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品牌是'Microsemi' (5267)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 输出的数量 | 工作电源电压 | 电源 | 最大电源电压 | 最小电源电压 | 工作电源电流 | 内存大小 | 时钟频率 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | 逻辑块数(LABs) | 速度等级 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | A3PE3000L-FG484M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 9 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 341 | -55°C~125°C TJ | Tray | 2009 | ProASIC3L | e0 | 活跃 | 3 (168 Hours) | 484 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.2V | 1mm | 30 | A3PE3000L | 341 | 1.5V | 1.2/1.51.2/3.3V | 63kB | 现场可编程门阵列 | 516096 | 3000000 | 75264 | 2.44mm | 23mm | 23mm | 无 | Non-RoHS Compliant | |||||||||||||||||||
 | A3PE3000L-1FGG484M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 9 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 341 | -55°C~125°C TJ | Tray | 2009 | ProASIC3L | e1 | 活跃 | 3 (168 Hours) | 484 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 250 | 1.2V | 40 | A3PE3000L | 341 | 1.5V | 63kB | 250MHz | 现场可编程门阵列 | 516096 | 3000000 | 1 | 75264 | 2.44mm | 23mm | 23mm | 无 | 符合RoHS标准 | |||||||||||||||||||||
 | MPF200TL-FCVG484E | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BFBGA | 484-FPBGA (19x19) | 284 | 0°C~100°C TJ | Tray | PolarFire™ | 活跃 | 0.97V~1.08V | 192000 | 13619200 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||
 | MPF200TL-FCG784E | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 784-BBGA, FCBGA | 784-FCBGA (29x29) | 364 | 0°C~100°C TJ | Tray | PolarFire™ | 活跃 | 0.97V~1.08V | 192000 | 13619200 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||
 | MPF100TS-1FCSG325I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 324-LFBGA | 325-FPGA (11x11) | 170 | -40°C~100°C TJ | Tray | PolarFire™ | 活跃 | 0.97V~1.08V | 109000 | 7782400 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||
| MPF200T-1FCVG484E | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BFBGA | 484-FPBGA (19x19) | 284 | 0°C~100°C TJ | Tray | PolarFire™ | 活跃 | 0.97V~1.08V | 192000 | 13619200 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||
| A3PE3000-1FG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 400.011771mg | 341 | 0°C~85°C TJ | Tray | 2009 | ProASIC3E | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | A3PE3000 | 1.5V | 1.575V | 1.425V | 63kB | 516096 | 3000000 | 272MHz | 1 | 75264 | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||
 | A3PE3000-2PQG208 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 208-PQFP (28x28) | 147 | 0°C~85°C TJ | Tray | ProASIC3E | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | A3PE3000 | 1.5V | 1.575V | 1.425V | 63kB | 516096 | 3000000 | 310MHz | 2 | 75264 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||
 | A3PE3000-1FG896 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 表面贴装 | 表面贴装 | 896-BGA | 896 | 896-FBGA (31x31) | 400.011771mg | 620 | 0°C~85°C TJ | Tray | 2009 | ProASIC3E | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | A3PE3000 | 1.5V | 1.575V | 1.425V | 63kB | 516096 | 3000000 | 272MHz | 1 | 75264 | 1.73mm | 31mm | 31mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||
| MPF200T-1FCG784I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 784-BBGA, FCBGA | 784-FCBGA (29x29) | 364 | -40°C~100°C TJ | Tray | PolarFire™ | 活跃 | 0.97V~1.08V | 192000 | 13619200 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||
| MPF200TLS-FCG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BFBGA | 484-FPBGA (19x19) | 244 | -40°C~100°C TJ | Tray | PolarFire™ | 活跃 | 0.97V~1.08V | 192000 | 13619200 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||
| M7A3P1000-2FG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NOT RECOMMENDED FOR NEW DESIGN (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | -40°C~100°C TJ | Tray | 2008 | ProASIC3 | e0 | 不用于新设计 | 3 (168 Hours) | 144 | Tin/Lead/Silver (Sn/Pb/Ag) | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | 310MHz | 30 | M7A3P1000 | 1.5V | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 2 | 24576 | 1.05mm | 13mm | 13mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||
 | M7A3P1000-1FG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NOT RECOMMENDED FOR NEW DESIGN (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 177 | -40°C~100°C TJ | Tray | 2008 | ProASIC3 | 不用于新设计 | 3 (168 Hours) | 256 | TIN LEAD/TIN LEAD SILVER | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 30 | M7A3P1000 | 1.5V | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 272MHz | 1 | 24576 | 1.2mm | 17mm | 17mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||
| M7A3P1000-1FGG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NOT RECOMMENDED FOR NEW DESIGN (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 177 | -40°C~100°C TJ | Tray | 2008 | ProASIC3 | e1 | 不用于新设计 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 260 | 1.5V | 272MHz | 40 | M7A3P1000 | 1.5V | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 1 | 24576 | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||
| M7A3P1000-FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NOT RECOMMENDED FOR NEW DESIGN (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 300 | -40°C~100°C TJ | Tray | 2008 | ProASIC3 | e0 | 不用于新设计 | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | 30 | M7A3P1000 | 1.5V | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 231MHz | 24576 | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||
