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品牌是'Microsemi' (5267)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 输出的数量 | 资历状况 | 电源 | 内存大小 | 内存大小 | 传播延迟 | 接通延迟时间 | 电流源 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | 筛选水平 | 速度等级 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | 电压 - 供电 （最大值） | 电压 - 供电 （最小值） | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | A1020B-CQ84M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 84-CQFP Exposed Pad and Tie Bar | 84 | 69 | -55°C~125°C TC | Tray | ACT™ 1 | e0 | Obsolete | 3 (168 Hours) | 84 | 3A001.A.2.C | 锡铅 | 8542.39.00.01 | 5V | QUAD | FLAT | 225 | 0.635mm | 48MHz | 20 | A1020 | 69 | 5V | 4.5 ns | 4.5 ns | 现场可编程门阵列 | 547 | 2000 | 273 | 5.5 ns | 547 | 547 | 2.54mm | 16.51mm | 16.51mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||
 | APA600-CQ352B | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 352-BFCQFP with Tie Bar | 352 | 248 | Military grade | -55°C~125°C TJ | Tray | 2007 | ProASICPLUS | e4 | Obsolete | 3 (168 Hours) | 352 | 3A001.A.2.C | Gold (Au) | 8542.39.00.01 | 2.5V | QUAD | FLAT | 225 | 0.5mm | 30 | APA600 | 248 | 2.52.5/3.3V | 15.8kB | 现场可编程门阵列 | 129024 | 600000 | 5MHz | MIL-STD-883 Class B | 21504 | 2.89mm | 48mm | 48mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||
 | M2GL060-FCSG325I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 324-LFBGA, CSPBGA | YES | 200 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 325 | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 260 | 30 | S-PBGA-B325 | 现场可编程门阵列 | 56520 | 1869824 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||
 | M2GL060-FGG676 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 11 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 676-BGA | YES | 387 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 676 | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 260 | 1mm | 30 | S-PBGA-B676 | 现场可编程门阵列 | 56520 | 1869824 | 2.44mm | 27mm | 27mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||
 | M2GL060T-FGG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BGA | YES | 267 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 484 | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 260 | 1mm | 30 | S-PBGA-B484 | 现场可编程门阵列 | 56520 | 1869824 | 2.44mm | 23mm | 23mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||
| A3P1000-1FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | Copper, Silver, Tin | 表面贴装 | 表面贴装 | 484-BGA | 484 | 300 | 0°C~85°C TJ | Tray | 2008 | ProASIC3 | e1 | 活跃 | 3 (168 Hours) | 484 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.5V | BOTTOM | BALL | 250 | 272MHz | 40 | A3P1000 | 18kB | 18kB | 8mA | 现场可编程门阵列 | 11000 | 147456 | 1000000 | 1 | 24576 | 2.23mm | 23mm | 23mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||
 | A3P030-2QNG48I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 48-VFQFN Exposed Pad | 48 | 34 | -40°C~100°C TJ | Tray | 2009 | ProASIC3 | 活跃 | 3 (168 Hours) | 48 | 1.5V | QUAD | 260 | 0.4mm | 30 | A3P030 | 2mA | 现场可编程门阵列 | 30000 | 310MHz | 2 | 768 | 768 | 880μm | 6mm | 6mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||
 | A3P030-2QNG68I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 68-VFQFN Exposed Pad | 68 | 49 | -40°C~100°C TJ | Tray | 2009 | ProASIC3 | 活跃 | 3 (168 Hours) | 68 | 1.5V | QUAD | 260 | 0.4mm | 30 | A3P030 | 2mA | 现场可编程门阵列 | 30000 | 310MHz | 2 | 768 | 768 | 880μm | 8mm | 8mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||
 | A3P030-2VQG100 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 100-VQFP (14x14) | 77 | 0°C~85°C TJ | Tray | 2009 | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | A3P030 | 30000 | 310MHz | 2 | 768 | 1.575V | 1.425V | 1mm | 14mm | 14mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||
| A3P060-1VQG100 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 100-VQFP (14x14) | 71 | 0°C~85°C TJ | Tray | 2013 | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | 272MHz | A3P060 | 2.3kB | 2.3kB | 2mA | 660 | 18432 | 60000 | 272MHz | 1 | 1536 | 1.575V | 1.425V | 1mm | 14mm | 14mm | 无 | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||
| A3P060-1VQG100I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 71 | -40°C~100°C TJ | Tray | 2008 | ProASIC3 | 活跃 | 3 (168 Hours) | 1.5V | A3P060 | 2.3kB | 2.3kB | 15mA | 现场可编程门阵列 | 660 | 18432 | 60000 | 272MHz | 1 | 1536 | 1mm | 14mm | 14mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||
| A3P125-1VQ100 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 100-VQFP (14x14) | 71 | 0°C~85°C TJ | Tray | 2009 | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | A3P125 | 4.5kB | 36864 | 125000 | 272MHz | 1 | 3072 | 1.575V | 1.425V | 1mm | 14mm | 14mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||
 | A3P060-1FGG144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 144-FPBGA (13x13) | 400.011771mg | 96 | 0°C~85°C TJ | Tray | 2008 | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | 272MHz | A3P060 | 2.3kB | 18432 | 60000 | 272MHz | 1 | 1536 | 1.575V | 1.425V | 1.05mm | 13mm | 13mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||
| AGL125V5-VQ100I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 71 | -40°C~85°C TA | Tray | 2013 | IGLOO | e0 | 活跃 | 3 (168 Hours) | 100 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.5V | QUAD | 鸥翼 | 230 | 0.5mm | 30 | AGL125 | 不合格 | 4.5kB | 现场可编程门阵列 | 3072 | 36864 | 125000 | 892.86MHz | 1mm | 14mm | 14mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||
