 | 5V | 320B | 现场可编程门阵列 | 2560 | 54000 | 131MHz | 1184 | 1822 | 2.7 ns | 2438 | 1.73mm | 27mm | 27mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||
 | M1A3PE3000L-PQG208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 147 | -40°C~100°C TJ | Tray | ProASIC3L | e3 | 活跃 | 3 (168 Hours) | 208 | Matte Tin (Sn) | 8542.39.00.01 | 1.14V~1.575V | QUAD | 鸥翼 | 245 | 1.2V | 0.5mm | 40 | M1A3PE3000L | 147 | 1.2V | 1.5/3.3V | 63kB | 现场可编程门阵列 | 516096 | 3000000 | 781.25MHz | 75264 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||
| AX2000-1CQ352M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 352-BFCQFP with Tie Bar | 352 | 10.567001g | 198 | Military grade | -55°C~125°C TA | Tray | 2005 | Axcelerator | e0 | 活跃 | 3 (168 Hours) | 352 | 锡铅 | 1.425V~1.575V | QUAD | FLAT | 225 | 1.5V | 0.5mm | 20 | AX2000 | 684 | 1.5V | 36kB | 850 ps | 现场可编程门阵列 | 21504 | 294912 | 2000000 | 763MHz | 32256 | MIL-STD-883 Class B | 1 | 0.84 ns | 2.66mm | 48mm | 48mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||
| M2GL050-1VF400 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 9 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 400-LFBGA | YES | 400 | 207 | 0°C~85°C TJ | Tray | 2013 | IGLOO2 | 活跃 | 3 (168 Hours) | 400 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 0.8mm | 20 | M2GL050 | 207 | 不合格 | 1.2V | 228.3kB | 现场可编程门阵列 | 56340 | 1869824 | 1.51mm | 17mm | 17mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||
| A3P1000L-1FGG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 177 | 0°C~85°C TJ | Tray | 2009 | ProASIC3L | e1 | 活跃 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.14V~1.575V | BOTTOM | BALL | 260 | 1.2V | 40 | A3P1000L | 177 | 1.2V | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 892.86MHz | 1 | 24576 | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 |
-
M2GL025T-1VFG400I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL025-1FGG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P1000-2FG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P1000-1FG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL050-VF400
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P1000L-FG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AFS250-1FGG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX500-1FG676I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1AFS1500-2FGG676
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A54SX72A-2FG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3PE3000L-1FGG896
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1AFS1500-FG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX1000-1FG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AFS1500-FG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AFS1500-1FGG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AFS1500-1FG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AFS1500-FG676I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1AFS1500-FGG676I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1AFS1500-FG676I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AFS1500-1FGG676I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A42MX36-BGG272I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3PE3000L-PQG208I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX2000-1CQ352M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL050-1VF400
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P1000L-1FGG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)