品牌是'NXP' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 安装类型 | 包装/外壳 | 表面安装 | 供应商器件包装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 电源电压 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 振荡器类型 | 速度 | 内存大小 | 电压 - 供电 (Vcc/Vdd) | uPs/uCs/外围ICs类型 | 核心处理器 | 周边设备 | 时钟频率 | 程序存储器类型 | 芯尺寸 | 程序内存大小 | 连接方式 | 电源电流-最大值 | 位元大小 | 有ADC | DMA 通道 | 脉宽调制通道 | 数模转换器通道 | 地址总线宽度 | EEPROM 大小 | 片上程序 ROM 宽度 | 处理器系列 | 边界扫描 | 低功率模式 | 筛选水平 | 外部数据总线宽度 | 格式 | 集成缓存 | 桶式移位器 | 内部总线架构 | 座位高度(最大) | 长度 | 宽度 | RoHS状态 | |||||
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![]() | SPC5744PGK1AMMM9 | NXP USA Inc. | 数据表 | 1500 In Stock | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | 表面贴装 | 257-LFBGA | YES | A/D 64x12b | -40°C~125°C TA | Tray | 2010 | MPC57xx | yes | 活跃 | 3 (168 Hours) | 257 | BOTTOM | BALL | 260 | 3.3V | 0.8mm | 40 | 3.6V | 3.15V | Internal | 200MHz | 384K x 8 | 3.15V~5.5V | MICROCONTROLLER, RISC | e200z4 | DMA, LVD, POR, WDT | 40MHz | FLASH | 32-Bit Dual-Core | 2.5MB 2.5M x 8 | CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART | 32 | YES | YES | YES | 32 | 64 | 14mm | 14mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||
![]() | S9S08SG8E2MTG | NXP USA Inc. | 数据表 | 15 In Stock | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 16-TSSOP (0.173, 4.40mm Width) | YES | A/D 8x10b | 12 | 8192 | Automotive grade | -40°C~125°C TA | Tube | 1999 | S08 | e3 | 活跃 | 3 (168 Hours) | 16 | EAR99 | 哑光锡 | 8542.31.00.01 | DUAL | 鸥翼 | 260 | 5V | 0.65mm | 40 | S9S08SG8 | R-PDSO-G16 | 不合格 | 5.5V | 3/5V | 2.7V | Internal | 40MHz | 512 x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 8KB 8K x 8 | I2C, LINbus, SCI, SPI | 8 | YES | NO | YES | NO | AEC-Q100 | 1.2mm | 5mm | 4.4mm | ROHS3 Compliant | |||||||||||||||||||||
![]() | MC9S08QD2CSCR | NXP USA Inc. | 数据表 | 7500 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | A/D 4x10b | 4 | -40°C~85°C TA | Tape & Reel (TR) | 2006 | S08 | e3 | 活跃 | 3 (168 Hours) | 8 | EAR99 | 哑光锡 | IT ALSO OPERATES AT 3V SUPPLY | DUAL | 鸥翼 | 260 | 5V | 1.27mm | 40 | MC9S08QD2 | R-PDSO-G8 | 不合格 | 5.5V | 3/5V | 2.7V | Internal | 16MHz | 128 x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 2KB 2K x 8 | 8 | YES | NO | YES | NO | 1.75mm | 3.9mm | ROHS3 Compliant | ||||||||||||||||||||||||||
![]() | MK20DX64VLH7 | NXP USA Inc. | 数据表 | 143 In Stock | - | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 64-LQFP | YES | 40 | 65536 | A/D 24x16b; D/A 1x12b | -40°C~105°C TA | Tray | 2012 | Kinetis K20 | e3 | 活跃 | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | MK20DX64 | S-PQFP-G64 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 72MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 64KB 64K x 8 | CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | 2K x 8 | CORTEX-M4 | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||||||||
