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品牌是'Microsemi' (5267)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 最大电源电压 | 最小电源电压 | 工作电源电流 | 内存大小 | 时钟频率 | 传播延迟 | 接通延迟时间 | 输入数量 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | 最高频率 | LABs数量/ CLBs数量 | 速度等级 | 寄存器数量 | CLB-Max的组合延时 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | RoHS状态 | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | AFS600-FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | Copper, Silver, Tin | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 400.011771mg | 172 | 0°C~85°C TJ | Tray | 2013 | Fusion® | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | 1.0989GHz | AFS600 | 1.5V | 1.575V | 1.425V | 13.5kB | 110592 | 600000 | 1.0989GHz | 13824 | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||
 | M2GL050TS-FGG896I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 896-BGA | YES | 377 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 896 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 1mm | 30 | S-PBGA-B896 | 377 | 不合格 | 1.2V | 377 | 现场可编程门阵列 | 56340 | 1869824 | 2.44mm | 31mm | 31mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||
 | A3P1000L-FGG144I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 144-LBGA | 144 | 400.011771mg | 97 | -40°C~100°C TJ | Tray | 2009 | ProASIC3L | e1 | 活跃 | 3 (168 Hours) | 144 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.14V~1.575V | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | A3P1000L | 97 | 1.2V | 1.5/3.3V | 18kB | 现场可编程门阵列 | 147456 | 1000000 | 781.25MHz | 24576 | 1.05mm | 13mm | 13mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||
 | AFS250-1FG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 114 | -40°C~100°C TJ | Tray | 2013 | Fusion® | 活跃 | 3 (168 Hours) | 256 | TIN LEAD/TIN LEAD SILVER | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 30 | AFS250 | 1.5V | 4.5kB | 现场可编程门阵列 | 36864 | 250000 | 1.28205GHz | 1 | 6144 | 1.2mm | 17mm | 17mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||
| AX250-FG256 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 22 Weeks | IN PRODUCTION (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 138 | 0°C~70°C TA | Tray | 2005 | Axcelerator | 活跃 | 3 (168 Hours) | 256 | 3A001.A.7.A | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | 649MHz | 30 | AX250 | 248 | 1.5V | 1.51.5/3.32.5/3.3V | 6.8kB | 990 ps | 990 ps | 现场可编程门阵列 | 55296 | 250000 | 4224 | 2816 | 0.99 ns | 1.2mm | 17mm | 17mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||
 | M2GL060TS-1FG676I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 676-BGA | YES | 387 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 676 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 1mm | 20 | S-PBGA-B676 | 现场可编程门阵列 | 56520 | 1869824 | 2.44mm | 27mm | 27mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||
| M2GL060TS-1FGG676I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 676-BGA | YES | 387 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 676 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 1mm | 30 | S-PBGA-B676 | 现场可编程门阵列 | 56520 | 1869824 | 2.44mm | 27mm | 27mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||
| M2GL060T-1FGG676I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 676-BGA | 676-FBGA (27x27) | 387 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 1.14V~2.625V | 56520 | 1869824 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||
| AFS600-2FGG484 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 484-BGA | 484 | 484-FPBGA (23x23) | 400.011771mg | 172 | 0°C~85°C TJ | Tray | 2013 | Fusion® | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | AFS600 | 1.5V | 1.575V | 1.425V | 13.5kB | 110592 | 600000 | 1.47059GHz | 2 | 13824 | 1.73mm | 23mm | 23mm | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||
