品牌是'NXP' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 安装类型 | 包装/外壳 | 表面安装 | 终端数量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 技术 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 电源电压 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 振荡器类型 | 速度 | 内存大小 | 电压 - 供电 (Vcc/Vdd) | uPs/uCs/外围ICs类型 | 核心处理器 | 周边设备 | 时钟频率 | 程序存储器类型 | 芯尺寸 | 程序内存大小 | 连接方式 | 电源电流-最大值 | 位元大小 | 有ADC | DMA 通道 | 脉宽调制通道 | 数模转换器通道 | 座位高度-最大 | 地址总线宽度 | 核心架构 | EEPROM 大小 | 片上程序 ROM 宽度 | 处理器系列 | 边界扫描 | 低功率模式 | 筛选水平 | 外部数据总线宽度 | 格式 | 集成缓存 | 以太网 | USB | 只读存储器可编程性 | 片上数据 RAM 宽度 | SPI,SPI | CAN | 脉宽调制 | ADC Channels | 设备核心 | 座位高度(最大) | 长度 | 宽度 | RoHS状态 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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![]() | S9S12DG12F1VPVER | NXP USA Inc. | 数据表 | 21 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 112-LQFP | A/D 16x10b | 91 | -40°C~105°C TA | Tape & Reel (TR) | 1996 | HCS12 | 不用于新设计 | 3 (168 Hours) | S9S12DG12 | Internal | 25MHz | 8K x 8 | 2.35V~5.25V | PWM, WDT | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, I2C, SCI, SPI | 2K x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S9S12P128J0VFT | NXP USA Inc. | 数据表 | 10 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 48-TFQFN Exposed Pad | YES | A/D 10x12b | 34 | 131072 | Automotive grade | -40°C~105°C TA | Tray | 2004 | HCS12 | e3 | 活跃 | 3 (168 Hours) | 48 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 无铅 | 260 | 5V | 0.5mm | 40 | S9S12P128 | S-XQCC-N48 | 不合格 | 5.5V | 1.83.3/5V | 3.13V | Internal | 32MHz | 6K x 8 | 1.72V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, SCI, SPI | 16 | YES | NO | YES | YES | 4K x 8 | CPU12 | AEC-Q100 | 16 | 1.05mm | 7mm | 7mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SPC5602PEF0MLH6R | NXP USA Inc. | 数据表 | 6 In Stock | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 64-LQFP | YES | A/D 16x10b | 45 | 262144 | Automotive grade | -40°C~125°C TA | Tape & Reel (TR) | 2007 | MPC56xx Qorivva | 活跃 | 3 (168 Hours) | 64 | 8542.31.00.01 | QUAD | 鸥翼 | 5V | 0.5mm | SPC5602 | S-PQFP-G64 | 不合格 | 5.5V | 3.3/5V | 4.5V | Internal | 64MHz | 20K x 8 | 3V~5.5V | 单片机RISC | e200z0h | DMA, POR, PWM, WDT | 40MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, LINbus, SCI, SPI | 65mA | 32 | YES | YES | YES | 4K x 16 | AEC-Q100 | 10mm | 10mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SPC5601DF1MLL4 | NXP USA Inc. | 数据表 | 288 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 100-LQFP | YES | A/D 33x12b | 79 | 131072 | Automotive grade | -40°C~125°C TA | Tray | 2006 | MPC56xx Qorivva | e3 | 活跃 | 3 (168 Hours) | 100 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | SPC5601 | S-PQFP-G100 | 不合格 | 3.6V | 3.3/5V | 3V | Internal | 48MHz | 12K x 8 | 3V~5.5V | MICROCONTROLLER | e200z0h | DMA, POR, PWM, WDT | 16MHz | FLASH | 32-Bit | 128KB 128K x 8 | CANbus, LINbus, SCI, SPI | 130mA | 32 | YES | YES | YES | NO | 4K x 16 | AEC-Q100 | 1.7mm | 14mm | 14mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S912ZVC19F0VKH | NXP USA Inc. | 数据表 | 30 In Stock | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 64-LQFP Exposed Pad | A/D 16x10b; D/A 1x8b | 42 | -40°C~105°C TA | Tray | S12 MagniV | 活跃 | 3 (168 Hours) | Internal | 32MHz | 12K x 8 | 3.5V~40V | S12Z | DMA, POR, PWM, WDT | FLASH | 16-Bit | 192KB 192K x 8 | CANbus, I2C, SCI, SPI | 2K x 8 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
