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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 安装类型 | 包装/外壳 | 表面安装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 振荡器类型 | 速度 | 内存大小 | 电压 - 供电 (Vcc/Vdd) | uPs/uCs/外围ICs类型 | 核心处理器 | 周边设备 | 时钟频率 | 程序存储器类型 | 芯尺寸 | 程序内存大小 | 连接方式 | 电源电流-最大值 | 位元大小 | 有ADC | DMA 通道 | 脉宽调制通道 | 数模转换器通道 | 地址总线宽度 | EEPROM 大小 | 片上程序 ROM 宽度 | 处理器系列 | 边界扫描 | 低功率模式 | 筛选水平 | 外部数据总线宽度 | 格式 | 桶式移位器 | 内部总线架构 | 座位高度(最大) | 长度 | 宽度 | RoHS状态 | |||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | MKL25Z32VFM4 | NXP USA Inc. | 数据表 | 2964 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 32-VFQFN Exposed Pad | YES | 32768 | A/D 7x16b; D/A 1x12b | 23 | -40°C~105°C TA | Tray | 2002 | Kinetis KL2 | 活跃 | 3 (168 Hours) | 32 | 3A991.A.2 | 8542.31.00.01 | QUAD | 无铅 | 260 | 3.3V | 0.5mm | 40 | MKL25Z32 | S-XQCC-N32 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 48MHz | 4K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 48MHz | FLASH | 32-Bit | 32KB 32K x 8 | I2C, LINbus, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | CORTEX-M0 | 5mm | 5mm | Non-RoHS Compliant | ||||||||||||||||||||
 | MK10DX128VMC7 | NXP USA Inc. | 数据表 | 5000 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 121-LFBGA | YES | 131072 | A/D 39x16b; D/A 1x12b | 74 | -40°C~105°C TA | Tray | 2002 | Kinetis K10 | e1 | 活跃 | 3 (168 Hours) | 121 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.65mm | 40 | MK10DX128 | S-PBGA-B121 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 72MHz | 32K x 8 | 1.71V~3.6V | MICROCONTROLLER | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 128KB 128K x 8 | CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART | 32 | YES | YES | YES | YES | 2K x 8 | CORTEX-M4 | 8mm | 8mm | ROHS3 Compliant | |||||||||||||||||
 | LPC2478FBD208,551 | NXP USA Inc. | 数据表 | 6000 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 208-LQFP | YES | 524288 | A/D 8x10b; D/A 1x10b | 160 | -40°C~85°C TA | Tray | 2003 | LPC2400 | e3 | Discontinued | 2 (1 Year) | 208 | EAR99 | Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 未说明 | LPC2478 | 208 | S-PQFP-G208 | 不合格 | 3.6V | 3.3V | 3V | Internal | 72MHz | 96K x 8 | 3V~3.6V | MICROCONTROLLER, RISC | ARM7® | Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT | 25MHz | FLASH | 16/32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG | 32 | YES | YES | YES | YES | 24 | 32 | 1.6mm | 28mm | 28mm | ROHS3 Compliant | |||||||||||||||
 | S9S08RN60W1MLF | NXP USA Inc. | 数据表 | 23 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 16 Weeks | 表面贴装 | 48-LQFP | A/D 16x12b | 39 | -40°C~125°C TA | Tray | 2012 | S08 | e3 | 活跃 | 3 (168 Hours) | 3A991.A.2 | 哑光锡 | 8542.31.00.01 | 260 | 40 | Internal | 20MHz | 4K x 8 | 2.7V~5.5V | MICROPROCESSOR | LVD, POR, PWM, WDT | FLASH | 8-Bit | 60KB 60K x 8 | I2C, LINbus, SPI, UART/USART | 256 x 8 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||
