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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 端子间距 | 时间@峰值回流温度-最大值(s) | 基本部件号 | JESD-30代码 | 资历状况 | 电源 | 振荡器类型 | 速度 | 内存大小 | uPs/uCs/外围ICs类型 | 核心处理器 | 周边设备 | 时钟频率 | 程序存储器类型 | 芯尺寸 | 程序内存大小 | 连接方式 | 电源电流-最大值 | 位元大小 | 有ADC | DMA 通道 | 脉宽调制通道 | 数模转换器通道 | 地址总线宽度 | EEPROM 大小 | 片上程序 ROM 宽度 | 处理器系列 | 边界扫描 | 低功率模式 | 筛选水平 | 外部数据总线宽度 | 格式 | 集成缓存 | 电压 - 供电 （最大值） | 只读存储器可编程性 | 电压 - 供电 （最小值） | 桶式移位器 | 内部总线架构 | 座位高度(最大) | 长度 | 宽度 | RoHS状态 | |||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | MC56F8157VPYE | NXP USA Inc. | 数据表 | 48 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 160-LQFP | YES | A/D 16x12b | 76 | 262144 | -40°C~105°C TA | Tray | 1998 | 56F8xxx | e3 | 活跃 | 3 (168 Hours) | 160 | 3A991.A.2 | Matte Tin (Sn) | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | 2.5V | QUAD | 鸥翼 | 260 | 0.5mm | 40 | MC56F8157 | S-PQFP-G160 | 不合格 | 2.53.3V | External | 40MHz | 8K x 16 | DIGITAL SIGNAL PROCESSOR, OTHER | 56800E | POR, PWM, WDT | 120MHz | FLASH | 16-Bit | 256KB 128K x 16 | EBI/EMI, SCI, SPI | 16 | 24 | YES | YES | 16 | 固定点 | 2.75V | 2.25V | YES | MULTIPLE | 1.6mm | 24mm | 24mm | ROHS3 Compliant | ||||||||||||||||||
 | MC9S08DN32AMLC | NXP USA Inc. | 数据表 | 49 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | 32-LQFP | 32-LQFP (7x7) | A/D 10x12b | 25 | -40°C~125°C TA | Tray | 1996 | S08 | 活跃 | 3 (168 Hours) | 2.7V~5.5V | MC9S08DN32 | External | 40MHz | 1.5K x 8 | S08 | LVD, POR, PWM, WDT | FLASH | 8-Bit | 32KB 32K x 8 | I2C, LINbus, SCI, SPI | 1K x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
 | SPC5642AF2MLU1 | NXP USA Inc. | 数据表 | 52 In Stock | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 176-LQFP | YES | A/D 40x12b | 84 | 131072 | 2097152 | Automotive grade | -40°C~125°C TA | Tray | 2004 | MPC56xx Qorivva | e3 | 活跃 | 3 (168 Hours) | 176 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | 1.2V | QUAD | 鸥翼 | 260 | 0.5mm | 40 | S-PQFP-G176 | 不合格 | 1.2V | Internal | 150MHz | 128K x 8 | MICROCONTROLLER, RISC | e200z4 | DMA, POR, PWM, WDT | 40MHz | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, EBI/EMI, LINbus, SCI, SPI | 400mA | 32 | YES | YES | YES | AEC-Q100 | 1.32V | 1.14V | 24mm | 24mm | ROHS3 Compliant | |||||||||||||||||||||
 | S9S12ZVL32F0CLF | NXP USA Inc. | 数据表 | 10000 In Stock | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 48-LQFP | A/D 10x10b | 34 | -40°C~85°C TA | Tray | 2013 | S12 MagniV | 活跃 | 3 (168 Hours) | 5.5V~18V | Internal | 32MHz | 1K x 8 | S12Z | LVD, POR, PWM, WDT | FLASH | 16-Bit | 32KB 32K x 8 | I2C, IrDA, LINbus, SCI, SPI, UART/USART | 128 x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
 | LPC3250FET296/01,5 | NXP USA Inc. | 数据表 | 9 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 296-TFBGA | YES | 296 | 51 | 0 | A/D 3x10b | -40°C~85°C TA | Tray | 2008 | LPC3200 | e1 | 不用于新设计 | 3 (168 Hours) | 296 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | 1.35V | BOTTOM | BALL | 未说明 | 0.8mm | 未说明 | LPC32*0 | S-PBGA-B296 | 不合格 | 1.23.3V | Internal | 266MHz | 256K x 8 | MICROCONTROLLER, RISC | ARM926EJ-S | DMA, I2S, LCD, Motor Control PWM, PWM, WDT | 20MHz | ROMless | 16/32-Bit | EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG | 32 | YES | YES | YES | NO | 24 | 32 | 1.39V | FLASH | 1.31V | 1.2mm | 15mm | 15mm | ROHS3 Compliant | |||||||||||||||||||
