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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 安装类型 | 包装/外壳 | 表面安装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 振荡器类型 | 速度 | 内存大小 | 电压 - 供电 (Vcc/Vdd) | uPs/uCs/外围ICs类型 | 核心处理器 | 周边设备 | 时钟频率 | 程序存储器类型 | 芯尺寸 | 程序内存大小 | 连接方式 | 电源电流-最大值 | 位元大小 | 有ADC | DMA 通道 | 脉宽调制通道 | 数模转换器通道 | 地址总线宽度 | EEPROM 大小 | 片上程序 ROM 宽度 | 处理器系列 | 边界扫描 | 低功率模式 | 筛选水平 | 外部数据总线宽度 | 格式 | 集成缓存 | 内存(字) | 只读存储器可编程性 | 桶式移位器 | 内部总线架构 | 座位高度(最大) | 长度 | 宽度 | RoHS状态 | |||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | MCF5235CVM150 | NXP USA Inc. | 数据表 | 2524 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 256-LBGA | YES | 97 | -40°C~85°C TA | Tray | 2004 | MCF523x | 不用于新设计 | 3 (168 Hours) | 256 | 5A002.A.1 | Tin/Silver/Copper - with Nickel barrier | 低功耗模式取自低功耗模式 | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1mm | 40 | MCF5235 | S-PBGA-B256 | 不合格 | 1.6V | 1.4V | External | 150MHz | 64K x 8 | 1.4V~1.6V | MICROPROCESSOR, RISC | Coldfire V2 | DMA, WDT | 75MHz | ROMless | 32-Bit | CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART | 32 | 24 | YES | YES | 32 | 固定点 | YES | 1.6mm | 17mm | 17mm | ROHS3 Compliant | |||||||||||||||||||||||
 | MK20DN128VLH5 | NXP USA Inc. | 数据表 | 20 In Stock | - | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 64-LQFP | YES | 40 | A/D 13x16b | -40°C~105°C TA | Tray | 2012 | Kinetis K20 | e3 | 活跃 | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | MK20DN128 | S-PQFP-G64 | 3.6V | 1.71V | Internal | 50MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 128KB 128K x 8 | I2C, IrDA, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||||||||||||||||||||||||
| MCF54417CMJ250 | NXP USA Inc. | 数据表 | 200 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 256-LBGA | YES | 87 | A/D 8x12b; D/A 2x12b | -40°C~85°C TA | Tray | 2006 | MCF5441x | e2 | 活跃 | 3 (168 Hours) | 256 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | MCF54417 | S-PBGA-B256 | 不合格 | 1.32V | 1.21.81.8/3.33.3V | 1.14V | Internal | 250MHz | 64K x 8 | 1.14V~1.32V | MICROPROCESSOR | Coldfire V4 | DMA, PWM, WDT | 100MHz | ROMless | 32-Bit | 1-Wire®, CANbus, EBI/EMI, Ethernet, I²C, SmartCard, SPI, SSI, UART/USART, USB, USB OTG | 32 | YES | YES | 固定点 | YES | ROHS3 Compliant | ||||||||||||||||||||||||||
 | MC9S08PA4MTGR | NXP USA Inc. | 数据表 | 2500 In Stock | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | 表面贴装 | 16-TSSOP (0.173, 4.40mm Width) | YES | A/D 8x12b | 14 | -40°C~125°C TA | Tape & Reel (TR) | 2013 | S08 | 活跃 | 3 (168 Hours) | 16 | DUAL | 鸥翼 | 260 | 3V | 0.65mm | 40 | 5.5V | 2.7V | Internal | 20MHz | 512 x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 4KB 4K x 8 | LINbus, SPI, UART/USART | 8 | YES | NO | YES | 128 x 8 | 5mm | 4.4mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||