 | S9S12GN32F1MTJ | NXP USA Inc. | 数据表 | 2250 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 20-TSSOP (0.173, 4.40mm Width) | YES | A/D 8x10b | 14 | 2048 | 32768 | Automotive grade | -40°C~125°C TA | Tube | 2008 | HCS12 | 活跃 | 3 (168 Hours) | 20 | 8542.31.00.01 | DUAL | 鸥翼 | 5V | 0.65mm | R-PDSO-G20 | 不合格 | 5.5V | 3.3/5V | 3.13V | Internal | 25MHz | 2K x 8 | 3.13V~5.5V | MICROCONTROLLER | 12V1 | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 32KB 32K x 8 | IrDA, LINbus, SCI, SPI | 16mA | 16 | YES | NO | YES | 1K x 8 | CPU12 | AEC-Q100 | 6.5mm | 4.4mm | ROHS3 Compliant | ||||||||||||||||||||
 | LPC11U35FBD64/401, | NXP USA Inc. | 数据表 | 25000 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 16 Weeks | 表面贴装 | 64-LQFP | YES | A/D 8x10b | 65536 | 54 | -40°C~85°C TA | Tray | 2010 | LPC11Uxx | e3 | 活跃 | 1 (Unlimited) | 64 | Tin (Sn) | QUAD | 鸥翼 | 3.3V | 0.5mm | LPC11U | S-PQFP-G64 | 不合格 | 3.3V | Internal | 50MHz | 10K x 8 | 1.8V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0 | Brown-out Detect/Reset, POR, WDT | FLASH | 32-Bit | 64KB 64K x 8 | I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB | 32 | 4K x 8 | CORTEX-M0 | ROHS3 Compliant | ||||||||||||||||||||||||||||||
 | SPC5605BK0MLL6 | NXP USA Inc. | 数据表 | 20 In Stock | - | 最小起订量: 1 最小包装量: 1 | 14 Weeks | 表面贴装 | 100-LQFP | YES | 786432 | A/D 7x10b, 5x12b | 77 | -40°C~125°C TA | Tray | 2006 | MPC56xx Qorivva | 活跃 | 3 (168 Hours) | 100 | 8542.31.00.01 | QUAD | 鸥翼 | 3.3V | 0.5mm | SPC5605 | S-PQFP-G100 | 不合格 | 3.6V | 3.3/5V | 3V | Internal | 64MHz | 64K x 8 | 3V~5.5V | 单片机RISC | e200z0h | DMA, POR, PWM, WDT | 16MHz | FLASH | 32-Bit | 768KB 768K x 8 | CANbus, I2C, LINbus, SCI, SPI | 32 | YES | YES | YES | 64K x 8 | 14mm | 14mm | ROHS3 Compliant | ||||||||||||||||||||||||
 | LPC54101J512UK49Z | NXP USA Inc. | 数据表 | 36 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 26 Weeks | 表面贴装 | 49-UFBGA, WLCSP | YES | 39 | 106496 | 524288 | A/D 12x12b | -40°C~105°C TA | Tape & Reel (TR) | 2010 | LPC54100 | 活跃 | 1 (Unlimited) | 49 | BOTTOM | BALL | 未说明 | 3.3V | 0.4mm | 未说明 | S-PBGA-B49 | 3.6V | 1.62V | Internal | 100MHz | 104K x 8 | 1.62V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | Brown-out Detect/Reset, POR, PWM, WDT | 25MHz | FLASH | 32-Bit | 512KB 512K x 8 | I2C, SPI, UART/USART | 32 | YES | YES | YES | NO | 8 | 0.58mm | 3.29mm | 3.29mm | ROHS3 Compliant | |||||||||||||||||||||||
 | S9S12VR32F0VLCR | NXP USA Inc. | 数据表 | 7500 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 32-LQFP | A/D 2x10b | 16 | -40°C~105°C TA | Tape & Reel (TR) | 2011 | S12 MagniV | 活跃 | 3 (168 Hours) | Internal | 25MHz | 2K x 8 | 3.13V~5.5V | 12V1 | LVD, POR, PWM, WDT | FLASH | 16-Bit | 32KB 32K x 8 | IrDA, LINbus, SCI, SPI | 128 x 8 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
