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品牌是'Microsemi' (5267)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 输出的数量 | 资历状况 | 电源 | 内存大小 | 内存大小 | 传播延迟 | 接通延迟时间 | 电流源 | 数据率 | 输入数量 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | LABs数量/ CLBs数量 | 逻辑块数(LABs) | 速度等级 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 逻辑单元数 | 电压 - 供电 （最大值） | 电压 - 供电 （最小值） | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | M2GL025-FGG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 9 Weeks | IN PRODUCTION (Last Updated: 4 weeks ago) | 表面贴装 | 484-BGA | YES | 267 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 484 | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 260 | 1mm | 30 | S-PBGA-B484 | 267 | 不合格 | 256kB | 667 Mbps | 267 | 现场可编程门阵列 | 27696 | 1130496 | 400MHz | 34 | 2.44mm | 23mm | 23mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||
 | A3P1000-FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | Lead, Tin | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 300 | -40°C~100°C TJ | Tray | 2015 | ProASIC3 | e0 | 活跃 | 3 (168 Hours) | 484 | 3A001.A.7.A | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.5V | BOTTOM | BALL | 225 | 1mm | 231MHz | 30 | A3P1000 | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 24576 | 2.44mm | 23mm | 23mm | 无 | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||
 | A3P1000-FG144M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | -55°C~125°C TJ | Tray | 2009 | ProASIC3 | e0 | 活跃 | 3 (168 Hours) | 144 | 3A001.A.2.C | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | 1.5V | BOTTOM | BALL | 1mm | A3P1000 | 97 | 1.51.5/3.3V | 18kB | 8mA | 现场可编程门阵列 | 147456 | 1000000 | 350MHz | 24576 | 1.55mm | 13mm | 13mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||
| M1A3PE3000-2FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 341 | -40°C~100°C TJ | Tray | 2015 | ProASIC3E | e0 | 活跃 | 3 (168 Hours) | 484 | 锡铅 | 1.5V | BOTTOM | BALL | 225 | 1mm | 310MHz | 30 | M1A3PE3000 | 341 | 1.5/3.3V | 63kB | 现场可编程门阵列 | 516096 | 3000000 | 2 | 75264 | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||
| APA450-FGG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 344 | -40°C~85°C TA | Tray | 2007 | ProASICPLUS | e1 | 活跃 | 3 (168 Hours) | 484 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 2.5V | BOTTOM | BALL | 250 | 1mm | 180MHz | 40 | APA450 | 344 | 2.52.5/3.3V | 13.5kB | 现场可编程门阵列 | 110592 | 450000 | 12288 | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||
| AX1000-FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 317 | -40°C~85°C TA | Tray | 2012 | Axcelerator | e0 | 活跃 | 3 (168 Hours) | 484 | 3A001.A.7.A | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.5V | BOTTOM | BALL | 225 | 1mm | 649MHz | 30 | AX1000 | 516 | 1.51.5/3.32.5/3.3V | 20.3kB | 990 ps | 990 ps | 现场可编程门阵列 | 165888 | 1000000 | 18144 | 12096 | 0.99 ns | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||
| A54SX72A-2FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 360 | -40°C~85°C TA | Tray | 2007 | SX-A | e0 | 活跃 | 3 (168 Hours) | 484 | 锡铅 | 2.5V | BOTTOM | BALL | 225 | 1mm | 294MHz | 30 | A54SX72A | 360 | 1.1 ns | 1.1 ns | 现场可编程门阵列 | 6036 | 108000 | 2 | 4024 | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||
 | APA600-BG456I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | Lead, Silver, Tin | 表面贴装 | 表面贴装 | 456-BBGA | 456 | 356 | -40°C~85°C TA | Tray | 2009 | ProASICPLUS | 活跃 | 3 (168 Hours) | 456 | 3A001.A.7.A | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | 2.5V | BOTTOM | BALL | 225 | 1.27mm | 180MHz | 30 | APA600 | 356 | 2.52.5/3.3V | 15.8kB | 现场可编程门阵列 | 129024 | 600000 | 21504 | 1.73mm | 35mm | 35mm | 无 | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||||
 | APA600-FG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 186 | -40°C~85°C TA | Tray | 2009 | ProASICPLUS | e0 | 活跃 | 3 (168 Hours) | 256 | 3A001.A.7.A | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | 2.5V | BOTTOM | BALL | 245 | 1mm | 180MHz | 30 | APA600 | 186 | 2.52.5/3.3V | 15.8kB | 现场可编程门阵列 | 129024 | 600000 | 21504 | 1.2mm | 17mm | 17mm | 无 | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||||
