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品牌是'Microsemi' (5267)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 最大电源电压 | 最小电源电压 | 内存大小 | 传播延迟 | 接通延迟时间 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | 筛选水平 | 逻辑块数(LABs) | 速度等级 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | A3P060-2FGG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 96 | -40°C~100°C TJ | Tray | 2009 | ProASIC3 | e1 | 活跃 | 3 (168 Hours) | 144 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 260 | 1.5V | 1mm | 310MHz | 40 | A3P060 | 1.5V | 2.3kB | 现场可编程门阵列 | 18432 | 60000 | 2 | 1536 | 1.05mm | 13mm | 13mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||
 | A3P060-2FG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 96 | -40°C~100°C TJ | Tray | 2013 | ProASIC3 | e0 | 活跃 | 3 (168 Hours) | 144 | 锡铅银 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | 30 | A3P060 | 1.5V | 2.3kB | 现场可编程门阵列 | 18432 | 60000 | 310MHz | 2 | 1536 | 1.05mm | 13mm | 13mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||
 | A3P125-2VQG100I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 71 | -40°C~100°C TJ | Tray | 2009 | ProASIC3 | e3 | 活跃 | 3 (168 Hours) | 100 | Matte Tin (Sn) | 1.425V~1.575V | QUAD | 鸥翼 | 260 | 1.5V | 0.5mm | 310MHz | 40 | A3P125 | 1.5V | 4.5kB | 现场可编程门阵列 | 36864 | 125000 | 2 | 3072 | 1mm | 14mm | 14mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||
 | M2GL005-1TQG144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 144-LQFP | YES | 84 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 144 | 8542.39.00.01 | 1.14V~2.625V | QUAD | 鸥翼 | 260 | 1.2V | 0.5mm | 30 | S-PQFP-G144 | 现场可编程门阵列 | 6060 | 719872 | 1.6mm | 20mm | 20mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||
| M1A3P250-1VQG100 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 100-VQFP (14x14) | 68 | 0°C~85°C TJ | Tray | 2013 | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | M1A3P250 | 1.5V | 1.575V | 1.425V | 4.5kB | 36864 | 250000 | 272MHz | 1 | 6144 | 1mm | 14mm | 14mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||
| A3P125-2FGG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | -40°C~100°C TJ | Tray | 2009 | ProASIC3 | e1 | 活跃 | 3 (168 Hours) | 144 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 260 | 1.5V | 1mm | 40 | A3P125 | 1.5V | 4.5kB | 现场可编程门阵列 | 36864 | 125000 | 310MHz | 2 | 3072 | 1.05mm | 13mm | 13mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||
 | A3P125-1PQG208 | Microsemi Corporation | 数据表 | 15 In Stock | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 208-PQFP (28x28) | 133 | 0°C~85°C TJ | Tray | 2008 | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | A3P125 | 1.5V | 1.575V | 1.425V | 4.5kB | 36864 | 125000 | 272MHz | 1 | 3072 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||
| M2GL005S-TQG144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 144-LQFP | YES | 84 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 144 | 8542.39.00.01 | 1.14V~2.625V | QUAD | 鸥翼 | 260 | 1.2V | 0.5mm | 30 | S-PQFP-G144 | 现场可编程门阵列 | 6060 | 719872 | 1.6mm | 20mm | 20mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||
| A3P250-2VQG100 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 100-VQFP (14x14) | 68 | 0°C~85°C TJ | Tray | 2009 | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | 310MHz | A3P250 | 1.5V | 1.575V | 1.425V | 4.5kB | 36864 | 250000 | 310MHz | 2 | 6144 | 1mm | 14mm | 14mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||
 | M2GL005S-VFG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 256-LFBGA | YES | 161 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 256 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 0.8mm | 30 | S-PBGA-B256 | 现场可编程门阵列 | 6060 | 719872 | 1.56mm | 14mm | 14mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||