| MC9S08DZ48ACLF | NXP USA Inc. | 数据表 | 32 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | 48-LQFP | YES | 39 | A/D 16x12b | -40°C~85°C TA | Tray | 2008 | S08 | yes | 活跃 | 3 (168 Hours) | 48 | 3V | QUAD | 鸥翼 | 0.5mm | MC9S08DZ48 | S-PQFP-G48 | External | 40MHz | 3K x 8 | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 48KB 48K x 8 | CANbus, I2C, LINbus, SCI, SPI | 8 | YES | NO | YES | NO | 1.5K x 8 | 8 | 5.5V | 2.7V | 1.6mm | 7mm | 7mm | ROHS3 Compliant | |||||||||||||||||||||||||||||
| S9S12GN32F0CLFR | NXP USA Inc. | 数据表 | 816 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 48-LQFP | YES | A/D 8x10b | 40 | 32768 | Automotive grade | -40°C~85°C TA | Tape & Reel (TR) | 2008 | HCS12 | 活跃 | 3 (168 Hours) | 48 | 8542.31.00.01 | 5V | QUAD | 鸥翼 | 0.5mm | S9S12GN32 | S-PQFP-G48 | 不合格 | 3.3/5V | Internal | 25MHz | 2K x 8 | MICROCONTROLLER | 12V1 | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 32KB 32K x 8 | IrDA, LINbus, SCI, SPI | 16mA | 16 | YES | NO | YES | 1K x 8 | CPU12 | AEC-Q100 | 5.5V | 3.13V | 7mm | 7mm | ROHS3 Compliant | ||||||||||||||||||||||||
 | MKL25Z32VFT4 | NXP USA Inc. | 数据表 | 100 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 48-VFQFN Exposed Pad | YES | A/D 13x16b; D/A 1x12b | 36 | 32768 | -40°C~105°C TA | Tray | 2002 | Kinetis KL2 | 活跃 | 3 (168 Hours) | 48 | 3A991.A.2 | 8542.31.00.01 | 3.3V | QUAD | 无铅 | 260 | 0.5mm | 40 | MKL25Z32 | S-XQCC-N48 | 不合格 | 1.8/3.3V | Internal | 48MHz | 4K x 8 | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 48MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, LINbus, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | CORTEX-M0 | 3.6V | 1.71V | 7mm | 7mm | Non-RoHS Compliant | ||||||||||||||||||||||||
 | MC9S08QG8CFFER | NXP USA Inc. | 数据表 | 4693 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 16-VQFN Exposed Pad | YES | A/D 8x10b | 12 | 8192 | -40°C~85°C TA | Tape & Reel (TR) | 2005 | S08 | e3 | 活跃 | 3 (168 Hours) | 16 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | 3V | QUAD | 无铅 | 260 | 0.8mm | 40 | MC9S08QG8 | S-XQCC-N16 | 不合格 | 1.8/3.6V | Internal | 20MHz | 512 x 8 | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 8KB 8K x 8 | I2C, SCI, SPI | 8 | YES | NO | YES | NO | 3.6V | 1.8V | 1mm | 5mm | 5mm | ROHS3 Compliant | |||||||||||||||||||||||
 | LPC11U67JBD64E | NXP USA Inc. | 数据表 | 30 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 16 Weeks | 表面贴装 | 64-LQFP | A/D 10x12b | 48 | -40°C~105°C TA | Tray | 2010 | LPC11Uxx | 活跃 | 2 (1 Year) | 2.4V~3.6V | Internal | 50MHz | 20K x 8 | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, POR, PWM, WDT | FLASH | 32-Bit | 128KB 128K x 8 | I2C, Microwire, SPI, SSI, SSP, UART/USART, USB | 4K x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