| AFS1500-2FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 223 | -40°C~100°C TJ | Tray | 2013 | Fusion® | e0 | 活跃 | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | 1.5V | BOTTOM | BALL | 225 | 1mm | 30 | AFS1500 | 33.8kB | 现场可编程门阵列 | 276480 | 1500000 | 1.47059GHz | 2 | 38400 | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||
 | M2GL150-FCG1152I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 1152-BBGA, FCBGA | YES | 574 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 260 | 1mm | 30 | S-PBGA-B1152 | 574 | 不合格 | 1.2V | 574 | 现场可编程门阵列 | 146124 | 5120000 | 2.9mm | 35mm | 35mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||||||
 | A3PN015-QNG68I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | Tin | 表面贴装 | 表面贴装 | 68-VFQFN Exposed Pad | 68 | 810.002575mg | 49 | -40°C~100°C TJ | Tray | 2009 | ProASIC3 nano | 活跃 | 3 (168 Hours) | 68 | 8542.39.00.01 | 1.5V | QUAD | 260 | 0.4mm | 30 | A3PN015 | 49 | 1.51.5/3.3V | 8mA | 现场可编程门阵列 | 160 | 15000 | 350MHz | 384 | 384 | 384 | 880μm | 8mm | 8mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||
 | AGLN010V5-QNG48I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 22 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 48-VFQFN Exposed Pad | 48 | 34 | -40°C~100°C TJ | Tray | 2013 | IGLOO nano | 活跃 | 3 (168 Hours) | 48 | 8542.39.00.01 | 1.5V | QUAD | 无铅 | 未说明 | 0.4mm | 未说明 | AGLN010 | 不合格 | 3μA | 现场可编程门阵列 | 260 | 10000 | 250MHz | 260 | 880μm | 6mm | 6mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||||
 | AGL250V2-VQ100I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 22 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 68 | -40°C~85°C TA | Tray | 2013 | IGLOO | e0 | 活跃 | 3 (168 Hours) | 100 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.5V | QUAD | 鸥翼 | 230 | 0.5mm | 30 | AGL250 | 不合格 | 4.5kB | 现场可编程门阵列 | 6144 | 36864 | 250000 | 892.86MHz | 1mm | 14mm | 14mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||
| M1AFS600-2FGG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 172 | -40°C~100°C TJ | Tray | 2013 | Fusion® | e1 | 活跃 | 3 (168 Hours) | 484 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.5V | BOTTOM | BALL | 250 | 1mm | 40 | M1AFS600 | 13.5kB | 现场可编程门阵列 | 110592 | 600000 | 1.47059GHz | 2 | 13824 | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||
| APA450-BGG456I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 456-BBGA | 456 | 344 | -40°C~85°C TA | Tray | ProASICPLUS | e1 | 活跃 | 3 (168 Hours) | 456 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 2.5V | BOTTOM | BALL | 245 | 1.27mm | 40 | APA450 | 344 | 2.52.5/3.3V | 13.5kB | 现场可编程门阵列 | 110592 | 450000 | 180MHz | 12288 | 1.73mm | 35mm | 35mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||
| AFS600-FG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | Lead, Silver, Tin | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 119 | -40°C~100°C TJ | Tray | 2013 | Fusion® | 活跃 | 3 (168 Hours) | 256 | 3A001.A.7.A | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | 1.5V | BOTTOM | BALL | 225 | 1mm | 1.0989GHz | 30 | AFS600 | 13.5kB | 现场可编程门阵列 | 110592 | 600000 | 13824 | 1.2mm | 17mm | 17mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||
 | APA150-PQG208 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 158 | 0°C~70°C TA | Tray | 2009 | ProASICPLUS | e3 | 活跃 | 3 (168 Hours) | 208 | Matte Tin (Sn) | 8542.39.00.01 | 2.5V | QUAD | 鸥翼 | 245 | 0.5mm | 180MHz | 40 | APA150 | 158 | 2.52.5/3.3V | 4.5kB | 4.5kB | 5mA | 现场可编程门阵列 | 36864 | 150000 | 6144 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||
| A3PN125-VQG100I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 71 | -40°C~100°C TJ | Tray | 2007 | ProASIC3 nano | 活跃 | 3 (168 Hours) | 100 | 8542.39.00.01 | 1.5V | QUAD | 鸥翼 | 260 | 0.5mm | 40 | A3PN125 | 4.5kB | 4.5kB | 15mA | 现场可编程门阵列 | 1500 | 36864 | 125000 | 350MHz | 3072 | 1mm | 14mm | 14mm | 无 | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||
