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品牌是'Microsemi' (5267)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 端子表面处理 | 最高工作温度 | 最小工作温度 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 最大电源电压 | 最小电源电压 | 内存大小 | 工作电源电流 | 内存大小 | 传播延迟 | 接通延迟时间 | 输入数量 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | LABs数量/ CLBs数量 | 逻辑块数(LABs) | 速度等级 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | M1A3P1000L-FGG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 177 | -40°C~100°C TJ | Tray | 2013 | ProASIC3L | e1 | 活跃 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.14V~1.575V | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | M1A3P1000L | 177 | 1.2V | 1.5/3.3V | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 781.25MHz | 24576 | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||
 | M1AFS600-2FG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 400.011771mg | 172 | 0°C~85°C TJ | Tray | 2013 | Fusion® | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | M1AFS600 | 1.5V | 1.575V | 1.425V | 13.5kB | 110592 | 600000 | 1.47059GHz | 2 | 13824 | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||
 | AX500-PQG208 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 22 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | Tin | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 115 | 0°C~70°C TA | Tray | 2005 | Axcelerator | e3 | 活跃 | 3 (168 Hours) | 208 | 8542.39.00.01 | 1.425V~1.575V | QUAD | 鸥翼 | 245 | 1.5V | 0.5mm | 649MHz | 40 | AX500 | 336 | 1.5V | 1.51.5/3.32.5/3.3V | 9kB | 990 ps | 990 ps | 现场可编程门阵列 | 73728 | 500000 | 8064 | 5376 | 0.99 ns | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||
| A3P1000-FG144T | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | -40°C~125°C TA | Tray | 2013 | Automotive, AEC-Q100, ProASIC3 | e0 | 活跃 | 3 (168 Hours) | 144 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 235 | 1.5V | 1mm | 20 | A3P1000 | 97 | 1.5V | 1.5/3.3V | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 231MHz | 24576 | 1.55mm | 13mm | 13mm | 无 | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||
 | APA300-FG144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 14 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 100 | 0°C~70°C TA | Tray | ProASICPLUS | e0 | 活跃 | 3 (168 Hours) | 144 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | 2.3V~2.7V | BOTTOM | BALL | 225 | 2.5V | 1mm | 180MHz | 30 | APA300 | 100 | 2.5V | 2.52.5/3.3V | 9kB | 现场可编程门阵列 | 73728 | 300000 | 8192 | 1.05mm | 13mm | 13mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||
 | AGLN010V5-UCG36I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 22 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 36-WFBGA, CSPBGA | 36 | 23 | -40°C~100°C TJ | Tray | IGLOO nano | 活跃 | 3 (168 Hours) | 36 | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 未说明 | 1.5V | 0.4mm | 未说明 | AGLN010 | 不合格 | 1.5V | 3μA | 现场可编程门阵列 | 260 | 10000 | 250MHz | 260 | 0.8mm | 3mm | 3mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||
 | A54SX72A-PQG208 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 208-PQFP (28x28) | 171 | 0°C~70°C TA | Tray | 2007 | SX-A | 活跃 | 3 (168 Hours) | 70°C | 0°C | 2.25V~5.25V | 217MHz | A54SX72A | 2.5V | 2.75V | 2.25V | 3.6mA | 1.5 ns | 1.5 ns | 6036 | 108000 | 217MHz | 6036 | 6036 | 4024 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||
| A3P600-PQG208 | Microsemi Corporation | 数据表 | 150 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 208-PQFP (28x28) | 154 | 0°C~85°C TJ | Tray | 2011 | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | 231MHz | A3P600 | 1.5V | 1.575V | 1.425V | 13.5kB | 5mA | 13.5kB | 6500 | 110592 | 600000 | 231MHz | 13824 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||||
 | A3PN125-VQ100 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 100-VQFP (14x14) | 71 | -20°C~85°C TJ | Tray | 2009 | ProASIC3 nano | 活跃 | 3 (168 Hours) | 70°C | -20°C | 1.425V~1.575V | A3PN125 | 1.5V | 1.575V | 1.425V | 2mA | 4.5kB | 36864 | 125000 | 350MHz | 3072 | 1mm | 14mm | 14mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||
