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品牌是'Microsemi' (5267)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 端子表面处理 | 最高工作温度 | 最小工作温度 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 输出的数量 | 工作电源电压 | 电源 | 最大电源电压 | 最小电源电压 | 内存大小 | 工作电源电流 | 内存大小 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | 逻辑块数(LABs) | 速度等级 | 寄存器数量 | 高度 | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | A3P600-1FGG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | -40°C~100°C TJ | Tray | 2009 | ProASIC3 | e1 | 活跃 | 3 (168 Hours) | 144 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 260 | 1.5V | 272MHz | 40 | A3P600 | 1.5V | 13.5kB | 现场可编程门阵列 | 110592 | 600000 | 1 | 13824 | 1.05mm | 13mm | 13mm | 无 | 符合RoHS标准 | ||||||||||||||||||
 | A3P600-1FGG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 400.011771mg | 177 | 0°C~85°C TJ | Tray | 2009 | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | A3P600 | 1.5V | 1.575V | 1.425V | 13.5kB | 110592 | 600000 | 272MHz | 1 | 13824 | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||
| A3P600-2FGG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 256-LBGA | 256-FPBGA (17x17) | 177 | 0°C~85°C TJ | Tray | 2013 | ProASIC3 | 活跃 | 3 (168 Hours) | 1.425V~1.575V | A3P600 | 110592 | 600000 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||
| A3P600-1FGG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 177 | -40°C~100°C TJ | Tray | 2009 | ProASIC3 | e1 | 活跃 | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 260 | 1.5V | 40 | A3P600 | 1.5V | 13.5kB | 现场可编程门阵列 | 110592 | 600000 | 272MHz | 1 | 13824 | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | ||||||||||||||||||
 | A3P400-2PQG208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 151 | -40°C~100°C TJ | Tray | 2009 | ProASIC3 | e3 | 活跃 | 3 (168 Hours) | 208 | Matte Tin (Sn) | 1.425V~1.575V | QUAD | 鸥翼 | 245 | 1.5V | 0.5mm | 310MHz | 40 | A3P400 | 1.5V | 6.8kB | 现场可编程门阵列 | 55296 | 400000 | 2 | 9216 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | ||||||||||||||||||
 | AGL030V2-QNG132 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 132-WFQFN | 132 | 132-QFN (8x8) | 81 | 0°C~70°C TA | Tray | 2009 | IGLOO | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.14V~1.575V | AGL030 | 1.575V | 1.14V | 768 | 30000 | 无 | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||||
 | AGL060V5-VQG100I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | Tin | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 71 | -40°C~85°C TA | Tray | 2012 | IGLOO | e3 | 活跃 | 3 (168 Hours) | 100 | 8542.39.00.01 | 1.425V~1.575V | QUAD | 鸥翼 | 1.5V | 0.5mm | AGL060 | 1.5V | 2.3kB | 2.3kB | 现场可编程门阵列 | 1536 | 18432 | 60000 | 892.86MHz | 1mm | 14mm | 14mm | 无 | 符合RoHS标准 | |||||||||||||||||||
 | A3PN020-QNG68 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 68-VFQFN Exposed Pad | 68 | 68-QFN (8x8) | 810.002575mg | 49 | -20°C~85°C TJ | Tray | 2009 | ProASIC3 nano | 活跃 | 3 (168 Hours) | 70°C | -20°C | 1.425V~1.575V | A3PN020 | 1.5V | 1.575V | 1.425V | 1mA | 220 | 20000 | 350MHz | 520 | 880μm | 8mm | 8mm | 无 | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||
 | AGL600V5-FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 22 Weeks | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 400.011771mg | 235 | 0°C~70°C TA | Tray | 2012 | IGLOO | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | AGL600 | 1.5V | 1.575V | 1.425V | 13.5kB | 13824 | 110592 | 600000 | 892.86MHz | 1.73mm | 23mm | 23mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||
| AGL125V2-FGG144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 144-FPBGA (13x13) | 97 | 0°C~70°C TA | Tray | 2009 | IGLOO | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.14V~1.575V | AGL125 | 1.5V | 1.575V | 1.14V | 4.5kB | 4.5kB | 3072 | 36864 | 125000 | 892.86MHz | 1.05mm | 13mm | 13mm | 无 | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||
| AGL400V5-FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 400.011771mg | 194 | 0°C~70°C TA | Tray | 2009 | IGLOO | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | AGL400 | 1.5V | 1.575V | 1.425V | 27μA | 6.8kB | 9216 | 55296 | 400000 | 250MHz | 12 | 1.73mm | 23mm | 23mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||
 | A3P060-TQ144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2 Weeks | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LQFP | 144 | 144-TQFP (20x20) | 1.319103g | 91 | 0°C~85°C TJ | Tray | 2000 | ProASIC3 | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | A3P060 | 1.5V | 1.575V | 1.425V | 2.3kB | 18432 | 60000 | 231MHz | 1536 | 1.4mm | 20mm | 20mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||
 | M1AGL600V5-FG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 400.011771mg | 235 | 0°C~70°C TA | Tray | 2015 | IGLOO | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | M1AGL600 | 1.5V | 1.575V | 1.425V | 13.5kB | 13824 | 110592 | 600000 | 1.73mm | 23mm | 23mm | Non-RoHS Compliant | ||||||||||||||||||||||||||
| A3PE1500-2PQ208 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 208-PQFP (28x28) | 147 | 0°C~85°C TJ | Tray | 2009 | ProASIC3E | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | A3PE1500 | 1.5V | 1.575V | 1.425V | 33.8kB | 276480 | 1500000 | 310MHz | 2 | 38400 | 3.4mm | 28mm | 28mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||
 | A3PE3000L-1FG896 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 896-BGA | 896 | 896-FBGA (31x31) | 400.011771mg | 620 | 0°C~85°C TJ | Tray | 2009 | ProASIC3L | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.14V~1.575V | A3PE3000L | 1.2V | 1.26V | 1.14V | 63kB | 516096 | 3000000 | 892.86MHz | 1 | 75264 | 1.73mm | 31mm | 31mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||