| A3P600-FGG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 177 | -40°C~100°C TJ | Tray | ProASIC3 | e1 | 活跃 | 3 (168 Hours) | 256 | 3A001.A.7.A | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.5V | BOTTOM | BALL | 260 | 1mm | 231MHz | 40 | A3P600 | 13.5kB | 13.5kB | 45mA | 现场可编程门阵列 | 6500 | 110592 | 600000 | 13824 | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||
 | AGLN010V2-UCG36I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 36-WFBGA, CSPBGA | 36 | 23 | -40°C~100°C TJ | Tray | 2015 | IGLOO nano | 活跃 | 3 (168 Hours) | 36 | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 未说明 | 0.4mm | 未说明 | AGLN010 | 不合格 | 3μA | 现场可编程门阵列 | 260 | 10000 | 250MHz | 260 | 0.8mm | 3mm | 3mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||||
| A3PN125-2VQG100I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 71 | -40°C~100°C TJ | Tray | 2009 | ProASIC3 nano | 活跃 | 3 (168 Hours) | 100 | 1.5V | QUAD | 鸥翼 | 260 | 0.5mm | 40 | A3PN125 | 4.5kB | 2mA | 现场可编程门阵列 | 36864 | 125000 | 350MHz | 2 | 3072 | 1mm | 14mm | 14mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||
| A3P1000-FG256T | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 177 | -40°C~125°C TA | Tray | 2009 | Automotive, AEC-Q100, ProASIC3 | e0 | 活跃 | 3 (168 Hours) | 256 | 3A001.A.7.A | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1mm | 231MHz | 20 | A3P1000 | 177 | 不合格 | 1.5/3.3V | 18kB | 8mA | 现场可编程门阵列 | 147456 | 1000000 | 24576 | 1.8mm | 17mm | 17mm | Non-RoHS Compliant | ||||||||||||||||||||||||||
| APA1000-PQG208M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 158 | -55°C~125°C TC | Tray | ProASICPLUS | e3 | 活跃 | 3 (168 Hours) | 208 | 3A001.A.2.C | Matte Tin (Sn) | 8542.39.00.01 | 2.5V | QUAD | 鸥翼 | 245 | 0.5mm | 40 | APA1000 | 158 | 2.52.5/3.3V | 24.8kB | 现场可编程门阵列 | 202752 | 1000000 | 180MHz | 56320 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||
| A3P400-1FG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 400.011771mg | 178 | 0°C~85°C TJ | Tray | 2009 | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | A3P400 | 6.8kB | 55296 | 400000 | 272MHz | 1 | 9216 | 1.575V | 1.425V | 1.2mm | 17mm | 17mm | 无 | Non-RoHS Compliant |
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M2GL025-FGG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P1000-FG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P1000-FG144M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3PE3000-2FG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
APA450-FGG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX1000-FG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A54SX72A-2FG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
APA600-BG456I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
APA600-FG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AFS1500-2FG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL150-FCG1152I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3PN015-QNG68I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGLN010V5-QNG48I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGL250V2-VQ100I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1AFS600-2FGG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
APA450-BGG456I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AFS600-FG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
APA150-PQG208
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3PN125-VQG100I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P600-FGG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGLN010V2-UCG36I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3PN125-2VQG100I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P1000-FG256T
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
APA1000-PQG208M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P400-1FG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)