| M7A3P1000-2FG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NOT RECOMMENDED FOR NEW DESIGN (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 177 | -40°C~100°C TJ | Tray | 2008 | ProASIC3 | 不用于新设计 | 3 (168 Hours) | 256 | TIN LEAD/TIN LEAD SILVER | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | 30 | M7A3P1000 | 1.5V | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 310MHz | 2 | 24576 | 1.2mm | 17mm | 17mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||
| M7A3P1000-1FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NOT RECOMMENDED FOR NEW DESIGN (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 300 | -40°C~100°C TJ | Tray | 2008 | ProASIC3 | e0 | 不用于新设计 | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 30 | M7A3P1000 | 1.5V | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 272MHz | 1 | 24576 | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||
 | M7A3P1000-2FGG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NOT RECOMMENDED FOR NEW DESIGN (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | -40°C~100°C TJ | Tray | 2003 | ProASIC3 | e1 | 不用于新设计 | 3 (168 Hours) | 144 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 260 | 1.5V | 1mm | 310MHz | 40 | M7A3P1000 | 1.5V | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 2 | 24576 | 1.05mm | 13mm | 13mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||
 | A42MX09-1PLG84I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 84-LCC (J-Lead) | 84 | 6.777889g | 72 | -40°C~85°C TA | Tube | MX | e3 | 活跃 | 3 (168 Hours) | 84 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 3V~3.6V 4.5V~5.5V | QUAD | J BEND | 245 | 3.3V | 40 | A42MX09 | 5V | 现场可编程门阵列 | 14000 | 247MHz | 336 | 1 | 516 | 684 | 3.68mm | 29.31mm | 29.31mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||
| M7A3P1000-1FG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NOT RECOMMENDED FOR NEW DESIGN (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 300 | 0°C~85°C TJ | Tray | 2008 | ProASIC3 | e0 | 不用于新设计 | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 30 | M7A3P1000 | 1.5V | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 272MHz | 1 | 24576 | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||
 | A42MX09-2VQG100I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 83 | -40°C~85°C TA | Tray | 2015 | MX | e3 | 活跃 | 3 (168 Hours) | 100 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 3V~3.6V 4.5V~5.5V | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | A42MX09 | 5V | 现场可编程门阵列 | 14000 | 269MHz | 336 | 2 | 516 | 1.8 ns | 684 | 1mm | 14mm | 14mm | 无 | 符合RoHS标准 | 无铅 | |||||||||||||||||||
| M7A3P1000-2FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NOT RECOMMENDED FOR NEW DESIGN (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 300 | -40°C~100°C TJ | Tray | 2008 | ProASIC3 | e0 | 不用于新设计 | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | 30 | M7A3P1000 | 1.5V | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 310MHz | 2 | 24576 | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||
 | A42MX16-PQG100I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-BQFP | 100 | 1.758804g | 83 | -40°C~85°C TA | Tray | 2009 | MX | e3 | 活跃 | 3 (168 Hours) | 100 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | 3V~3.6V 4.5V~5.5V | QUAD | 鸥翼 | 245 | 3.3V | 0.65mm | 40 | A42MX16 | 5V | 现场可编程门阵列 | 24000 | 172MHz | 608 | 928 | 2.8 ns | 1232 | 2.7mm | 20mm | 14mm | 无 | 符合RoHS标准 | |||||||||||||||||||
| A3PE3000-1FGG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 341 | -40°C~100°C TJ | Tray | 2013 | ProASIC3E | e1 | 活跃 | 3 (168 Hours) | 484 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 250 | 1.5V | 40 | A3PE3000 | 1.5V | 63kB | 现场可编程门阵列 | 516096 | 3000000 | 272MHz | 1 | 75264 | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||
| A3PE3000L-FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 9 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 400.011771mg | 341 | 0°C~85°C TJ | Tray | 2015 | ProASIC3L | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.14V~1.575V | A3PE3000L | 1.2V | 1.26V | 1.14V | 25mA | 63kB | 516096 | 3000000 | 781.25MHz | 75264 | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 |
-
A3PE3000L-FG484M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3PE3000L-1FGG484M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
MPF200TL-FCVG484E
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
MPF200TL-FCG784E
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
MPF100TS-1FCSG325I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
MPF200T-1FCVG484E
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3PE3000-1FG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3PE3000-2PQG208
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3PE3000-1FG896
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
MPF200T-1FCG784I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
MPF200TLS-FCG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M7A3P1000-2FG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M7A3P1000-1FG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M7A3P1000-1FGG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M7A3P1000-FG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M7A3P1000-2FG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M7A3P1000-1FG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M7A3P1000-2FGG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A42MX09-1PLG84I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M7A3P1000-1FG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A42MX09-2VQG100I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M7A3P1000-2FG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A42MX16-PQG100I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3PE3000-1FGG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3PE3000L-FGG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)