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品牌是'Microsemi' (5267)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 最大电源电压 | 最小电源电压 | 内存大小 | 工作电源电流 | 内存大小 | 时钟频率 | 输入数量 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | 逻辑块数(LABs) | 速度等级 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 最大结点温度（Tj） | 逻辑单元数 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | M2GL060TS-FG676 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 676-BGA | YES | 387 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 676 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 1mm | 20 | S-PBGA-B676 | 现场可编程门阵列 | 56520 | 1869824 | 2.44mm | 27mm | 27mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||
 | M2GL090-1FCSG325 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 324-LFBGA, CSPBGA | YES | 180 | 0°C~85°C TJ | Tray | IGLOO2 | 活跃 | 3 (168 Hours) | 325 | 8542.39.00.01 | 1.14V~2.625V | 1.2V | 180 | 不合格 | 1.2V | 180 | 现场可编程门阵列 | 86184 | 2648064 | 86316 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||
 | M1AGL1000V5-FG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 300 | 0°C~70°C TA | Tray | 2015 | IGLOO | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | M1AGL1000 | 127μA | 18kB | 24576 | 147456 | 1000000 | 250MHz | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||
| M2GL060T-1FGG676 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 676-BGA | YES | 387 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 676 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 1mm | 30 | S-PBGA-B676 | 现场可编程门阵列 | 56520 | 1869824 | 2.44mm | 27mm | 27mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||
 | M2GL090-1FCS325 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 325-TFBGA | YES | 180 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 325 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 20 | S-PBGA-B325 | 180 | 不合格 | 1.2V | 180 | 现场可编程门阵列 | 86184 | 2648064 | 86316 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||
 | M1AGL1000V5-FG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 177 | -40°C~85°C TA | Tray | 2013 | IGLOO | 活跃 | 3 (168 Hours) | 256 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | 30 | M1AGL1000 | 不合格 | 18kB | 108MHz | 现场可编程门阵列 | 24576 | 147456 | 1000000 | 1.8mm | 17mm | 17mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||
 | M1A3PE3000L-1FGG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 341 | -40°C~100°C TJ | Tray | 2013 | ProASIC3L | e1 | 活跃 | 3 (168 Hours) | 484 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.14V~1.575V | BOTTOM | BALL | 250 | 1.2V | 40 | M1A3PE3000L | 341 | 1.2V | 63kB | 350MHz | 现场可编程门阵列 | 516096 | 3000000 | 1 | 75264 | 2.44mm | 23mm | 23mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||
 | APA1000-FGG896 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 11 Weeks | 表面贴装 | 表面贴装 | 896-BGA | 896 | 400.011771mg | 642 | 0°C~70°C TA | Tray | 2007 | ProASICPLUS | e1 | 活跃 | 3 (168 Hours) | 896 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 2.3V~2.7V | BOTTOM | BALL | 250 | 2.5V | 180MHz | 40 | APA1000 | 642 | 2.5V | 2.52.5/3.3V | 24.8kB | 现场可编程门阵列 | 202752 | 1000000 | 56320 | 1.73mm | 31mm | 31mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||
 | AGL125V2-QNG132 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 132-WFQFN | 132 | 132-QFN (8x8) | 84 | 0°C~70°C TA | Tray | 2009 | IGLOO | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.14V~1.575V | AGL125 | 1.575V | 1.14V | 4.5kB | 3072 | 36864 | 125000 | 无 | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||
 | AGLN060V5-VQG100 | Microsemi Corporation | 数据表 | 300 In Stock | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | Tin | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 100-VQFP (14x14) | 71 | -20°C~85°C TJ | Tray | 2013 | IGLOO nano | 活跃 | 3 (168 Hours) | 70°C | -20°C | 1.425V~1.575V | AGLN060 | 1.5V | 1.575V | 1.425V | 2.3kB | 10μA | 2.3kB | 1536 | 18432 | 60000 | 250MHz | 1mm | 14mm | 14mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||||
 | AGLN010V2-QNG48 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 48-VFQFN Exposed Pad | 48 | 48-QFN (6x6) | 150.507618mg | FLASH | 34 | -20°C~85°C TJ | Tray | IGLOO nano | 活跃 | 3 (168 Hours) | 85°C | -20°C | 1.14V~1.575V | 250MHz | AGLN010 | 1.5V | 1.575V | 1.14V | 3μA | 260 | 10000 | 250MHz | 85°C | 900μm | 6mm | 6mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||||||
| AGLN250V5-VQG100 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 100-VQFP (14x14) | 68 | -20°C~85°C TJ | Tray | 2013 | IGLOO nano | 活跃 | 3 (168 Hours) | 70°C | -20°C | 1.425V~1.575V | AGLN250 | 1.575V | 1.425V | 34μA | 4.5kB | 6144 | 36864 | 250000 | 250MHz | 1mm | 14mm | 14mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||||||||||||
| M1A3P1000L-1PQG208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 154 | -40°C~100°C TJ | Tray | ProASIC3L | e3 | Obsolete | 3 (168 Hours) | 208 | 哑光锡 | 1.14V~1.575V | QUAD | 鸥翼 | 245 | 1.2V | 0.5mm | 40 | M1A3P1000L | 154 | 1.2V | 8mA | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 892.86MHz | 1 | 24576 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||
| M1AFS600-PQ208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 95 | -40°C~100°C TJ | Tray | 2013 | Fusion® | e0 | Obsolete | 3 (168 Hours) | 208 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.425V~1.575V | QUAD | FLAT | 225 | 1.5V | 0.5mm | 1.0989GHz | 30 | M1AFS600 | 1.5V | 13.5kB | 现场可编程门阵列 | 110592 | 600000 | 13824 | 3.4mm | 28mm | 28mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||
