品牌是'NXP' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 资历状况 | 电源 | 振荡器类型 | 速度 | 内存大小 | uPs/uCs/外围ICs类型 | 核心处理器 | 周边设备 | 时钟频率 | 程序存储器类型 | 芯尺寸 | 程序内存大小 | 连接方式 | 电源电流-最大值 | 位元大小 | 有ADC | DMA 通道 | 脉宽调制通道 | 数模转换器通道 | 地址总线宽度 | EEPROM 大小 | 片上程序 ROM 宽度 | 边界扫描 | 低功率模式 | 筛选水平 | 外部数据总线宽度 | 格式 | 集成缓存 | 内存(字) | 定时器数量 | 电压 - 供电 (最大值) | 只读存储器可编程性 | 电压 - 供电 (最小值) | 外部中断数量 | 片上数据 RAM 宽度 | 座位高度(最大) | 长度 | 宽度 | RoHS状态 | ||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | S912ZVML12F2WKH | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 64-LQFP Exposed Pad | YES | A/D 9x12b | 31 | -40°C~150°C TA | Tray | 2011 | S12 MagniV | yes | Obsolete | 3 (168 Hours) | 64 | 12V | QUAD | 鸥翼 | 0.5mm | S-PQFP-G64 | Internal | 50MHz | 8K x 8 | MICROCONTROLLER | S12Z | DMA, POR, PWM, WDT | 20MHz | FLASH | 16-Bit | 128KB 128K x 8 | LINbus, SCI, SPI | 16 | YES | NO | NO | NO | 512 x 8 | 8 | 18V | 5.5V | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||
![]() | S912ZVMC12F2VKH | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 64-LQFP Exposed Pad | A/D 9x12b | 31 | -40°C~105°C TA | Tray | S12 MagniV | Obsolete | 3 (168 Hours) | 3.5V~40V | Internal | 50MHz | 8K x 8 | S12Z | DMA, POR, PWM, WDT | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, SCI, SPI | 512 x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S912ZVML32F2VKH | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 64-LQFP Exposed Pad | A/D 9x12b | 31 | -40°C~105°C TA | Tray | S12 MagniV | Obsolete | 3 (168 Hours) | 3.5V~40V | Internal | 50MHz | 4K x 8 | S12Z | DMA, POR, PWM, WDT | FLASH | 16-Bit | 32KB 32K x 8 | CANbus, LINbus, SCI, SPI | 512 x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MCF5208CVM166J | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 196-LBGA | 50 | -40°C~85°C TA | Tray | 2004 | MCF520x | Obsolete | 3 (168 Hours) | 1.4V~3.6V | MCF5208 | External | 166.67MHz | 16K x 8 | Coldfire V2 | DMA, WDT | ROMless | 32-Bit | EBI/EMI, Ethernet, I2C, SPI, UART/USART | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
MC9S08DV16MLF | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 48-LQFP | A/D 16x12b | 39 | -40°C~125°C TA | Tray | S08 | Obsolete | 3 (168 Hours) | 8542.31.00.01 | 2.7V~5.5V | unknown | MC9S08DV16 | External | 40MHz | 1K x 8 | MICROCONTROLLER | LVD, POR, PWM, WDT | FLASH | 8-Bit | 16KB 16K x 8 | CANbus, I2C, LINbus, SCI, SPI | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SPC5748CBK0AVKU2 | NXP USA Inc. | 数据表 | 35 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 17 Weeks | 表面贴装 | 176-LQFP Exposed Pad | YES | A/D 80x10b, 64x12b | 129 | -40°C~105°C TA | Tray | MPC57xx | 活跃 | 3 (168 Hours) | 176 | 1.2V | QUAD | 鸥翼 | 260 | 0.5mm | 40 | Internal | 80MHz/160MHz | 768K x 8 | MICROCONTROLLER, RISC | e200z2, e200z4 | DMA, LVD, POR, WDT | 40MHz | FLASH | 32-Bit Dual-Core | 6MB 6M x 8 | CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG | 32 | YES | YES | NO | 1.32V | 1.08V | 24mm | 24mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||
