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品牌是'Microsemi' (5267)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 最大电源电压 | 最小电源电压 | 内存大小 | 传播延迟 | 接通延迟时间 | 输入数量 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | LABs数量/ CLBs数量 | 筛选水平 | 逻辑块数(LABs) | 速度等级 | 寄存器数量 | CLB-Max的组合延时 | 逻辑单元数 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | 无铅 | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | A3P1000-1FG256M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 256-LBGA | 256 | 256-FPBGA (17x17) | 177 | -55°C~125°C TJ | Tray | 2014 | ProASIC3 | 活跃 | 3 (168 Hours) | 125°C | -55°C | 1.14V~1.575V | 4kB | 147456 | 1000000 | 1 | 24576 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||
 | M2GL050T-1FGG484M | Microsemi Corporation | 数据表 | 18 In Stock | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BGA | YES | 267 | -55°C~125°C TJ | Tray | IGLOO2 | 活跃 | 3 (168 Hours) | 484 | 3A001.A.2.C | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 1mm | 30 | S-PBGA-B484 | 267 | 不合格 | 1.2V | 267 | 现场可编程门阵列 | 56340 | 1869824 | 2.44mm | 23mm | 23mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||
 | M2GL050T-1FG484M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BGA | YES | 484 | 267 | -55°C~125°C TJ | Tray | IGLOO2 | 活跃 | 3 (168 Hours) | 484 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 20 | 267 | 不合格 | 1.2V | 228.3kB | 现场可编程门阵列 | 56340 | 1869824 | 1 | 2.44mm | 23mm | 23mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||
 | APA1000-FGG896I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 11 Weeks | 表面贴装 | 表面贴装 | 896-BGA | 896 | 400.011771mg | 642 | -40°C~85°C TA | Tray | ProASICPLUS | e1 | 活跃 | 3 (168 Hours) | 896 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 2.3V~2.7V | BOTTOM | BALL | 245 | 2.5V | 180MHz | 30 | APA1000 | 642 | 2.5V | 2.52.5/3.3V | 24.8kB | 现场可编程门阵列 | 202752 | 1000000 | 56320 | 1.73mm | 31mm | 31mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||
| APA1000-FGG896M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 11 Weeks | 表面贴装 | 表面贴装 | 896-BGA | 896 | 400.011771mg | 642 | -55°C~125°C TC | Tray | 2007 | ProASICPLUS | e1 | 活跃 | 3 (168 Hours) | 896 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 2.3V~2.7V | BOTTOM | BALL | 250 | 2.5V | 40 | APA1000 | 642 | 2.5V | 2.52.5/3.3V | 24.8kB | 现场可编程门阵列 | 202752 | 1000000 | 180MHz | 56320 | 1.73mm | 31mm | 31mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||
| AX1000-FGG484M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 317 | Military grade | -55°C~125°C TA | Tray | 2005 | Axcelerator | e1 | 活跃 | 3 (168 Hours) | 484 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 250 | 1.5V | 1mm | 649MHz | 40 | AX1000 | 516 | 1.5V | 1.51.5/3.32.5/3.3V | 20.3kB | 990 ps | 990 ps | 现场可编程门阵列 | 165888 | 1000000 | 18144 | MIL-STD-883 Class B | 12096 | 0.99 ns | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | |||||||||||||||||||
 | A54SX32-CQ208 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 24 Weeks | 表面贴装 | 表面贴装 | 208-BFCQFP with Tie Bar | 208 | 208-CQFP (75x75) | 10.567001g | 174 | 0°C~70°C TA | Tray | SX | 活跃 | 3 (168 Hours) | 70°C | 0°C | 3V~3.6V 4.75V~5.25V | 205MHz | A54SX32 | 5V | 5.25V | 4.75V | 1 ns | 1 ns | 2880 | 48000 | 205MHz | 2880 | 2880 | 1080 | 2.8mm | 29.21mm | 29.21mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
 | M2GL060-1FGG676I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 676-BGA | YES | 387 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 676 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 1mm | 30 | S-PBGA-B676 | 现场可编程门阵列 | 56520 | 1869824 | 2.44mm | 27mm | 27mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||
| M2GL060-1FG676I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 676-BGA | YES | 387 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 676 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 1mm | 20 | S-PBGA-B676 | 现场可编程门阵列 | 56520 | 1869824 | 2.44mm | 27mm | 27mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||
 | M2GL050TS-1VF400I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 400-LFBGA | YES | 400 | 207 | -40°C~100°C TJ | Tray | IGLOO2 | 活跃 | 3 (168 Hours) | 400 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 0.8mm | 20 | M2GL050TS | 207 | 不合格 | 1.2V | 228.3kB | 现场可编程门阵列 | 56340 | 1869824 | 1.51mm | 17mm | 17mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||
| M2GL060TS-1FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BGA | YES | 267 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 484 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 1mm | 30 | S-PBGA-B484 | 现场可编程门阵列 | 56520 | 1869824 | 2.44mm | 23mm | 23mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||
| M2GL060TS-1FGG676 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 676-BGA | YES | 387 | 0°C~85°C TJ | Tray | IGLOO2 | 活跃 | 3 (168 Hours) | 676 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 1mm | 30 | S-PBGA-B676 | 现场可编程门阵列 | 56520 | 1869824 | 2.44mm | 27mm | 27mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||||||
| M2GL060TS-1FG676 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 676-BGA | YES | 387 | 0°C~85°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 676 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 1mm | 20 | S-PBGA-B676 | 现场可编程门阵列 | 56520 | 1869824 | 2.44mm | 27mm | 27mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||
| M2GL060TS-FGG676I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 676-BGA | YES | 387 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 676 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 1mm | 30 | S-PBGA-B676 | 现场可编程门阵列 | 56520 | 1869824 | 2.44mm | 27mm | 27mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||
