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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 安装类型 | 包装/外壳 | 表面安装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 电源电压 | 端子间距 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 振荡器类型 | 速度 | 内存大小 | 电压 - 供电 (Vcc/Vdd) | uPs/uCs/外围ICs类型 | 核心处理器 | 周边设备 | 时钟频率 | 程序存储器类型 | 芯尺寸 | 程序内存大小 | 连接方式 | 电源电流-最大值 | 位元大小 | 有ADC | DMA 通道 | 脉宽调制通道 | 数模转换器通道 | 地址总线宽度 | EEPROM 大小 | 片上程序 ROM 宽度 | 处理器系列 | 边界扫描 | 低功率模式 | 筛选水平 | 外部数据总线宽度 | 格式 | 集成缓存 | 内存(字) | 串行I/O数 | 定时器数量 | 外部中断数量 | 片上数据 RAM 宽度 | DMA通道数 | 座位高度(最大) | 长度 | 宽度 | RoHS状态 | |||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | MC56F84553VLH | NXP USA Inc. | 数据表 | 160 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 64-LQFP | YES | 98304 | A/D 16x12b, 8x16b; D/A 1x12b | 54 | -40°C~105°C TA | Tray | 2002 | 56F8xxx | e3 | 活跃 | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | MC56F845 | S-PQFP-G64 | 不合格 | 3.6V | 3/3.3V | 2.7V | Internal | 80MHz | 16K x 8 | 3V~3.6V | MICROCONTROLLER | 56800EX | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 16MHz | FLASH | 32-Bit | 96KB 96K x 8 | CANbus, I2C, LINbus, SCI, SPI | 32 | YES | YES | YES | YES | 2K x 8 | 10mm | 10mm | ROHS3 Compliant | ||||||||||||||||||||||||
 | MC9S08QG8CDNE | NXP USA Inc. | 数据表 | 2 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | A/D 4x10b | 8192 | 4 | -40°C~85°C TA | Tube | 2003 | S08 | e3 | 活跃 | 3 (168 Hours) | 8 | 3A991.A.2 | Matte Tin (Sn) | DUAL | 鸥翼 | 260 | 3V | 1.27mm | 40 | MC9S08QG8 | R-PDSO-G8 | 不合格 | 3.6V | 1.8/3.6V | 1.8V | Internal | 20MHz | 512 x 8 | 1.8V~3.6V | MICROCONTROLLER | LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 8KB 8K x 8 | I2C, SCI, SPI | 8 | YES | NO | YES | NO | 1.75mm | 3.9mm | ROHS3 Compliant | ||||||||||||||||||||||||||
 | LPC2468FET208,551 | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 208-TFBGA | YES | 32768 | A/D 8x10b; D/A 1x10b | 160 | -40°C~85°C TA | Tray | 2009 | LPC2400 | e1 | 不用于新设计 | 2 (1 Year) | 208 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.8mm | 未说明 | LPC2468 | 208 | S-PBGA-B208 | 不合格 | 3.6V | 3.3V | 3V | Internal | 72MHz | 98K x 8 | 3V~3.6V | MICROCONTROLLER, RISC | ARM7® | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | 25MHz | FLASH | 16/32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG | 32 | YES | YES | YES | YES | 24 | 128 | YES | YES | 32 | 固定点 | NO | 16384 | 4 | 4 | 4 | 32 | 1 | 1.2mm | 15mm | 15mm | ROHS3 Compliant | |||||||||
 | S9S12ZVL16F0VLC | NXP USA Inc. | 数据表 | 139 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 32-LQFP | YES | A/D 6x10b | 19 | 1024 | 16384 | Automotive grade | -40°C~105°C TA | Tray | 2013 | S12 MagniV | 活跃 | 3 (168 Hours) | 32 | 8542.31.00.01 | QUAD | 鸥翼 | 12V | 0.8mm | S-PQFP-G32 | 不合格 | 18V | 5.5/18V | 5.5V | Internal | 32MHz | 1K x 8 | 5.5V~18V | MICROCONTROLLER | S12Z | LVD, POR, PWM, WDT | 20MHz | FLASH | 16-Bit | 16KB 16K x 8 | I2C, IrDA, LINbus, SCI, SPI, UART/USART | 26mA | 16 | YES | NO | YES | 128 x 8 | CPU12 | AEC-Q100 | 7mm | 7mm | ROHS3 Compliant | |||||||||||||||||||||||||
