Samsung Semiconductor KMDP6001DA-B425

表面安装

YES

Contact plating

gold-plated

Number of pins

9

终端数量

254

Part Life Cycle Code

Obsolete

Ihs Manufacturer

SAMSUNG SEMICONDUCTOR INC

Package Description

FBGA-254

Number of Words

68719476736 words

Number of Words Code

64000000000

Package Body Material

PLASTIC/EPOXY

Package Shape

RECTANGULAR

Type of connector

pin strips

Connector

socket

Kind of connector

female

Spatial orientation

straight

Contacts pitch

2.54mm

Electrical mounting

THT

Connector pinout layout

1x9

Gross weight

0.77 g

Operating temperature

-40...163°C

附加功能

DRAM IS ORGANISED AS 32G X 1

端子位置

BOTTOM

终端形式

BALL

功能数量

1

Reach合规守则

compliant

Current rating

1.5A

JESD-30代码

R-PBGA-B254

组织结构

64GX8

内存宽度

8

记忆密度

549755813888 bit

内存IC类型

存储器电路

Rated voltage

60V

个人资料

beryllium copper

混合内存类型

FLASH+DRAM

Plating thickness

0.75µm

Flammability rating

UL94V-0