| AGL125V5-FG144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 144-FPBGA (13x13) | 400.011771mg | 97 | 0°C~70°C TA | Tray | IGLOO | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | AGL125 | 4.5kB | 3072 | 36864 | 125000 | 892.86MHz | 1.575V | 1.425V | 1.05mm | 13mm | 13mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||
| A3P060-2FGG144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 144-FPBGA (13x13) | 400.011771mg | 96 | 0°C~85°C TJ | Tray | 2013 | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | A3P060 | 2.3kB | 18432 | 60000 | 310MHz | 2 | 1536 | 1.575V | 1.425V | 1.05mm | 13mm | 13mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||
| A3P125-1VQG100I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 71 | -40°C~100°C TJ | Tray | 2008 | ProASIC3 | e3 | 活跃 | 3 (168 Hours) | 100 | Matte Tin (Sn) | 1.5V | QUAD | 鸥翼 | 260 | 0.5mm | 40 | A3P125 | 4.5kB | 现场可编程门阵列 | 36864 | 125000 | 272MHz | 1 | 3072 | 1mm | 14mm | 14mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||
| AGL250V5-FGG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 5 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 97 | -40°C~85°C TA | Tray | 2009 | IGLOO | e1 | 活跃 | 3 (168 Hours) | 144 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.5V | BOTTOM | BALL | 260 | 1mm | 40 | AGL250 | 4.5kB | 4.5kB | 现场可编程门阵列 | 6144 | 36864 | 250000 | 892.86MHz | 1.05mm | 13mm | 13mm | 无 | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||
| M2GL060-FGG676I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 6 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 676-BGA | YES | 387 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 676 | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 260 | 1mm | 30 | S-PBGA-B676 | 现场可编程门阵列 | 56520 | 1869824 | 2.44mm | 27mm | 27mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||
| AGLN020V5-QNG68 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 68-VFQFN Exposed Pad | 68 | 68-QFN (8x8) | 810.002575mg | 49 | -20°C~85°C TJ | Tray | 2005 | IGLOO nano | 活跃 | 3 (168 Hours) | 70°C | -20°C | 1.5V | AGLN020 | 6μA | 520 | 20000 | 250MHz | 520 | 1.575V | 1.425V | 880μm | 8mm | 8mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||
| A3P030-2QNG48 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 48-VFQFN Exposed Pad | 48 | 34 | 0°C~85°C TJ | Tray | 2009 | ProASIC3 | 活跃 | 3 (168 Hours) | 48 | 1.5V | QUAD | 260 | 0.4mm | 30 | A3P030 | 2mA | 现场可编程门阵列 | 30000 | 310MHz | 2 | 768 | 768 | 880μm | 6mm | 6mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||
| A3P030-2QNG68 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 68-VFQFN Exposed Pad | 68 | 68-QFN (8x8) | 49 | 0°C~85°C TJ | Tray | 2009 | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | 310MHz | A3P030 | 2mA | 30000 | 310MHz | 2 | 768 | 1.575V | 1.425V | 880μm | 8mm | 8mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||
 | A3P250-FG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 400.011771mg | 157 | 0°C~85°C TJ | Tray | 2009 | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | A3P250 | 4.5kB | 36864 | 250000 | 231MHz | 6144 | 1.575V | 1.425V | 1.2mm | 17mm | 17mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||
| A3P250-2FGG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | -40°C~100°C TJ | Tray | 2009 | ProASIC3 | e1 | 活跃 | 3 (168 Hours) | 144 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.5V | BOTTOM | BALL | 260 | 1mm | 310MHz | 30 | A3P250 | 4.5kB | 现场可编程门阵列 | 36864 | 250000 | 2 | 6144 | 1.05mm | 13mm | 13mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||
 | M1A3P250-PQG208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 151 | -40°C~100°C TJ | Tray | 2012 | ProASIC3 | e3 | 活跃 | 3 (168 Hours) | 208 | Matte Tin (Sn) | 8542.39.00.01 | 1.5V | QUAD | 鸥翼 | 245 | 0.5mm | 40 | M1A3P250 | 4.5kB | 现场可编程门阵列 | 36864 | 250000 | 231MHz | 6144 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 |
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A1020B-CQ84M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
APA600-CQ352B
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL060-FCSG325I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL060-FGG676
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL060T-FGG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P1000-1FGG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P030-2QNG48I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P030-2QNG68I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P030-2VQG100
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P060-1VQG100
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P060-1VQG100I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P125-1VQ100
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P060-1FGG144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGL125V5-VQ100I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGL125V5-FG144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P060-2FGG144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P125-1VQG100I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGL250V5-FGG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL060-FGG676I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGLN020V5-QNG68
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P030-2QNG48
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P030-2QNG68
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P250-FG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P250-2FGG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P250-PQG208I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)