我的订单
会员中心 
在线咨询
0755-83328606
品牌是'Microsemi' (5267)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 资历状况 | 工作电源电压 | 最大电源电压 | 最小电源电压 | 内存大小 | 工作电源电流 | 内存大小 | 时钟频率 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | 速度等级 | 寄存器数量 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | M2GL025-1VF256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 9 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 256-LFBGA | YES | 138 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 256 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 0.8mm | 20 | S-PBGA-B256 | 现场可编程门阵列 | 27696 | 1130496 | 1.56mm | 14mm | 14mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||
 | A3PE600-1FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 400.011771mg | 270 | 0°C~85°C TJ | Tray | 2009 | ProASIC3E | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | 272MHz | A3PE600 | 1.5V | 1.575V | 1.425V | 13.5kB | 110592 | 600000 | 272MHz | 1 | 13824 | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||
| A3PE600-2FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 400.011771mg | 270 | 0°C~85°C TJ | Tray | 2009 | ProASIC3E | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | A3PE600 | 1.5V | 1.575V | 1.425V | 13.5kB | 110592 | 600000 | 310MHz | 2 | 13824 | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||
 | M1AGL600V2-FGG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | -40°C~85°C TA | Tray | IGLOO | e1 | 活跃 | 3 (168 Hours) | 144 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.14V~1.575V | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | M1AGL600 | 不合格 | 1.5V | 13.5kB | 108MHz | 现场可编程门阵列 | 13824 | 110592 | 600000 | 1.05mm | 13mm | 13mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||
| AGL1000V5-FG144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 144-LBGA | 144 | 144-FPBGA (13x13) | 400.011771mg | 97 | 0°C~70°C TA | Tray | IGLOO | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | AGL1000 | 1.5V | 1.575V | 1.425V | 18kB | 24576 | 147456 | 1000000 | 892.86MHz | 1.05mm | 13mm | 13mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||
 | A3P1000-PQG208 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 208-PQFP (28x28) | 154 | 0°C~85°C TJ | Tray | 2008 | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | 231MHz | A3P1000 | 1.5V | 1.575V | 1.425V | 18kB | 8mA | 18kB | 11000 | 147456 | 1000000 | 231MHz | 24576 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||
| A3P250-FGG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 7 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | Copper, Silver, Tin | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 157 | 0°C~85°C TJ | Tray | 2013 | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | 231MHz | A3P250 | 1.5V | 1.575V | 1.425V | 4.5kB | 3mA | 4.5kB | 3000 | 36864 | 250000 | 231MHz | 6144 | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | 无铅 | |||||||||||||||||||||
 | MPF300TS-1FCG1152I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 1152-BBGA, FCBGA | 1152-FCBGA (35x35) | 512 | -40°C~100°C TJ | Tray | PolarFire™ | 活跃 | 3 (168 Hours) | 0.97V~1.08V | 300000 | 21094400 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||
 | M2GL010-TQG144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 11 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 144-LQFP | YES | 84 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 144 | 8542.39.00.01 | 1.14V~2.625V | QUAD | 鸥翼 | 260 | 1.2V | 0.5mm | 30 | S-PQFP-G144 | 现场可编程门阵列 | 12084 | 933888 | 1.6mm | 20mm | 20mm | 符合RoHS标准 | |||||||||||||||||||||||||||||
| A3P400-FGG256I | Microsemi Corporation | 数据表 | 145 In Stock | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 178 | -40°C~100°C TJ | Tray | 2013 | ProASIC3 | e1 | 活跃 | 3 (168 Hours) | 256 | 3A001.A.7.B | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 260 | 1.5V | 1mm | 231MHz | 40 | A3P400 | 1.5V | 6.8kB | 现场可编程门阵列 | 55296 | 400000 | 9216 | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | 无铅 | ||||||||||||||||||
 | MPF100T-FCVG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BFBGA | 484-FPBGA (19x19) | 284 | -40°C~100°C TJ | Tray | PolarFire™ | 活跃 | 4 (72 Hours) | 0.97V~1.08V | 109000 | 7782400 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||
| AFS600-FGG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 119 | 0°C~85°C TJ | Tray | 2000 | Fusion® | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | 1.0989GHz | AFS600 | 1.5V | 1.575V | 1.425V | 13.5kB | 13.5kB | 110592 | 600000 | 350MHz | 13824 | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||
 | A3P030-VQG100 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | Tin | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 100-VQFP (14x14) | 77 | 0°C~85°C TJ | Tray | 2009 | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | 231MHz | A3P030 | 1.5V | 1.575V | 1.425V | 2mA | 330 | 30000 | 231MHz | 768 | 1mm | 14mm | 14mm | 无 | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||
