品牌是'Microsemi' (5267)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 工作电源电流 | 内存大小 | 时钟频率 | 输入数量 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | 筛选水平 | 逻辑块数(LABs) | 速度等级 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | MPF300TLS-FCSG536I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 536-LFBGA, CSPBGA | 536-CSPBGA (16x16) | 300 | -40°C~100°C TJ | Tray | PolarFire™ | 活跃 | 0.97V~1.08V | 300000 | 21094400 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPF300TS-1FCSG536I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 536-LFBGA, CSPBGA | 536-CSPBGA (16x16) | 300 | -40°C~100°C TJ | Tray | PolarFire™ | 活跃 | 0.97V~1.08V | 300000 | 21094400 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPF500TL-FCG784E | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 784-BBGA, FCBGA | 784-FCBGA (29x29) | 388 | 0°C~100°C TJ | Tray | PolarFire™ | 活跃 | 0.97V~1.08V | 481000 | 33792000 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX36-2BGG272I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 272-BBGA | 272 | 202 | -40°C~85°C TA | Tray | 2009 | MX | e1 | 活跃 | 3 (168 Hours) | 272 | Tin/Silver/Copper (Sn/Ag/Cu) | ALSO OPERATES AT 5V SUPPLY | 3V~3.6V 4.5V~5.5V | BOTTOM | BALL | 250 | 3.3V | 40 | A42MX36 | 5V | 320B | 现场可编程门阵列 | 2560 | 54000 | 164MHz | 1184 | 2 | 1822 | 1.73mm | 27mm | 27mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||
![]() | MPF300TL-FCSG536E | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 536-LFBGA, CSPBGA | 536-CSPBGA (16x16) | 300 | 0°C~100°C TJ | Tray | PolarFire™ | 活跃 | 0.97V~1.08V | 300000 | 21094400 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A42MX36-CQ256B | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 22 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 256-BFCQFP with Tie Bar | 256 | 202 | Military grade | -55°C~125°C TJ | Tray | 2009 | MX | e0 | 活跃 | 3 (168 Hours) | 256 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | 3V~3.6V 4.5V~5.5V | QUAD | FLAT | 225 | 3.3V | 0.5mm | 20 | A42MX36 | 256 | 3.3V | 320B | 73MHz | 现场可编程门阵列 | 2560 | 54000 | MIL-STD-883 | 1822 | 2.7 ns | 2438 | 3.3mm | 36mm | 36mm | 无 | Non-RoHS Compliant | ||||||||||||||||||
![]() | M7A3P1000-FG144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NOT RECOMMENDED FOR NEW DESIGN (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | 0°C~85°C TJ | Tray | 2008 | ProASIC3 | e0 | 不用于新设计 | 3 (168 Hours) | 144 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | 30 | M7A3P1000 | 1.5V | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 231MHz | 24576 | 1.05mm | 13mm | 13mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||
![]() | M2GL010TS-1FGG484M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BGA | YES | 233 | -55°C~125°C TJ | Tray | IGLOO2 | 活跃 | 3 (168 Hours) | 484 | 3A001.A.2.C | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 1mm | 30 | S-PBGA-B484 | 233 | 不合格 | 1.2V | 233 | 现场可编程门阵列 | 12084 | 933888 | 2.44mm | 23mm | 23mm | 符合RoHS标准 | |||||||||||||||||||||||||||||
![]() | APA075-FGG144I | Microsemi Corporation | 数据表 | 100 In Stock | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 100 | -40°C~85°C TA | Tray | 2007 | ProASICPLUS | 活跃 | 3 (168 Hours) | 144 | 8542.39.00.01 | 2.3V~2.7V | BOTTOM | BALL | 260 | 2.5V | 1mm | 180MHz | 40 | APA075 | 100 | 2.5V | 2.52.5/3.3V | 3.4kB | 现场可编程门阵列 | 27648 | 75000 | 3072 | 1.05mm | 13mm | 13mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||
![]() | M7A3P1000-FG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NOT RECOMMENDED FOR NEW DESIGN (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 177 | 0°C~85°C TJ | Tray | 2008 | ProASIC3 | 不用于新设计 | 3 (168 Hours) | 256 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | 30 | M7A3P1000 | 1.5V | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 231MHz | 24576 | 1.2mm | 17mm | 17mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||
![]() | M7A3P1000-FG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NOT RECOMMENDED FOR NEW DESIGN (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | -40°C~100°C TJ | Tray | 2008 | ProASIC3 | e0 | 不用于新设计 | 3 (168 Hours) | 144 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | 30 | M7A3P1000 | 1.5V | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 231MHz | 24576 | 1.05mm | 13mm | 13mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||
A42MX09-VQG100I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 83 | -40°C~85°C TA | Tray | 2009 | MX | e3 | 活跃 | 3 (168 Hours) | 100 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | 3V~3.6V 4.5V~5.5V | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | A42MX09 | 5V | 现场可编程门阵列 | 14000 | 215MHz | 336 | 516 | 2.5 ns | 684 | 1mm | 14mm | 14mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||
![]() | M7A3P1000-1FG144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NOT RECOMMENDED FOR NEW DESIGN (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | 0°C~85°C TJ | Tray | ProASIC3 | 不用于新设计 | 3 (168 Hours) | 144 | 1.425V~1.575V | BOTTOM | BALL | 1.5V | M7A3P1000 | 1.5V | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 272MHz | 1 | 24576 | 1.05mm | 13mm | 13mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||
