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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 终端数量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 资历状况 | 电源 | 振荡器类型 | 速度 | 内存大小 | uPs/uCs/外围ICs类型 | 核心处理器 | 周边设备 | 时钟频率 | 程序存储器类型 | 芯尺寸 | 程序内存大小 | 连接方式 | 位元大小 | 有ADC | DMA 通道 | 脉宽调制通道 | 数模转换器通道 | 地址总线宽度 | 核心架构 | EEPROM 大小 | 处理器系列 | 筛选水平 | 外部数据总线宽度 | 以太网 | USB | 电压 - 供电 （最大值） | 只读存储器可编程性 | 电压 - 供电 （最小值） | 源Url状态检查日期 | SPI,SPI | CAN | 脉宽调制 | ADC Channels | 设备核心 | 座位高度(最大) | 长度 | 宽度 | RoHS状态 | ||||||||||||||||||||||||||||||||||||||||||||||||||
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 | MC908QB4CDTE | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 16-TSSOP (0.173, 4.40mm Width) | A/D 10x10b | 13 | -40°C~85°C TA | Tube | 2000 | HC08 | Obsolete | 3 (168 Hours) | 2.7V~5.5V | MC908QB4 | Internal | 8MHz | 128 x 8 | LVD, POR, PWM | FLASH | 8-Bit | 4KB 4K x 8 | SCI, SPI | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | LPC2214FBD144/01,551 | NXP Semiconductors | 数据表 | 2 In Stock | - | 最小起订量: 1 最小包装量: 1 | YES | 144 | 144 | LPC2000 | RISC | 60 | 60 | 16|32 | 有 | I2C/SPI | 112 | 2 | Single | 10 | 0 | 0 | 1 | 0 | 1 | 3|1.65|2.5 | 1.8|3.3 | 1.95|3.6 | 1500 | -40 | 85 | Industrial | 无 | QFP | LQFP | 表面贴装 | 1.45(Max) | 20.1(Max) | 20.1(Max) | 144 | Gull-wing | LFQFP, | FLATPACK, LOW PROFILE, FINE PITCH | 1.8 V | 1.65 V | LPC2214FBD144/01,551 | 32 MHz | LFQFP | SQUARE | 恩智浦半导体 | 活跃 | 112 | NXP SEMICONDUCTORS | 1.95 V | 5.73 | Tray | Obsolete | QUAD | 鸥翼 | 0.5 mm | unknown | 60 MHz | 16KB | MICROCONTROLLER, RISC | Flash | 256KB | 32 | YES | NO | YES | 24 | ARM | 32 | 0 | 0 | 2 | 0 | 1 | 8 | ARM7TDMI-S | 20 mm | 20 mm | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||
 | MC9S08PA8AVWJ | NXP USA Inc. | 数据表 | 6000 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 20 Weeks | 表面贴装 | 20-SOIC (0.295, 7.50mm Width) | A/D 12x12b | 18 | -40°C~105°C TA | Tube | 2011 | S08 | e3 | 活跃 | 3 (168 Hours) | 3A991.A.2 | Tin (Sn) | 8542.31.00.01 | 2.7V~5.5V | 260 | 40 | Internal | 20MHz | 2K x 8 | MICROCONTROLLER | LVD, POR, PWM, WDT | FLASH | 8-Bit | 8KB 8K x 8 | I2C, LINbus, SPI, UART/USART | 256 x 8 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SPC5602BK0MLH6 | NXP USA Inc. | 数据表 | 50 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 14 Weeks | 表面贴装 | 64-LQFP | YES | A/D 12x10b | 45 | -40°C~125°C TA | Tray | 2006 | MPC56xx Qorivva | 活跃 | 3 (168 Hours) | 64 | 5V | QUAD | 鸥翼 | 260 | 0.5mm | 40 | SPC5602 | Internal | 64MHz | 24K x 8 | MICROCONTROLLER, RISC | e200z0h | DMA, POR, PWM, WDT | 8MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, I2C, LINbus, SCI, SPI | 32 | YES | NO | YES | 64K x 8 | 5.5V | 4.5V | 10mm | 10mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MC9S12DJ128VPVE | NXP USA Inc. | 数据表 | 10645 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 15 Weeks | 表面贴装 | 112-LQFP | YES | A/D 16x10b | 91 | -40°C~105°C TA | Tray | 1996 | HCS12 | e3 | 活跃 | 3 (168 Hours) | 112 | Matte Tin (Sn) | ALSO REQUIRES 5V SUPPLY | 8542.31.00.01 | 2.5V | QUAD | 鸥翼 | 260 | 0.65mm | 40 | MC9S12DJ128 | S-PQFP-G112 | 不合格 | Internal | 25MHz | 8K x 8 | MICROCONTROLLER | PWM, WDT | 50MHz | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, I2C, SCI, SPI | 16 | YES | NO | YES | NO | 20 | 2K x 8 | 16 | 2.75V | 2.35V | 1.6mm | 20mm | 20mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | S9S12G240F0CLFR | NXP USA Inc. | 数据表 | 49 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 48-LQFP | YES | 40 | 245760 | Automotive grade | A/D 16x10b | -40°C~85°C TA | Tape & Reel (TR) | 2008 | HCS12 | 活跃 | 3 (168 Hours) | 48 | 8542.31.00.01 | 5V | QUAD | 鸥翼 | 0.5mm | S9S12G240 | S-PQFP-G48 | 不合格 | 3.3/5V | Internal | 25MHz | 11K x 8 | MICROCONTROLLER | 12V1 | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 240KB 240K x 8 | CANbus, IrDA, LINbus, SCI, SPI | 16 | YES | NO | YES | 4K x 8 | CPU12 | AEC-Q100 | 5.5V | 3.13V | 7mm | 7mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | S9S12GN16BMLC | NXP USA Inc. | 数据表 | 1079 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 32-LQFP | A/D 8x10b | 26 | -40°C~125°C TA | Tray | HCS12 | 活跃 | 3 (168 Hours) | 3.13V~5.5V | Internal | 25MHz | 1K x 8 | 12V1 | LVD, POR, PWM, WDT | FLASH | 16-Bit | 16KB 16K x 8 | IrDA, LINbus, SCI, SPI | 512 x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | S9KEAZ64ACLK | NXP USA Inc. | 数据表 | 49 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 20 Weeks | 表面贴装 | 80-LQFP | YES | 71 | -40°C~85°C TA | Tray | 2013 | Kinetis KEA | e3 | 活跃 | 3 (168 Hours) | 80 | 3A991.A.2 | 哑光锡 | 8542.31.00.01 | 3V | QUAD | 鸥翼 | 260 | 40 | S-PQFP-G80 | Internal | 48MHz | 8K x 8 | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | LVD, POR, PWM, WDT | 24MHz | FLASH | 32-Bit | 64KB 64K x 8 | CANbus, I2C, LINbus, SPI, UART/USART | YES | NO | YES | NO | 5.5V | 2.7V | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | S912XDT512J1CAGR | NXP USA Inc. | 数据表 | 48 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 144-LQFP | YES | 119 | 20480 | 524288 | A/D 24x12b | -40°C~85°C TA | Tape & Reel (TR) | 1996 | HCS12X | e3 | 不用于新设计 | 3 (168 Hours) | 144 | 3A991.A.2 | Matte Tin (Sn) | ALSO REQUIRES 5V SUPPLY | 8542.31.00.01 | 2.5V | QUAD | 鸥翼 | 260 | 0.5mm | 40 | S-PQFP-G144 | 不合格 | 2.55V | External | 80MHz | 20K x 8 | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 512KB 512K x 8 | CANbus, I2C, SCI, SPI | 16 | YES | YES | YES | NO | 23 | 4K x 8 | CPU12 | 16 | 2.75V | 2.35V | 1.6mm | 20mm | 20mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | FS32K144MFT0CLLT | NXP USA Inc. | 数据表 | 398 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 16 Weeks | 表面贴装 | 100-LQFP | YES | A/D 16x12b; D/A 1x8b | 89 | -40°C~85°C TA | Tray | S32K | 活跃 | 3 (168 Hours) | 100 | 3.3V | QUAD | 鸥翼 | 260 | 0.5mm | compliant | 40 | Internal | 64MHz | 64K x 8 | MICROCONTROLLER, RISC | ARM® Cortex®-M4F | POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, FlexIO, I2C, LINbus, SPI, UART/USART | 32 | YES | YES | YES | 4K x 8 | 5.5V | 2.7V | 14mm | 14mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| LPC1820FBD144,551 | NXP USA Inc. | 数据表 | 12388 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 144-LQFP | YES | 144 | A/D 8x10b; D/A 1x10b | 83 | 65536 | -40°C~85°C TA | Tray | 2010 | LPC18xx | e3 | 活跃 | 3 (168 Hours) | 144 | Tin (Sn) | 3.3V | QUAD | 鸥翼 | 未说明 | 0.5mm | 未说明 | LPC1820 | S-PQFP-G144 | 不合格 | 2.5/3.3V | Internal | 180MHz | 168K x 8 | MICROCONTROLLER, RISC | ARM® Cortex®-M3 | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | 25MHz | ROMless | 32-Bit | CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | 24 | CORTEX-M3 | 32 | 3.6V | FLASH | 2.2V | 2013-06-14 00:00:00 | 1.6mm | 20mm | 20mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| S9S12G128AMLFR | NXP USA Inc. | 数据表 | 20000 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 48-LQFP | A/D 12x10b | 40 | -40°C~125°C TA | Tape & Reel (TR) | HCS12 | 活跃 | 3 (168 Hours) | 3.13V~5.5V | Internal | 25MHz | 8K x 8 | 12V1 | LVD, POR, PWM, WDT | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, IrDA, LINbus, SCI, SPI | 4K x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MC912DT128AVPVE | NXP USA Inc. | 数据表 | 650 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 112-LQFP | YES | A/D 16x8/10b | 67 | -40°C~105°C | Tray | 2003 | HC12 | e3 | 不用于新设计 | 3 (168 Hours) | 112 | EAR99 | 哑光锡 | 8542.31.00.01 | 5V | QUAD | 鸥翼 | 260 | 0.65mm | 40 | MC912DT128 | S-PQFP-G112 | 不合格 | Internal | 8MHz | 8K x 8 | MICROCONTROLLER | CPU12 | POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, I2C, SCI, SPI | 16 | YES | NO | YES | NO | 16 | 2K x 8 | 16 | 5.5V | 4.5V | 1.6mm | 20mm | 20mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MCF51AG128CLK | NXP USA Inc. | 数据表 | 2800 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 14 Weeks | 表面贴装 | 80-LQFP | YES | 131072 | A/D 24x12b | 69 | -40°C~85°C TA | Tray | 2007 | MCF51AG | e3 | 活跃 | 3 (168 Hours) | 80 | EAR99 | Matte Tin (Sn) | 8542.31.00.01 | 3V | QUAD | 鸥翼 | 260 | 0.65mm | 40 | MCF51AG128 | S-PQFP-G80 | 不合格 | 3/5V | Internal | 50MHz | 16K x 8 | MICROCONTROLLER, RISC | Coldfire V1 | DMA, LVD, PWM, WDT | 16MHz | FLASH | 32-Bit | 128KB 128K x 8 | I2C, SCI, SPI | 32 | YES | YES | YES | YES | 5.5V | 2.7V | 1.6mm | 14mm | 14mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MC908JB16JDWE | NXP USA Inc. | 数据表 | 2230 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 20-SOIC (0.295, 7.50mm Width) | 13 | 0°C~70°C TA | Tube | 2011 | HC08 | Obsolete | 3 (168 Hours) | 4V~5.5V | MC908JB16 | Internal | 6MHz | 384 x 8 | LED, LVD, POR, PWM | FLASH | 8-Bit | 16KB 16K x 8 | SCI, USB | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MCF51QU64VLFR | NXP USA Inc. | 数据表 | 49 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 48-LQFP | YES | A/D 13x12b; D/A 1x12b | 35 | -40°C~105°C TA | Tape & Reel (TR) | 2004 | MCF51Qx | 活跃 | 3 (168 Hours) | 48 | 3.3V | QUAD | 鸥翼 | 260 | 0.5mm | 40 | External | 50MHz | 16K x 8 | MICROCONTROLLER | Coldfire V1 | DMA, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 64KB 64K x 8 | EBI/EMI, I2C, SPI, UART/USART | 32 | YES | YES | YES | 3.6V | 1.71V | 7mm | 7mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MCF51QU32VHS | NXP USA Inc. | 数据表 | 76 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 44-VFLGA Exposed Pad | YES | 32768 | A/D 11x12b; D/A 1x12b | 31 | -40°C~105°C TA | Tray | 2004 | MCF51Qx | 活跃 | 3 (168 Hours) | 44 | 5A992 | 3V | QUAD | 无铅 | 260 | 0.65mm | 40 | MCF51QU32 | S-XQCC-N44 | 不合格 | 1.8/3.3V | External | 50MHz | 8K x 8 | MICROCONTROLLER | Coldfire V1 | DMA, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 32KB 32K x 8 | EBI/EMI, I2C, SPI, UART/USART | 32 | YES | YES | YES | YES | 3.6V | 1.71V | 0.98mm | 5mm | 5mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SPC5604BF2VLL4R | NXP USA Inc. | 数据表 | 42 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 100-LQFP | YES | 79 | 524288 | Automotive grade | A/D 28x10b | -40°C~105°C TA | Tape & Reel (TR) | 2006 | MPC56xx Qorivva | 活跃 | 3 (168 Hours) | 100 | 8542.31.00.01 | 3.3V | QUAD | 鸥翼 | 0.5mm | SPC5604 | S-PQFP-G100 | 不合格 | 3.3/5V | Internal | 48MHz | 32K x 8 | MICROCONTROLLER | e200z0h | DMA, POR, PWM, WDT | 16MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, I2C, LINbus, SCI, SPI | 32 | YES | YES | YES | 64K x 8 | AEC-Q100 | 64 | 3.6V | 3V | 14mm | 14mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MK60DX256VMC10 | NXP USA