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品牌是'Microsemi' (5267)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 端子间距 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 输出的数量 | 资历状况 | 电源 | 内存大小 | 时钟频率 | 电流源 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | 筛选水平 | 逻辑块数(LABs) | 速度等级 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 电压 - 供电 （最大值） | 电压 - 供电 （最小值） | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | A40MX04-PLG68I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 14 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 68-LCC (J-Lead) | 68 | 4.869796g | 57 | -40°C~85°C TA | Tray | 2009 | MX | 活跃 | 3 (168 Hours) | 68 | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | 5V | QUAD | J BEND | 1.27mm | A40MX04 | 现场可编程门阵列 | 6000 | 139MHz | 547 | 273 | 2.7 ns | 547 | 3.68mm | 24.23mm | 24.23mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||
 | A3PE600-1FGG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 270 | -40°C~100°C TJ | Tray | ProASIC3E | e1 | 活跃 | 3 (168 Hours) | 484 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.5V | BOTTOM | BALL | 250 | 40 | A3PE600 | 13.5kB | 现场可编程门阵列 | 110592 | 600000 | 272MHz | 1 | 13824 | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||
 | M2GL005S-1VF256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 256-LFBGA | YES | 161 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 256 | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 240 | 0.8mm | 20 | S-PBGA-B256 | 现场可编程门阵列 | 6060 | 719872 | 1.56mm | 14mm | 14mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||
| M2GL005S-1VFG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 256-LFBGA | YES | 161 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 256 | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 260 | 0.8mm | 30 | S-PBGA-B256 | 现场可编程门阵列 | 6060 | 719872 | 1.56mm | 14mm | 14mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||
| M2GL025T-1VF256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 256-LFBGA | YES | 138 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 256 | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 240 | 0.8mm | 20 | S-PBGA-B256 | 现场可编程门阵列 | 27696 | 1130496 | 1.56mm | 14mm | 14mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||
| M2GL025TS-1VFG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 256-LFBGA | YES | 138 | Automotive grade | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | yes | 活跃 | 3 (168 Hours) | 256 | 1.2V | BOTTOM | BALL | 未说明 | 0.8mm | 未说明 | S-PBGA-B256 | 现场可编程门阵列 | 27696 | 1130496 | AEC-Q100 | 1.56mm | 14mm | 14mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||
 | M1A3P1000L-1FG484I | Microsemi Corporation | 数据表 | 2970 In Stock | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 300 | -40°C~100°C TJ | Tray | 2015 | ProASIC3L | e0 | Obsolete | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | 1.2V | BOTTOM | BALL | 225 | 30 | M1A3P1000L | 300 | 18kB | 8mA | 现场可编程门阵列 | 147456 | 1000000 | 892.86MHz | 1 | 24576 | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||
| M1A3P1000L-1FGG484I | Microsemi Corporation | 数据表 | 2972 In Stock | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 300 | -40°C~100°C TJ | Tray | 2015 | ProASIC3L | e1 | Obsolete | 3 (168 Hours) | 484 | 锡银铜 | 1.2V | BOTTOM | BALL | 250 | 40 | M1A3P1000L | 300 | 18kB | 8mA | 现场可编程门阵列 | 147456 | 1000000 | 892.86MHz | 1 | 24576 | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||
| M1A3P1000L-FG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 400.011771mg | 300 | 0°C~85°C TJ | Tray | 2015 | ProASIC3L | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.2V | M1A3P1000L | 18kB | 147456 | 1000000 | 781.25MHz | 24576 | 1.26V | 1.14V | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||
| A3P1000L-1FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 400.011771mg | 300 | 0°C~85°C TJ | Tray | 2009 | ProASIC3L | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.2V | A3P1000L | 18kB | 147456 | 1000000 | 892.86MHz | 1 | 24576 | 1.26V | 1.14V | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||
| M1A3P1000L-1FGG484 | Microsemi Corporation | 数据表 | 2952 In Stock | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 400.011771mg | 300 | 0°C~85°C TJ | Tray | 2015 | ProASIC3L | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.2V | M1A3P1000L | 18kB | 8mA | 147456 | 1000000 | 892.86MHz | 1 | 24576 | 1.26V | 1.14V | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||
| M1A3P1000L-FGG484I | Microsemi Corporation | 数据表 | 2968 In Stock | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 300 | -40°C~100°C TJ | Tray | 2015 | ProASIC3L | e1 | Obsolete | 3 (168 Hours) | 484 | 锡银铜 | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 250 | 1mm | 40 | M1A3P1000L | 300 | 1.5/3.3V | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 781.25MHz | 24576 | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||
| A3P1000L-FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 300 | -40°C~100°C TJ | Tray | 2009 | ProASIC3L | e0 | Obsolete | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 225 | 1mm | 30 | A3P1000L | 300 | 1.5/3.3V | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 781.25MHz | 24576 | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||
 | A3P250L-PQG208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 151 | -40°C~100°C TJ | Tray | 2009 | ProASIC3L | e3 | Obsolete | 3 (168 Hours) | 208 | 哑光锡 | 8542.39.00.01 | 1.2V | QUAD | 鸥翼 | 245 | 0.5mm | 40 | A3P250L | 151 | 1.5/3.3V | 4.5kB | 3mA | 现场可编程门阵列 | 36864 | 250000 | 781.25MHz | 6144 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||