| M1A3P250-2VQG100 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 100-VQFP (14x14) | 68 | 0°C~85°C TJ | Tray | 2013 | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | M1A3P250 | 1.5V | 1.575V | 1.425V | 4.5kB | 36864 | 250000 | 310MHz | 2 | 6144 | 1mm | 14mm | 14mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||
 | AGL125V2-CSG196I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 196-TFBGA, CSBGA | 196 | 133 | -40°C~85°C TA | Tray | 2016 | IGLOO | 活跃 | 3 (168 Hours) | 196 | 8542.39.00.01 | 1.14V~1.575V | BOTTOM | BALL | 未说明 | 1.2V | 0.5mm | 未说明 | AGL125 | 不合格 | 1.5V | 4.5kB | 现场可编程门阵列 | 3072 | 36864 | 125000 | 892.86MHz | 700μm | 8mm | 8mm | 符合RoHS标准 | ||||||||||||||||||||||||||||
| M2GL005S-TQG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 144-LQFP | YES | 84 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 144 | 8542.39.00.01 | 1.14V~2.625V | QUAD | 鸥翼 | 260 | 1.2V | 0.5mm | 30 | S-PQFP-G144 | 现场可编程门阵列 | 6060 | 719872 | 1.6mm | 20mm | 20mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||
| A3P250-1VQ100I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 68 | -40°C~100°C TJ | Tray | ProASIC3 | e0 | 活跃 | 3 (168 Hours) | 100 | Tin/Lead (Sn/Pb) | 1.425V~1.575V | QUAD | 鸥翼 | 225 | 1.5V | 0.5mm | 272MHz | 30 | A3P250 | 1.5V | 4.5kB | 现场可编程门阵列 | 36864 | 250000 | 1 | 6144 | 1mm | 14mm | 14mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||
 | M2GL005-1VF400I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 400-LFBGA | YES | 400 | 169 | -40°C~100°C TJ | Tray | 2013 | IGLOO2 | 活跃 | 3 (168 Hours) | 400 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 0.8mm | 20 | M2GL005 | 171 | 不合格 | 1.2V | 87.9kB | 现场可编程门阵列 | 6060 | 719872 | 1.51mm | 17mm | 17mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||
| A3P125-1PQG208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 133 | -40°C~100°C TJ | Tray | 2008 | ProASIC3 | e3 | 活跃 | 3 (168 Hours) | 208 | Matte Tin (Sn) | 1.425V~1.575V | QUAD | 鸥翼 | 245 | 1.5V | 0.5mm | 40 | A3P125 | 1.5V | 4.5kB | 现场可编程门阵列 | 36864 | 125000 | 272MHz | 1 | 3072 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||
| M1A3P250-FGG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | -40°C~100°C TJ | Tray | 2013 | ProASIC3 | e1 | 活跃 | 3 (168 Hours) | 144 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 260 | 1.5V | 1mm | 40 | M1A3P250 | 1.5V | 4.5kB | 现场可编程门阵列 | 36864 | 250000 | 231MHz | 6144 | 1.05mm | 13mm | 13mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||
| AGL125V2-CS196I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 196-TFBGA, CSBGA | 196 | 133 | -40°C~85°C TA | Tray | 2016 | IGLOO | 活跃 | 3 (168 Hours) | 196 | 8542.39.00.01 | 1.14V~1.575V | BOTTOM | BALL | 未说明 | 1.2V | 0.5mm | 未说明 | AGL125 | 不合格 | 1.5V | 4.5kB | 现场可编程门阵列 | 3072 | 36864 | 125000 | 892.86MHz | 700μm | 8mm | 8mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||
| A3P250-2FGG144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 144-FPBGA (13x13) | 400.011771mg | 97 | 0°C~85°C TJ | Tray | 2009 | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | 310MHz | A3P250 | 1.5V | 1.575V | 1.425V | 4.5kB | 36864 | 250000 | 310MHz | 2 | 6144 | 1.05mm | 13mm | 13mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||
| M1AGL250V5-FGG144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 144-FPBGA (13x13) | 400.011771mg | 97 | 0°C~70°C TA | Tray | IGLOO | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | M1AGL250 | 1.5V | 1.575V | 1.425V | 4.5kB | 6144 | 36864 | 250000 | 1.05mm | 13mm | 13mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||
