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品牌是'Microsemi' (5267)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 端子表面处理 | 最高工作温度 | 最小工作温度 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 输出的数量 | 资历状况 | 电源 | 内存大小 | 内存大小 | 传播延迟 | 电流源 | 数据率 | 输入数量 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | LABs数量/ CLBs数量 | 筛选水平 | 逻辑块数(LABs) | 速度等级 | 寄存器数量 | CLB-Max的组合延时 | 电压 - 供电 （最大值） | 电压 - 供电 （最小值） | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | M1AGLE3000V5-FGG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 341 | -40°C~85°C TA | Tray | IGLOOe | e1 | 活跃 | 3 (168 Hours) | 484 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.5V | BOTTOM | BALL | 250 | 1mm | 30 | M1AGLE3000 | 63kB | 现场可编程门阵列 | 75264 | 516096 | 3000000 | 2.44mm | 23mm | 23mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||
| M1AGLE3000V2-FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 341 | 0°C~70°C TA | Tray | 2012 | IGLOOe | e1 | 活跃 | 3 (168 Hours) | 484 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.5V | BOTTOM | BALL | 250 | 1mm | 30 | M1AGLE3000 | 63kB | 现场可编程门阵列 | 75264 | 516096 | 3000000 | 892.86MHz | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||
 | AGLE3000V2-FG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 22 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 400.011771mg | 341 | 0°C~70°C TA | Tray | 2012 | IGLOOe | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | AGLE3000 | 63kB | 75264 | 516096 | 3000000 | 892.86MHz | 75264 | 1.575V | 1.14V | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||
 | A42MX36-3PQG208 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 208-PQFP (28x28) | 176 | 0°C~70°C TA | Tray | 2009 | MX | 活跃 | 3 (168 Hours) | 70°C | 0°C | 5V | A42MX36 | 320B | 1184 | 2560 | 54000 | 180MHz | 1184 | 3 | 1822 | 5.25V | 3V | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||
| AGLE3000V2-FGG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 22 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 341 | -40°C~85°C TA | Tray | IGLOOe | e1 | 活跃 | 3 (168 Hours) | 484 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.5V | BOTTOM | BALL | 250 | 1mm | 40 | AGLE3000 | 341 | 63kB | 现场可编程门阵列 | 75264 | 516096 | 3000000 | 892.86MHz | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||
 | A42MX36-3BGG272 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 272-BBGA | 272 | 272-PBGA (27x27) | 202 | 0°C~70°C TA | Tray | 2009 | MX | 活跃 | 3 (168 Hours) | 70°C | 0°C | 3V~3.6V 4.75V~5.25V | A42MX36 | 320B | 1184 | 2560 | 54000 | 180MHz | 1184 | 3 | 1822 | 5.25V | 3V | 1.73mm | 27mm | 27mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||
 | AX1000-1CQ352M | Microsemi Corporation | 数据表 | 100 In Stock | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 352-BFCQFP with Tie Bar | 352 | 10.567001g | 198 | Military grade | -55°C~125°C TA | Tray | 2005 | Axcelerator | e0 | 活跃 | 3 (168 Hours) | 352 | 锡铅 | 1.5V | QUAD | FLAT | 225 | 0.5mm | 20 | AX1000 | 516 | 20.3kB | 850 ps | 现场可编程门阵列 | 12096 | 165888 | 1000000 | 763MHz | 18144 | MIL-STD-883 Class B | 1 | 0.84 ns | 2.66mm | 48mm | 48mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||
 | M2GL010TS-VF256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 256-LFBGA | YES | 138 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 256 | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 240 | 0.8mm | 20 | S-PBGA-B256 | 现场可编程门阵列 | 12084 | 933888 | 1.56mm | 14mm | 14mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||
| M2GL010T-VF256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 256-LFBGA | YES | 138 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 256 | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 240 | 0.8mm | 20 | S-PBGA-B256 | 现场可编程门阵列 | 12084 | 933888 | 1.56mm | 14mm | 14mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||
| M2GL010-VF256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 3 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 256-LFBGA | YES | 138 | -40°C~100°C TJ | Tray | IGLOO2 | 活跃 | 3 (168 Hours) | 256 | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 240 | 0.8mm | 20 | S-PBGA-B256 | 现场可编程门阵列 | 12084 | 933888 | 1.56mm | 14mm | 14mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||
| M2GL010TS-VFG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 256-LFBGA | YES | 138 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 256 | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 260 | 0.8mm | 30 | S-PBGA-B256 | 现场可编程门阵列 | 12084 | 933888 | 1.56mm | 14mm | 14mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||
| M2GL010T-1VF256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 256-LFBGA | YES | 138 | -40°C~100°C TJ | Tray | IGLOO2 | 活跃 | 3 (168 Hours) | 256 | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 240 | 0.8mm | 20 | S-PBGA-B256 | 现场可编程门阵列 | 12084 | 933888 | 1.56mm | 14mm | 14mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||
| M2GL010T-1VFG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 256-LFBGA | YES | 138 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 256 | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 260 | 0.8mm | 30 | S-PBGA-B256 | 现场可编程门阵列 | 12084 | 933888 | 1.56mm | 14mm | 14mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||
| A3P400-1PQG208 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 208-PQFP (28x28) | 151 | 0°C~85°C TJ | Tray | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | A3P400 | 6.8kB | 55296 | 400000 | 272MHz | 1 | 9216 | 1.575V | 1.425V | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||||