| A3PN060-VQ100I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 71 | -40°C~100°C TJ | Tray | 2000 | ProASIC3 nano | e0 | 活跃 | 3 (168 Hours) | 100 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.425V~1.575V | QUAD | 鸥翼 | 225 | 1.5V | 0.5mm | 30 | A3PN060 | 1.5V | 2mA | 2.3kB | 现场可编程门阵列 | 18432 | 60000 | 350MHz | 1536 | 1mm | 14mm | 14mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||
| A3PN060-2VQ100I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 71 | -40°C~100°C TJ | Tray | 2005 | ProASIC3 nano | e0 | 活跃 | 3 (168 Hours) | 100 | 锡铅 | 1.425V~1.575V | QUAD | 鸥翼 | 225 | 1.5V | 0.5mm | 30 | A3PN060 | 1.5V | 2mA | 2.3kB | 现场可编程门阵列 | 18432 | 60000 | 350MHz | 2 | 1536 | 1mm | 14mm | 14mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||
| A3PN125-1VQG100 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 71 | -20°C~85°C TJ | Tray | 2009 | ProASIC3 nano | 活跃 | 3 (168 Hours) | 100 | 1.425V~1.575V | QUAD | 鸥翼 | 260 | 1.5V | 0.5mm | 40 | A3PN125 | 1.5V | 2mA | 4.5kB | 现场可编程门阵列 | 36864 | 125000 | 350MHz | 1 | 3072 | 1mm | 14mm | 14mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||
| A3PN060-1VQ100I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 71 | -40°C~100°C TJ | Tray | 2009 | ProASIC3 nano | e0 | 活跃 | 3 (168 Hours) | 100 | 锡铅 | 1.425V~1.575V | QUAD | 鸥翼 | 225 | 1.5V | 0.5mm | 30 | A3PN060 | 1.5V | 2mA | 2.3kB | 现场可编程门阵列 | 18432 | 60000 | 350MHz | 1 | 1536 | 1mm | 14mm | 14mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||
| A3PN125-VQ100I | Microsemi Corporation | 数据表 | 5000 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 100-VQFP (14x14) | 71 | -40°C~100°C TJ | Tray | 2009 | ProASIC3 nano | 活跃 | 3 (168 Hours) | 85°C | -40°C | 1.425V~1.575V | A3PN125 | 1.5V | 1.575V | 1.425V | 2mA | 4.5kB | 36864 | 125000 | 350MHz | 3072 | 1mm | 14mm | 14mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||
| AGLN060V5-VQ100I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 22 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 71 | -40°C~100°C TJ | Tray | 2013 | IGLOO nano | e0 | 活跃 | 3 (168 Hours) | 100 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.425V~1.575V | QUAD | 鸥翼 | 230 | 1.5V | 0.5mm | 30 | AGLN060 | 不合格 | 1.5V | 10μA | 2.3kB | 现场可编程门阵列 | 1536 | 18432 | 60000 | 250MHz | 1mm | 14mm | 14mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||
| A3PN125-2VQG100 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 71 | -20°C~85°C TJ | Tray | 2009 | ProASIC3 nano | 活跃 | 3 (168 Hours) | 100 | 1.425V~1.575V | QUAD | 鸥翼 | 260 | 1.5V | 0.5mm | 40 | A3PN125 | 1.5V | 2mA | 4.5kB | 现场可编程门阵列 | 36864 | 125000 | 350MHz | 2 | 3072 | 1mm | 14mm | 14mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||
| A3PN250-1VQG100 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 68 | -20°C~85°C TJ | Tray | 2013 | ProASIC3 nano | 活跃 | 3 (168 Hours) | 100 | 1.425V~1.575V | QUAD | 鸥翼 | 260 | 1.5V | 0.5mm | 40 | A3PN250 | 1.5V | 3mA | 4.5kB | 现场可编程门阵列 | 36864 | 250000 | 350MHz | 1 | 6144 | 1mm | 14mm | 14mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||
| AGLP060V2-CS201I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 201-VFBGA, CSBGA | 201 | 201-CSP (8x8) | 157 | -40°C~100°C TJ | Tray | 2015 | IGLOO PLUS | 活跃 | 3 (168 Hours) | 85°C | -40°C | 1.14V~1.575V | AGLP060 | 1.5V | 1.575V | 1.14V | 2.3kB | 1584 | 18432 | 60000 | 892.86MHz | 512 | 1584 | 660μm | 8mm | 8mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||
 | AGLP125V2-CS289 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 22 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 289-TFBGA, CSBGA | 289 | 289-CSP (14x14) | 212 | 0°C~85°C TJ | Tray | 2015 | IGLOO PLUS | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.14V~1.575V | AGLP125 | 1.5V | 1.575V | 1.14V | 4.5kB | 3120 | 36864 | 125000 | 892.86MHz | 1024 | 3120 | 810μm | 14mm | 14mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||