| MC56F8167VPYE | NXP USA Inc. | 数据表 | 6600 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 160-LQFP | YES | A/D 16x12b | 76 | 524288 | -40°C~105°C TA | Tray | 1998 | 56F8xxx | e3 | 活跃 | 3 (168 Hours) | 160 | 3A991.A.2 | Matte Tin (Sn) | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | 2.5V | QUAD | 鸥翼 | 260 | 0.5mm | 40 | MC56F8167 | S-PQFP-G160 | 不合格 | 2.53.3V | External | 40MHz | 16K x 16 | DIGITAL SIGNAL PROCESSOR, OTHER | 56800E | POR, PWM, WDT | 120MHz | FLASH | 16-Bit | 512KB 256K x 16 | EBI/EMI, SCI, SPI | 16 | 24 | YES | YES | 16 | 固定点 | 2.75V | 2.25V | YES | MULTIPLE | 1.6mm | 24mm | 24mm | ROHS3 Compliant | ||||||||||||||||||
| MC9S08DV48ACLC | NXP USA Inc. | 数据表 | 32 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | 32-LQFP | YES | 25 | A/D 10x12b | -40°C~85°C TA | Tray | 2005 | S08 | e3 | 活跃 | 3 (168 Hours) | 32 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | 3V | QUAD | 鸥翼 | 260 | 0.8mm | 40 | MC9S08DV48 | S-PQFP-G32 | External | 40MHz | 2K x 8 | MICROCONTROLLER | LVD, POR, PWM, WDT | 40MHz | FLASH | 8-Bit | 48KB 48K x 8 | CANbus, I2C, LINbus, SCI, SPI | 8 | YES | NO | YES | NO | 5.5V | 2.7V | 1.6mm | 7mm | 7mm | ROHS3 Compliant | ||||||||||||||||||||||||||
 | MC56F8145VFGE | NXP USA Inc. | 数据表 | 49 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 128-LQFP | YES | A/D 16x12b | 49 | 131072 | -40°C~105°C TA | Tray | 1998 | 56F8xxx | e3 | 活跃 | 3 (168 Hours) | 128 | 3A991.A.2 | Matte Tin (Sn) | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | 2.5V | QUAD | 鸥翼 | 260 | 0.5mm | 40 | MC56F8145 | R-PQFP-G128 | 不合格 | 2.53.3V | External | 40MHz | 4K x 16 | DIGITAL SIGNAL PROCESSOR, OTHER | 56800E | POR, PWM, WDT | 120MHz | FLASH | 16-Bit | 128KB 64K x 16 | EBI/EMI, SCI, SPI | 16 | 11 | YES | YES | 4 | 固定点 | 2.75V | 2.25V | YES | MULTIPLE | 1.6mm | 20mm | 14mm | ROHS3 Compliant | ||||||||||||||||||
 | MK12DX128VLK5 | NXP USA Inc. | 数据表 | 5200 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 80-LQFP | YES | A/D 24x16b; D/A 1x12b | 60 | 131072 | -40°C~105°C TA | Tray | 2002 | Kinetis K10 | e3 | 活跃 | 3 (168 Hours) | 80 | 3A991.A.2 | 哑光锡 | 8542.31.00.01 | 3.3V | QUAD | 鸥翼 | 260 | 0.5mm | 40 | MK12DX128 | S-PQFP-G80 | 不合格 | 1.8/3.3V | Internal | 50MHz | 32K x 8 | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 128KB 128K x 8 | I2C, IrDA, SPI, UART/USART | 32 | YES | YES | YES | YES | 4K x 8 | CORTEX-M4 | 3.6V | 1.71V | 12mm | 12mm | ROHS3 Compliant | |||||||||||||||||||||
| MKL82Z128VLK7 | NXP USA Inc. | 数据表 | 500 In Stock | - | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 80-LQFP | YES | 56 | A/D 12x16b; D/A 1x6b, 1x12b | -40°C~105°C TA | Tray | 2008 | Kinetis KL8 | 活跃 | 3 (168 Hours) | 80 | 5A992 | 8542.31.00.01 | 3.3V | QUAD | 鸥翼 | 未说明 | 0.5mm | 未说明 | Internal | 72MHz | 96K x 8 | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 128KB 128K x 8 | I2C, SPI, UART/USART, USB OTG | 32 | YES | YES | YES | 3.6V | 1.71V | 12mm | 12mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||
 | MCF5472VR200 | NXP USA Inc. | 数据表 | 107 In Stock | - | 最小起订量: 1 最小包装量: 1 | 14 Weeks | 表面贴装 | 388-BBGA | YES | 99 | 0°C~70°C TA | Tray | 2001 | MCF547x | e1 | 不用于新设计 | 3 (168 Hours) | 388 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | 1.5V | BOTTOM | BALL | 260 | 1mm | 40 | MCF5472 | S-PBGA-B388 | 不合格 | External | 200MHz | 32K x 8 | MICROPROCESSOR, RISC | Coldfire V4E | DMA, PWM, WDT | 66.66MHz | ROMless | 32-Bit | EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB | 32 | 32 | YES | YES | 32 | 浮点 | YES | 1.58V | 1.43V | 2.55mm | 27mm | 27mm | ROHS3 Compliant | |||||||||||||||||||||||||