 | MC68332ACAG16 | NXP USA Inc. | 数据表 | 23 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 144-LQFP | YES | 15 | -40°C~85°C TA | Tray | 1996 | M683xx | e3 | 不用于新设计 | 3 (168 Hours) | 144 | EAR99 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 5V | 0.5mm | 40 | MC68332 | S-PQFP-G144 | 不合格 | Internal | 16MHz | 2K x 8 | 4.5V~5.5V | MICROCONTROLLER | CPU32 | POR, PWM, WDT | 16MHz | ROMless | 32-Bit | EBI/EMI, SCI, SPI, UART/USART | 32 | NO | NO | YES | NO | 24 | 16 | 1.6mm | 20mm | 20mm | ROHS3 Compliant | |||||||||||||||||||||||||
 | MKE14F512VLL16 | NXP USA Inc. | 数据表 | 4500 In Stock | - | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 100-LQFP | A/D 16x12b; D/A 1x12b | 89 | -40°C~105°C TA | Tray | 2016 | Kinetis KE1xF | 活跃 | 3 (168 Hours) | 3A991.A.2 | 8542.31.00.01 | 未说明 | 未说明 | Internal | 168MHz | 64K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M4F | DMA, LVD, PWM, WDT | FLASH | 32-Bit | 512KB 512K x 8 | FlexIO, I2C, SPI, UART/USART | 68K x 8 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||
 | MCHC11F1CFNE3 | NXP USA Inc. | 数据表 | 130 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 68-LCC (J-Lead) | YES | 30 | A/D 8x8b | -40°C~85°C TA | Tube | 1993 | HC11 | e3 | 不用于新设计 | 3 (168 Hours) | 68 | EAR99 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | J BEND | 250 | 5V | 1.27mm | 30 | MCHC11 | S-PQCC-J68 | 5.25V | 4.75V | Internal | 3MHz | 1K x 8 | 4.75V~5.25V | MICROCONTROLLER | POR, WDT | 12MHz | ROMless | 8-Bit | SCI, SPI | 8 | YES | NO | NO | NO | 16 | 512 x 8 | 8 | EEPROM | 4.572mm | 24.2062mm | 24.2062mm | ROHS3 Compliant | ||||||||||||||||||||||
 | MK40DN512VMD10 | NXP USA Inc. | 数据表 | 2000 In Stock | - | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 144-LBGA | YES | 524288 | A/D 42x16b; D/A 2x12b | 98 | -40°C~105°C TA | Tray | 2012 | Kinetis K40 | e1 | 活跃 | 3 (168 Hours) | 144 | 3A991.A.2 | 锡银铜 | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 40 | MK40DN512 | S-PBGA-B144 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 100MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LCD, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | CORTEX-M4 | 1.7mm | 13mm | 13mm | ROHS3 Compliant | ||||||||||||||||||||
 | MPC561MVR56 | NXP USA Inc. | 数据表 | 5 In Stock | - | 最小起订量: 1 最小包装量: 1 | 14 Weeks | 表面贴装 | 388-BBGA | YES | 0 | A/D 32x10b | 64 | -40°C~125°C TA | Tray | 1999 | MPC5xx | e1 | 不用于新设计 | 3 (168 Hours) | 388 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 2.6V | 1mm | 40 | MPC561 | S-PBGA-B388 | 不合格 | 2.7V | 2.65V | 2.5V | External | 56MHz | 32K x 8 | 2.5V~2.7V | MICROCONTROLLER | PowerPC | POR, PWM, WDT | 25MHz | ROMless | 32-Bit | CANbus, EBI/EMI, SCI, SPI, UART/USART | 32 | YES | YES | YES | 24 | 16 | 27mm | 27mm | ROHS3 Compliant | ||||||||||||||||||||||
 | SPC5517EAMLU66 | NXP USA Inc. | 数据表 | 4 In Stock | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 176-LQFP | YES | 137 | 196608 | Automotive grade | A/D 40x12b | -40°C~125°C TA | Tray | 2004 | MPC55xx Qorivva | e3 | 活跃 | 3 (168 Hours) | 176 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 5V | 0.5mm | 40 | SPC5517 | S-PQFP-G176 | 不合格 | 5.25V | 5V | 4.5V | Internal | 66MHz | 80K x 8 | 4.5V~5.25V | MICROCONTROLLER, RISC | e200z0, e200z1 | DMA, POR, PWM, WDT | 40MHz | FLASH | 32-Bit Dual-Core | 1.5MB 1.5M x 8 | CANbus, EBI/EMI, I2C, SCI, SPI | 32 | YES | YES | YES | NO | 32 | AEC-Q100 | 32 | 1.6mm | 24mm | 24mm | ROHS3 Compliant | |||||||||||||||||
