品牌是'Microsemi' (5267)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 最大电源电压 | 最小电源电压 | 工作电源电流 | 内存大小 | 时钟频率 | 传播延迟 | 输入数量 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | 逻辑块数(LABs) | 速度等级 | 寄存器数量 | 逻辑块数量 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | M2GL010TS-VF256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 256-LFBGA | YES | 138 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 256 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 0.8mm | 20 | S-PBGA-B256 | 现场可编程门阵列 | 12084 | 933888 | 1.56mm | 14mm | 14mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||
![]() | A3P400-2FGG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | -40°C~100°C TJ | Tray | 2009 | ProASIC3 | e1 | 活跃 | 3 (168 Hours) | 144 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 260 | 1.5V | 1mm | 40 | A3P400 | 1.5V | 6.8kB | 现场可编程门阵列 | 55296 | 400000 | 310MHz | 2 | 9216 | 1.05mm | 13mm | 13mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||
![]() | AGL400V2-FGG144 | Microsemi Corporation | 数据表 | 158 In Stock | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 144-FPBGA (13x13) | 400.011771mg | 97 | 0°C~70°C TA | Tray | 2009 | IGLOO | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.14V~1.575V | AGL400 | 1.5V | 1.575V | 1.14V | 27μA | 6.8kB | 9216 | 55296 | 400000 | 250MHz | 12 | 1.05mm | 13mm | 13mm | 无 | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||
![]() | M2GL010TS-FG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BGA | YES | 233 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 484 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 1mm | 20 | S-PBGA-B484 | 233 | 不合格 | 1.2V | 233 | 现场可编程门阵列 | 12084 | 933888 | 2.44mm | 23mm | 23mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||
![]() | A3P400-2FGG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 178 | -40°C~100°C TJ | Tray | 2009 | ProASIC3 | e1 | 活跃 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 260 | 1.5V | 1mm | 310MHz | 40 | A3P400 | 1.5V | 6.8kB | 现场可编程门阵列 | 55296 | 400000 | 2 | 9216 | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||
![]() | A3P600-2FG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 400.011771mg | 177 | 0°C~85°C TJ | Tray | 2009 | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | A3P600 | 1.5V | 1.575V | 1.425V | 13.5kB | 110592 | 600000 | 310MHz | 2 | 13824 | 1.2mm | 17mm | 17mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||
![]() | A3P600-1PQG208 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 208-PQFP (28x28) | 154 | 0°C~85°C TJ | Tray | 2016 | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | A3P600 | 1.5V | 1.575V | 1.425V | 13.5kB | 110592 | 600000 | 272MHz | 1 | 13824 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||
![]() | A3P600-2FGG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 256-LBGA | YES | 177 | -40°C~100°C TJ | Tray | 2009 | ProASIC3 | e1 | 活跃 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 260 | 1.5V | 1mm | 40 | A3P600 | S-PBGA-B256 | 不合格 | 350MHz | 现场可编程门阵列 | 110592 | 600000 | 13824 | 1.8mm | 17mm | 17mm | 符合RoHS标准 | |||||||||||||||||||||||||||||
![]() | M2GL005-1VFG400 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 400-LFBGA | YES | 400 | 169 | 0°C~85°C TJ | Tray | 2013 | IGLOO2 | 活跃 | 3 (168 Hours) | 400 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 0.8mm | 30 | M2GL005 | 171 | 不合格 | 1.2V | 87.9kB | 现场可编程门阵列 | 6060 | 719872 | 1.51mm | 17mm | 17mm | 符合RoHS标准 | |||||||||||||||||||||||||||||
![]() | M2GL005S-TQ144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 144-LQFP | YES | 84 | 0°C~85°C TJ | Tray | IGLOO2 | Obsolete | 3 (168 Hours) | 144 | 8542.39.00.01 | 1.14V~2.625V | QUAD | 鸥翼 | 240 | 1.2V | 0.5mm | 20 | S-PQFP-G144 | 现场可编程门阵列 | 6060 | 719872 | 1.6mm | 20mm | 20mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||