MCF51JF64VLF | NXP USA Inc. | 数据表 | 48 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 48-LQFP | YES | A/D 11x12b; D/A 1x12b | 35 | 65536 | -40°C~105°C TA | Tray | 2004 | MCF51Jx | e3 | 活跃 | 3 (168 Hours) | 48 | 5A992 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 1V | 0.5mm | 40 | MCF51JF64 | S-PQFP-G48 | 不合格 | 1.1V | 1.8/3.3V | 0.9V | External | 50MHz | 16K x 8 | 1.71V~3.6V | MICROCONTROLLER | Coldfire V1 | DMA, I2S, LVD, POR, PWM, WDT | 32MHz | FLASH | 32-Bit | 64KB 64K x 8 | EBI/EMI, I2C, SPI, UART/USART, USB OTG | 32 | YES | YES | YES | YES | 1.6mm | 7mm | 7mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S9S12GN32BMLC | NXP USA Inc. | 数据表 | 3200 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 32-LQFP | A/D 8x10b | 26 | -40°C~125°C TA | Tray | HCS12 | 活跃 | 3 (168 Hours) | Internal | 25MHz | 2K x 8 | 3.13V~5.5V | 12V1 | LVD, POR, PWM, WDT | FLASH | 16-Bit | 32KB 32K x 8 | IrDA, LINbus, SCI, SPI | 1K x 8 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S912XEQ512F1MAL | NXP USA Inc. | 数据表 | 10000 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 112-LQFP | YES | A/D 16x12b | 91 | 32768 | 524288 | Automotive grade | -40°C~125°C TA | Tray | 2012 | HCS12X | 活跃 | 3 (168 Hours) | 112 | 8542.31.00.01 | QUAD | 鸥翼 | 1.8V | 0.65mm | S-PQFP-G112 | 不合格 | 1.98V | 3.3/5V | 1.72V | External | 50MHz | 32K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | 100mA | 16 | YES | YES | YES | 4K x 8 | CPU12 | AEC-Q100 | 20mm | 20mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MC9S12XDT512MAG | NXP USA Inc. | 数据表 | 21 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 144-LQFP | YES | 524288 | A/D 24x10b | 119 | -40°C~125°C TA | Tray | 1996 | HCS12X | e3 | 活跃 | 3 (168 Hours) | 144 | 3A991.A.2 | Matte Tin (Sn) | IT ALSO REQUIRES 5 V SUPPLY | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 2.5V | 0.5mm | 40 | 9S12XDT512 | S-PQFP-G144 | 不合格 | 2.75V | 2.55V | 2.35V | External | 80MHz | 20K x 8 | 2.35V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 80MHz | FLASH | 16-Bit | 512KB 512K x 8 | CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI | 16 | YES | YES | YES | NO | 4K x 8 | CPU12 | 1.6mm | 20mm | 20mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S9S08AW60E7VPUE | NXP USA Inc. | 数据表 | 6 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 64-LQFP | YES | A/D 16x10b | 54 | -40°C~105°C TA | Tray | 2000 | S08 | 活跃 | 3 (168 Hours) | 64 | QUAD | 鸥翼 | 3V | 0.5mm | 5.5V | 2.7V | Internal | 40MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 60KB 60K x 8 | I2C, SCI, SPI | 8 | YES | NO | YES | 10mm | 10mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MC68HC11F1CFN4 | NXP USA Inc. | 数据表 | 1 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 68-LCC (J-Lead) | YES | A/D 8x8b | 30 | -40°C~85°C TA | Tube | HC11 | Obsolete | 3 (168 Hours) | 68 | QUAD | 无铅 | MC68HC11 | S-PQCC-N68 | Internal | 4MHz | 1K x 8 | 4.75V~5.25V | MICROCONTROLLER | POR, WDT | ROMless | 8-Bit | SCI, SPI | 8 | YES | NO | NO | NO | 16 | 512 x 8 | NO | NO | 8 | FIXED-POINT | NO | 8 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MC9S08QE4CPG | NXP USA Inc. | 数据表 | 6 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 通孔 | 16-DIP (0.300, 7.62mm) | NO | A/D 8x12b | 12 | 4096 | -40°C~85°C TA | Tube | 2006 | S08 | e3 | 活跃 | 不适用 | 16 | 3A991.A.2 | 哑光锡 | 8542.31.00.01 | DUAL | 未说明 | 3V | 2.54mm | 未说明 | MC9S08QE4 | R-PDIP-T16 | 不合格 | 3.6V | 1.8/3.6V | 1.8V | Internal | 20MHz | 256 x 8 | 1.8V~3.6V | MICROCONTROLLER | LVD, PWM, WDT | 16MHz | FLASH | 8-Bit | 4KB 4K x 8 | I2C, LINbus, SCI, SPI | 8 | YES | NO | YES | NO | 4.44mm | 19.175mm | 7.62mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SPC5646CCF0MMJ1 | NXP USA Inc. | 数据表 | 90 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 16 Weeks | 表面贴装 | 256-LBGA | YES | A/D 33x10b, 10x12b | 199 | 3145728 | Automotive grade | -40°C~125°C TA | Bulk | 2007 | MPC56xx Qorivva | 活跃 | 3 (168 Hours) | 256 | 8542.31.00.01 | BOTTOM | BALL | 3.3V | 1mm | SPC5646 | S-PBGA-B256 | 不合格 | 3.6V | 3.3/5V | 3V | Internal | 80MHz/120MHz | 256K x 8 | 3V~5.5V | 单片机RISC | e200z4d, e200z0h | DMA, POR, PWM, WDT | 40MHz | FLASH | 32-Bit Dual-Core | 3MB 3M x 8 | CANbus, Ethernet, I2C, LINbus, SCI, SPI | 300mA | 32 | YES | YES | YES | 64K x 8 | AEC-Q100 | 17mm | 17mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SPC5646CCF0MLT1R | NXP USA Inc. | 数据表 | 360 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 208-LQFP | A/D 33x10b, 10x12b | 177 | -40°C~125°C TA | Tape & Reel (TR) | 2007 | MPC56xx Qorivva | 活跃 | 3 (168 Hours) | 未说明 | 未说明 | SPC5646 | Internal | 80MHz/120MHz | 256K x 8 | 3V~5.5V | MICROCONTROLLER, RISC | e200z4d, e200z0h | DMA, POR, PWM, WDT | FLASH | 32-Bit Dual-Core | 3MB 3M x 8 | CANbus, Ethernet, I2C, LINbus, SCI, SPI | 64K x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
LPC1124JBD48/303QL | NXP USA Inc. | 数据表 | 48888 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 16 Weeks | 表面贴装 | 48-LQFP | A/D 8x12b | 38 | -40°C~105°C TA | Tray | 2010 | LPC1100 | 活跃 | 1 (Unlimited) | Internal | 50MHz | 8K x 8 | 1.8V~3.6V | ARM® Cortex®-M0 | Brown-out Detect/Reset, POR, PWM, WDT | FLASH | 32-Bit | 32KB 32K x 8 | I2C, Microwire, SPI, SSI, SSP, UART/USART | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