| AFS600-PQG208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 95 | -40°C~100°C TJ | Tray | 2013 | Fusion® | e3 | Obsolete | 3 (168 Hours) | 208 | 哑光锡 | 8542.39.00.01 | 1.425V~1.575V | QUAD | FLAT | 245 | 1.5V | 0.5mm | 1.0989GHz | 40 | AFS600 | 1.5V | 13.5kB | 现场可编程门阵列 | 110592 | 600000 | 13824 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||
 | M1A3PE1500-PQ208 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 208-PQFP (28x28) | 147 | 0°C~85°C TJ | Tray | 2012 | ProASIC3E | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | M1A3PE1500 | 1.5V | 1.575V | 1.425V | 33.8kB | 276480 | 1500000 | 231MHz | 38400 | 3.4mm | 28mm | 28mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||
| A3P1000L-1PQG208 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 154 | 0°C~85°C TJ | Tray | ProASIC3L | e3 | Obsolete | 3 (168 Hours) | 208 | 哑光锡 | 1.14V~1.575V | QUAD | 鸥翼 | 245 | 1.2V | 0.5mm | 40 | A3P1000L | 154 | 1.2V | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 892.86MHz | 1 | 24576 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||
| M1A3P600L-PQ208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 154 | -40°C~100°C TJ | Tray | ProASIC3L | e0 | Obsolete | 3 (168 Hours) | 208 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.14V~1.575V | QUAD | 鸥翼 | 225 | 1.2V | 0.5mm | 30 | M1A3P600L | 154 | 1.2V | 1.5/3.3V | 13.5kB | 现场可编程门阵列 | 110592 | 600000 | 781.25MHz | 13824 | 3.4mm | 28mm | 28mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
| A42MX24-PQ208M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 176 | -55°C~125°C TC | Tray | 2015 | MX | e0 | Obsolete | 3 (168 Hours) | 208 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | 3V~3.6V 4.5V~5.5V | QUAD | 鸥翼 | 225 | 3.3V | 0.5mm | 30 | A42MX24 | 208 | 5V | 现场可编程门阵列 | 36000 | 912 | 1410 | 2.5 ns | 1890 | 3.4mm | 28mm | 28mm | 无 | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||
| M1A3P600L-1PQG208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 154 | -40°C~100°C TJ | Tray | ProASIC3L | e3 | Obsolete | 3 (168 Hours) | 208 | 哑光锡 | 1.14V~1.575V | QUAD | 鸥翼 | 245 | 1.2V | 0.5mm | 40 | M1A3P600L | 154 | 1.2V | 5mA | 13.5kB | 现场可编程门阵列 | 110592 | 600000 | 892.86MHz | 1 | 13824 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||
| M1A3P1000L-1PQ208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 154 | -40°C~100°C TJ | Tray | ProASIC3L | e0 | Obsolete | 3 (168 Hours) | 208 | Tin/Lead (Sn/Pb) | 1.14V~1.575V | QUAD | 鸥翼 | 225 | 1.2V | 0.5mm | 30 | M1A3P1000L | 154 | 1.2V | 8mA | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 892.86MHz | 1 | 24576 | 3.4mm | 28mm | 28mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
| M1A3P1000L-1PQG208 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 208-PQFP (28x28) | 154 | 0°C~85°C TJ | Tray | ProASIC3L | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.14V~1.575V | M1A3P1000L | 1.2V | 1.26V | 1.14V | 8mA | 18kB | 147456 | 1000000 | 892.86MHz | 1 | 24576 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||
| M1AFS250-PQ208I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 93 | -40°C~100°C TJ | Tray | 2013 | Fusion® | e0 | Obsolete | 3 (168 Hours) | 208 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.425V~1.575V | QUAD | FLAT | 225 | 1.5V | 0.5mm | 1.0989GHz | 30 | M1AFS250 | 1.5V | 4.5kB | 现场可编程门阵列 | 36864 | 250000 | 6144 | 3.4mm | 28mm | 28mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||
| A3P1000L-PQ208 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 208-PQFP (28x28) | 154 | 0°C~85°C TJ | Tray | 2009 | ProASIC3L | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.14V~1.575V | A3P1000L | 1.2V | 1.26V | 1.14V | 18kB | 147456 | 1000000 | 781.25MHz | 24576 | 3.4mm | 28mm | 28mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||
| M1A3P1000-PQ208 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 208-PQFP (28x28) | 154 | 0°C~85°C TJ | Tray | 2003 | ProASIC3 | Obsolete | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | M1A3P1000 | 1.5V | 1.575V | 1.425V | 18kB | 147456 | 1000000 | 231MHz | 24576 | 无 | Non-RoHS Compliant |
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M2GL060TS-FG676
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL090-1FCSG325
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1AGL1000V5-FG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL060T-1FGG676
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL090-1FCS325
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1AGL1000V5-FG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3PE3000L-1FGG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
APA1000-FGG896
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGL125V2-QNG132
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGLN060V5-VQG100
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGLN010V2-QNG48
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AGLN250V5-VQG100
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P1000L-1PQG208I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1AFS600-PQ208I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AFS600-PQG208I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3PE1500-PQ208
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P1000L-1PQG208
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P600L-PQ208I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A42MX24-PQ208M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P600L-1PQG208I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P1000L-1PQ208I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P1000L-1PQG208
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1AFS250-PQ208I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P1000L-PQ208
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P1000-PQ208
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)