![]() | MKL26Z256VMP4 | NXP USA Inc. | 数据表 | 68 In Stock | - | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 64-LFBGA | YES | 50 | 262144 | A/D - 16bit; D/A - 12bit | -40°C~105°C TA | Tray | 2002 | Kinetis KL2 | e1 | 活跃 | 3 (168 Hours) | 64 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.5mm | 40 | MKL26Z256 | S-PBGA-B64 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 48MHz | 32K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT | 48MHz | FLASH | 32-Bit | 256KB 256K x 8 | I2C, LINbus, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | CORTEX-M0 | 5mm | 5mm | ROHS3 Compliant | ||||||||||||||||||||||
![]() | S9S08SG8E2CTJR | NXP USA Inc. | 数据表 | 4000 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 20-TSSOP (0.173, 4.40mm Width) | YES | 8192 | 16 | A/D 12x10b | Automotive grade | -40°C~85°C TA | Tape & Reel (TR) | 1999 | S08 | e3 | 活跃 | 3 (168 Hours) | 20 | EAR99 | 哑光锡 | 8542.31.00.01 | DUAL | 鸥翼 | 260 | 5V | 0.65mm | 40 | S9S08SG8 | R-PDSO-G20 | 不合格 | 5.5V | 3/5V | 2.7V | Internal | 40MHz | 512 x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | FLASH | 8-Bit | 8KB 8K x 8 | I2C, LINbus, SCI, SPI | 120mA | 8 | YES | NO | YES | NO | AEC-Q100 | 1.2mm | 6.5mm | 5mm | ROHS3 Compliant | |||||||||||||||||||||
![]() | S9S12GN48F0CLH | NXP USA Inc. | 数据表 | 5500 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 64-LQFP | YES | A/D 12x10b | 54 | 49152 | Automotive grade | -40°C~85°C TA | Tray | 2008 | HCS12 | 活跃 | 3 (168 Hours) | 64 | QUAD | 鸥翼 | 5V | 0.5mm | S9S12GN48 | S-PQFP-G64 | 不合格 | 5.5V | 3.3/5V | 3.13V | Internal | 25MHz | 4K x 8 | 3.13V~5.5V | MICROCONTROLLER | 12V1 | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 48KB 48K x 8 | IrDA, LINbus, SCI, SPI | 16 | YES | NO | YES | 1.5K x 8 | CPU12 | AEC-Q100 | 10mm | 10mm | ROHS3 Compliant | ||||||||||||||||||||||||||
![]() | MKL17Z128VMP4 | NXP USA Inc. | 数据表 | 5120 In Stock | - | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 64-LFBGA | YES | A/D 20x16b; D/A 1x12b | 54 | -40°C~105°C TA | Tray | 2002 | Kinetis KL1 | e1 | 活跃 | 3 (168 Hours) | 64 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3V | 0.5mm | 40 | S-PBGA-B64 | 3.6V | 1.71V | Internal | 48MHz | 32K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT | 48MHz | FLASH | 32-Bit | 128KB 128K x 8 | I2C, LINbus, SPI, UART/USART | YES | YES | YES | YES | 5mm | 5mm | ROHS3 Compliant | |||||||||||||||||||||||||||||
![]() | LPC11U68JBD100E | NXP USA Inc. | 数据表 | 450 In Stock | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 100-LQFP | YES | 80 | 262144 | A/D 12x12b | -40°C~105°C TA | Tray | 2010 | LPC11Uxx | Discontinued | 3 (168 Hours) | 100 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 未说明 | LPC11U | 100 | S-PQFP-G100 | 3.6V | 2.4V | Internal | 50MHz | 36K x 8 | 2.4V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 25MHz | FLASH | 32-Bit | 256KB 256K x 8 | I2C, Microwire, SPI, SSI, SSP, UART/USART, USB | 32 | YES | YES | YES | NO | 4K x 8 | 8 | 1.6mm | 14mm | 14mm | ROHS3 Compliant | |||||||||||||||||||||||||
