品牌是'NXP' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 安装类型 | 包装/外壳 | 表面安装 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 电源电压 | 端子间距 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 电源 | 电源电压-最小值(Vsup) | 振荡器类型 | 速度 | 内存大小 | 电压 - 供电 (Vcc/Vdd) | uPs/uCs/外围ICs类型 | 核心处理器 | 周边设备 | 时钟频率 | 程序存储器类型 | 芯尺寸 | 程序内存大小 | 连接方式 | 电源电流-最大值 | 位元大小 | 有ADC | DMA 通道 | 脉宽调制通道 | 数模转换器通道 | 地址总线宽度 | EEPROM 大小 | 片上程序 ROM 宽度 | 处理器系列 | 边界扫描 | 低功率模式 | 筛选水平 | 外部数据总线宽度 | 格式 | 集成缓存 | 座位高度(最大) | 长度 | 宽度 | RoHS状态 | |||||
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![]() | SPC5748GSK1MMJ6 | NXP USA Inc. | 数据表 | 4500 In Stock | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | 表面贴装 | 256-LBGA | YES | A/D 80x10b, 64x12b | 178 | 786432 | 6291456 | Automotive grade | -40°C~125°C TA | Bulk | MPC57xx | yes | 活跃 | 3 (168 Hours) | 256 | EEPROM SUP : 32KB-192KB EMULATED, ADC CH(INT AND EXT) BASED ON PACKAGE | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | S-PBGA-B256 | 1.32V | 1.08V | Internal | 80MHz/160MHz | 768K x 8 | 3V~5.5V | MICROCONTROLLER, RISC | e200z2, e200z4, e200z4 | DMA, LVD, POR, WDT | 40MHz | FLASH | 32-Bit Tri-Core | 6MB 6M x 8 | CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG | 32 | YES | YES | NO | NO | 8 | ISO 26262 | 1.7mm | 17mm | 17mm | ROHS3 Compliant | ||||||||||||||||||||
![]() | MCF5253CVM140 | NXP USA Inc. | 数据表 | 2400 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 225-LFBGA | YES | A/D 6x12b | -40°C~85°C TA | Tray | 2006 | MCF525x | e1 | 不用于新设计 | 3 (168 Hours) | 225 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 0.8mm | 40 | MCF5253 | S-PBGA-B225 | 1.32V | 1.08V | External | 140MHz | 128K x 8 | 1.08V~1.32V | Coldfire V2 | DMA, WDT | 35MHz | ROMless | 32-Bit | CANbus, EBI/EMI, I2C, QSPI, UART/USART, USB OTG | 16 | YES | NO | 16 | 固定点 | NO | 2.85mm | 13mm | 13mm | ROHS3 Compliant | |||||||||||||||||||||||
![]() | S9S08SG32E1WTG | NXP USA Inc. | 数据表 | 23 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 16-TSSOP (0.173, 4.40mm Width) | YES | 12 | A/D 8x10b | -40°C~150°C TA | Tube | 1999 | S08 | 活跃 | 3 (168 Hours) | 16 | 8542.31.00.01 | DUAL | 鸥翼 | 260 | 3V | 0.65mm | 未说明 | S9S08SG32 | 5.5V | 2.7V | Internal | 40MHz | 1K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 32KB 32K x 8 | I2C, LINbus, SCI, SPI | 8 | YES | NO | YES | 5mm | 4.4mm | ROHS3 Compliant | ||||||||||||||||||||||||||||
![]() | S9S12P96J0MFT | NXP USA Inc. | 数据表 | 6000 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 16 Weeks | 表面贴装 | 48-TFQFN Exposed Pad | YES | 34 | 98304 | Automotive grade | A/D 10x12b | -40°C~125°C TA | Tray | 2006 | HCS12 | 活跃 | 3 (168 Hours) | 48 | 8542.31.00.01 | QUAD | 无铅 | 0.5mm | 9S12P96 | S-PQCC-N48 | 不合格 | 1.83.3/5V | Internal | 32MHz | 6K x 8 | 1.72V~5.5V | LVD, POR, PWM, WDT | FLASH | 16-Bit | 96KB 96K x 8 | CANbus, SCI, SPI | 16 | 4K x 8 | CPU12 | AEC-Q100 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||