 | MK51DN256CMD10 | NXP USA Inc. | 数据表 | 160 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 144-LBGA | YES | 262144 | A/D 41x16b; D/A 2x12b | 94 | -40°C~85°C TA | Tray | 2012 | Kinetis K50 | e1 | 活跃 | 3 (168 Hours) | 144 | 3A991.A.2 | 锡银铜 | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 40 | MK51DN256 | S-PBGA-B144 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 100MHz | 64K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LCD, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 256KB 256K x 8 | EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | CORTEX-M4 | 1.7mm | 13mm | 13mm | ROHS3 Compliant | ||||||||||||||||||||||
 | S9S08SG16E1VTL | NXP USA Inc. | 数据表 | 1969 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 28-TSSOP (0.173, 4.40mm Width) | YES | 22 | A/D 16x10b | -40°C~105°C TA | Tube | 1999 | S08 | 活跃 | 3 (168 Hours) | 28 | 8542.31.00.01 | DUAL | 鸥翼 | 260 | 3V | 0.65mm | 未说明 | S9S08SG16 | 5.5V | 2.7V | Internal | 40MHz | 1K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 16KB 16K x 8 | I2C, LINbus, SCI, SPI | 8 | YES | NO | YES | 9.7mm | 4.4mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||
 | MC9S08QB8CWL | NXP USA Inc. | 数据表 | 10000 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 28-SOIC (0.295, 7.50mm Width) | YES | 8192 | A/D 8x12b | 22 | -40°C~85°C TA | Tray | 2006 | S08 | e3 | 活跃 | 3 (168 Hours) | 28 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | DUAL | 鸥翼 | 260 | 3V | 1.27mm | 40 | MC9S08QB8 | R-PDSO-G28 | 不合格 | 3.6V | 1.8/3.6V | 1.8V | External | 20MHz | 512 x 8 | 1.8V~3.6V | MICROCONTROLLER | LVD, PWM, WDT | 16MHz | FLASH | 8-Bit | 8KB 8K x 8 | LINbus, SCI | 8 | YES | NO | YES | NO | 2.65mm | 17.925mm | 7.5mm | ROHS3 Compliant | ||||||||||||||||||||||||
 | S912ZVML64F3MKHR | NXP USA Inc. | 数据表 | 4212 In Stock | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 64-LQFP Exposed Pad | A/D 9x12b | 31 | -40°C~125°C TA | Tape & Reel (TR) | S12 MagniV | 活跃 | 3 (168 Hours) | Internal | 50MHz | 4K x 8 | 3.5V~40V | S12Z | DMA, POR, PWM, WDT | FLASH | 16-Bit | 64KB 64K x 8 | CANbus, LINbus, SCI, SPI | 512 x 8 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | MC9RS08KB4CWJ | NXP USA Inc. | 数据表 | 10868 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 20-SOIC (0.295, 7.50mm Width) | YES | 4096 | A/D 12x10b | 18 | -40°C~85°C TA | Tube | 2009 | RS08 | e3 | 活跃 | 3 (168 Hours) | 20 | EAR99 | Matte Tin (Sn) | 8542.31.00.01 | DUAL | 鸥翼 | 260 | 3V | 1.27mm | 40 | MC9RS08KB4 | R-PDSO-G20 | 不合格 | 5.5V | 2/5V | 1.8V | Internal | 20MHz | 126 x 8 | 1.8V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 4KB 4K x 8 | I2C, SPI | 8 | YES | NO | YES | 12.8mm | 7.5mm | ROHS3 Compliant | ||||||||||||||||||||||||||
 | LPC11U67JBD100E | NXP USA Inc. | 数据表 | 149 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 16 Weeks | 表面贴装 | 100-LQFP | A/D 12x12b | 80 | -40°C~105°C TA | Tray | 2010 | LPC11Uxx | 活跃 | 3 (168 Hours) | Internal | 50MHz | 20K x 8 | 2.4V~3.6V | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, POR, PWM, WDT | FLASH | 32-Bit | 128KB 128K x 8 | I2C, Microwire, SPI, SSI, SSP, UART/USART, USB | 4K x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
 | MK22DX256VLK5 | NXP USA Inc. | 数据表 | 15 In Stock | - | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 80-LQFP | YES | 262144 | A/D 20x16b; D/A 1x12b | 56 | -40°C~105°C TA | Tray | 2002 | Kinetis K20 | e3 | 活跃 | 3 (168 Hours) | 80 | 3A991.A.2 | 哑光锡 | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | MK22DX256 | S-PQFP-G80 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 50MHz | 32K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 256KB 256K x 8 | I2C, IrDA, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | 4K x 8 | CORTEX-M4 | 12mm | 12mm | ROHS3 Compliant | ||||||||||||||||||||||