![]() | MC56F8365MFGE | NXP USA Inc. | 数据表 | 50 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 128-LQFP | YES | 49 | 524288 | A/D 16x12b | -40°C~125°C TA | Tray | 1998 | 56F8xxx | e3 | 活跃 | 3 (168 Hours) | 128 | 3A991.A.2 | Matte Tin (Sn) | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 2.5V | 0.5mm | 40 | MC56F8365 | R-PQFP-G128 | 不合格 | 2.75V | 2.53.3V | 2.25V | External | 60MHz | 18K x 16 | 2.25V~3.6V | DIGITAL SIGNAL PROCESSOR, OTHER | 56800E | POR, PWM, Temp Sensor, WDT | 120MHz | FLASH | 16-Bit | 512KB 256K x 16 | CANbus, EBI/EMI, SCI, SPI | 16 | 11 | YES | YES | 4 | 固定点 | YES | MULTIPLE | 1.6mm | 20mm | 14mm | ROHS3 Compliant | ||||||||||||||||||
![]() | LPC54113J128BD64QL | NXP USA Inc. | 数据表 | 320 In Stock | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | 表面贴装 | 64-LQFP | YES | A/D 12x12b | 48 | -40°C~105°C TA | Tray | 2010 | LPC54100 | 活跃 | 1 (Unlimited) | 64 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 未说明 | 64 | 3.6V | 1.62V | Internal | 100MHz | 96K x 8 | 1.62V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | 25MHz | FLASH | 32-Bit | 128KB 128K x 8 | I2C, SPI, UART/USART, USB | 32 | YES | YES | YES | 10mm | 10mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||
MC908GR16VFAE | NXP USA Inc. | 数据表 | 6 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 48-LQFP | YES | 37 | A/D 8x10b | -40°C~105°C TA | Tray | 2007 | HC08 | e3 | 不用于新设计 | 3 (168 Hours) | 48 | 3A991.A.2 | Matte Tin (Sn) | OPERATES AT 3.3V SUPPLY AT 4.1MHZ | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 5V | 0.5mm | 40 | MC908GR16 | S-PQFP-G48 | 不合格 | 5.5V | 4.5V | Internal | 8MHz | 1K x 8 | 3V~5.5V | MICROCONTROLLER | LVD, POR, PWM | 32.8MHz | FLASH | 8-Bit | 16KB 16K x 8 | LINbus, SCI, SPI | 8 | YES | NO | YES | NO | 1.6mm | 7mm | 7mm | ROHS3 Compliant | ||||||||||||||||||||||||||
![]() | MC68711E20CFNE3 | NXP USA Inc. | 数据表 | 1352 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 52-LCC (J-Lead) | YES | 38 | A/D 8x8b | -40°C~85°C TA | Tube | 2005 | HC11 | e3 | 不用于新设计 | 3 (168 Hours) | 52 | EAR99 | Matte Tin (Sn) | 坐高计算值 | 8542.31.00.01 | QUAD | J BEND | 250 | 5V | 1.27mm | 30 | MC68711 | S-PQCC-J52 | 5.5V | 4.5V | Internal | 3MHz | 768 x 8 | 4.5V~5.5V | MICROCONTROLLER | POR, WDT | 12MHz | OTP | 8-Bit | 20KB 20K x 8 | SCI, SPI | 8 | YES | NO | NO | NO | 16 | 512 x 8 | 8 | 5.08mm | 19.125mm | 19.125mm | ROHS3 Compliant | |||||||||||||||||||||||
![]() | S9S12P128J0MQK | NXP USA Inc. | 数据表 | 3634 In Stock | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | 表面贴装 | 80-QFP | YES | A/D 10x12b | 64 | 131072 | Automotive grade | -40°C~125°C TA | Tray | 2004 | HCS12 | e3 | 活跃 | 3 (168 Hours) | 80 | EAR99 | 哑光锡 | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 5V | 0.65mm | 40 | 9S12P128 | S-XQFP-G80 | 不合格 | 5.5V | 1.83.3/5V | 3.13V | Internal | 32MHz | 6K x 8 | 1.72V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, SCI, SPI | 16 | YES | NO | YES | YES | 4K x 8 | CPU12 | AEC-Q100 | 16 | 2.45mm | 14mm | 14mm | ROHS3 Compliant | ||||||||||||||||||