 | M1A3PE3000-1FG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 341 | -40°C~100°C TJ | Tray | 2015 | ProASIC3E | e0 | 活跃 | 3 (168 Hours) | 484 | 锡铅 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 30 | M1A3PE3000 | 341 | 1.5V | 63kB | 现场可编程门阵列 | 516096 | 3000000 | 272MHz | 1 | 75264 | 1.73mm | 23mm | 23mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||
| A3PE3000-2FG896 | Microsemi Corporation | 数据表 | 27 In Stock | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 表面贴装 | 表面贴装 | 896-BGA | 896 | 896-FBGA (31x31) | 400.011771mg | 620 | 0°C~85°C TJ | Tray | 2009 | ProASIC3E | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | A3PE3000 | 1.5V | 1.575V | 1.425V | 63kB | 516096 | 3000000 | 310MHz | 2 | 75264 | 1.73mm | 31mm | 31mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||
| M1A3PE3000L-FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 400.011771mg | 341 | 0°C~85°C TJ | Tray | 2013 | ProASIC3L | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.14V~1.575V | M1A3PE3000L | 1.2V | 1.26V | 1.14V | 63kB | 516096 | 3000000 | 781.25MHz | 75264 | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||
| M1A3PE3000-2FGG484I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 341 | -40°C~100°C TJ | Tray | 2013 | ProASIC3E | e1 | 活跃 | 3 (168 Hours) | 484 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 250 | 1.5V | 1mm | 40 | M1A3PE3000 | 341 | 1.5V | 1.5/3.3V | 63kB | 现场可编程门阵列 | 516096 | 3000000 | 310MHz | 2 | 75264 | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||
| M2GL090TS-1FGG484M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BGA | YES | 267 | -55°C~125°C TJ | Tray | IGLOO2 | 活跃 | 3 (168 Hours) | 484 | 3A001.A.2.C | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 1mm | 30 | S-PBGA-B484 | 267 | 不合格 | 1.2V | 267 | 现场可编程门阵列 | 86184 | 2648064 | 86316 | 2.44mm | 23mm | 23mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||
 | A3PE3000-2FGG896I | Microsemi Corporation | 数据表 | 10 In Stock | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | Copper, Silver, Tin | 表面贴装 | 表面贴装 | 896-BGA | 896 | 400.011771mg | 620 | -40°C~100°C TJ | Tray | 2009 | ProASIC3E | e1 | 活跃 | 3 (168 Hours) | 896 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.425V~1.575V | BOTTOM | BALL | 250 | 1.5V | 40 | A3PE3000 | 1.5V | 63kB | 现场可编程门阵列 | 516096 | 3000000 | 310MHz | 2 | 75264 | 1.73mm | 31mm | 31mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||
 | A3PE3000L-1PQG208 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 9 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 208-PQFP (28x28) | 147 | 0°C~85°C TJ | Tray | ProASIC3L | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.14V~1.575V | A3PE3000L | 1.2V | 1.26V | 1.14V | 63kB | 516096 | 3000000 | 892.86MHz | 1 | 75264 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||
 | A42MX36-FBGG272 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 272-BBGA | 272 | 272-PBGA (27x27) | 202 | 0°C~70°C TA | Tray | 2012 | MX | 活跃 | 3 (168 Hours) | 70°C | 0°C | 3V~3.6V 4.75V~5.25V | A42MX36 | 5V | 5.25V | 3V | 320B | 1184 | 2560 | 54000 | 79MHz | 1184 | 1822 | 1.73mm | 27mm | 27mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||
 | APA600-PQG208 | Microsemi Corporation | 数据表 | 120 In Stock | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 158 | 0°C~70°C TA | Tray | 2007 | ProASICPLUS | e3 | 活跃 | 3 (168 Hours) | 208 | Matte Tin (Sn) | 8542.39.00.01 | 2.3V~2.7V | QUAD | 鸥翼 | 245 | 2.5V | 0.5mm | 180MHz | 30 | APA600 | 158 | 2.5V | 2.52.5/3.3V | 15.8kB | 现场可编程门阵列 | 129024 | 600000 | 21504 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||
| AFS1500-1FG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 119 | -40°C~100°C TJ | Tray | 2013 | Fusion® | 活跃 | 3 (168 Hours) | 256 | TIN LEAD/TIN LEAD SILVER | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 30 | AFS1500 | 1.5V | 33.8kB | 现场可编程门阵列 | 276480 | 1500000 | 1.28205GHz | 1 | 38400 | 1.2mm | 17mm | 17mm | 无 | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||
| M1AGLE3000V5-FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 400.011771mg | 341 | 0°C~70°C TA | Tray | 2012 | IGLOOe | e1 | 活跃 | 3 (168 Hours) | 484 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 250 | 1.5V | 1mm | 30 | M1AGLE3000 | 1.5V | 63kB | 现场可编程门阵列 | 75264 | 516096 | 3000000 | 892.86MHz | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 |
-
A3P1000-1FG256M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL050T-1FGG484M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL050T-1FG484M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
APA1000-FGG896I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
APA1000-FGG896M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX1000-FGG484M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A54SX32-CQ208
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL060-1FGG676I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL060-1FG676I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL050TS-1VF400I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL060TS-1FGG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL060TS-1FGG676
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL060TS-1FG676
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL060TS-FGG676I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3PE3000-1FG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3PE3000-2FG896
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3PE3000L-FGG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3PE3000-2FGG484I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL090TS-1FGG484M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3PE3000-2FGG896I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3PE3000L-1PQG208
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A42MX36-FBGG272
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
APA600-PQG208
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AFS1500-1FG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1AGLE3000V5-FGG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)