![]() | M2GL005S-1TQ144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 144-LQFP | YES | 84 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | Obsolete | 3 (168 Hours) | 144 | 8542.39.00.01 | 1.14V~2.625V | QUAD | 鸥翼 | 240 | 1.2V | 0.5mm | 20 | S-PQFP-G144 | 现场可编程门阵列 | 6060 | 719872 | 1.6mm | 20mm | 20mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||
![]() | M2GL005-1TQ144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 144-LQFP | YES | 84 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | Obsolete | 3 (168 Hours) | 144 | 8542.39.00.01 | 1.14V~2.625V | QUAD | 鸥翼 | 240 | 1.2V | 0.5mm | 20 | S-PQFP-G144 | 现场可编程门阵列 | 6060 | 719872 | 1.6mm | 20mm | 20mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||
![]() | M2GL005S-1TQ144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 144-LQFP | YES | 84 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | Obsolete | 3 (168 Hours) | 144 | 8542.39.00.01 | 1.14V~2.625V | QUAD | 鸥翼 | 240 | 1.2V | 0.5mm | 20 | S-PQFP-G144 | 现场可编程门阵列 | 6060 | 719872 | 1.6mm | 20mm | 20mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||
![]() | M2GL010-TQ144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 144-LQFP | YES | 84 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | Obsolete | 3 (168 Hours) | 144 | 8542.39.00.01 | 1.14V~2.625V | QUAD | 鸥翼 | 240 | 1.2V | 0.5mm | 20 | S-PQFP-G144 | 现场可编程门阵列 | 12084 | 933888 | 1.6mm | 20mm | 20mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||
![]() | AGLP125V2-CSG281I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 281-TFBGA, CSBGA | 281 | 281-CSP (10x10) | 212 | -40°C~100°C TJ | Tray | 2015 | IGLOO PLUS | 活跃 | 3 (168 Hours) | 85°C | -40°C | 1.14V~1.575V | AGLP125 | 1.5V | 1.575V | 1.14V | 4.5kB | 3120 | 36864 | 125000 | 892.86MHz | 1024 | 3120 | 710μm | 10mm | 10mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||
![]() | A3P015-QNG68I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2 Weeks | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 68-VFQFN Exposed Pad | 68 | 67.698661mg | 49 | -40°C~100°C TJ | Tray | 2009 | ProASIC3 | Obsolete | 3 (168 Hours) | 68 | 8542.39.00.01 | 1.425V~1.575V | QUAD | 260 | 1.5V | 0.4mm | 231MHz | 30 | A3P015 | 1.5V | 2mA | 现场可编程门阵列 | 15000 | 384 | 384 | 1mm | 8mm | 8mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||
![]() | A3P030-QNG48I | Microsemi Corporation | 数据表 | 5 In Stock | - | 最小起订量: 1 最小包装量: 1 | 21 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 48-VFQFN Exposed Pad | 48 | 150.507618mg | 34 | -40°C~100°C TJ | Tray | 2009 | ProASIC3 | 活跃 | 3 (168 Hours) | 48 | 8542.39.00.01 | 1.425V~1.575V | QUAD | 260 | 1.5V | 0.4mm | 231MHz | 30 | A3P030 | 1.5V | 15mA | 现场可编程门阵列 | 330 | 30000 | 768 | 768 | 880μm | 6mm | 6mm | 无 | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||
![]() | AGL015V2-QNG68I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 68-VFQFN Exposed Pad | 68 | 49 | -40°C~85°C TA | Tray | 2009 | IGLOO | Obsolete | 3 (168 Hours) | 68 | 8542.39.00.01 | 1.14V~1.575V | QUAD | 无铅 | 未说明 | 1.2V | 0.4mm | 未说明 | AGL015 | 不合格 | 1.5V | 4μA | 现场可编程门阵列 | 384 | 15000 | 250MHz | 384 | 880μm | 8mm | 8mm | 符合RoHS标准 | |||||||||||||||||||||||||||||
![]() | AGL060V2-CS121 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | OBSOLETE (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 121-VFBGA, CSBGA | 121 | 121-CSP (6x6) | 96 | 0°C~70°C TA | Tray | 2016 | IGLOO | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.14V~1.575V | AGL060 | 1.5V | 1.575V | 1.14V | 2.3kB | 1536 | 18432 | 60000 | 892.86MHz | 990μm | 6mm | 6mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||
![]() | AGL015V5-QNG68 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 68-VFQFN Exposed Pad | 68 | 68-QFN (8x8) | 49 | 0°C~70°C TA | Tray | IGLOO | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | AGL015 | 1.5V | 1.575V | 1.425V | 384 | 15000 | 880μm | 8mm | 8mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||