![]() | S9S12G64F0MLH | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 64-LQFP | YES | A/D 12x10b | 54 | 65536 | Automotive grade | -40°C~125°C TA | Tray | 2008 | HCS12 | 活跃 | 3 (168 Hours) | 64 | QUAD | 鸥翼 | 5V | 0.5mm | S9S12G64 | S-PQFP-G64 | 不合格 | 5.5V | 3.3/5V | 3.13V | Internal | 25MHz | 4K x 8 | 3.13V~5.5V | MICROCONTROLLER | 12V1 | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 64KB 64K x 8 | CANbus, IrDA, LINbus, SCI, SPI | 16 | YES | NO | YES | 2K x 8 | CPU12 | AEC-Q100 | 10mm | 10mm | ROHS3 Compliant | ||||||||||||||||||||||||||
![]() | MK22FN1M0VLL12 | NXP USA Inc. | 数据表 | 1000 In Stock | - | 最小起订量: 1 最小包装量: 1 | 14 Weeks | 表面贴装 | 100-LQFP | YES | 66 | 1048576 | A/D 33x16b; D/A 1x12b | -40°C~105°C TA | Tray | 2002 | Kinetis K20 | e3 | 不用于新设计 | 3 (168 Hours) | 100 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 2.5V | 0.5mm | 40 | MK22FN1M0 | S-PQFP-G100 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 120MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | CORTEX-M4 | 14mm | 14mm | ROHS3 Compliant | |||||||||||||||||||||||
![]() | MC9S08QA2CDNE | NXP USA Inc. | 数据表 | 10 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | A/D 4x10b | 4 | -40°C~85°C TA | Tube | 2006 | S08 | e3 | 活跃 | 3 (168 Hours) | 8 | 3A991.A.2 | Matte Tin (Sn) | DUAL | 鸥翼 | 260 | 3V | 1.27mm | 40 | MC9S08QA2 | R-PDSO-G8 | 不合格 | 3.6V | 2/3.3V | 1.8V | Internal | 20MHz | 160 x 8 | 1.8V~3.6V | MICROCONTROLLER | LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 2KB 2K x 8 | 8 | YES | NO | YES | NO | 1.75mm | 3.9mm | ROHS3 Compliant | |||||||||||||||||||||||||||
![]() | MC908QB4CDWE | NXP USA Inc. | 数据表 | 1 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 16-SOIC (0.295, 7.50mm Width) | YES | A/D 10x10b | 13 | -40°C~85°C TA | Tube | 1996 | HC08 | e3 | 不用于新设计 | 3 (168 Hours) | 16 | 3A991.A.2 | Matte Tin (Sn) | OPERATES AT 3V SUPPLY AT 4 MHZ | 8542.31.00.01 | DUAL | 鸥翼 | 260 | 5V | 1.27mm | 40 | MC908QB4 | R-PDSO-G16 | 不合格 | 5.5V | 4.5V | Internal | 8MHz | 128 x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM | 32MHz | FLASH | 8-Bit | 4KB 4K x 8 | SCI, SPI | 8 | YES | NO | YES | NO | 2.65mm | 10.3mm | 7.5mm | ROHS3 Compliant | ||||||||||||||||||||||||
![]() | MC9S08DZ32AMLH | NXP USA Inc. | 数据表 | 6800 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 64-LQFP | 64-LQFP (10x10) | A/D 24x12b | 53 | -40°C~125°C TA | Tray | 2005 | S08 | 活跃 | 3 (168 Hours) | MC9S08DZ32 | External | 40MHz | 2K x 8 | 2.7V~5.5V | S08 | LVD, POR, PWM, WDT | FLASH | 8-Bit | 32KB 32K x 8 | CANbus, I2C, LINbus, SCI, SPI | 1K x 8 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MCF51QE64CLH | NXP USA Inc. | 数据表 | 10000 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 64-LQFP | YES | 54 | 65536 | A/D 20x12b | -40°C~85°C TA | Tray | 2006 | MCF51QE | e3 | 活跃 | 3 (168 Hours) | 64 | 3A991.A.2 | Tin (Sn) | QUAD | 鸥翼 | 260 | 3V | 0.5mm | 40 | MCF51QE64 | S-PQFP-G64 | 不合格 | 3.6V | 1.8/3.6V | 1.8V | Internal | 50MHz | 8K x 8 | 1.8V~3.6V | MICROCONTROLLER | Coldfire V1 | LVD, PWM, WDT | 16MHz | FLASH | 32-Bit | 64KB 64K x 8 | I2C, SCI, SPI | 32 | YES | NO | YES | NO | 1.6mm | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||||||||||