 | MKL24Z64VLH4 | NXP USA Inc. | 数据表 | 3600 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 64-LQFP | YES | A/D 14x12b | 50 | 65536 | -40°C~105°C TA | Tray | 2012 | Kinetis KL2 | e3 | 活跃 | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | 1V | QUAD | 鸥翼 | 260 | 0.5mm | 40 | MKL24Z64 | S-PQFP-G64 | 不合格 | 1.8/3.3V | Internal | 48MHz | 8K x 8 | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 16MHz | FLASH | 32-Bit | 64KB 64K x 8 | I2C, LINbus, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | CORTEX-M0 | 1.1V | 0.9V | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||||||||||
 | MKV56F1M0VLL24 | NXP USA Inc. | 数据表 | 9 In Stock | - | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 100-LQFP | YES | 74 | A/D 4x12b, 1x16b; D/A 1x12b | -40°C~105°C TA | Tray | 2002 | Kinetis KV | 活跃 | 3 (168 Hours) | 100 | 3A991.A.2 | 8542.31.00.01 | 3.3V | QUAD | 鸥翼 | 未说明 | 0.5mm | 未说明 | Internal | 240MHz | 256K x 8 | MICROCONTROLLER, RISC | ARM® Cortex®-M7 | DMA, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 1MB 1M x 8 | CANbus, Ethernet, I2C, SPI, UART/USART | 32 | YES | YES | YES | 3.6V | 1.71V | 14mm | 14mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||
 | MC9S08GT60ACFBE | NXP USA Inc. | 数据表 | 3098 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 44-QFP | YES | A/D 8x10b | 36 | -40°C~85°C TA | Tray | 2008 | S08 | e3 | 不用于新设计 | 3 (168 Hours) | 44 | EAR99 | Tin (Sn) | OPERATES AT 1.8V MINIMUM SUPPLY | 8542.31.00.01 | 3V | QUAD | 鸥翼 | 260 | 0.8mm | 40 | MC9S08GT60 | S-PQFP-G44 | 不合格 | Internal | 40MHz | 4K x 8 | MICROCONTROLLER | LVD, POR, PWM, WDT | 40MHz | FLASH | 8-Bit | 60KB 60K x 8 | I2C, SCI, SPI | 8 | YES | NO | YES | NO | 3.6V | 2.08V | 2.45mm | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||||||||||||
 | S9S08AW60E5MFGER | NXP USA Inc. | 数据表 | 5000 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 44-LQFP | YES | 34 | A/D 8x10b | -40°C~125°C TA | Tape & Reel (TR) | 2000 | S08 | 活跃 | 3 (168 Hours) | 44 | 8542.31.00.01 | 3V | QUAD | 鸥翼 | 0.8mm | S9S08AW60 | Internal | 40MHz | 2K x 8 | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 60KB 60K x 8 | I2C, SCI, SPI | 8 | YES | NO | YES | 5.5V | 2.7V | 10mm | 10mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||
 | MC9S08SH8CTJR | NXP USA Inc. | 数据表 | N/A |
- | 最小起订量: 1 最小包装量: 1 | 22 Weeks | 表面贴装 | 20-TSSOP (0.173, 4.40mm Width) | YES | A/D 12x10b | 17 | 8192 | -40°C~85°C TA | Tape & Reel (TR) | 2010 | S08 | e3 | 活跃 | 3 (168 Hours) | 20 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | 3V | DUAL | 鸥翼 | 260 | 0.65mm | 40 | MC9S08SH8 | R-PDSO-G20 | 不合格 | 3/5V | Internal | 40MHz | 512 x 8 | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 8KB 8K x 8 | I2C, LINbus, SCI, SPI | 8 | YES | NO | YES | NO | 5.5V | 2.7V | 1.2mm | 6.5mm | 4.4mm | ROHS3 Compliant | |||||||||||||||||||||||