| A3P250-FGG144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 144-FPBGA (13x13) | 97 | 0°C~85°C TJ | Tray | 2012 | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | 231MHz | A3P250 | 1.5V | 1.575V | 1.425V | 4.5kB | 3mA | 4.5kB | 3000 | 36864 | 250000 | 231MHz | 6144 | 1.05mm | 13mm | 13mm | 无 | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||
| MPF200T-FCVG484E | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BFBGA | 484-FPBGA (19x19) | 284 | 0°C~100°C TJ | Tray | PolarFire™ | 活跃 | 3 (168 Hours) | 0.97V~1.08V | 192000 | 13619200 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||
 | MPF300T-FCSG536I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 536-LFBGA, CSPBGA | 536-CSPBGA (16x16) | 300 | -40°C~100°C TJ | Tray | PolarFire™ | 活跃 | 3 (168 Hours) | 0.97V~1.08V | 300000 | 21094400 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||
| MPF200T-FCSG536I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 536-LFBGA, CSPBGA | 536-CSPBGA (16x16) | 300 | -40°C~100°C TJ | Tray | PolarFire™ | 活跃 | 3 (168 Hours) | 0.97V~1.08V | 192000 | 13619200 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||
 | MPF200T-FCSG325E | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 324-LFBGA | 325-FPGA (11x11) | 170 | 0°C~100°C TJ | Tray | PolarFire™ | 活跃 | 3 (168 Hours) | 0.97V~1.08V | 192000 | 13619200 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||
 | MPF300T-FCVG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BBGA, FCBGA | 484-FCBGA (23x23) | 284 | -40°C~100°C TJ | Tray | PolarFire™ | 活跃 | 3 (168 Hours) | 0.97V~1.08V | 300000 | 21094400 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||
| MPF300T-FCVG484E | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BBGA, FCBGA | 484-FCBGA (23x23) | 284 | 0°C~100°C TJ | Tray | PolarFire™ | 活跃 | 3 (168 Hours) | 0.97V~1.08V | 300000 | 21094400 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||
| MPF300T-FCSG536E | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 536-LFBGA, CSPBGA | 536-CSPBGA (16x16) | 300 | 0°C~100°C TJ | Tray | PolarFire™ | 活跃 | 3 (168 Hours) | 0.97V~1.08V | 300000 | 21094400 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||
| MPF200T-FCSG536E | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 536-LFBGA, CSPBGA | 536-CSPBGA (16x16) | 300 | 0°C~100°C TJ | Tray | PolarFire™ | 活跃 | 3 (168 Hours) | 0.97V~1.08V | 192000 | 13619200 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||
| AGL125V5-FGG144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 144-FPBGA (13x13) | 400.011771mg | 97 | 0°C~70°C TA | Tray | 2013 | IGLOO | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | AGL125 | 1.5V | 1.575V | 1.425V | 4.5kB | 3072 | 36864 | 125000 | 892.86MHz | 1.05mm | 13mm | 13mm | 符合RoHS标准 | |||||||||||||||||||||||||||
| MPF100T-FCG484E | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BBGA, FCBGA | 484-FCBGA (23x23) | 244 | 0°C~100°C TJ | Tray | PolarFire™ | 活跃 | 3 (168 Hours) | 0.97V~1.08V | 109000 | 7782400 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||
 | MPF300T-FCG784E | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 784-BBGA, FCBGA | 784-FCBGA (29x29) | 388 | 0°C~100°C TJ | Tray | PolarFire™ | 活跃 | 3 (168 Hours) | 0.97V~1.08V | 300000 | 21094400 | 符合RoHS标准 |
-
M2GL025-1VF256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3PE600-1FGG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3PE600-2FGG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1AGL600V2-FGG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGL1000V5-FG144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P1000-PQG208
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P250-FGG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
MPF300TS-1FCG1152I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL010-TQG144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P400-FGG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
MPF100T-FCVG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AFS600-FGG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P030-VQG100
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P250-FGG144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
MPF200T-FCVG484E
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
MPF300T-FCSG536I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
MPF200T-FCSG536I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
MPF200T-FCSG325E
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
MPF300T-FCVG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
MPF300T-FCVG484E
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
MPF300T-FCSG536E
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
MPF200T-FCSG536E
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGL125V5-FGG144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
MPF100T-FCG484E
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
MPF300T-FCG784E
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)