LPC4330FBD144 | NXP Semiconductors | 数据表 | 3569 In Stock | - | 最小起订量: 1 最小包装量: 1 | YES | 144 | 8542.31.00.01 | LPC4300 | RISC | 204 | 204 | 32 | 无 | CAN/I2C/I2S/Ethernet/SPI/UART/USART/USB | 83 | 6 | Dual | 10/10 | Single | 10 | 3 | 1 | 2 | 2 | 1 | CAN控制器 | 2.2 | 2.5|3.3 | 3.6 | 1500 | -40 | 85 | 无 | QFP | LQFP | 表面贴装 | 1.45(Max) | 20.1(Max) | 20.1(Max) | 144 | Gull-wing | 20 X 20 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT486-1, LQFP-144 | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | -40 °C | 3.3 V | 2.2 V | 85 °C | 有 | LPC4330FBD144 | 25 MHz | LFQFP | SQUARE | 恩智浦半导体 | 活跃 | 83 | NXP SEMICONDUCTORS | 3.6 V | 5.71 | QFP | EAR99 | e3 | 活跃 | TIN | 8542.31.00.01 | CMOS | QUAD | 鸥翼 | 260 | 0.5 mm | compliant | 30 | 144 | S-PQFP-G144 | INDUSTRIAL | 204 MHz | 264KB | MICROCONTROLLER, RISC | ROMLess | 32 | YES | YES | YES | 1 | 1.6 mm | 24 | ARM | 32 | 1 | 2 | FLASH | 4 | 2 | 1 | 8/8 | ARM Cortex M4/M0 | 20 mm | 20 mm | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||
![]() | S9S08RNA16W2MTG | NXP USA Inc. | 数据表 | 107 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 16 Weeks | 表面贴装 | 16-TSSOP (0.173, 4.40mm Width) | A/D 8x10b | 12 | -40°C~125°C TA | Tube | 2012 | S08 | 活跃 | 3 (168 Hours) | 260 | 40 | Internal | 20MHz | 2K x 8 | 2.7V~5.5V | MICROPROCESSOR | LVD, POR, PWM, WDT | FLASH | 8-Bit | 16KB 16K x 8 | I2C, LINbus, SPI, UART/USART | 256 x 8 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MCF52235CVM60 | NXP USA Inc. | 数据表 | 10 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 121-LBGA | YES | A/D 8x12b | 73 | 262144 | -40°C~85°C TA | Tray | 2004 | MCF5223x | e1 | 活跃 | 3 (168 Hours) | 121 | 3A991.A.2 | Tin/Silver/Copper (Sn/Ag/Cu) | ALSO OPERATES AT 3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 40 | MCF52235 | S-PBGA-B121 | 不合格 | 3.6V | 3.3V | 3V | Internal | 60MHz | 32K x 8 | 3V~3.6V | MICROCONTROLLER, RISC | Coldfire V2 | DMA, LVD, POR, PWM, WDT | 60MHz | FLASH | 32-Bit | 256KB 256K x 8 | CANbus, Ethernet, I2C, SPI, UART/USART | 32 | YES | YES | YES | NO | 1.6mm | 12mm | 12mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S9S12P128J0MFTR | NXP USA Inc. | 数据表 | 10500 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 16 Weeks | 表面贴装 | 48-TFQFN Exposed Pad | YES | A/D 10x12b | 34 | 131072 | Automotive grade | -40°C~125°C TA | Tape & Reel (TR) | 2006 | HCS12 | e3 | 活跃 | 3 (168 Hours) | 48 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 无铅 | 260 | 5V | 0.5mm | 40 | S9S12P128 | S-XQCC-N48 | 不合格 | 5.5V | 1.83.3/5V | 3.13V | Internal | 32MHz | 6K x 8 | 1.72V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 16-Bit | 128KB 128K x 8 | CANbus, SCI, SPI | 16 | YES | NO | YES | YES | 4K x 8 | CPU12 | AEC-Q100 | 16 | 1.05mm | 7mm | 7mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MKL25Z64VFM4 | NXP USA Inc. | 数据表 | 490 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 32-VFQFN Exposed Pad | YES | 65536 | 23 | A/D 7x16b; D/A 1x12b | -40°C~105°C TA | Tray | 2002 | Kinetis KL2 | 活跃 | 3 (168 Hours) | 32 | 3A991.A.2 | 8542.31.00.01 | QUAD | 无铅 | 260 | 3.3V | 0.5mm | 40 | MKL25Z64 | S-XQCC-N32 | 不合格 | 3.6V | 1.8/3.3V | 1.71V | Internal | 48MHz | 8K x 8 | 1.71V~3.6V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 48MHz | FLASH | 32-Bit | 64KB 64K x 8 | I2C, LINbus, SPI, UART/USART, USB, USB OTG | 32 | YES | YES | YES | YES | CORTEX-M0 | 5mm | 5mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SPC5643LF2MLQ1R | NXP USA Inc. | 数据表 | 5 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 144-LQFP | YES | A/D 32x12b | -40°C~125°C TA | Tape & Reel (TR) | 2007 | MPC56xx Qorivva | 活跃 | 3 (168 Hours) | 144 | 3A991.A.2 | 8542.31.00.01 | QUAD | 鸥翼 | 未说明 | 3.3V | 0.5mm | 未说明 | SPC5643 | 3.63V | 3V | Internal | 120MHz | 128K x 8 | 3V~5.5V | 单片机RISC | e200z4 | DMA, POR, PWM, WDT | 40MHz | FLASH | 32-Bit Dual-Core | 1MB 1M x 8 | CANbus, FlexRay, LINbus, SPI, UART/USART | 32 | YES | YES | YES | 32 | 64 | 20mm | 20mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MC9S08PA16AVWJ | NXP USA Inc. | 数据表 | 10000 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 20 Weeks | 表面贴装 | 20-SOIC (0.295, 7.50mm Width) | YES | A/D 12x12b | 18 | -40°C~105°C TA | Tube | 2009 | S08 | e3 | 活跃 | 3 (168 Hours) | 20 | 3A991.A.2 | Tin (Sn) | 8542.31.00.01 | DUAL | 鸥翼 | 260 | 5V | 1.27mm | 40 | 5.5V | 2.7V | Internal | 20MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 20MHz | FLASH | 8-Bit | 16KB 16K x 8 | I2C, LINbus, SPI, UART/USART | 8 | YES | NO | YES | 256 x 8 | 12.8mm | 7.5mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MC9S08AC48CFJE | NXP USA Inc. | 数据表 | 162 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 32-LQFP | YES | A/D 6x10b | 22 | 49152 | -40°C~85°C TA | Tray | 2008 | S08 | e3 | 活跃 | 3 (168 Hours) | 32 | 3A991.A.2 | Matte Tin (Sn) | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 5V | 0.8mm | 40 | MC9S08AC48 | S-PQFP-G32 | 不合格 | 5.5V | 3/5V | 2.7V | Internal | 40MHz | 2K x 8 | 2.7V~5.5V | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | FLASH | 8-Bit | 48KB 48K x 8 | I2C, SCI, SPI | 8 | YES | NO | YES | NO | 1.6mm | 7mm | 7mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S912XEG384BCALR | NXP USA Inc. | 数据表 | 21 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 112-LQFP | YES | A/D 16x12b | 91 | 24576 | 393216 | Automotive grade | -40°C~85°C TA | Tape & Reel (TR) | 1996 | HCS12X | 活跃 | 3 (168 Hours) | 112 | 8542.31.00.01 | QUAD | 鸥翼 | 1.8V | 0.65mm | S-PQFP-G112 | 不合格 | 1.98V | 3.3/5V | 1.72V | External | 50MHz | 24K x 8 | 1.72V~5.5V | MICROCONTROLLER, RISC | LVD, POR, PWM, WDT | 40MHz | FLASH | 16-Bit | 384KB 384K x 8 | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | 100mA | 16 | YES | YES | YES | 4K x 8 | CPU12 | AEC-Q100 | 20mm | 20mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MKE14Z256VLH7R | NXP USA Inc. | 数据表 | 3000 In Stock | - | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | 64-LQFP | YES | A/D 16x12b; D/A 1x8b | 58 | 32768 | 262144 | -40°C~105°C TA | Tape & Reel (TR) | Kinetis KE1xZ | 活跃 | 3 (168 Hours) | 64 | 3A991.A.2 | FLEXRAM WITH 2KB FOR EEPROM EMULATION | 8542.31.00.01 | QUAD | 鸥翼 | 260 | 3.3V | 0.5mm | 40 | S-PQFP-G64 | 5.5V | 2.7V | Internal | 72MHz | 32K x 8 | 2.7V~5.5V | MICROCONTROLLER, RISC | ARM® Cortex®-M0+ | DMA, LVD, PWM, WDT | 32MHz | FLASH | 32-Bit | 256KB 256K x 8 | FlexIO, I2C, SPI, UART/USART | 32 | YES | YES | YES | NO | 34K x 8 | 8 | 1.6mm | 10mm | 10mm | ROHS3 Compliant |
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