| A3P600L-PQG208 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 208-PQFP (28x28) | 154 | 0°C~85°C TJ | Tray | 2009 | ProASIC3L | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.2V | A3P600L | 13.5kB | 110592 | 600000 | 781.25MHz | 13824 | 1.26V | 1.14V | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||
| A3P600L-PQ208 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 208-PQFP (28x28) | 154 | 0°C~85°C TJ | Tray | 2009 | ProASIC3L | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.2V | A3P600L | 13.5kB | 5mA | 110592 | 600000 | 781.25MHz | 13824 | 1.26V | 1.14V | 3.4mm | 28mm | 28mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
 | A3P060-1TQ144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LQFP | 144 | 144-TQFP (20x20) | 1.319103g | 91 | 0°C~85°C TJ | Tray | 2009 | ProASIC3 | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.5V | A3P060 | 2.3kB | 18432 | 60000 | 272MHz | 1 | 1536 | 1.575V | 1.425V | 1.4mm | 20mm | 20mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||
| AGL600V2-FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 22 Weeks | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 400.011771mg | 235 | 0°C~70°C TA | Tray | 2009 | IGLOO | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.5V | AGL600 | 13.5kB | 13824 | 110592 | 600000 | 892.86MHz | 1.575V | 1.14V | 1.73mm | 23mm | 23mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||
| AGLE600V5-FGG484I | Microsemi Corporation | 数据表 | 2963 In Stock | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 270 | -40°C~85°C TA | Tray | 2009 | IGLOOe | e1 | Obsolete | 3 (168 Hours) | 484 | 锡银铜 | 8542.39.00.01 | 1.5V | BOTTOM | BALL | 250 | 1mm | 40 | AGLE600 | 270 | 13.5kB | 现场可编程门阵列 | 13824 | 110592 | 600000 | 892.86MHz | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||
| AGLE600V5-FG484I | Microsemi Corporation | 数据表 | 2962 In Stock | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 270 | -40°C~85°C TA | Tray | 2012 | IGLOOe | e0 | Obsolete | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.5V | BOTTOM | BALL | 230 | 1mm | 30 | AGLE600 | 270 | 13.5kB | 现场可编程门阵列 | 13824 | 110592 | 600000 | 892.86MHz | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||
| M1A3P1000L-FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 400.011771mg | 300 | 0°C~85°C TJ | Tray | 2015 | ProASIC3L | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.2V | M1A3P1000L | 18kB | 147456 | 1000000 | 781.25MHz | 24576 | 1.26V | 1.14V | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||
| AGLE600V2-FGG484I | Microsemi Corporation | 数据表 | 2964 In Stock | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 270 | -40°C~85°C TA | Tray | 2012 | IGLOOe | e1 | Obsolete | 3 (168 Hours) | 484 | 锡银铜 | 8542.39.00.01 | 1.5V | BOTTOM | BALL | 250 | 1mm | 40 | AGLE600 | 270 | 13.5kB | 现场可编程门阵列 | 13824 | 110592 | 600000 | 892.86MHz | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||
| AGL400V2-FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 194 | -40°C~85°C TA | Tray | 2015 | IGLOO | e0 | Obsolete | 3 (168 Hours) | 484 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | 1.5V | BOTTOM | BALL | 230 | 1mm | 30 | AGL400 | 不合格 | 6.8kB | 27μA | 现场可编程门阵列 | 9216 | 55296 | 400000 | 250MHz | 1.73mm | 23mm | 23mm | Non-RoHS Compliant | |||||||||||||||||||||||||
| M1AGL600V2-FG484I | Microsemi Corporation | 数据表 | 2954 In Stock | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 2 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 235 | -40°C~85°C TA | Tray | 2015 | IGLOO | e0 | Obsolete | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.5V | BOTTOM | BALL | 225 | 1mm | 30 | M1AGL600 | 不合格 | 13.5kB | 108MHz | 现场可编程门阵列 | 13824 | 110592 | 600000 | 1.73mm | 23mm | 23mm | Non-RoHS Compliant | ||||||||||||||||||||||||||
| M1AGL600V5-FG484I | Microsemi Corporation | 数据表 | 2947 In Stock | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 400.011771mg | 235 | -40°C~85°C TA | Tray | IGLOO | e0 | Obsolete | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.5V | BOTTOM | BALL | 225 | 1mm | 30 | M1AGL600 | S-PBGA-B484 | 不合格 | 13.5kB | 108MHz | 现场可编程门阵列 | 13824 | 110592 | 600000 | 1.73mm | 23mm | 23mm | Non-RoHS Compliant |
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A40MX04-PLG68I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3PE600-1FGG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL005S-1VF256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL005S-1VFG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL025T-1VF256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL025TS-1VFG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P1000L-1FG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P1000L-1FGG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P1000L-FG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P1000L-1FGG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P1000L-1FGG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P1000L-FGG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P1000L-FG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P250L-PQG208I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P600L-PQG208
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P600L-PQ208
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P060-1TQ144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGL600V2-FGG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGLE600V5-FGG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGLE600V5-FG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P1000L-FGG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGLE600V2-FGG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGL400V2-FG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1AGL600V2-FG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1AGL600V5-FG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)