 | M1A3P600-FGG144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 144-FPBGA (13x13) | 400.011771mg | 97 | 0°C~85°C TJ | Tray | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | M1A3P600 | 13.5kB | 110592 | 600000 | 231MHz | 13824 | 1.575V | 1.425V | 1.05mm | 13mm | 13mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||
| M1A3P600-1FGG144 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 144-FPBGA (13x13) | 400.011771mg | 97 | 0°C~85°C TJ | Tray | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | 272MHz | M1A3P600 | 13.5kB | 110592 | 600000 | 272MHz | 1 | 13824 | 1.575V | 1.425V | 1.05mm | 13mm | 13mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||
| M2GL010TS-1VFG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 256-LFBGA | YES | 138 | -40°C~100°C TJ | Tray | IGLOO2 | 活跃 | 3 (168 Hours) | 256 | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 260 | 0.8mm | 30 | S-PBGA-B256 | 现场可编程门阵列 | 12084 | 933888 | 1.56mm | 14mm | 14mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||
| M1A3P600-FGG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 400.011771mg | 177 | 0°C~85°C TJ | Tray | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | M1A3P600 | 13.5kB | 110592 | 600000 | 231MHz | 13824 | 1.575V | 1.425V | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||
 | M2GL025-FCSG325 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 9 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 324-LFBGA, CSPBGA | YES | 180 | 0°C~85°C TJ | Tray | IGLOO2 | 活跃 | 3 (168 Hours) | 325 | 8542.39.00.01 | 1.2V | BOTTOM | BALL | 260 | 30 | S-PBGA-B325 | 180 | 不合格 | 1.2V | 180 | 现场可编程门阵列 | 27696 | 1130496 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||
| M1A3P600-PQG208 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 208-PQFP (28x28) | 154 | 0°C~85°C TJ | Tray | 2003 | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | M1A3P600 | 13.5kB | 13.5kB | 5mA | 700 Mbps | 6500 | 110592 | 600000 | 350MHz | 1.575V | 1.425V | 3.4mm | 28mm | 28mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||
| M1A3P600-1FG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 400.011771mg | 177 | 0°C~85°C TJ | Tray | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | M1A3P600 | 13.5kB | 110592 | 600000 | 272MHz | 1 | 13824 | 1.575V | 1.425V | 1.2mm | 17mm | 17mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
| M1A3P600-1FGG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 400.011771mg | 177 | 0°C~85°C TJ | Tray | 2003 | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | M1A3P600 | 13.5kB | 110592 | 600000 | 272MHz | 1 | 13824 | 1.575V | 1.425V | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||
| AGL400V5-FG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 22 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 400.011771mg | 178 | 0°C~70°C TA | Tray | 2012 | IGLOO | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | AGL400 | 6.8kB | 27μA | 9216 | 55296 | 400000 | 250MHz | 1.575V | 1.425V | 1.2mm | 17mm | 17mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
| M1A3P600-2FGG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 400.011771mg | 177 | 0°C~85°C TJ | Tray | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | M1A3P600 | 13.5kB | 110592 | 600000 | 310MHz | 2 | 13824 | 1.575V | 1.425V | 1.2mm | 17mm | 17mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||
| M1A3P600-2PQG208 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 208-PQFP (28x28) | 154 | 0°C~85°C TJ | Tray | ProASIC3 | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.5V | M1A3P600 | 13.5kB | 110592 | 600000 | 310MHz | 2 | 13824 | 1.575V | 1.425V | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 |
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M1AGLE3000V5-FGG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1AGLE3000V2-FGG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGLE3000V2-FG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A42MX36-3PQG208
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGLE3000V2-FGG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A42MX36-3BGG272
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX1000-1CQ352M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL010TS-VF256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL010T-VF256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL010-VF256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL010TS-VFG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL010T-1VF256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL010T-1VFG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P400-1PQG208
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P600-FGG144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P600-1FGG144
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL010TS-1VFG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P600-FGG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL025-FCSG325
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P600-PQG208
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P600-1FG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P600-1FGG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGL400V5-FG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P600-2FGG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P600-2PQG208
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)