![]() | MC9S08MP12VWL | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 28-SOIC (0.295, 7.50mm Width) | A/D 13x12b; D/A 3x5b | 22 | -40°C~105°C TA | Tube | S08 | Obsolete | 3 (168 Hours) | 8542.31.00.01 | 2.7V~5.5V | unknown | MC9S08MP12 | Internal | 51.34MHz | 512 x 8 | MICROCONTROLLER | LVD, POR, PWM, WDT | FLASH | 8-Bit | 12KB 12K x 8 | I2C, LINbus, SCI, SPI | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MC908AP64ACFBER | NXP USA Inc. | 数据表 | 50 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 44-QFP | YES | A/D 8x10b | 32 | -40°C~85°C TA | Tape & Reel (TR) | 2007 | HC08 | e3 | 不用于新设计 | 3 (168 Hours) | 44 | EAR99 | 哑光锡 | 8542.31.00.01 | 5V | QUAD | 鸥翼 | 260 | 0.8mm | 40 | MC908AP64 | S-PQFP-G44 | 不合格 | Internal | 8MHz | 2K x 8 | MICROCONTROLLER | LED, LVD, POR, PWM | FLASH | 8-Bit | 64KB 64K x 8 | I2C, IRSCI, SCI, SPI | 8 | YES | NO | YES | NO | 5.5V | 4.5V | 2.45mm | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||||||||||||||
![]() | MPXD2020VVU125 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 416-BBGA | 177 | A/D 20x10b | -40°C~105°C TA | Tray | 2006 | PX | Obsolete | 3 (168 Hours) | 3V~5.5V | MPXD2020 | Internal | 125MHz | 64K x 8 | MICROCONTROLLER | e200z4d | DMA, POR, PWM, WDT | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, I2C, LINbus, SCI, SPI, UART/USART | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SPC5747GSK1MKU6R | NXP USA Inc. | 数据表 | 35 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 18 Weeks | 表面贴装 | 176-LQFP Exposed Pad | YES | A/D 80x10b, 64x12b | 129 | Automotive grade | -40°C~125°C TA | Tape & Reel (TR) | MPC57xx | yes | 活跃 | 3 (168 Hours) | 176 | 1.2V | QUAD | 鸥翼 | 0.5mm | S-PQFP-G176 | Internal | 80MHz/160MHz | 768K x 8 | MICROCONTROLLER, RISC | e200z2, e200z4, e200z4 | DMA, LVD, POR, WDT | 40MHz | FLASH | 32-Bit Tri-Core | 4MB 4M x 8 | CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG | 32 | YES | YES | NO | NO | 8 | ISO 26262 | 1.32V | 1.08V | 1.6mm | 24mm | 24mm | ROHS3 Compliant | |||||||||||||||||||||||||||||
![]() | MPXD1010VLQ64 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 144-LQFP | A/D 16x10b | 105 | -40°C~105°C TA | Tray | 2008 | PX | Obsolete | 3 (168 Hours) | 3V~3.6V | MPXD1010 | Internal | 64MHz | 48K x 8 | MICROCONTROLLER, RISC | e200z0h | DMA, LCD, POR, PWM, WDT | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, I2C, LINbus, SCI, SPI, UART/USART | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S912ZVM16F1MKH | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 64-LQFP Exposed Pad | A/D 9x12b | 31 | -40°C~125°C TA | Tray | S12 MagniV | 活跃 | 3 (168 Hours) | 3.5V~40V | Internal | 50MHz | 2K x 8 | S12Z | DMA, POR, WDT | FLASH | 16-Bit | 16KB 16K x 8 | SCI, SPI | 128 x 8 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MKM14Z128ACHH5R | NXP USA Inc. | 数据表 | 37 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 44-VFLGA Exposed Pad | YES | 20 | A/D 5x16b, 4x24b | -40°C~85°C TA | Tape & Reel (TR) | 2002 | 动力学 KM | 活跃 | 3 (168 Hours) | 44 | 3A991.A.2 | ALSO AVAILABLE 2.7-3.6V WHEN AFE IS OPERATIONAL, 2 SD ADC WITH PGA AND 2 SD ADC | 8542.31.00.01 | 1V | BOTTOM | 无铅 | 260 | 0.65mm | 40 | S-XBGA-N44 | Internal | 50MHz | 16K x 8 | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | DMA, WDT | 32MHz | FLASH | 32-Bit | 128KB 128K x 8 | I2C, SPI, UART/USART | YES | YES | NO | NO | 1.1V | 0.9V | 5mm | 5mm | ROHS3 Compliant | |||||||||||||||||||||||||||||