| MK60DN256ZVLL10 | NXP USA Inc. | 数据表 | 1500 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-LQFP | YES | A/D 33x16b; D/A 1x12b | 66 | -40°C~105°C TA | Tray | 2012 | Kinetis K60 | e3 | 不用于新设计 | 3 (168 Hours) | 100 | 3A991.A.2 | 哑光锡 | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3V | 0.5mm | 40 | MK60DN256 | S-PQFP-G100 | 不合格 | 3.6V | 1.71V | Internal | 100MHz | 64K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | 1.7mm | 14mm | 14mm | ROHS3 Compliant | ||||||||||||||||||||||||
| MK20DX128VLL7 | NXP USA Inc. | 数据表 | 900 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 100-LQFP | YES | 131072 | A/D 33x16b; D/A 1x12b | 66 | -40°C~105°C TA | Tray | 2002 | Kinetis K20 | e3 | 活跃 | 3 (168 Hours) | 100 | 3A991.A.2 | 哑光锡 | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | MK20DX128 | S-PQFP-G100 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 72MHz | 32K x 8 | 1.71V~3.6V | MICROCONTROLLER | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 128KB 128K x 8 | CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | 2K x 8 | CORTEX-M4 | 14mm | 14mm | ROHS3 Compliant | ||||||||||||||||||||
 | MC9S12XEP100CAL | NXP USA Inc. | 数据表 | 300 In Stock | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | 表面贴装 | 112-LQFP | YES | 1048576 | A/D 16x12b | 91 | -40°C~85°C TA | Tray | 2012 | HCS12X | e3 | 活跃 | 3 (168 Hours) | 112 | Matte Tin (Sn) | IT ALSO REQUIRES 5 V I/O SUPPLY | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 1.8V | 0.65mm | 40 | MC9S12XEP100 | S-PQFP-G112 | 不合格 | 1.98V | 3.3/5V | 1.72V | External | 50MHz | 64K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | 32 | YES | YES | YES | NO | 23 | 4K x 8 | CPU12 | 16 | 1.6mm | 20mm | 20mm | ROHS3 Compliant | ||||||||||||||||||
 | LPC4370FET100E | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 100-TFBGA | YES | 49 | 288768 | 0 | A/D 3x12b; D/A 1x10b | -40°C~85°C TA | Tray | 2010 | LPC43xx | 活跃 | 3 (168 Hours) | 100 | BOTTOM | BALL | 未说明 | 3.3V | 0.8mm | 未说明 | 100 | S-PBGA-B100 | 不合格 | 3.6V | 2.5/3.3V | 2.2V | Internal | 204MHz | 282K x 8 | 2.2V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4/M0/M0 | Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT | 25MHz | ROMless | 32-Bit Tri-Core | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, SSC, UART/USART, USB | 32 | YES | YES | YES | YES | CORTEX-M4F | FLASH | 1.2mm | 9mm | 9mm | ROHS3 Compliant | |||||||||||||||||||||||
| MC9S08PA4MTG | NXP USA Inc. | 数据表 | 382 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 20 Weeks | 表面贴装 | 16-TSSOP (0.173, 4.40mm Width) | YES | 14 | A/D 8x12b | -40°C~125°C TA | Tube | 2012 | S08 | e3 | 活跃 | 3 (168 Hours) | 16 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | DUAL | 鸥翼 | 260 | 5V | 0.65mm | 40 | R-PDSO-G16 | 5.5V | 2.7V | Internal | 20MHz | 512 x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 4KB 4K x 8 | LINbus, SPI, UART/USART | 8 | YES | NO | YES | NO | 128 x 8 | 5mm | 4.4mm | ROHS3 Compliant | ||||||||||||||||||||||||||