| M2GL010T-FG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 484-BGA | YES | 233 | 0°C~85°C TJ | Tray | 2013 | IGLOO2 | 活跃 | 3 (168 Hours) | 484 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 1mm | 20 | M2GL010T | S-PBGA-B484 | 233 | 不合格 | 1.2V | 114kB | 233 | 现场可编程门阵列 | 12084 | 933888 | 2.44mm | 23mm | 23mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||
 | M2GL010-1VF400I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 400-LFBGA | YES | 400 | 195 | -40°C~100°C TJ | Tray | 2013 | IGLOO2 | 活跃 | 3 (168 Hours) | 400 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 0.8mm | 20 | M2GL010 | 195 | 不合格 | 1.2V | 114kB | 现场可编程门阵列 | 12084 | 933888 | 1.51mm | 17mm | 17mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||
 | M2GL010-1FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 484-BGA | YES | 233 | 0°C~85°C TJ | Tray | 2013 | IGLOO2 | 活跃 | 3 (168 Hours) | 484 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 1mm | 30 | M2GL010 | S-PBGA-B484 | 233 | 不合格 | 1.2V | 114kB | 233 | 现场可编程门阵列 | 12084 | 933888 | 2.44mm | 23mm | 23mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||
| AGLP030V5-CS289I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 15 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 289-TFBGA, CSBGA | 289 | 289-CSP (14x14) | 120 | -40°C~100°C TJ | Tray | 2015 | IGLOO PLUS | 活跃 | 3 (168 Hours) | 85°C | -40°C | 1.425V~1.575V | AGLP030 | 1.5V | 1.575V | 1.425V | 792 | 30000 | 892.86MHz | 256 | 792 | 810μm | 14mm | 14mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||
| A3P125-1FG144T | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | Automotive grade | -40°C~125°C TA | Tray | 2009 | Automotive, AEC-Q100, ProASIC3 | e0 | 活跃 | 3 (168 Hours) | 144 | 锡铅 | 1.425V~1.575V | BOTTOM | BALL | 235 | 1.5V | 20 | A3P125 | 97 | 1.5V | 4.5kB | 现场可编程门阵列 | 36864 | 125000 | 272MHz | 1 | 3072 | 1.05mm | 13mm | 13mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||
| M2GL025-VF400 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 13 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 400-LFBGA | YES | 400 | 207 | 0°C~85°C TJ | Tray | 2013 | IGLOO2 | no | 活跃 | 3 (168 Hours) | 400 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 未说明 | 1.2V | 0.8mm | 未说明 | M2GL025 | 400 | 207 | 不合格 | 1.2V | 138kB | 现场可编程门阵列 | 27696 | 1130496 | 1.51mm | 17mm | 17mm | Non-RoHS Compliant |
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M1A3P1000L-FGG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1AFS600-2FG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX500-PQG208
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P1000-FG144T
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
APA300-FG144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGLN010V5-UCG36I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A54SX72A-PQG208
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P600-PQG208
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3PN125-VQ100
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3PN060-VQ100I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3PN060-2VQ100I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3PN125-1VQG100
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3PN060-1VQ100I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3PN125-VQ100I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGLN060V5-VQ100I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3PN125-2VQG100
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3PN250-1VQG100
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGLP060V2-CS201I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGLP125V2-CS289
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL010T-FG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL010-1VF400I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL010-1FGG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGLP030V5-CS289I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P125-1FG144T
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL025-VF400
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)