![]() | MC9S08GT32CB | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 通孔 | 42-SDIP (0.600, 15.24mm) | NO | A/D 8x10b | 34 | 32768 | -40°C~85°C TA | Tube | S08 | Obsolete | 1 (Unlimited) | 42 | 8542.31.00.01 | 3V | DUAL | 1.778mm | MC9S08GT32 | R-PDIP-T42 | Internal | 40MHz | 2K x 8 | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 32KB 32K x 8 | I2C, SCI, SPI | 120mA | 8 | YES | NO | YES | NO | 8 | NO | YES | 固定点 | NO | 2000 | 2 | 3.6V | 2.08V | 1 | 8 | 5.08mm | 36.83mm | 15.24mm | Non-RoHS Compliant | |||||||||||||||||||||||
![]() | MC9S08PA32VQH | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 64-QFP | YES | A/D 16x12b | 57 | 32768 | -40°C~105°C TA | Tray | 2014 | S08 | e3 | 不用于新设计 | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | 3V | QUAD | 鸥翼 | 260 | 0.8mm | 40 | MC9S08PA32 | S-PQFP-G64 | 不合格 | 3/5V | Internal | 20MHz | 4K x 8 | MICROCONTROLLER | LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 32KB 32K x 8 | I2C, LINbus, SPI, UART/USART | 8 | YES | NO | YES | NO | 256 x 8 | 5.5V | 2.7V | 14mm | 14mm | ROHS3 Compliant | ||||||||||||||||||||||||
![]() | P80C32UBAA,512 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 44-LCC (J-Lead) | YES | 44 | 0 | 32 | 0°C~70°C TA | Tube | 2011 | 80C | e3 | Obsolete | 3 (168 Hours) | 44 | Tin (Sn) | 8542.31.00.01 | 5V | QUAD | J BEND | 245 | 1.27mm | 30 | P80C32 | S-PQCC-J44 | 不合格 | 3/5V | Internal | 33MHz | 256 x 8 | MICROCONTROLLER | 8051 | POR | 33MHz | ROMless | 8-Bit | UART/USART | 30.8mA | 8 | NO | NO | NO | NO | 16 | 8 | 5.5V | N/A | 4.5V | 4.57mm | 16.5862mm | 16.5862mm | ROHS3 Compliant | |||||||||||||||||||||
![]() | S912ZVML32F2MKH | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 64-LQFP Exposed Pad | A/D 9x12b | 31 | -40°C~125°C TA | Tray | S12 MagniV | Obsolete | 3 (168 Hours) | 3.5V~40V | Internal | 50MHz | 4K x 8 | S12Z | DMA, POR, PWM, WDT | FLASH | 16-Bit | 32KB 32K x 8 | CANbus, LINbus, SCI, SPI | 512 x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S912ZVMC64F2WKH | NXP USA Inc. | 数据表 | 81 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 64-LQFP Exposed Pad | A/D 9x12b | 31 | -40°C~150°C TA | Tray | S12 MagniV | Obsolete | 3 (168 Hours) | 3.5V~40V | Internal | 50MHz | 4K x 8 | S12Z | DMA, POR, PWM, WDT | FLASH | 16-Bit | 64KB 64K x 8 | CANbus, SCI, SPI | 512 x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S912ZVML12F2VKH | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 64-LQFP Exposed Pad | A/D 9x12b | 31 | -40°C~105°C TA | Tray | S12 MagniV | Obsolete | 3 (168 Hours) | 3.5V~40V | Internal | 50MHz | 8K x 8 | S12Z | DMA, POR, PWM, WDT | FLASH | 16-Bit | 128KB 128K x 8 | LINbus, SCI, SPI | 512 x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S912ZVMC64F2VKH | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 64-LQFP Exposed Pad | A/D 9x12b | 31 | -40°C~105°C TA | Tray | S12 MagniV | Obsolete | 3 (168 Hours) | 3.5V~40V | Internal | 50MHz | 4K x 8 | S12Z | DMA, POR, PWM, WDT | FLASH | 16-Bit | 64KB 64K x 8 | CANbus, SCI, SPI | 512 x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MCF5328CVM240J | NXP USA Inc. | 数据表 | 691 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 256-LBGA | 94 | -40°C~85°C TA | Tray | MCF532x | Obsolete | 3 (168 Hours) | 1.4V~3.6V | MCF5328 | External | 240MHz | 32K x 8 | Coldfire V3 | DMA, LCD, PWM, WDT | ROMless | 32-Bit | EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MK22FX512VLQ12R | NXP USA Inc. | 数据表 | 33 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 144-LQFP | YES | 100 | A/D 42x16b; D/A 2x12b | -40°C~105°C TA | Tape & Reel (TR) | 2012 | Kinetis K20 | e3 | 不用于新设计 | 3 (168 Hours) | 144 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | 3.3V | QUAD | 鸥翼 | 260 | 0.5mm | 40 | S-PQFP-G144 | Internal | 120MHz | 64K x 8 | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | 3.6V | 1.71V | 20mm | 20mm | ROHS3 Compliant | |||||||||||||||||||||||||||