 | S9S08AW32E5CFUE | NXP USA Inc. | 数据表 | 4800 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 64-QFP | YES | 54 | 32768 | Automotive grade | A/D 16x10b | -40°C~85°C TA | Tray | 2000 | S08 | 活跃 | 3 (168 Hours) | 64 | QUAD | 鸥翼 | 3V | 0.8mm | S9S08AW32 | S-PQFP-G64 | 不合格 | 5.5V | 3/5V | 2.7V | Internal | 40MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 32KB 32K x 8 | I2C, SCI, SPI | 8 | YES | NO | YES | AEC-Q100 | 10mm | 10mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||
| MC9S08AW60CPUER | NXP USA Inc. | 数据表 | 1393 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 64-LQFP | YES | 63280 | A/D 16x10b | 54 | -40°C~85°C TA | Tape & Reel (TR) | 2011 | S08 | e3 | 活跃 | 3 (168 Hours) | 64 | 3A991.A.2 | Matte Tin (Sn) | QUAD | 鸥翼 | 260 | 3V | 0.5mm | 40 | MC9S08AW60 | S-PQFP-G64 | 不合格 | 5.5V | 3/5V | 2.7V | Internal | 40MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 40MHz | FLASH | 8-Bit | 60KB 60K x 8 | I2C, SCI, SPI | 8 | YES | NO | YES | NO | 1.6mm | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||||||||||||
 | MK22FN512VLL12R | NXP USA Inc. | 数据表 | 20 In Stock | - | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 100-LQFP | YES | 66 | A/D 33x16b; D/A 2x12b | -40°C~105°C TA | Tape & Reel (TR) | Kinetis K20 | e3 | 活跃 | 3 (168 Hours) | 100 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | S-PQFP-G100 | 3.6V | 1.71V | Internal | 120MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 512KB 512K x 8 | I2C, IrDA, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | 14mm | 14mm | ROHS3 Compliant | |||||||||||||||||||||||||||||
 | S912XEQ384F1CAGR | NXP USA Inc. | 数据表 | 500 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 144-LQFP | YES | A/D 24x12b | 119 | 24576 | 393216 | Automotive grade | -40°C~85°C TA | Tape & Reel (TR) | 1996 | HCS12X | 活跃 | 3 (168 Hours) | 144 | 8542.31.00.01 | QUAD | 鸥翼 | 1.8V | 0.5mm | S-PQFP-G144 | 不合格 | 1.98V | 3.3/5V | 1.72V | External | 50MHz | 24K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 384KB 384K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | 100mA | 16 | YES | YES | YES | 23 | 4K x 8 | CPU12 | AEC-Q100 | 16 | 20mm | 20mm | ROHS3 Compliant | ||||||||||||||||||||||||
 | MK10DN64VFM5 | NXP USA Inc. | 数据表 | 1 In Stock | - | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 32-VFQFN Exposed Pad | YES | 65536 | A/D 10x16b | 24 | -40°C~105°C TA | Tray | 2002 | Kinetis K10 | 活跃 | 3 (168 Hours) | 32 | 3A991.A.2 | 8542.31.00.01 | QUAD | 无铅 | 260 | 3.3V | 0.5mm | 40 | MK10DN64 | S-XQCC-N32 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 50MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 64KB 64K x 8 | I2C, IrDA, SPI, UART/USART | 32 | YES | YES | YES | YES | CORTEX-M4 | 1mm | 5mm | 5mm | ROHS3 Compliant | ||||||||||||||||||||||||