![]() | APA600-PQ208A | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 158 | -40°C~125°C TJ | Tray | 2004 | ProASICPLUS | Obsolete | 3 (168 Hours) | 208 | 8542.39.00.01 | 2.375V~2.625V | QUAD | 鸥翼 | 0.5mm | APA600 | 158 | 2.5V | 2.52.5/3.3V | 15.8kB | 现场可编程门阵列 | 129024 | 600000 | 180MHz | 21504 | 3.4mm | 28mm | 28mm | 无 | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||||
![]() | A42MX36-PQ208A | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 176 | -40°C~125°C TA | Tray | 2009 | MX | e0 | Obsolete | 3 (168 Hours) | 208 | Tin/Lead (Sn/Pb) | CAN ALSO BE OPERATED AT 3V SUPPLY | 8542.39.00.01 | 3V~3.6V 4.5V~5.5V | QUAD | 鸥翼 | 225 | 5V | 0.5mm | 30 | A42MX36 | 208 | 5V | 320B | 2.3 ns | 现场可编程门阵列 | 2560 | 54000 | 116MHz | 1822 | 2438 | 3.4mm | 28mm | 28mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||
![]() | A3P1000-2PQ208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 154 | -40°C~100°C TJ | Tray | 2015 | ProASIC3 | e0 | Obsolete | 3 (168 Hours) | 208 | Tin/Lead (Sn/Pb) | 1.425V~1.575V | QUAD | 鸥翼 | 225 | 1.5V | 0.5mm | 30 | A3P1000 | 1.5V | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 310MHz | 2 | 24576 | 4.1mm | 无 | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||
![]() | A3P1000L-1FG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 300 | 0°C~85°C TJ | Tray | 2009 | ProASIC3L | e0 | Obsolete | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | 1.14V~1.575V | BOTTOM | BALL | 225 | 1.2V | 30 | A3P1000L | 300 | 1.2V | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 892.86MHz | 1 | 24576 | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||
![]() | A3P1000L-1FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 300 | -40°C~100°C TJ | Tray | 2009 | ProASIC3L | e0 | Obsolete | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | 1.14V~1.575V | BOTTOM | BALL | 225 | 1.2V | 30 | A3P1000L | 300 | 1.2V | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 892.86MHz | 1 | 24576 | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant |
M2GL010TS-VF256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3P400-2FGG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
AGL400V2-FGG144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL010TS-FG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3P400-2FGG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3P600-2FG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3P600-1PQG208
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3P600-2FGG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL005-1VFG400
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL005S-TQ144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL005S-1TQ144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL005-1TQ144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL005S-1TQ144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL010-TQ144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
AGLP125V2-CSG281I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3P015-QNG68I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3P030-QNG48I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
AGL015V2-QNG68I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
AGL060V2-CS121
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
AGL015V5-QNG68
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
APA600-PQ208A
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
A42MX36-PQ208A
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3P1000-2PQ208I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3P1000L-1FG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3P1000L-1FG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