![]() | MPF500TS-FCG784I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 784-BBGA, FCBGA | 784-FCBGA (29x29) | 388 | -40°C~100°C TJ | Tray | PolarFire™ | 活跃 | 0.97V~1.08V | 481000 | 33792000 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPF500TL-FCG784I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 784-BBGA, FCBGA | 784-FCBGA (29x29) | 388 | -40°C~100°C TJ | Tray | PolarFire™ | 活跃 | 0.97V~1.08V | 481000 | 33792000 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPF500TLS-FCG784I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 784-BBGA, FCBGA | 784-FCBGA (29x29) | 388 | -40°C~100°C TJ | Tray | PolarFire™ | 活跃 | 0.97V~1.08V | 481000 | 33792000 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPF500TLS-FCG1152I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 1152-BBGA, FCBGA | 584 | -40°C~100°C TJ | Tray | PolarFire™ | 活跃 | 0.97V~1.08V | 现场可编程门阵列 | 481000 | 33792000 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A3PE3000L-FGG484M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 9 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 341 | -55°C~125°C TJ | Tray | 2009 | ProASIC3L | e1 | 活跃 | 3 (168 Hours) | 484 | 3A001.A.2.C | 锡银铜 | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 250 | 1.2V | 1mm | 40 | A3PE3000L | 341 | 1.5V | 1.2/1.51.2/3.3V | 25mA | 63kB | 现场可编程门阵列 | 516096 | 3000000 | 350MHz | 75264 | 2.44mm | 23mm | 23mm | 无 | 符合RoHS标准 | ||||||||||||||||||||
![]() | A3PE3000L-1FG896M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 9 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 896-BGA | 896 | 400.011771mg | 620 | -55°C~125°C TJ | Tray | 2009 | ProASIC3L | e0 | 活跃 | 3 (168 Hours) | 896 | 锡铅 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.2V | 30 | A3PE3000L | 620 | 1.5V | 63kB | 250MHz | 现场可编程门阵列 | 516096 | 3000000 | 1 | 75264 | 2.44mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||
![]() | M7A3P1000-2FGG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NOT RECOMMENDED FOR NEW DESIGN (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | -40°C~100°C TJ | Tray | 2003 | ProASIC3 | e1 | 不用于新设计 | 3 (168 Hours) | 144 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 260 | 1.5V | 1mm | 310MHz | 40 | M7A3P1000 | 1.5V | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 2 | 24576 | 1.05mm | 13mm | 13mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||
![]() | A42MX09-1PLG84I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 84-LCC (J-Lead) | 84 | 6.777889g | 72 | -40°C~85°C TA | Tube | MX | e3 | 活跃 | 3 (168 Hours) | 84 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 3V~3.6V 4.5V~5.5V | QUAD | J BEND | 245 | 3.3V | 40 | A42MX09 | 5V | 现场可编程门阵列 | 14000 | 247MHz | 336 | 1 | 516 | 684 | 3.68mm | 29.31mm | 29.31mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||
![]() | M7A3P1000-1FG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NOT RECOMMENDED FOR NEW DESIGN (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 300 | 0°C~85°C TJ | Tray | 2008 | ProASIC3 | e0 | 不用于新设计 | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 30 | M7A3P1000 | 1.5V | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 272MHz | 1 | 24576 | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||
A42MX09-2VQG100I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 83 | -40°C~85°C TA | Tray | 2015 | MX | e3 | 活跃 | 3 (168 Hours) | 100 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 3V~3.6V 4.5V~5.5V | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | A42MX09 | 5V | 现场可编程门阵列 | 14000 | 269MHz | 336 | 2 | 516 | 1.8 ns | 684 | 1mm | 14mm | 14mm | 无 | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||
![]() | M7A3P1000-2FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NOT RECOMMENDED FOR NEW DESIGN (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 300 | -40°C~100°C TJ | Tray | 2008 | ProASIC3 | e0 | 不用于新设计 | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | 30 | M7A3P1000 | 1.5V | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 310MHz | 2 | 24576 | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||
![]() | A42MX16-PQG100I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-BQFP | 100 | 1.758804g | 83 | -40°C~85°C TA | Tray | 2009 | MX | e3 | 活跃 | 3 (168 Hours) | 100 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | 3V~3.6V 4.5V~5.5V | QUAD | 鸥翼 | 245 | 3.3V | 0.65mm | 40 | A42MX16 | 5V | 现场可编程门阵列 | 24000 | 172MHz | 608 | 928 | 2.8 ns | 1232 | 2.7mm | 20mm | 14mm | 无 | 符合RoHS标准 |
MPF300TLS-FCSG536I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
MPF300TS-1FCSG536I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
MPF500TL-FCG784E
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
A42MX36-2BGG272I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
MPF300TL-FCSG536E
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
A42MX36-CQ256B
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M7A3P1000-FG144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M2GL010TS-1FGG484M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
APA075-FGG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M7A3P1000-FG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M7A3P1000-FG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
A42MX09-VQG100I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M7A3P1000-1FG144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
MPF500TS-FCG784I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
MPF500TL-FCG784I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
MPF500TLS-FCG784I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
MPF500TLS-FCG1152I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3PE3000L-FGG484M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
A3PE3000L-1FG896M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M7A3P1000-2FGG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
A42MX09-1PLG84I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M7A3P1000-1FG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
A42MX09-2VQG100I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
M7A3P1000-2FG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
A42MX16-PQG100I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