![]() | MC9S08DZ48AMLH | NXP USA Inc. | 数据表 | 11222 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | 64-LQFP | YES | 53 | A/D 24x12b | -40°C~125°C TA | Tray | 2008 | S08 | yes | 活跃 | 3 (168 Hours) | 64 | QUAD | 鸥翼 | 3V | 0.5mm | MC9S08DZ48 | S-PQFP-G64 | 5.5V | 2.7V | External | 40MHz | 3K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 48KB 48K x 8 | CANbus, I2C, LINbus, SCI, SPI | 8 | YES | NO | YES | NO | 1.5K x 8 | 8 | 1.6mm | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||||||||||||
![]() | MC9S12XD256CAA | NXP USA Inc. | 数据表 | 450 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 80-QFP | YES | A/D 8x10b | 59 | 262144 | -40°C~85°C TA | Tray | 2001 | HCS12X | e3 | 活跃 | 3 (168 Hours) | 80 | 3A991.A.2 | Matte Tin (Sn) | IT ALSO REQUIRES 5 V SUPPLY | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 2.5V | 0.65mm | 40 | 9S12XD256 | S-PQFP-G80 | 不合格 | 2.75V | 2.55V | 2.35V | External | 80MHz | 14K x 8 | 2.35V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 80MHz | FLASH | 16-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI | 16 | YES | YES | YES | NO | 4K x 8 | CPU12 | 2.45mm | 14mm | 14mm | ROHS3 Compliant | ||||||||||||||||
![]() | MC9RS08LA8CFT | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 48-VFQFN Exposed Pad | YES | 8192 | A/D 6x10b | 31 | -40°C~85°C TA | Tray | 2006 | RS08 | 活跃 | 3 (168 Hours) | 48 | EAR99 | QUAD | 无铅 | 260 | 3.3V | 0.5mm | 40 | MC9RS08LA8 | S-PQCC-N48 | 不合格 | 5.5V | 3/5V | 2.7V | Internal | 20MHz | 256 x 8 | 2.7V~5.5V | MICROCONTROLLER | LCD, LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 8KB 8K x 8 | SCI, SPI | 8 | YES | NO | YES | 7mm | 7mm | ROHS3 Compliant | ||||||||||||||||||||||||
![]() | MK10DN512VLK10R | NXP USA Inc. | 数据表 | 2000 In Stock | - | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 80-LQFP | YES | 56 | A/D 31x16b; D/A 1x12b | -40°C~105°C TA | Tape & Reel (TR) | 2002 | Kinetis K10 | e3 | 活跃 | 3 (168 Hours) | 80 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | S-PQFP-G80 | 3.6V | 1.71V | Internal | 100MHz | 128K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART | 32 | YES | YES | YES | YES | 1.6mm | 12mm | 12mm | ROHS3 Compliant | ||||||||||||||||||||||
![]() | MCF53281CVM240 | NXP USA Inc. | 数据表 | 10000 In Stock | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 256-LBGA | YES | 94 | -40°C~85°C TA | Tray | 2006 | MCF532x | e1 | 不用于新设计 | 3 (168 Hours) | 256 | 5A992 | 锡银铜 | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.5V | 1mm | 40 | MCF53281 | S-PBGA-B256 | 不合格 | 1.6V | 1.4V | External | 240MHz | 32K x 8 | 1.4V~3.6V | MICROPROCESSOR, RISC | Coldfire V3 | DMA, LCD, PWM, WDT | 80MHz | ROMless | 32-Bit | CANbus, EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG | 32 | 24 | YES | YES | 32 | 固定点 | YES | 1.6mm | 17mm | 17mm | ROHS3 Compliant | ||||||||||||||||||||
![]() | S9S08QD4J1VSC | NXP USA Inc. | 数据表 | 60 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 16 Weeks | 表面贴装 | 8-SOIC (0.154, 3.90mm Width) | YES | 4 | 256 | Automotive grade | A/D 4x10b | -40°C~105°C TA | Tube | 2004 | S08 | e3 | 活跃 | 3 (168 Hours) | 8 | EAR99 | 哑光锡 | DUAL | 鸥翼 | 260 | 3V | 1.27mm | 40 | R-PDSO-G8 | 不合格 | 5.5V | 3/5V | 2.7V | Internal | 16MHz | 256 x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 5MHz | FLASH | 8-Bit | 4KB 4K x 8 | 8 | YES | NO | YES | NO | AEC-Q100 | 1.75mm | 3.9mm | ROHS3 Compliant | |||||||||||||||||||||