 | A1020B-CQ84M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 84-CQFP Exposed Pad and Tie Bar | 84 | 69 | -55°C~125°C TC | Tray | ACT™ 1 | e0 | Obsolete | 3 (168 Hours) | 84 | 3A001.A.2.C | 锡铅 | 8542.39.00.01 | 4.5V~5.5V | QUAD | FLAT | 225 | 5V | 0.635mm | 48MHz | 20 | A1020 | 69 | 5V | 5V | 4.5 ns | 4.5 ns | 现场可编程门阵列 | 547 | 2000 | 273 | 5.5 ns | 547 | 547 | 2.54mm | 16.51mm | 16.51mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||
 | APA600-CQ352B | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 352-BFCQFP with Tie Bar | 352 | 248 | Military grade | -55°C~125°C TJ | Tray | 2007 | ProASICPLUS | e4 | Obsolete | 3 (168 Hours) | 352 | 3A001.A.2.C | Gold (Au) | 8542.39.00.01 | 2.3V~2.7V | QUAD | FLAT | 225 | 2.5V | 0.5mm | 30 | APA600 | 248 | 2.5V | 2.52.5/3.3V | 15.8kB | 现场可编程门阵列 | 129024 | 600000 | 5MHz | MIL-STD-883 Class B | 21504 | 2.89mm | 48mm | 48mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||
 | A1020B-CQ84C | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 84-CQFP Exposed Pad and Tie Bar | 84 | 69 | 0°C~70°C TA | Tray | 2000 | ACT™ 1 | e0 | Obsolete | 3 (168 Hours) | 84 | 锡铅 | 8542.39.00.01 | 4.5V~5.5V | QUAD | FLAT | 225 | 5V | 0.635mm | 48MHz | 20 | A1020 | 69 | 5V | 5V | 4.5 ns | 4.5 ns | 现场可编程门阵列 | 547 | 2000 | 273 | 5.5 ns | 547 | 547 | 2.54mm | 16.51mm | 16.51mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||
| A3PN250-Z1VQG100 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 68 | -20°C~85°C TJ | Tray | 2009 | ProASIC3 nano | Obsolete | 3 (168 Hours) | 100 | 1.425V~1.575V | QUAD | 鸥翼 | 260 | 1.5V | 0.5mm | 40 | A3PN250 | 68 | 1.5V | 4.5kB | 现场可编程门阵列 | 36864 | 250000 | 1 | 6144 | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||
 | EX64-TQ100 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2 Weeks | OBSOLETE (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 100-LQFP | 100 | 100-TQFP (14x14) | 657.000198mg | 56 | 0°C~70°C TA | Tray | 2006 | EX | Obsolete | 1 (Unlimited) | 70°C | 0°C | 2.3V~2.7V | 250MHz | EX64 | 2.5V | 2.7V | 2.3V | 1.1 ns | 1.1 ns | 128 | 3000 | 250MHz | 128 | 128 | 1.4mm | 14mm | 14mm | 无 | Non-RoHS Compliant |
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A3P060-2FGG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P060-2FG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P125-2VQG100I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL005-1TQG144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P250-1VQG100
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P125-2FGG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P125-1PQG208
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL005S-TQG144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P250-2VQG100
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL005S-VFG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P250-2VQG100
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGL125V2-CSG196I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL005S-TQG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P250-1VQ100I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL005-1VF400I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P125-1PQG208I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P250-FGG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGL125V2-CS196I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P250-2FGG144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1AGL250V5-FGG144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A1020B-CQ84M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
APA600-CQ352B
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A1020B-CQ84C
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3PN250-Z1VQG100
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
EX64-TQ100
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)