 | MCF5282CVF66 | NXP USA Inc. | 数据表 | 1 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 256-LBGA | YES | 142 | A/D 8x10b | -40°C~85°C TA | Tray | 2002 | MCF528x | e0 | Obsolete | 3 (168 Hours) | 256 | 3A991.A.2 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 220 | 3.3V | 1mm | 30 | MCF5282 | S-PBGA-B256 | 不合格 | 3.6V | 2.7V | External | 66MHz | 64K x 8 | 2.7V~3.6V | MICROCONTROLLER, RISC | Coldfire V2 | DMA, LVD, POR, PWM, WDT | 66MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART | 32 | YES | YES | YES | NO | 24 | 8 | 32 | 1.6mm | 17mm | 17mm | Non-RoHS Compliant | ||||||||||||||||||||||
| S9S08SG32E1WTL | NXP USA Inc. | 数据表 | 1535 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 28-TSSOP (0.173, 4.40mm Width) | YES | 22 | A/D 16x10b | -40°C~150°C TA | Tube | 1999 | S08 | 活跃 | 3 (168 Hours) | 28 | 8542.31.00.01 | DUAL | 鸥翼 | 260 | 3V | 0.65mm | 未说明 | S9S08SG32 | 5.5V | 2.7V | Internal | 40MHz | 1K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 32KB 32K x 8 | I2C, LINbus, SCI, SPI | 8 | YES | NO | YES | 9.7mm | 4.4mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||
 | MKL03Z8VFG4R | NXP USA Inc. | 数据表 | 5402 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 16-UFQFN Exposed Pad | YES | 14 | 2048 | 8192 | A/D 7x12b | -40°C~105°C TA | Tape & Reel (TR) | 2002 | Kinetis KL03 | e3 | 活跃 | 3 (168 Hours) | 16 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 无铅 | 260 | 3.3V | 0.5mm | 40 | S-XQCC-N16 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 48MHz | 2K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, LVD, POR, PWM, WDT | 24MHz | FLASH | 32-Bit | 8KB 8K x 8 | I2C, SPI, UART/USART | 32 | YES | NO | YES | NO | CORTEX-M0 | 3mm | 3mm | ROHS3 Compliant | |||||||||||||||||||||||
| LPC1766FBD100,551 | NXP USA Inc. | 数据表 | 9688 In Stock | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 100-LQFP | YES | 262144 | A/D 8x12b; D/A 1x10b | 70 | -40°C~85°C TA | Tray | 2009 | LPC17xx | e3 | Discontinued | 3 (168 Hours) | 100 | EAR99 | Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 30 | LPC1766 | 100 | S-PQFP-G100 | 不合格 | 3.6V | 2.5/3.33/3.3V | 2.4V | Internal | 100MHz | 64K x 8 | 2.4V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M3 | Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT | 25MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG | 32 | YES | YES | YES | YES | ARM7 | 1.6mm | 14mm | 14mm | ROHS3 Compliant | |||||||||||||||||||||
| S9S12GN48F0VLH | NXP USA Inc. | 数据表 | 2400 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 64-LQFP | YES | 54 | 49152 | Automotive grade | A/D 12x10b | -40°C~105°C TA | Tray | 2008 | HCS12 | 活跃 | 3 (168 Hours) | 64 | QUAD | 鸥翼 | 0.5mm | S9S12GN48 | S-PQFP-G64 | 不合格 | 3.3/5V | Internal | 25MHz | 4K x 8 | 3.13V~5.5V | 12V1 | LVD, POR, PWM, WDT | FLASH | 16-Bit | 48KB 48K x 8 | IrDA, LINbus, SCI, SPI | 20mA | 16 | 1.5K x 8 | CPU12 | AEC-Q100 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||
 | MC9S08SH4CTJR | NXP USA Inc. | 数据表 | 10000 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 22 Weeks | 表面贴装 | 20-TSSOP (0.173, 4.40mm Width) | YES | 4096 | A/D 12x10b | 17 | -40°C~85°C TA | Tape & Reel (TR) | 2006 | S08 | e3 | 活跃 | 3 (168 Hours) | 20 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | DUAL | 鸥翼 | 260 | 3V | 0.65mm | 40 | MC9S08SH4 | R-PDSO-G20 | 不合格 | 5.5V | 3/5V | 2.7V | Internal | 40MHz | 256 x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 4KB 4K x 8 | I2C, LINbus, SCI, SPI | 8 | YES | NO | YES | NO | 1.2mm | 6.5mm | 4.4mm | ROHS3 Compliant | ||||||||||||||||||||||||