| MKE18F256VLH16 | NXP USA Inc. | 数据表 | 898 In Stock | - | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 64-LQFP | YES | 58 | A/D 16x12b; D/A 1x12b | -40°C~105°C TA | Tray | 2016 | Kinetis KE1xF | 活跃 | 3 (168 Hours) | 64 | 3A991.A.2 | 8542.31.00.01 | QUAD | 鸥翼 | 未说明 | 5V | 0.5mm | 未说明 | 5.5V | 2.7V | Internal | 168MHz | 64K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M4F | DMA, LVD, PWM, WDT | 50MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, FlexIO, I2C, SPI, UART/USART | 32 | YES | YES | YES | 68K x 8 | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||||||||||||||||
 | S9S12G128F0CLF | NXP USA Inc. | 数据表 | 1000 In Stock | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 48-LQFP | YES | 40 | 131072 | Automotive grade | A/D 12x10b | -40°C~85°C TA | Tray | 2011 | HCS12 | 活跃 | 3 (168 Hours) | 48 | 8542.31.00.01 | QUAD | 鸥翼 | 5V | 0.5mm | S9S12G128 | S-PQFP-G48 | 不合格 | 5.5V | 3.3/5V | 3.13V | Internal | 25MHz | 8K x 8 | 3.13V~5.5V | MICROCONTROLLER | 12V1 | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, IrDA, LINbus, SCI, SPI | 23mA | 16 | YES | NO | YES | 4K x 8 | CPU12 | AEC-Q100 | 7mm | 7mm | ROHS3 Compliant | |||||||||||||||||||||||
| SPC5606BK0VLU6R | NXP USA Inc. | 数据表 | 13720 In Stock | - | 最小起订量: 1 最小包装量: 1 | 14 Weeks | 表面贴装 | 176-LQFP | YES | A/D 29x10b, 5x12b | 149 | -40°C~105°C TA | Tape & Reel (TR) | 2006 | MPC56xx Qorivva | 活跃 | 3 (168 Hours) | 176 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | SPC5606 | 3.6V | 3V | Internal | 64MHz | 80K x 8 | 3V~5.5V | MICROCONTROLLER, RISC | e200z0h | DMA, POR, PWM, WDT | 40MHz | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, I2C, LINbus, SCI, SPI | 32 | YES | YES | YES | 64K x 8 | 24mm | 24mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||
 | DSP56F807VF80E | NXP USA Inc. | 数据表 | 1002 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 160-BGA | YES | 32 | A/D 16x12b | -40°C~85°C TA | Tray | 1998 | 56F8xx | e1 | 活跃 | 3 (168 Hours) | 160 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 40 | DSP56F807 | S-PBGA-B160 | 不合格 | 3.6V | 3.3V | 3V | External | 80MHz | 4K x 16 | 3V~3.6V | DIGITAL SIGNAL PROCESSOR, OTHER | 56800 | POR, PWM, WDT | 80MHz | FLASH | 16-Bit | 120KB 60K x 16 | CANbus, EBI/EMI, SCI, SPI | 16 | 16 | YES | YES | 16 | 固定点 | 4096 | YES | MULTIPLE | 1.75mm | 15mm | 15mm | ROHS3 Compliant | ||||||||||||||||||
| MK63FN1M0VLQ12 | NXP USA Inc. | 数据表 | 415 In Stock | - | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 144-LQFP | YES | 100 | A/D 41x16b; D/A 2x12b | -40°C~105°C TA | Tray | 2002 | Kinetis K60 | e3 | 活跃 | 3 (168 Hours) | 144 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | S-PQFP-G144 | 3.6V | 1.71V | Internal | 120MHz | 256K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | 20mm | 20mm | ROHS3 Compliant | ||||||||||||||||||||||||||