![]() | MK10DX256VLH7R | NXP USA Inc. | 数据表 | 1500 In Stock | - | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 64-LQFP | YES | A/D 26x16b; D/A 1x12b | 44 | -40°C~105°C TA | Tape & Reel (TR) | 2002 | Kinetis K10 | e3 | 活跃 | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | MK10DX256 | S-PQFP-G64 | 3.6V | 1.71V | Internal | 72MHz | 64K x 8 | 1.71V~3.6V | MICROCONTROLLER | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART | 32 | YES | YES | YES | YES | 2K x 8 | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||||||||||||
![]() | LPC54101J256UK49Z | NXP USA Inc. | 数据表 | 10 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 26 Weeks | 表面贴装 | 49-UFBGA, WLCSP | YES | A/D 12x12b | 39 | 106496 | 262144 | -40°C~105°C TA | Tape & Reel (TR) | 2010 | LPC54100 | 活跃 | 1 (Unlimited) | 49 | BOTTOM | BALL | 未说明 | 3.3V | 0.4mm | 未说明 | S-PBGA-B49 | 3.6V | 1.62V | Internal | 100MHz | 104K x 8 | 1.62V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | Brown-out Detect/Reset, POR, PWM, WDT | 25MHz | FLASH | 32-Bit | 256KB 256K x 8 | I2C, SPI, UART/USART | 32 | YES | YES | YES | NO | 8 | 0.58mm | 3.29mm | 3.29mm | ROHS3 Compliant | |||||||||||||||||||||||||||
![]() | MC9S08QG8CFFE | NXP USA Inc. | 数据表 | 4693 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 16-VQFN Exposed Pad | YES | 12 | 8192 | A/D 8x10b | -40°C~85°C TA | Tray | 2005 | S08 | e3 | 活跃 | 3 (168 Hours) | 16 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 无铅 | 260 | 3V | 0.8mm | 40 | MC9S08QG8 | S-XQCC-N16 | 不合格 | 3.6V | 1.8/3.6V | 1.8V | Internal | 20MHz | 512 x 8 | 1.8V~3.6V | MICROCONTROLLER | LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 8KB 8K x 8 | I2C, SCI, SPI | 8 | YES | NO | YES | NO | 1mm | 5mm | 5mm | ROHS3 Compliant | |||||||||||||||||||||||
![]() | MCF5474ZP266 | NXP USA Inc. | 数据表 | 700 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 14 Weeks | 表面贴装 | 388-BBGA | YES | 99 | 0°C~70°C TA | Tray | 2001 | MCF547x | e0 | 不用于新设计 | 3 (168 Hours) | 388 | 锡铅 | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1mm | unknown | 40 | MCF5474 | S-PBGA-B388 | 不合格 | 1.58V | 1.43V | External | 266MHz | 32K x 8 | 1.43V~1.58V | MICROPROCESSOR, RISC | Coldfire V4E | DMA, PWM, WDT | 66.66MHz | ROMless | 32-Bit | EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB | 32 | 32 | YES | YES | 32 | 浮点 | YES | 2.55mm | 27mm | 27mm | Non-RoHS Compliant | ||||||||||||||||||||||||
![]() | MKV10Z128VFM7 | NXP USA Inc. | 数据表 | 202 In Stock | - | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 32-VFQFN Exposed Pad | YES | A/D 2x16b; D/A 1x12b | 28 | -40°C~105°C TA | Tray | 2002 | Kinetis KV | 活跃 | 3 (168 Hours) | 32 | 3A991.A.2 | 8542.31.00.01 | QUAD | 无铅 | 未说明 | 3.3V | 0.5mm | 未说明 | S-XQCC-N32 | 3.6V | 1.71V | Internal | 75MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | DMA, LVD, POR, WDT | 50MHz | FLASH | 32-Bit | 128KB 128K x 8 | I2C, SPI, UART/USART | YES | YES | NO | YES | 5mm | 5mm | ROHS3 Compliant |
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分类:Embedded - Microcontrollers
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NXP USA Inc.
分类:Embedded - Microcontrollers
