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品牌是'Microsemi' (5267)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 最大电源电压 | 最小电源电压 | 内存大小 | 工作电源电流 | 内存大小 | 时钟频率 | 数据率 | 输入数量 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | 筛选水平 | 逻辑块数(LABs) | 速度等级 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | A3PE600L-FGG484M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 270 | -55°C~125°C TJ | Tray | ProASIC3EL | e1 | 活跃 | 3 (168 Hours) | 484 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 250 | 1.2V | 1mm | 40 | A3PE600L | 270 | 1.5V | 1.2/1.51.2/3.3V | 13.5kB | 250MHz | 现场可编程门阵列 | 110592 | 600000 | 13824 | 2.44mm | 23mm | 23mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||
 | MPF100TL-FCSG325I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 324-LFBGA | 325-FPGA (11x11) | 170 | -40°C~100°C TJ | Tray | PolarFire™ | 活跃 | 0.97V~1.08V | 109000 | 7782400 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| MPF100TS-FCSG325I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 324-LFBGA | 325-FPGA (11x11) | 170 | -40°C~100°C TJ | Tray | PolarFire™ | 活跃 | 0.97V~1.08V | 109000 | 7782400 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MPF100TS-1FCVG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BBGA, FCBGA | 484-FCBGA (23x23) | 284 | -40°C~100°C TJ | Tray | PolarFire™ | 活跃 | 0.97V~1.08V | 109000 | 7782400 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | A40MX04-PLG84M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 14 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 84-LCC (J-Lead) | 84 | 6.777889g | 69 | -55°C~125°C TC | Tube | 2009 | MX | e3 | 活跃 | 3 (168 Hours) | 84 | 3A001.A.2.C | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | 3V~3.6V 4.5V~5.5V | QUAD | J BEND | 245 | 3.3V | 1.27mm | 40 | A40MX04 | 5V | 现场可编程门阵列 | 6000 | 139MHz | 547 | 273 | 2.7 ns | 547 | 3.68mm | 29.31mm | 29.31mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||
 | MPF200TL-FCG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BFBGA | 484-FPBGA (19x19) | 244 | -40°C~100°C TJ | Tray | PolarFire™ | 活跃 | 0.97V~1.08V | 192000 | 13619200 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| MPF100TLS-FCSG325I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 324-LFBGA | 325-FPGA (11x11) | 170 | -40°C~100°C TJ | Tray | PolarFire™ | 活跃 | 0.97V~1.08V | 109000 | 7782400 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | A3PE3000-FG896 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 表面贴装 | 表面贴装 | 896-BGA | 896 | 896-FBGA (31x31) | 400.011771mg | 620 | 0°C~85°C TJ | Tray | 2009 | ProASIC3E | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | A3PE3000 | 1.5V | 1.575V | 1.425V | 63kB | 516096 | 3000000 | 231MHz | 75264 | 1.73mm | 31mm | 31mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||
| MPF200T-1FCSG325E | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 324-LFBGA | 325-FPGA (11x11) | 170 | 0°C~100°C TJ | Tray | PolarFire™ | 活跃 | 0.97V~1.08V | 192000 | 13619200 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| MPF200TL-FCSG325E | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 324-LFBGA | 325-FPGA (11x11) | 170 | 0°C~100°C TJ | Tray | PolarFire™ | 活跃 | 0.97V~1.08V | 192000 | 13619200 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | M2GL025T-1VF256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 256-LFBGA | YES | 138 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 256 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 0.8mm | 20 | S-PBGA-B256 | 现场可编程门阵列 | 27696 | 1130496 | 1.56mm | 14mm | 14mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||
| M2GL025TS-1VFG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 256-LFBGA | YES | 138 | Automotive grade | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | yes | 活跃 | 3 (168 Hours) | 256 | 1.14V~2.625V | BOTTOM | BALL | 未说明 | 1.2V | 0.8mm | 未说明 | S-PBGA-B256 | 现场可编程门阵列 | 27696 | 1130496 | AEC-Q100 | 1.56mm | 14mm | 14mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||
| A3PE600-FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 22 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 270 | 0°C~85°C TJ | Tray | 2009 | ProASIC3E | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | A3PE600 | 1.5V | 1.575V | 1.425V | 13.5kB | 5mA | 13.5kB | 700 Mbps | 6500 | 110592 | 600000 | 231MHz | 13824 | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||
 | M2GL060T-1FCSG325 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 324-LFBGA, CSPBGA | YES | 200 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 325 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 30 | S-PBGA-B325 | 现场可编程门阵列 | 56520 | 1869824 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||
| M2GL050T-1FCSG325 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 324-LFBGA, CSPBGA | YES | 200 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 325 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 30 | S-PBGA-B325 | 200 | 不合格 | 1.2V | 200 | 现场可编程门阵列 | 56340 | 1869824 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||