| S9S12G192F0VLL | NXP USA Inc. | 数据表 | 1500 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 100-LQFP | YES | 86 | 196608 | Automotive grade | A/D 16x10b | -40°C~105°C TA | Tray | 2001 | HCS12 | 活跃 | 3 (168 Hours) | 100 | 8542.31.00.01 | QUAD | 鸥翼 | 5V | 0.5mm | S9S12G192 | S-PQFP-G100 | 不合格 | 5.5V | 3.3/5V | 3.13V | Internal | 25MHz | 11K x 8 | 3.13V~5.5V | MICROCONTROLLER | 12V1 | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 192KB 192K x 8 | CANbus, IrDA, LINbus, SCI, SPI | 16 | YES | NO | YES | 4K x 8 | CPU12 | AEC-Q100 | 14mm | 14mm | ROHS3 Compliant | ||||||||||||||||||||||||
 | MC9S08LC36LK | NXP USA Inc. | 数据表 | 9999 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 80-LQFP | YES | 36864 | A/D 8x12b | 24 | 0°C~70°C TA | Tray | 2007 | S08 | e3 | 活跃 | 3 (168 Hours) | 80 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3V | 0.5mm | 40 | MC9S08LC36 | S-PQFP-G80 | 不合格 | 3.6V | 2/3.3V | 1.8V | External | 40MHz | 2.5K x 8 | 1.8V~3.6V | MICROCONTROLLER | LCD, LVD, POR, PWM, WDT | 40MHz | FLASH | 8-Bit | 36KB 36K x 8 | I2C, SCI, SPI | 8 | YES | NO | YES | NO | 1.6mm | 12mm | 12mm | ROHS3 Compliant | ||||||||||||||||||||||
 | MKE02Z64VLD4R | NXP USA Inc. | 数据表 | 200 In Stock | - | 最小起订量: 1 最小包装量: 1 | 20 Weeks | 表面贴装 | 44-LQFP | YES | 37 | 4096 | 65536 | A/D 16x12b; D/A 2x6b | -40°C~105°C TA | Tape & Reel (TR) | 2013 | Kinetis KE02 | 活跃 | 3 (168 Hours) | 44 | 3A991.A.2 | 从制造商网站考虑的柱塞尺寸 | 8542.31.00.01 | QUAD | 鸥翼 | 未说明 | 3V | 0.8mm | 未说明 | S-PQFP-G44 | 5.5V | 2.7V | Internal | 40MHz | 4K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | LVD, PWM, WDT | 20MHz | FLASH | 32-Bit | 64KB 64K x 8 | I2C, SPI, UART/USART | 32 | YES | NO | YES | NO | 256 x 8 | 8 | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||||||||||
 | S9S12GN16F1VLCR | NXP USA Inc. | 数据表 | 2000 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 32-LQFP | YES | 26 | 16384 | Automotive grade | A/D 8x10b | -40°C~105°C TA | Tape & Reel (TR) | 2012 | HCS12 | 活跃 | 3 (168 Hours) | 32 | 8542.31.00.01 | QUAD | 鸥翼 | 5V | 0.8mm | S9S12GN16 | S-PQFP-G32 | 不合格 | 5.5V | 3.3/5V | 3.13V | Internal | 25MHz | 1K x 8 | 3.13V~5.5V | MICROCONTROLLER | 12V1 | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 16KB 16K x 8 | IrDA, LINbus, SCI, SPI | 16mA | 16 | YES | NO | YES | 512 x 8 | CPU12 | AEC-Q100 | 7mm | 7mm | ROHS3 Compliant | |||||||||||||||||||||||
 | S9S08SG16E1MTLR | NXP USA Inc. | 数据表 | 29990 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 28-TSSOP (0.173, 4.40mm Width) | YES | 22 | A/D 16x10b | -40°C~125°C TA | Tape & Reel (TR) | 1999 | S08 | 活跃 | 3 (168 Hours) | 28 | 8542.31.00.01 | DUAL | 鸥翼 | 260 | 3V | 0.65mm | 未说明 | S9S08SG16 | 5.5V | 2.7V | Internal | 40MHz | 1K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 16KB 16K x 8 | I2C, LINbus, SCI, SPI | 8 | YES | NO | YES | 9.7mm | 4.4mm | ROHS3 Compliant |
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