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品牌是'Microsemi' (5267)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 端子表面处理 | 最高工作温度 | 最小工作温度 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 最大电源电压 | 最小电源电压 | 工作电源电流 | 内存大小 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | 逻辑块数(LABs) | 速度等级 | 寄存器数量 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | MPF200T-FCG484E | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BBGA, FCBGA | 484-FCBGA (23x23) | 244 | 0°C~100°C TJ | Tray | PolarFire™ | 活跃 | 3 (168 Hours) | 0.97V~1.08V | 192000 | 13619200 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||
 | MPF300TS-FCG1152I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 1152-BBGA, FCBGA | 1152-FCBGA (35x35) | 512 | -40°C~100°C TJ | Tray | PolarFire™ | 活跃 | 3 (168 Hours) | 0.97V~1.08V | 300000 | 21094400 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||
 | MPF300T-FCG784I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 784-BBGA, FCBGA | 784-FCBGA (29x29) | 388 | -40°C~100°C TJ | Tray | PolarFire™ | 活跃 | 3 (168 Hours) | 0.97V~1.08V | 300000 | 21094400 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||
| MPF300T-FCG1152E | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 1152-BBGA, FCBGA | 1152-FCBGA (35x35) | 512 | 0°C~100°C TJ | Tray | PolarFire™ | 活跃 | 3 (168 Hours) | 0.97V~1.08V | 300000 | 21094400 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||
| MPF300T-1FCG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BBGA, FCBGA | 484-FCBGA (23x23) | 244 | -40°C~100°C TJ | Tray | PolarFire™ | 活跃 | 3 (168 Hours) | 0.97V~1.08V | 300000 | 21094400 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||
| MPF300T-FCG1152I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 1152-BBGA, FCBGA | 1152-FCBGA (35x35) | 512 | -40°C~100°C TJ | Tray | PolarFire™ | 活跃 | 3 (168 Hours) | 0.97V~1.08V | 300000 | 21094400 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||
 | M2GL005S-TQ144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 144-LQFP | YES | 84 | 0°C~85°C TJ | Tray | IGLOO2 | Obsolete | 3 (168 Hours) | 144 | 8542.39.00.01 | 1.14V~2.625V | QUAD | 鸥翼 | 240 | 1.2V | 0.5mm | 20 | S-PQFP-G144 | 现场可编程门阵列 | 6060 | 719872 | 1.6mm | 20mm | 20mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||
| M2GL005S-1TQ144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 144-LQFP | YES | 84 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | Obsolete | 3 (168 Hours) | 144 | 8542.39.00.01 | 1.14V~2.625V | QUAD | 鸥翼 | 240 | 1.2V | 0.5mm | 20 | S-PQFP-G144 | 现场可编程门阵列 | 6060 | 719872 | 1.6mm | 20mm | 20mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||
| M2GL005-1TQ144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 144-LQFP | YES | 84 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | Obsolete | 3 (168 Hours) | 144 | 8542.39.00.01 | 1.14V~2.625V | QUAD | 鸥翼 | 240 | 1.2V | 0.5mm | 20 | S-PQFP-G144 | 现场可编程门阵列 | 6060 | 719872 | 1.6mm | 20mm | 20mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||
| M2GL005S-1TQ144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 144-LQFP | YES | 84 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | Obsolete | 3 (168 Hours) | 144 | 8542.39.00.01 | 1.14V~2.625V | QUAD | 鸥翼 | 240 | 1.2V | 0.5mm | 20 | S-PQFP-G144 | 现场可编程门阵列 | 6060 | 719872 | 1.6mm | 20mm | 20mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||
| M2GL010-TQ144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 144-LQFP | YES | 84 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | Obsolete | 3 (168 Hours) | 144 | 8542.39.00.01 | 1.14V~2.625V | QUAD | 鸥翼 | 240 | 1.2V | 0.5mm | 20 | S-PQFP-G144 | 现场可编程门阵列 | 12084 | 933888 | 1.6mm | 20mm | 20mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||
 | AFS090-2FGG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 75 | -40°C~100°C TJ | Tray | 2013 | Fusion® | e1 | Obsolete | 3 (168 Hours) | 256 | 锡银铜 | 1.425V~1.575V | BOTTOM | BALL | 260 | 1.5V | 1mm | 40 | AFS090 | 1.5V | 3.4kB | 现场可编程门阵列 | 27648 | 90000 | 1.47059GHz | 2 | 2304 | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | |||||||||||||||||||||
 | APA600-FGG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 186 | -40°C~85°C TA | Tray | 2000 | ProASICPLUS | e1 | 活跃 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 2.3V~2.7V | BOTTOM | BALL | 250 | 2.5V | 1mm | 180MHz | 30 | APA600 | 186 | 2.5V | 2.52.5/3.3V | 15.8kB | 现场可编程门阵列 | 129024 | 600000 | 21504 | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | |||||||||||||||||||
| A3P600L-1FG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 400.011771mg | 177 | 0°C~85°C TJ | Tray | 2009 | ProASIC3L | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.14V~1.575V | A3P600L | 1.2V | 1.26V | 1.14V | 5mA | 13.5kB | 110592 | 600000 | 892.86MHz | 1 | 13824 | 1.2mm | 17mm | 17mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||
| A3P600L-1FGG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 400.011771mg | 177 | 0°C~85°C TJ | Tray | 2009 | ProASIC3L | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.14V~1.575V | A3P600L | 1.2V | 1.26V | 1.14V | 5mA | 13.5kB | 110592 | 600000 | 892.86MHz | 1 | 13824 | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||