 | LPC1102UK,118 | NXP USA Inc. | 数据表 | 5000 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 16 Weeks | 表面贴装 | 16-UFBGA, WLCSP | YES | 11 | 8192 | 32768 | A/D 5x10b | -40°C~85°C TA | Tape & Reel (TR) | 2010 | LPC1102 | 活跃 | 1 (Unlimited) | 16 | BOTTOM | BALL | 未说明 | 3.3V | 0.5mm | 未说明 | 16 | R-PBGA-B16 | 不合格 | 3.6V | 3.3V | 1.8V | Internal | 50MHz | 8K x 8 | 1.8V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0 | Brown-out Detect/Reset, POR, WDT | 25MHz | FLASH | 32-Bit | 32KB 32K x 8 | SPI, UART/USART | 32 | YES | NO | NO | NO | CORTEX-M0 | 0.65mm | 2.32mm | 2.17mm | ROHS3 Compliant | ||||||||||||||||||||
 | MC9S08QG8CFKE | NXP USA Inc. | 数据表 | 2000 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 24-VFQFN Exposed Pad | YES | 12 | 8192 | A/D 8x10b | -40°C~85°C TA | Tray | 2003 | S08 | 活跃 | 3 (168 Hours) | 24 | 3A991.A.2 | 8542.31.00.01 | QUAD | 无铅 | 260 | 3V | 0.5mm | 40 | MC9S08QG8 | S-XQCC-N24 | 不合格 | 3.6V | 1.8/3.6V | 1.8V | Internal | 20MHz | 512 x 8 | 1.8V~3.6V | MICROCONTROLLER | LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 8KB 8K x 8 | I2C, SCI, SPI | 8 | YES | NO | YES | NO | 1mm | 4mm | 4mm | ROHS3 Compliant | |||||||||||||||||||||
| S9S08SG32E1MTJ | NXP USA Inc. | 数据表 | 1000 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 20-TSSOP (0.173, 4.40mm Width) | YES | 32768 | A/D 12x10b | 16 | -40°C~125°C TA | Tube | 1999 | S08 | 活跃 | 3 (168 Hours) | 20 | 3A991.A.2 | 8542.31.00.01 | DUAL | 鸥翼 | 260 | 3V | 0.65mm | 未说明 | S9S08SG32 | R-PDSO-G20 | 5.5V | 2.7V | Internal | 40MHz | 1K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 40MHz | FLASH | 8-Bit | 32KB 32K x 8 | I2C, LINbus, SCI, SPI | 8 | YES | NO | YES | NO | 8 | 1.2mm | 6.5mm | 4.4mm | ROHS3 Compliant | ||||||||||||||||||||||
 | S9S12G64AMLH | NXP USA Inc. | 数据表 | 17280 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 64-LQFP | A/D 12x10b | 54 | -40°C~125°C TA | Tray | HCS12 | 活跃 | 3 (168 Hours) | Internal | 25MHz | 4K x 8 | 3.13V~5.5V | 12V1 | LVD, POR, PWM, WDT | FLASH | 16-Bit | 64KB 64K x 8 | CANbus, IrDA, LINbus, SCI, SPI | 2K x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
 | SPC5673FF3MVY2 | NXP USA Inc. | 数据表 | 2240 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 516-BBGA | YES | A/D 64x12b | 3145728 | Automotive grade | 32 | -40°C~125°C TA | Tray | 2008 | MPC56xx Qorivva | 活跃 | 3 (168 Hours) | 516 | 8542.31.00.01 | BOTTOM | BALL | 1.2V | 1mm | SPC5673 | S-PBGA-B516 | 不合格 | 1.23.35V | 1.14V | External | 200MHz | 192K x 8 | 1.08V~5.25V | MICROCONTROLLER, RISC | e200z7 | DMA, POR, PWM | 40MHz | FLASH | 32-Bit | 3MB 3M x 8 | CANbus, EBI/EMI, SCI, SPI | 32 | YES | YES | YES | AEC-Q100 | 27mm | 27mm | ROHS3 Compliant | ||||||||||||||||||||||||
 | SPC5604BF2MLQ6 | NXP USA Inc. | 数据表 | 2079 In Stock | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 144-LQFP | YES | 123 | A/D 36x10b | Automotive grade | 524288 | -40°C~125°C TA | Tray | 2007 | MPC56xx Qorivva | 活跃 | 3 (168 Hours) | 144 | 8542.31.00.01 | QUAD | 鸥翼 | 3.3V | 0.5mm | SPC5604 | S-PQFP-G144 | 不合格 | 3.6V | 3.3/5V | 3V | Internal | 64MHz | 32K x 8 | 3V~5.5V | MICROCONTROLLER | e200z0h | DMA, POR, PWM, WDT | 16MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, I2C, LINbus, SCI, SPI | 32 | YES | YES | YES | 64K x 8 | AEC-Q100 | 64 | 20mm | 20mm | ROHS3 Compliant | |||||||||||||||||||||