S9S12GA128AVLFR | NXP USA Inc. | 数据表 | 49 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 48-LQFP | A/D 12x12b | 40 | -40°C~105°C TA | Tape & Reel (TR) | HCS12 | 活跃 | 3 (168 Hours) | 3.13V~5.5V | Internal | 25MHz | 8K x 8 | 12V1 | LVD, POR, PWM, WDT | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, IrDA, LINbus, SCI, SPI | 4K x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S9S12GA192F0CLL | NXP USA Inc. | 数据表 | 12 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 100-LQFP | A/D 16x12b; D/A 2x8b | 86 | -40°C~85°C TA | Tray | HCS12 | 活跃 | 3 (168 Hours) | 3.13V~5.5V | Internal | 25MHz | 11K x 8 | 12V1 | LVD, POR, PWM, WDT | FLASH | 16-Bit | 192KB 192K x 8 | CANbus, IrDA, LINbus, SCI, SPI | 4K x 8 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SAC57D53MCVMO | NXP USA Inc. | 数据表 | 10 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 516-BGA | YES | A/D 24x12b | -40°C~105°C TA | Tray | MAC57Dxxx | 活跃 | 3 (168 Hours) | 516 | 1.25V | BOTTOM | BALL | 1mm | Internal | 80MHz, 160MHz, 320MHz | 2.3M x 8 | MICROCONTROLLER, RISC | ARM® Cortex®-A5, -M4, -M0+ | DMA, LCD, LVD/HVD, POR, PWM, WDT | 40MHz | FLASH | 32-Bit Tri-Core | 3MB 3M x 8 | CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI | 32 | YES | YES | YES | 1.32V | 1.2V | 27mm | 27mm | ROHS3 Compliant |
S912ZVML12F2WKH
NXP USA Inc.
分类:Embedded - Microcontrollers
S912ZVMC12F2VKH
NXP USA Inc.
分类:Embedded - Microcontrollers
S912ZVML32F2VKH
NXP USA Inc.
分类:Embedded - Microcontrollers
MCF5208CVM166J
NXP USA Inc.
分类:Embedded - Microcontrollers
MC9S08DV16MLF
NXP USA Inc.
分类:Embedded - Microcontrollers
SPC5748CBK0AVKU2
NXP USA Inc.
分类:Embedded - Microcontrollers
238.800279
MC9S08MP12VWL
NXP USA Inc.
分类:Embedded - Microcontrollers
MC908AP64ACFBER
NXP USA Inc.
分类:Embedded - Microcontrollers
106.633315
MPXD2020VVU125
NXP USA Inc.
分类:Embedded - Microcontrollers
SPC5747GSK1MKU6R
NXP USA Inc.
分类:Embedded - Microcontrollers
306.137559
MPXD1010VLQ64
NXP USA Inc.
分类:Embedded - Microcontrollers
S912ZVM16F1MKH
NXP USA Inc.
分类:Embedded - Microcontrollers
MKM14Z128ACHH5R
NXP USA Inc.
分类:Embedded - Microcontrollers
47.400284
MC9S08GT32CB
NXP USA Inc.
分类:Embedded - Microcontrollers
MC9S08PA32VQH
NXP USA Inc.
分类:Embedded - Microcontrollers
P80C32UBAA,512
NXP USA Inc.
分类:Embedded - Microcontrollers
S912ZVML32F2MKH
NXP USA Inc.
分类:Embedded - Microcontrollers
S912ZVMC64F2WKH
NXP USA Inc.
分类:Embedded - Microcontrollers
S912ZVML12F2VKH
NXP USA Inc.
分类:Embedded - Microcontrollers
S912ZVMC64F2VKH
NXP USA Inc.
分类:Embedded - Microcontrollers
MCF5328CVM240J
NXP USA Inc.
分类:Embedded - Microcontrollers
MK22FX512VLQ12R
NXP USA Inc.
分类:Embedded - Microcontrollers
85.625682
S9S12GA128AVLFR
NXP USA Inc.
分类:Embedded - Microcontrollers
43.444124
S9S12GA192F0CLL
NXP USA Inc.
分类:Embedded - Microcontrollers
50.316669
SAC57D53MCVMO
NXP USA Inc.
分类:Embedded - Microcontrollers
252.331797