| M1A3P1000L-1FG484I | Microsemi Corporation | 数据表 | 2970 In Stock | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 300 | -40°C~100°C TJ | Tray | 2015 | ProASIC3L | e0 | Obsolete | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | 1.14V~1.575V | BOTTOM | BALL | 225 | 1.2V | 30 | M1A3P1000L | 300 | 1.2V | 8mA | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 892.86MHz | 1 | 24576 | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant | |||||||||||||||||
| M1A3P1000L-1FGG484I | Microsemi Corporation | 数据表 | 2972 In Stock | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 300 | -40°C~100°C TJ | Tray | 2015 | ProASIC3L | e1 | Obsolete | 3 (168 Hours) | 484 | 锡银铜 | 1.14V~1.575V | BOTTOM | BALL | 250 | 1.2V | 40 | M1A3P1000L | 300 | 1.2V | 8mA | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 892.86MHz | 1 | 24576 | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | |||||||||||||||||
| M1A3P1000L-FG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 400.011771mg | 300 | 0°C~85°C TJ | Tray | 2015 | ProASIC3L | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.14V~1.575V | M1A3P1000L | 1.2V | 1.26V | 1.14V | 18kB | 147456 | 1000000 | 781.25MHz | 24576 | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||
| A3P1000L-1FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 400.011771mg | 300 | 0°C~85°C TJ | Tray | 2009 | ProASIC3L | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.14V~1.575V | A3P1000L | 1.2V | 1.26V | 1.14V | 18kB | 147456 | 1000000 | 892.86MHz | 1 | 24576 | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||
| M1A3P1000L-1FGG484 | Microsemi Corporation | 数据表 | 2952 In Stock | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 400.011771mg | 300 | 0°C~85°C TJ | Tray | 2015 | ProASIC3L | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.14V~1.575V | M1A3P1000L | 1.2V | 1.26V | 1.14V | 8mA | 18kB | 147456 | 1000000 | 892.86MHz | 1 | 24576 | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||
| M1A3P1000L-FGG484I | Microsemi Corporation | 数据表 | 2968 In Stock | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 300 | -40°C~100°C TJ | Tray | 2015 | ProASIC3L | e1 | Obsolete | 3 (168 Hours) | 484 | 锡银铜 | 8542.39.00.01 | 1.14V~1.575V | BOTTOM | BALL | 250 | 1.2V | 1mm | 40 | M1A3P1000L | 300 | 1.2V | 1.5/3.3V | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 781.25MHz | 24576 | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | ||||||||||||||||
| A3P1000L-FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 300 | -40°C~100°C TJ | Tray | 2009 | ProASIC3L | e0 | Obsolete | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.14V~1.575V | BOTTOM | BALL | 225 | 1.2V | 1mm | 30 | A3P1000L | 300 | 1.2V | 1.5/3.3V | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 781.25MHz | 24576 | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant | 含铅 | |||||||||||||||
 | A3P250L-PQG208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 151 | -40°C~100°C TJ | Tray | 2009 | ProASIC3L | e3 | Obsolete | 3 (168 Hours) | 208 | 哑光锡 | 8542.39.00.01 | 1.14V~1.575V | QUAD | 鸥翼 | 245 | 1.2V | 0.5mm | 40 | A3P250L | 151 | 1.2V | 1.5/3.3V | 3mA | 4.5kB | 现场可编程门阵列 | 36864 | 250000 | 781.25MHz | 6144 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | 无铅 | ||||||||||||||||
| A3P600L-PQG208 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 208-PQFP (28x28) | 154 | 0°C~85°C TJ | Tray | 2009 | ProASIC3L | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.14V~1.575V | A3P600L | 1.2V | 1.26V | 1.14V | 13.5kB | 110592 | 600000 | 781.25MHz | 13824 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||
| A3P600L-PQ208 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 208-PQFP (28x28) | 154 | 0°C~85°C TJ | Tray | 2009 | ProASIC3L | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.14V~1.575V | A3P600L | 1.2V | 1.26V | 1.14V | 5mA | 13.5kB | 110592 | 600000 | 781.25MHz | 13824 | 3.4mm | 28mm | 28mm | 无 | Non-RoHS Compliant |
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A3P600-1FGG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P600-1FGG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P600-2FGG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P600-1FGG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P400-2PQG208I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGL030V2-QNG132
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGL060V5-VQG100I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3PN020-QNG68
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGL600V5-FGG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGL125V2-FGG144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGL400V5-FGG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P060-TQ144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1AGL600V5-FG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3PE1500-2PQ208
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3PE3000L-1FG896
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P1000L-1FG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P1000L-1FGG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P1000L-FG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P1000L-1FGG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P1000L-1FGG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P1000L-FGG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P1000L-FG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P250L-PQG208I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P600L-PQG208
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P600L-PQ208
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)