| S912XEQ384F1CAG | NXP USA Inc. | 数据表 | 6000 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 144-LQFP | YES | A/D 24x12b | 119 | 24576 | 393216 | Automotive grade | -40°C~85°C TA | Tray | 1996 | HCS12X | 活跃 | 3 (168 Hours) | 144 | 8542.31.00.01 | QUAD | 鸥翼 | 1.8V | 0.5mm | S-PQFP-G144 | 不合格 | 1.98V | 3.3/5V | 1.72V | External | 50MHz | 24K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 384KB 384K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | 100mA | 16 | YES | YES | YES | 23 | 4K x 8 | CPU12 | AEC-Q100 | 16 | 20mm | 20mm | ROHS3 Compliant | |||||||||||||||||||
| S9S12GN16F1MLC | NXP USA Inc. | 数据表 | 3228 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 32-LQFP | YES | 16384 | A/D 8x10b | Automotive grade | 26 | -40°C~125°C TA | Tray | 2008 | HCS12 | 活跃 | 3 (168 Hours) | 32 | 8542.31.00.01 | QUAD | 鸥翼 | 0.8mm | S9S12GN16 | S-PQFP-G32 | 不合格 | 3.3/5V | Internal | 25MHz | 1K x 8 | 3.13V~5.5V | 12V1 | LVD, POR, PWM, WDT | FLASH | 16-Bit | 16KB 16K x 8 | IrDA, LINbus, SCI, SPI | 16mA | 16 | 512 x 8 | CPU12 | AEC-Q100 | ROHS3 Compliant | ||||||||||||||||||||||||||||||
| S9S08RN48W1MLCR | NXP USA Inc. | 数据表 | 1750 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 16 Weeks | 表面贴装 | 32-LQFP | A/D 16x12b | 26 | -40°C~125°C TA | Tape & Reel (TR) | 2012 | S08 | 活跃 | 3 (168 Hours) | 260 | 40 | Internal | 20MHz | 4K x 8 | 2.7V~5.5V | MICROPROCESSOR | LVD, POR, PWM, WDT | FLASH | 8-Bit | 48KB 48K x 8 | I2C, LINbus, SPI, UART/USART | 256 x 8 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||
| SPC5645SF1VLT | NXP USA Inc. | 数据表 | 7850 In Stock | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | 表面贴装 | 208-LQFP | YES | 150 | 2097152 | Automotive grade | A/D 20x10b | -40°C~105°C TA | Tray | 2006 | MPC56xxS Qorivva | e3 | 活跃 | 3 (168 Hours) | 208 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 0.5mm | 40 | SPC5645 | S-PQFP-G208 | 不合格 | 3.3/5V | Internal | 125MHz | 1.064M x 8 | 3V~5.5V | MICROCONTROLLER | e200z4d | DMA, POR, PWM, WDT | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, I2C, LINbus, SCI, SPI | 375mA | 32 | AEC-Q100 | ROHS3 Compliant | ||||||||||||||||||||||||||
 | SPC5777CK3MMO3 | NXP USA Inc. | 数据表 | 10400 In Stock | - | 最小起订量: 1 最小包装量: 1 | 16 Weeks | 表面贴装 | 516-BGA | YES | 8388608 | A/D 16b Sigma-Delta, eQADC | 524288 | -40°C~125°C TA | Tray | 2016 | MPC57xx | 活跃 | 3 (168 Hours) | 516 | 5A992 | ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SD ADC AVAILABLE. | 8542.31.00.01 | BOTTOM | BALL | 未说明 | 1mm | 未说明 | S-PBGA-B516 | 1.32V | 1.2V | Internal | 264MHz | 512K x 8 | 3V~5.5V | MICROCONTROLLER, RISC | e200z7 | DMA, LVD, POR, Zipwire | 40MHz | FLASH | 32-Bit Tri-Core | 8MB 8M x 8 | CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI | 32 | YES | YES | YES | NO | 8 | 2.02mm | 27mm | 27mm | ROHS3 Compliant | ||||||||||||||||||||||