![]() | LPC1776FET180,551 | NXP USA Inc. | 数据表 | 49 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 180-TFBGA | YES | 262144 | A/D 8x12b; D/A 1x10b | 141 | -40°C~85°C TA | Tray | 2010 | LPC17xx | e1 | 活跃 | 3 (168 Hours) | 180 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.8mm | 未说明 | LPC1776 | 180 | S-PBGA-B180 | 不合格 | 3.6V | 3.3V | 2.4V | Internal | 120MHz | 80K x 8 | 2.4V~3.6V | ARM® Cortex®-M3 | Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT | 25MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG | 32 | YES | YES | YES | YES | 20 | 4K x 8 | CORTEX-M3 | 16 | 1.2mm | 12mm | 12mm | ROHS3 Compliant | ||||||||||||||
![]() | LPC1758FBD80Y | NXP USA Inc. | 数据表 | 1130 In Stock | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 80-LQFP | YES | 52 | A/D 6x12b; D/A 1x10b | -40°C~85°C TA | Tape & Reel (TR) | 2009 | LPC17xx | 活跃 | 2 (1 Year) | 80 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 未说明 | LPC1758 | 80 | S-PQFP-G80 | 不合格 | 3.6V | 3.3V | 2.4V | Internal | 100MHz | 64K x 8 | 2.4V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M3 | Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT | 25MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG | 32 | YES | YES | YES | YES | CORTEX-M3 | 1.6mm | 12mm | 12mm | ROHS3 Compliant | |||||||||||||||||||||
![]() | S9S12XS256J0MAAR | NXP USA Inc. | 数据表 | 4250 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 16 Weeks | 表面贴装 | 80-QFP | YES | 59 | 262144 | Automotive grade | A/D 8x12b | -40°C~125°C TA | Tape & Reel (TR) | 2002 | HCS12X | 活跃 | 3 (168 Hours) | 80 | 8542.31.00.01 | QUAD | 鸥翼 | 1.8V | 0.65mm | S9S12XS256 | S-PQFP-G80 | 不合格 | 1.98V | 1.83.3/5V | 1.72V | External | 40MHz | 12K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 256KB 256K x 8 | CANbus, SCI, SPI | 35mA | 16 | YES | YES | YES | CPU12 | AEC-Q100 | 14mm | 14mm | ROHS3 Compliant | ||||||||||||||||||||||
MC9S12GC96CFAE | NXP USA Inc. | 数据表 | 384 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 48-LQFP | YES | 31 | A/D 8x10b | -40°C~85°C TA | Tray | 2010 | HCS12 | e3 | 活跃 | 3 (168 Hours) | 48 | EAR99 | Matte Tin (Sn) | ALSO REQUIRES 5V SUPPLY | QUAD | 鸥翼 | 260 | 2.5V | 0.5mm | 40 | MC9S12GC96 | S-PQFP-G48 | 不合格 | 2.75V | 2.35V | Internal | 25MHz | 4K x 8 | 2.35V~5.5V | MICROCONTROLLER | POR, PWM, WDT | 50MHz | FLASH | 16-Bit | 96KB 96K x 8 | EBI/EMI, SCI, SPI | 16 | YES | NO | YES | NO | 1.6mm | 7mm | 7mm | ROHS3 Compliant | ||||||||||||||||||||||
![]() | MC9S12XDT512MAA | NXP USA Inc. | 数据表 | 90 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 80-QFP | YES | 524288 | A/D 8x10b | 59 | -40°C~125°C TA | Tray | 1996 | HCS12X | e3 | 活跃 | 3 (168 Hours) | 80 | 3A991.A.2 | Matte Tin (Sn) | IT ALSO REQUIRES 5 V SUPPLY | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 2.5V | 0.65mm | 40 | 9S12XDT512 | S-PQFP-G80 | 不合格 | 2.75V | 2.55V | 2.35V | External | 80MHz | 20K x 8 | 2.35V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 80MHz | FLASH | 16-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI | 16 | YES | YES | YES | NO | 4K x 8 | CPU12 | 2.45mm | 14mm | 14mm | ROHS3 Compliant | ||||||||||||||||