| M2GL090TS-1FCS325I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 325-TFBGA | YES | 325 | 180 | -40°C~100°C TJ | Tray | 2015 | IGLOO2 | 活跃 | 3 (168 Hours) | 325 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 20 | 180 | 不合格 | 1.2V | 323.3kB | 现场可编程门阵列 | 86184 | 2648064 | 1 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||
| M2GL025T-1FGG484M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 484-BGA | 484-FPBGA (23x23) | 267 | -55°C~125°C TJ | Tray | IGLOO2 | 活跃 | 3 (168 Hours) | 1.14V~2.625V | 27696 | 1130496 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||
 | A3PE1500-1PQG208 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 表面贴装 | 表面贴装 | 208-BFQFP | 208 | 208-PQFP (28x28) | 147 | 0°C~85°C TJ | Tray | 2009 | ProASIC3E | 活跃 | 3 (168 Hours) | 70°C | 0°C | 1.425V~1.575V | A3PE1500 | 1.5V | 1.575V | 1.425V | 33.8kB | 276480 | 1500000 | 272MHz | 1 | 38400 | 3.4mm | 28mm | 28mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||
| M2GL090-FG676 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 11 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 表面贴装 | 676-BGA | YES | 425 | 0°C~85°C TJ | Tray | 2013 | IGLOO2 | 活跃 | 3 (168 Hours) | 676 | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 1mm | 20 | M2GL090 | S-PBGA-B676 | 425 | 不合格 | 1.2V | 323.3kB | 425 | 现场可编程门阵列 | 86316 | 2648064 | 2.44mm | 27mm | 27mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||
 | A14100A-1CQ256M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 256-BFCQFP with Tie Bar | 256 | 228 | -55°C~125°C TC | Tray | 2012 | ACT™ 3 | e0 | Obsolete | 3 (168 Hours) | 256 | 锡铅 | 25000 PLD EQUIVALENT GATES AVAILABLE | 4.5V~5.5V | QUAD | FLAT | 5V | 0.5mm | 125MHz | A14100 | 228 | 5V | 5V | 2.6 ns | 2.6 ns | 现场可编程门阵列 | 1377 | 10000 | 1 | 1153 | 3.3mm | 36mm | 36mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||
 | M2GL150TS-1FC1152M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | IN PRODUCTION (Last Updated: 1 month ago) | 表面贴装 | 1152-BBGA, FCBGA | YES | 574 | -55°C~125°C TJ | Tray | IGLOO2 | 活跃 | 3 (168 Hours) | 3A001.A.2.C | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 240 | 1.2V | 1mm | 20 | S-PBGA-B1152 | 574 | 不合格 | 1.2V | 574 | 现场可编程门阵列 | 146124 | 5120000 | 2.9mm | 35mm | 35mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||
| M2GL150TS-1FCG1152M | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 1152-BBGA, FCBGA | YES | 574 | -55°C~125°C TJ | Tray | IGLOO2 | 活跃 | 3 (168 Hours) | 3A001.A.2.C | 8542.39.00.01 | 1.14V~2.625V | BOTTOM | BALL | 260 | 1.2V | 1mm | 30 | S-PBGA-B1152 | 574 | 不合格 | 1.2V | 574 | 现场可编程门阵列 | 146124 | 5120000 | 2.9mm | 35mm | 35mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||
| AX125-1FG324I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 3 weeks ago) | 表面贴装 | 表面贴装 | 324-BGA | 324 | 400.011771mg | 168 | -40°C~85°C TA | Tray | 2005 | Axcelerator | e0 | Obsolete | 3 (168 Hours) | 324 | Tin/Lead/Silver (Sn/Pb/Ag) | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 763MHz | 30 | AX125 | 168 | 1.5V | 2.3kB | 850 ps | 850 ps | 现场可编程门阵列 | 18432 | 125000 | 2016 | 1 | 1344 | 0.84 ns | 1.25mm | 19mm | 19mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||
| M1A3P600L-FG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 177 | -40°C~100°C TJ | Tray | 2013 | ProASIC3L | Obsolete | 3 (168 Hours) | 256 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | 1.14V~1.575V | BOTTOM | BALL | 225 | 1.2V | 1mm | 30 | M1A3P600L | 177 | 1.2V | 1.5/3.3V | 13.5kB | 现场可编程门阵列 | 110592 | 600000 | 781.25MHz | 13824 | 1.2mm | 17mm | 17mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||
| AFS090-FG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 75 | -40°C~100°C TJ | Tray | 2013 | Fusion® | Obsolete | 3 (168 Hours) | 256 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | 1.0989GHz | 30 | AFS090 | 1.5V | 3.4kB | 现场可编程门阵列 | 27648 | 90000 | 2304 | 1.2mm | 17mm | 17mm | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||