 | A3P250L-FGG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 400.011771mg | 157 | 0°C~85°C TJ | Tray | 2009 | ProASIC3L | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.14V~1.575V | A3P250L | 1.2V | 1.26V | 1.14V | 4.5kB | 36864 | 250000 | 781.25MHz | 6144 | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||
 | AFS090-FGG256 | Microsemi Corporation | 数据表 | 100 In Stock | - | 最小起订量: 1 最小包装量: 1 | 2 Weeks | LIMITED TIME BUY (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 400.011771mg | 75 | 0°C~85°C TJ | Tray | 2009 | Fusion® | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | 1.0989GHz | AFS090 | 1.5V | 1.575V | 1.425V | 3.4kB | 27648 | 90000 | 1.0989GHz | 2304 | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||
 | A3P250L-1FGG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | -40°C~100°C TJ | Tray | 2009 | ProASIC3L | e1 | Obsolete | 3 (168 Hours) | 144 | 锡银铜 | 1.14V~1.575V | BOTTOM | BALL | 260 | 1.2V | 40 | A3P250L | 97 | 1.2V | 3mA | 4.5kB | 现场可编程门阵列 | 36864 | 250000 | 892.86MHz | 1 | 6144 | 1.05mm | 13mm | 13mm | 无 | 符合RoHS标准 | |||||||||||||||||||
 | A3P125-1PQ208 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 208-PQFP (28x28) | 133 | 0°C~85°C TJ | Tray | 2012 | ProASIC3 | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | A3P125 | 1.5V | 1.575V | 1.425V | 4.5kB | 36864 | 125000 | 272MHz | 1 | 3072 | 3.4mm | 28mm | 28mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||
| AGL400V5-FG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | -40°C~85°C TA | Tray | 2013 | IGLOO | e0 | Obsolete | 3 (168 Hours) | 144 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 230 | 1.5V | 1mm | 30 | AGL400 | 不合格 | 1.5V | 27μA | 6.8kB | 现场可编程门阵列 | 9216 | 55296 | 400000 | 250MHz | 1.05mm | 13mm | 13mm | Non-RoHS Compliant | |||||||||||||||||||
| AGL1000V2-FG144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 144-LBGA | 144 | 144-FPBGA (13x13) | 400.011771mg | 97 | 0°C~70°C TA | Tray | 2013 | IGLOO | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.14V~1.575V | AGL1000 | 1.5V | 1.575V | 1.14V | 18kB | 24576 | 147456 | 1000000 | 892.86MHz | 1.05mm | 13mm | 13mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||
| AGL400V2-FG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | -40°C~85°C TA | Tray | 2009 | IGLOO | e0 | Obsolete | 3 (168 Hours) | 144 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | 1.14V~1.575V | BOTTOM | BALL | 230 | 1.2V | 1mm | 30 | AGL400 | 1.5V | 27μA | 6.8kB | 现场可编程门阵列 | 9216 | 55296 | 400000 | 250MHz | 1.05mm | 13mm | 13mm | 无 | Non-RoHS Compliant | |||||||||||||||||||
| AGL400V2-FGG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | -40°C~85°C TA | Tray | 2013 | IGLOO | e1 | Obsolete | 3 (168 Hours) | 144 | 锡银铜 | 8542.39.00.01 | 1.14V~1.575V | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | AGL400 | 不合格 | 1.5V | 27μA | 6.8kB | 现场可编程门阵列 | 9216 | 55296 | 400000 | 250MHz | 12 | 1.05mm | 13mm | 13mm | 符合RoHS标准 | |||||||||||||||||
| A3P1000-1PQ208M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 154 | -55°C~125°C TJ | Tray | 2009 | ProASIC3 | e0 | Obsolete | 3 (168 Hours) | 208 | Tin/Lead (Sn/Pb) | 1.425V~1.575V | QUAD | 鸥翼 | 225 | 1.5V | 0.5mm | 30 | A3P1000 | 154 | 1.5V | 8mA | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 350MHz | 1 | 24576 | 28mm | 28mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||
| AGLP125V2-CSG281I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 281-TFBGA, CSBGA | 281 | 281-CSP (10x10) | 212 | -40°C~100°C TJ | Tray | 2015 | IGLOO PLUS | 活跃 | 3 (168 Hours) | 85°C | -40°C | 1.14V~1.575V | AGLP125 | 1.5V | 1.575V | 1.14V | 4.5kB | 3120 | 36864 | 125000 | 892.86MHz | 1024 | 3120 | 710μm | 10mm | 10mm | 无 | 符合RoHS标准 |
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MPF200T-FCG484E
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
MPF300TS-FCG1152I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
MPF300T-FCG784I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
MPF300T-FCG1152E
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
MPF300T-1FCG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
MPF300T-FCG1152I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL005S-TQ144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL005S-1TQ144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL005-1TQ144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL005S-1TQ144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL010-TQ144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AFS090-2FGG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
APA600-FGG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P600L-1FG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P600L-1FGG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P250L-FGG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AFS090-FGG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P250L-1FGG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P125-1PQ208
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGL400V5-FG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGL1000V2-FG144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGL400V2-FG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGL400V2-FGG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P1000-1PQ208M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGLP125V2-CSG281I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)