![]() | MK30DX256VMC7 | NXP USA Inc. | 数据表 | 637 In Stock | - | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 121-LFBGA | YES | 262144 | A/D 38x16b; D/A 1x12b | 74 | -40°C~105°C TA | Tray | 2002 | Kinetis K30 | e1 | 活跃 | 3 (168 Hours) | 121 | 3A991.A.2 | 锡银铜 | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 0.65mm | 40 | MK30DX256 | S-PBGA-B121 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 72MHz | 64K x 8 | 1.71V~3.6V | MICROCONTROLLER | ARM® Cortex®-M4 | DMA, I2S, LCD, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, I2C, IrDA, SPI, UART/USART | 32 | YES | YES | YES | YES | 2K x 8 | CORTEX-M4 | 8mm | 8mm | ROHS3 Compliant | |||||||||||||||||
![]() | MC9S12E128MFUE | NXP USA Inc. | 数据表 | 138 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 80-QFP | YES | 60 | A/D 16x10b; D/A 2x8b | -40°C~125°C TA | Tray | 2005 | HCS12 | e3 | 活跃 | 3 (168 Hours) | 80 | EAR99 | 哑光锡 | ALSO REQUIRES 3.3V OR 5V SUPPLY | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 2.5V | 0.65mm | 40 | MC9S12E128 | S-PQFP-G80 | 不合格 | 2.75V | 2.35V | Internal | 25MHz | 8K x 8 | 2.35V~2.75V | MICROCONTROLLER | POR, PWM, WDT | 50MHz | FLASH | 16-Bit | 128KB 128K x 8 | EBI/EMI, I2C, SCI, SPI | 16 | YES | NO | YES | YES | 2.45mm | 14mm | 14mm | ROHS3 Compliant | ||||||||||||||||||||
![]() | SPC5676RDK3MVU1 | NXP USA Inc. | 数据表 | 2781 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 14 Weeks | 表面贴装 | 416-BBGA | YES | A/D 64x12b | 182 | 393216 | 6291456 | Automotive grade | -40°C~125°C TA | Tray | 2007 | MPC56xx Qorivva | 活跃 | 3 (168 Hours) | 416 | 8542.31.00.01 | BOTTOM | BALL | 1.2V | 1mm | S-PBGA-B416 | 不合格 | 1.32V | 1.23.35V | 1.14V | Internal | 180MHz | 384K x 8 | 1.14V~1.32V | 单片机RISC | e200z7 | DMA, POR, PWM | 40MHz | FLASH | 32-Bit Dual-Core | 6MB 6M x 8 | CANbus, EBI/EMI, SCI, SPI | 32 | YES | YES | YES | 32 | AEC-Q100 | 32 | 27mm | 27mm | ROHS3 Compliant | |||||||||||||||||||||
MC9S12C64VFAE | NXP USA Inc. | 数据表 | 1250 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 48-LQFP | YES | 65536 | A/D 8x10b | 31 | -40°C~105°C TA | Tray | 2005 | HCS12 | e3 | 活跃 | 3 (168 Hours) | 48 | EAR99 | Matte Tin (Sn) | ALSO REQUIRES 5V SUPPLY | QUAD | 鸥翼 | 260 | 2.5V | 0.5mm | 40 | MC9S12C64 | S-PQFP-G48 | 不合格 | 2.75V | 2.53.3/5V | 2.35V | Internal | 25MHz | 4K x 8 | 2.35V~5.5V | MICROCONTROLLER | POR, PWM, WDT | 50MHz | FLASH | 16-Bit | 64KB 64K x 8 | CANbus, EBI/EMI, SCI, SPI | 16 | YES | NO | YES | NO | 16 | CPU12 | 16 | 1.6mm | 7mm | 7mm | ROHS3 Compliant | |||||||||||||||||
![]() | MK10DN128VFT5 | NXP USA Inc. | 数据表 | 1500 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 48-VFQFN Exposed Pad | YES | 131072 | A/D 16x16b | 33 | -40°C~105°C TA | Tray | 2002 | Kinetis K10 | 活跃 | 3 (168 Hours) | 48 | 3A991.A.2 | 8542.31.00.01 | QUAD | 无铅 | 260 | 3.3V | 0.5mm | 40 | MK10DN128 | S-XQCC-N48 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 50MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M4 | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | FLASH | 32-Bit | 128KB 128K x 8 | I2C, IrDA, SPI, UART/USART | 32 | YES | YES | YES | YES | CORTEX-M4 | 1mm | 7mm | 7mm | ROHS3 Compliant | |||||||||||||||||||