 | A3PN250-Z2VQG100I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 68 | -40°C~100°C TJ | Tray | 2009 | ProASIC3 nano | Obsolete | 3 (168 Hours) | 100 | 1.425V~1.575V | QUAD | 鸥翼 | 260 | 1.5V | 0.5mm | 40 | A3PN250 | 68 | 1.5V | 1.51.5/3.3V | 4.5kB | 现场可编程门阵列 | 36864 | 250000 | 2 | 6144 | 14mm | 14mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||
 | EX64-PTQG100I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 4 weeks ago) | 表面贴装 | 表面贴装 | 100-LQFP | 100 | 657.000198mg | 56 | -40°C~85°C TA | Tray | 2006 | EX | e3 | Obsolete | 1 (Unlimited) | 100 | 哑光锡 | LG-MIN; WD-MIN; TERM PITCH-MIN | 8542.39.00.01 | 2.3V~2.7V | QUAD | 鸥翼 | 260 | 2.5V | 0.5mm | 40 | EX64 | 2.5V | 357MHz | 现场可编程门阵列 | 128 | 3000 | 0.7 ns | 1.4mm | 14mm | 14mm | 符合RoHS标准 | ||||||||||||||||||||||||||||
| A3P250L-1VQ100 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 68 | 0°C~85°C TJ | Tray | 2009 | ProASIC3L | e0 | Obsolete | 3 (168 Hours) | 100 | Tin/Lead (Sn/Pb) | 1.14V~1.575V | QUAD | 鸥翼 | 225 | 1.2V | 0.5mm | 30 | A3P250L | 68 | 1.2V | 3mA | 4.5kB | 现场可编程门阵列 | 36864 | 250000 | 892.86MHz | 1 | 6144 | 1mm | 14mm | 14mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||
| A3PN250-Z2VQ100I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 68 | -40°C~100°C TJ | Tray | 2009 | ProASIC3 nano | e0 | Obsolete | 3 (168 Hours) | 100 | 锡铅 | 1.425V~1.575V | QUAD | 鸥翼 | 225 | 1.5V | 0.5mm | 30 | A3PN250 | 68 | 1.5V | 1.51.5/3.3V | 4.5kB | 现场可编程门阵列 | 36864 | 250000 | 2 | 6144 | 14mm | 14mm | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||
| A3PN250-Z1VQ100I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 100-TQFP | 100 | 68 | -40°C~100°C TJ | Tray | 2009 | ProASIC3 nano | e0 | Obsolete | 3 (168 Hours) | 100 | 锡铅 | 1.425V~1.575V | QUAD | 鸥翼 | 225 | 1.5V | 0.5mm | 30 | A3PN250 | 68 | 1.5V | 4.5kB | 现场可编程门阵列 | 36864 | 250000 | 1 | 6144 | 无 | Non-RoHS Compliant | |||||||||||||||||||||||||||||||
| M1A3P600L-1FG256I | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | OBSOLETE (Last Updated: 1 month ago) | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 400.011771mg | 177 | -40°C~100°C TJ | Tray | ProASIC3L | Obsolete | 3 (168 Hours) | 256 | TIN LEAD/TIN LEAD SILVER | 1.14V~1.575V | BOTTOM | BALL | 225 | 1.2V | 30 | M1A3P600L | 177 | 1.2V | 13.5kB | 现场可编程门阵列 | 110592 | 600000 | 892.86MHz | 1 | 13824 | 1.2mm | 17mm | 17mm | 无 | Non-RoHS Compliant |
-
AFS600-FGG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL050TS-FGG896I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P1000L-FGG144I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AFS250-1FG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX250-FG256
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL060TS-1FG676I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL060TS-1FGG676I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL060T-1FGG676I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AFS600-2FGG484
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL090TS-1FCS325I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL025T-1FGG484M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3PE1500-1PQG208
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL090-FG676
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A14100A-1CQ256M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL150TS-1FC1152M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M2GL150TS-1FCG1152M
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AX125-1FG324I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P600L-FG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
AFS090-FG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3PN250-Z2VQG100I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
EX64-PTQG100I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3P250L-1VQ100
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3PN250-Z2VQ100I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
A3PN250-Z1VQ100I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)
-
M1A3P600L-1FG256I
Microsemi Corporation
分类:Embedded - FPGAs (Field Programmable Gate Array)