| S9S12G64F0CLF | NXP USA Inc. | 数据表 | 2500 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 48-LQFP | YES | A/D 12x10b | 40 | 65536 | Automotive grade | -40°C~85°C TA | Tray | 2010 | HCS12 | 活跃 | 3 (168 Hours) | 48 | 8542.31.00.01 | 5V | QUAD | 鸥翼 | 0.5mm | S9S12G64 | S-PQFP-G48 | 不合格 | 3.3/5V | Internal | 25MHz | 4K x 8 | MICROCONTROLLER | 12V1 | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 64KB 64K x 8 | CANbus, IrDA, LINbus, SCI, SPI | 16 | YES | NO | YES | 2K x 8 | CPU12 | AEC-Q100 | 5.5V | 3.13V | 7mm | 7mm | ROHS3 Compliant | |||||||||||||||||||||||||
| S9S12ZVL32F0VLF | NXP USA Inc. | 数据表 | 4011 In Stock | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 48-LQFP | YES | A/D 10x10b | 34 | 1024 | 32768 | Automotive grade | -40°C~105°C TA | Tray | 2013 | S12 MagniV | 活跃 | 3 (168 Hours) | 48 | 8542.31.00.01 | 5.5V~18V | QUAD | 鸥翼 | 0.5mm | S-PQFP-G48 | 不合格 | 5.5/18V | Internal | 32MHz | 1K x 8 | S12Z | LVD, POR, PWM, WDT | FLASH | 16-Bit | 32KB 32K x 8 | I2C, IrDA, LINbus, SCI, SPI, UART/USART | 26mA | 16 | 128 x 8 | CPU12 | AEC-Q100 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||
 | MC9S08SF4MTG | NXP USA Inc. | 数据表 | 65 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 16-TSSOP (0.173, 4.40mm Width) | YES | A/D 8x10b | 14 | 4096 | -40°C~125°C TA | Tube | 2006 | S08 | e3 | 活跃 | 3 (168 Hours) | 16 | EAR99 | Matte Tin (Sn) | 8542.31.00.01 | 3V | DUAL | 鸥翼 | 260 | 0.65mm | 40 | MC9S08SF4 | R-PDSO-G16 | 不合格 | 3/5V | External | 40MHz | 128 x 8 | MICROCONTROLLER | LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 4KB 4K x 8 | I2C | 8 | YES | NO | YES | NO | 5.5V | 2.7V | 1.2mm | 5mm | 4.4mm | ROHS3 Compliant | |||||||||||||||||||||||
| S9S08SG4E2MTG | NXP USA Inc. | 数据表 | 2612 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 16-TSSOP (0.173, 4.40mm Width) | YES | A/D 8x10b | 12 | 4096 | Automotive grade | -40°C~125°C TA | Tube | 1999 | S08 | e3 | 活跃 | 3 (168 Hours) | 16 | EAR99 | Matte Tin (Sn) | 8542.31.00.01 | 5V | DUAL | 鸥翼 | 260 | 0.65mm | 40 | S9S08SG4 | R-PDSO-G16 | 不合格 | 3/5V | Internal | 40MHz | 256 x 8 | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 4KB 4K x 8 | I2C, LINbus, SCI, SPI | 8 | YES | NO | YES | NO | AEC-Q100 | 5.5V | 2.7V | 1.2mm | 5mm | 4.4mm | ROHS3 Compliant |
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34.801718
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64.784355
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76.115324
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分类:Embedded - Microcontrollers
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分类:Embedded - Microcontrollers
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NXP USA Inc.
分类:Embedded - Microcontrollers
66.451775
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分类:Embedded - Microcontrollers
32.658802
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分类:Embedded - Microcontrollers
46.059775
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分类:Embedded - Microcontrollers
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NXP USA Inc.
分类:Embedded - Microcontrollers
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NXP USA Inc.
分类:Embedded - Microcontrollers
93.973586