![]() | SPC5644CK0VLU1 | NXP USA Inc. | 数据表 | 155 In Stock | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | 表面贴装 | 176-LQFP | A/D 27x10b, 5x12b | 147 | -40°C~105°C TA | Tray | MPC56xx Qorivva | 活跃 | 3 (168 Hours) | SPC5644 | Internal | 80MHz/120MHz | 192K x 8 | 3V~5.5V | e200z4d, e200z0h | DMA, POR, PWM, WDT | FLASH | 32-Bit Dual-Core | 1.5MB 1.5M x 8 | CANbus, Ethernet, I2C, LINbus, SCI, SPI | 64K x 8 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | MC9S08SE8VWL | NXP USA Inc. | 数据表 | 9 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 28-SOIC (0.295, 7.50mm Width) | YES | 8192 | A/D 10x10b | 24 | -40°C~105°C TA | Tube | 2006 | S08 | e3 | 活跃 | 3 (168 Hours) | 28 | EAR99 | 哑光锡 | 8542.31.00.01 | DUAL | 鸥翼 | 260 | 3V | 1.27mm | 40 | MC9S08SE8 | R-PDSO-G28 | 不合格 | 5.5V | 3/5V | 2.7V | Internal | 20MHz | 512 x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM | 16MHz | FLASH | 8-Bit | 8KB 8K x 8 | LINbus, SCI | 8 | YES | NO | YES | NO | 2.65mm | 17.925mm | 7.5mm | ROHS3 Compliant | |||||||||||||||||||
![]() | S912XEQ512J3MAAR | NXP USA Inc. | 数据表 | 12300 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 16 Weeks | 表面贴装 | 80-QFP | YES | 32768 | 59 | A/D 8x12b | 524288 | -40°C~125°C TA | Tape & Reel (TR) | 2012 | HCS12X | e3 | 活跃 | 3 (168 Hours) | 80 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 1.8V | 0.65mm | 40 | S-PQFP-G80 | 不合格 | 1.98V | 3.3/5V | 1.72V | External | 50MHz | 32K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | 16 | YES | YES | YES | 4K x 8 | CPU12 | 14mm | 14mm | ROHS3 Compliant | |||||||||||||||||||
![]() | LPC1778FBD208,551 | NXP USA Inc. | 数据表 | 20 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 208-LQFP | YES | 524288 | A/D 8x12b; D/A 1x10b | 165 | -40°C~85°C TA | Tray | 2007 | LPC17xx | e3 | Discontinued | 2 (1 Year) | 208 | EAR99 | Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 未说明 | LPC1778 | 208 | S-PQFP-G208 | 不合格 | 3.6V | 3.3V | 2.4V | Internal | 120MHz | 96K x 8 | 2.4V~3.6V | ARM® Cortex®-M3 | Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT | 25MHz | FLASH | 32-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG | 32 | YES | YES | YES | YES | 26 | 4K x 8 | CORTEX-M3 | 32 | 1.6mm | 28mm | 28mm | ROHS3 Compliant | ||||||||||||||
![]() | SPC5642AF2MVZ3 | NXP USA Inc. | 数据表 | 10 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 324-BBGA | YES | A/D 40x12b | 151 | 131072 | 2097152 | Automotive grade | -40°C~125°C TA | Tray | 2004 | MPC56xx Qorivva | e2 | 活跃 | 3 (168 Hours) | 324 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.2V | 1mm | 40 | S-PBGA-B324 | 不合格 | 1.32V | 1.2V | 1.14V | Internal | 80MHz | 128K x 8 | 1.14V~5.25V | MICROCONTROLLER, RISC | e200z4 | DMA, POR, PWM, WDT | 40MHz | FLASH | 32-Bit | 2MB 2M x 8 | CANbus, EBI/EMI, LINbus, SCI, SPI | 300mA | 32 | YES | YES | YES | AEC-Q100 | 23mm | 23mm | ROHS3 Compliant |
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