Inc. | 数据表 | 40 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 121-LFBGA | YES | 262144 | A/D 38x16b; D/A 2x12b | 86 | -40°C~105°C TA | Tray | 2002 | Kinetis K60 | e1 | 活跃 | 3 (168 Hours) | 121 | 3A991.A.2 | 锡银铜 | 8542.31.00.01 | 3.3V | BOTTOM | BALL | 260 | 0.65mm | 40 | MK60DX256 | S-PBGA-B121 | 不合格 | 1.8/3V | Internal | 100MHz | 64K x 8 | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | 4K x 8 | CORTEX-M4 | 3.6V | 1.71V | 1.52mm | 8mm | 8mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| S912XET512J3MAGR | NXP USA Inc. | 数据表 | 49 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 16 Weeks | 表面贴装 | 144-LQFP | YES | 119 | 32768 | 524288 | A/D 24x12b | -40°C~125°C TA | Tape & Reel (TR) | 1996 | HCS12X | e3 | 活跃 | 3 (168 Hours) | 144 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | 1.8V | QUAD | 鸥翼 | 260 | 0.5mm | 40 | S-PQFP-G144 | 不合格 | 3.3/5V | External | 50MHz | 32K x 8 | MICROCONTROLLER, RISC | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | 16 | YES | YES | YES | 23 | 4K x 8 | CPU12 | 16 | 1.98V | 1.72V | 20mm | 20mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| S912ZVL64F0MLC | NXP USA Inc. | 数据表 | 1166 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 32-LQFP | A/D 6x10b | 19 | -40°C~125°C TA | Tray | S12 MagniV | 活跃 | 3 (168 Hours) | 5.5V~18V | Internal | 32MHz | 1K x 8 | S12Z | LVD, POR, PWM, WDT | FLASH | 16-Bit | 64KB 64K x 8 | CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART | 512 x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| S9S08DN32F2MLH | NXP USA Inc. | 数据表 | 49 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 64-LQFP | YES | A/D 16x12b | 53 | -40°C~125°C TA | Tray | 1996 | S08 | 活跃 | 3 (168 Hours) | 64 | 5V | QUAD | 鸥翼 | 260 | 0.5mm | 40 | Internal | 40MHz | 1.5K x 8 | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 32KB 32K x 8 | I2C, LINbus, SCI, SPI | 8 | YES | NO | YES | 1K x 8 | 5.5V | 2.7V | 10mm | 10mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | SPC5646BCF0VLU1 | NXP USA Inc. | 数据表 | 35 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 176-LQFP | YES | A/D 27x10b, 5x12b | 147 | -40°C~105°C TA | Tray | 2007 | MPC56xx Qorivva | 活跃 | 3 (168 Hours) | 176 | 5V | QUAD | 鸥翼 | 260 | 0.5mm | 40 | SPC5646 | Internal | 120MHz | 192K x 8 | 单片机RISC | e200z4d | DMA, POR, PWM, WDT | 40MHz | FLASH | 32-Bit | 3MB 3M x 8 | CANbus, I2C, LINbus, SCI, SPI | 32 | YES | YES | YES | 64K x 8 | 5.5V | 4.5V | 24mm | 24mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SCF5249LAG133 | NXP USA Inc. | 数据表 | 10 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 144-LQFP | A/D 4x12b | 34 | 0°C~70°C TA | Bulk | 2001 | MCF524x | 不用于新设计 | 3 (168 Hours) | 3V~3.6V | External | 133MHz | 96K x 8 | Coldfire V2 | DMA, I2S, POR, Serial Audio, WDT | ROMless | 32-Bit | I2C, IDE, Memory Card, SPI, UART/USART | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MC9S12NE64VTUE | NXP USA Inc. | 数据表 | 1086 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 80-TQFP Exposed Pad | 80-TQFP-EP (14x14) | A/D 8x10b | 38 | -40°C~105°C TA | Tray | 2004 | HCS12 | Obsolete | 3 (168 Hours) | 2.375V~3.465V | MC9S12NE64 | Internal | 25MHz | 8K x 8 | HCS12 | POR, PWM, WDT | FLASH | 16-Bit | 64KB 64K x 8 | EBI/EMI, Ethernet, I2C, SCI, SPI | ROHS3 Compliant |
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NXP USA Inc.
分类:Embedded - Microcontrollers
266.311342
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NXP USA Inc.
分类:Embedded - Microcontrollers