 | MCF5212LCVM66 | NXP USA Inc. | 数据表 | 2400 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 81-LBGA | YES | 56 | A/D 8x12b | -40°C~85°C TA | Tray | 2002 | MCF521x | e1 | 不用于新设计 | 3 (168 Hours) | 81 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 40 | MCF5212 | S-PBGA-B81 | 不合格 | 3.6V | 3V | Internal | 66MHz | 32K x 8 | 3V~3.6V | MICROCONTROLLER, RISC | Coldfire V2 | DMA, LVD, POR, PWM, WDT | 48MHz | FLASH | 32-Bit | 256KB 256K x 8 | I2C, SPI, UART/USART | 32 | YES | YES | YES | NO | 1.6mm | 10mm | 10mm | ROHS3 Compliant | ||||||||||||||||||||
| MC56F8122VFAE | NXP USA Inc. | 数据表 | 6 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 48-LQFP | YES | 21 | A/D 6x12b | -40°C~105°C TA | Tray | 1998 | 56F8xxx | e3 | 不用于新设计 | 3 (168 Hours) | 48 | 3A991.A.2 | Matte Tin (Sn) | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 2.5V | 0.5mm | 40 | MC56F8122 | S-PQFP-G48 | 不合格 | 2.75V | 2.25V | Internal | 40MHz | 4K x 16 | 2.25V~3.6V | DIGITAL SIGNAL PROCESSOR, OTHER | 56800E | POR, WDT | 80MHz | FLASH | 16-Bit | 32KB 16K x 16 | SCI, SPI | YES | YES | 固定点 | YES | MULTIPLE | 1.6mm | 7mm | 7mm | ROHS3 Compliant | |||||||||||||||||||
 | MC9S12XD64MAA | NXP USA Inc. | 数据表 | 1500 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 24 Weeks | 表面贴装 | 80-QFP | YES | 65536 | A/D 8x10b | 59 | -40°C~125°C TA | Tray | 1996 | HCS12X | e3 | 不用于新设计 | 3 (168 Hours) | 80 | 3A991.A.2 | Matte Tin (Sn) | ALSO REQUIRES 5V SUPPLY | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 2.5V | 0.65mm | 40 | MC9S12XD64 | S-PQFP-G80 | 不合格 | 2.75V | 2.55V | 2.35V | External | 80MHz | 4K x 8 | 2.35V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 64KB 64K x 8 | CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI | 16 | YES | YES | YES | NO | 1K x 8 | CPU12 | 2.45mm | 14mm | 14mm | ROHS3 Compliant | ||||||||||||||||
| S912XEG128J2MAA | NXP USA Inc. | 数据表 | 222 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 16 Weeks | 表面贴装 | 80-QFP | YES | 131072 | A/D 8x12b | 59 | -40°C~125°C TA | Tray | 1996 | HCS12X | e3 | 活跃 | 3 (168 Hours) | 80 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 0.635mm | 40 | S912XEG128 | S-PQFP-G80 | 不合格 | 3.3/5V | External | 50MHz | 12K x 8 | 1.72V~5.5V | LVD, POR, PWM, WDT | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | 16 | 2K x 8 | CPU12 | ROHS3 Compliant | |||||||||||||||||||||||||||||
| MKL24Z64VFM4 | NXP USA Inc. | 数据表 | 10006 In Stock | - | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 32-VFQFN Exposed Pad | YES | 65536 | A/D 7x12b | 23 | -40°C~105°C TA | Tray | 2012 | Kinetis KL2 | 活跃 | 3 (168 Hours) | 32 | 3A991.A.2 | 8542.31.00.01 | QUAD | 无铅 | 260 | 1V | 0.5mm | 40 | MKL24Z64 | S-PQCC-N32 | 不合格 | 1.1V | 1.8/3.3V | 0.9V | Internal | 48MHz | 8K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 16MHz | FLASH | 32-Bit | 64KB 64K x 8 | I2C, LINbus, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | CORTEX-M0 | 5mm | 5mm | ROHS3 Compliant |
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