 | A40MX04-PLG68I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 14 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 68-LCC (J-Lead) | 68 | 4.869796g | 57 | -40°C~85°C TA | Tray | 2009 | MX | 活跃 | 3 (168 Hours) | 68 | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | 3V~3.6V 4.5V~5.5V | QUAD | J BEND | 3.3V | 1.27mm | A40MX04 | 5V | 现场可编程门阵列 | 6000 | 139MHz | 547 | 273 | 2.7 ns | 547 | 3.68mm | 24.23mm | 24.23mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||
| A3PE600-1FGG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 270 | -40°C~100°C TJ | Tray | ProASIC3E | e1 | 活跃 | 3 (168 Hours) | 484 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 250 | 1.5V | 40 | A3PE600 | 1.5V | 13.5kB | 现场可编程门阵列 | 110592 | 600000 | 272MHz | 1 | 13824 | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||
| A3PE3000-1FGG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 341 | -40°C~100°C TJ | Tray | 2013 | ProASIC3E | e1 | 活跃 | 3 (168 Hours) | 484 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 250 | 1.5V | 40 | A3PE3000 | 1.5V | 63kB | 现场可编程门阵列 | 516096 | 3000000 | 272MHz | 1 | 75264 | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||
| A3PE3000L-FGG484 | Microsemi Corporation | 数据表 | 60 In Stock | - | 最小起订量: 1 最小包装量: 1 | 9 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 400.011771mg | 341 | 0°C~85°C TJ | Tray | 2015 | ProASIC3L | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.14V~1.575V | A3PE3000L | 1.2V | 1.26V | 1.14V | 25mA | 63kB | 516096 | 3000000 | 781.25MHz | 75264 | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||
 | MPF200T-1FCSG536E | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 536-LFBGA, CSPBGA | 536-CSPBGA (16x16) | 300 | 0°C~100°C TJ | Tray | PolarFire™ | 活跃 | 0.97V~1.08V | 192000 | 13619200 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MPF200TS-1FCG784I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 784-BBGA, FCBGA | 784-FCBGA (29x29) | 364 | -40°C~100°C TJ | Tray | PolarFire™ | 活跃 | 0.97V~1.08V | 192000 | 13619200 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| MPF200T-1FCVG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BFBGA | 484-FPBGA (19x19) | 284 | -40°C~100°C TJ | Tray | PolarFire™ | 活跃 | 0.97V~1.08V | 192000 | 13619200 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| MPF200TLS-FCG784I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 784-BBGA, FCBGA | 784-FCBGA (29x29) | 364 | -40°C~100°C TJ | Tray | PolarFire™ | 活跃 | 0.97V~1.08V | 192000 | 13619200 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| MPF200T-1FCSG325I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 324-LFBGA | 325-FPGA (11x11) | 170 | -40°C~100°C TJ | Tray | PolarFire™ | 活跃 | 0.97V~1.08V | 192000 | 13619200 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| MPF200TL-FCSG536E | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 536-LFBGA, CSPBGA | 536-CSPBGA (16x16) | 300 | 0°C~100°C TJ | Tray | PolarFire™ | 活跃 | 0.97V~1.08V | 192000 | 13619200 | 符合RoHS标准 |
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A3PE600L-FGG484M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
MPF100TL-FCSG325I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
MPF100TS-FCSG325I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
MPF100TS-1FCVG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A40MX04-PLG84M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
MPF200TL-FCG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
MPF100TLS-FCSG325I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3PE3000-FG896
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
MPF200T-1FCSG325E
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
MPF200TL-FCSG325E
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL025T-1VF256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL025TS-1VFG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3PE600-FGG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL060T-1FCSG325
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL050T-1FCSG325
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A40MX04-PLG68I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3PE600-1FGG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3PE3000-1FGG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3PE3000L-FGG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
MPF200T-1FCSG536E
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
MPF200TS-1FCG784I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
MPF200T-1FCVG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
MPF200TLS-FCG784I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
MPF200T-1FCSG325I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
MPF200TL-FCSG536E
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)