 | MKL43Z256VMP4 | NXP USA Inc. | 数据表 | 526 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 64-LFBGA | YES | 50 | A/D 16x16b; D/A 1x12b | -40°C~105°C TA | Tray | 2002 | Kinetis KL4 | e1 | 活跃 | 3 (168 Hours) | 64 | 3A991.A.2 | 锡银铜 | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 40 | S-PBGA-B64 | 3.6V | 1.71V | Internal | 48MHz | 32K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | DMA, I2S, LCD, LVD, POR, PWM, WDT | 48MHz | FLASH | 32-Bit | 256KB 256K x 8 | I2C, SPI, UART/USART, USB | YES | YES | YES | YES | ROHS3 Compliant | ||||||||||||||||||||||||||||||||
 | MC9S08GT60ACFDE | NXP USA Inc. | 数据表 | 1 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 48-VFQFN Exposed Pad | YES | A/D 8x10b | 39 | -40°C~85°C TA | Tray | 2005 | S08 | 不用于新设计 | 3 (168 Hours) | 48 | EAR99 | 8542.31.00.01 | QUAD | 无铅 | 260 | 3V | 0.5mm | 40 | MC9S08GT60 | 3.6V | 2.08V | Internal | 40MHz | 4K x 8 | 1.8V~3.6V | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 60KB 60K x 8 | I2C, SCI, SPI | 8 | YES | NO | YES | 7mm | 7mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||
 | S9S08DZ32F2MLF | NXP USA Inc. | 数据表 | 1521 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 48-LQFP | A/D 16x12b | 39 | -40°C~125°C TA | Tray | 2006 | S08 | yes | 活跃 | 3 (168 Hours) | 260 | 40 | S9S08DZ32 | External | 40MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | FLASH | 8-Bit | 32KB 32K x 8 | CANbus, I2C, LINbus, SCI, SPI | 1K x 8 | ROHS3 Compliant |
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MC56F84553VLH
NXP USA Inc.
分类:Embedded - Microcontrollers
129.187771
-
MC9S08QG8CDNE
NXP USA Inc.
分类:Embedded - Microcontrollers
-
LPC2468FET208,551
NXP USA Inc.
分类:Embedded - Microcontrollers
-
S9S12ZVL16F0VLC
NXP USA Inc.
分类:Embedded - Microcontrollers
26.034739
-
MK51DN256CMD10
NXP USA Inc.
分类:Embedded - Microcontrollers
106.049597
-
S9S08SG16E1VTL
NXP USA Inc.
分类:Embedded - Microcontrollers
41.627978
-
MC9S08QB8CWL
NXP USA Inc.
分类:Embedded - Microcontrollers
29.518392
-
S912ZVML64F3MKHR
NXP USA Inc.
分类:Embedded - Microcontrollers
-
MC9RS08KB4CWJ
NXP USA Inc.
分类:Embedded - Microcontrollers
-
LPC11U67JBD100E
NXP USA Inc.
分类:Embedded - Microcontrollers
54.568368
-
MK22DX256VLK5
NXP USA Inc.
分类:Embedded - Microcontrollers
-
S9S08AW32E5CFUE
NXP USA Inc.
分类:Embedded - Microcontrollers
36.940194
-
MC9S08AW60CPUER
NXP USA Inc.
分类:Embedded - Microcontrollers
94.631137
-
MK22FN512VLL12R
NXP USA Inc.
分类:Embedded - Microcontrollers
-
S912XEQ384F1CAGR
NXP USA Inc.
分类:Embedded - Microcontrollers
255.813031
-
MK10DN64VFM5
NXP USA Inc.
分类:Embedded - Microcontrollers
-
MCF5282CVF66
NXP USA Inc.
分类:Embedded - Microcontrollers
-
S9S08SG32E1WTL
NXP USA Inc.
分类:Embedded - Microcontrollers
50.034844
-
MKL03Z8VFG4R
NXP USA Inc.
分类:Embedded - Microcontrollers
19.222808
-
LPC1766FBD100,551
NXP USA Inc.
分类:Embedded - Microcontrollers
-
S9S12GN48F0VLH
NXP USA Inc.
分类:Embedded - Microcontrollers
22.643012
-
MC9S08SH4CTJR
NXP USA Inc.
分类:Embedded - Microcontrollers
23.892991
-
MKL43Z256VMP4
NXP USA Inc.
分类:Embedded - Microcontrollers
77.335391
-
MC9S08GT60ACFDE
NXP USA Inc.
分类:Embedded - Microcontrollers
-
S9S08DZ32F2MLF
NXP USA Inc.
分类:Embedded - Microcontrollers
59.928647