STMicroelectronics的专用模块_正品采购_价格信息

品牌是'STMicroelectronics' (7)

产品型号	品牌	数据表	库存	价格(含增值税)	数量	表面安装	终端数量																	JESD-609代码	ECCN 代码	端子表面处理	附加功能	HTS代码	端子位置	终端形式	功能数量	端子间距	Reach合规守则	引脚数量	JESD-30代码	资历状况	电源电压-最大值(Vsup)	温度等级	电源电压-最小值(Vsup)	操作模式	电源电流-最大值	组织结构	输出特性	座位高度-最大	内存宽度	待机电流-最大值	记忆密度	I/O类型	内存IC类型	混合内存类型	长度	宽度
M36L0R8060T1ZAQE	STMicroelectronics	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	88	Transferred	STMICROELECTRONICS	BGA	8 X 10 MM, 0.80 MM PITCH, ROHS COMPLIANT, TFBGA-88	16777216 words	16000000	85 °C	-25 °C	PLASTIC/EPOXY	TFBGA	BGA88,8X12,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	1.8 V	有	e1	EAR99	锡银铜	PSEUDO SRAM IS ORGANIZED AS 4M X 16; SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE	8542.32.00.71	BOTTOM	BALL	1	0.8 mm	unknown	88	R-PBGA-B88	不合格	1.95 V	OTHER	1.7 V	ASYNCHRONOUS	0.052 mA	16MX16		1.2 mm	16	0.00011 A	268435456 bit		存储器电路	FLASH+PSRAM	10 mm	8 mm
M36L0R7040U3ZA5U	SGS Thomson	数据表	N/A	-	最小起订量: 1 最小包装量: 1
MAP168-45L	Waferscale Integration Inc	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	44	CERAMIC	QCCJ	LDCC44,.7SQ	SQUARE	CHIP CARRIER	5 V	无	Obsolete	WAFERSCALE INTEGRATION INC	45 ns	70 °C	e0	EAR99	Tin/Lead (Sn/Pb)		8542.32.00.71	QUAD	J BEND		1.27 mm	unknown		S-XQCC-J44	不合格		COMMERCIAL			0.143 mA					0.001 A
HCF40108BF	SGS-Ates Componenti Electronici SPA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	NO	24	-40 °C	CERAMIC	DIP	DIP24,.6	RECTANGULAR	IN-LINE	无	Obsolete	SGS-ATES COMPONENTI ELECTRONICI S P A	DIP, DIP24,.6	85 °C	e0	EAR99	Tin/Lead (Sn/Pb)		8542.32.00.71	DUAL	THROUGH-HOLE		2.54 mm	unknown		R-XDIP-T24	不合格		INDUSTRIAL
M36W0R6050B1ZAQF	STMicroelectronics	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	88	有	Transferred	STMICROELECTRONICS	BGA	8 X 10 MM, 0.80 MM PITCH, LEAD FREE, TFBGA-88	70 ns	4194304 words	4000000	85 °C	-30 °C	PLASTIC/EPOXY	TFBGA	BGA88,8X12,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	1.8 V	e1	EAR99	锡银铜	PSRAM IS ORGANIZED AS 2M X 16	8542.32.00.71	BOTTOM	BALL	1	0.8 mm	compliant	88	R-PBGA-B88	不合格	1.95 V	OTHER	1.7 V	ASYNCHRONOUS		4MX16		1.2 mm	16		67108864 bit		存储器电路	FLASH+PSRAM	10 mm	8 mm
M2704	SGS-Ates Componenti Electronici SPA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	NO	24	DIP, DIP24,.6	450 ns	512 words	512	70 °C	CERAMIC	DIP	DIP24,.6	RECTANGULAR	IN-LINE	无	Obsolete	SGS-ATES COMPONENTI ELECTRONICI S P A	e0	EAR99	Tin/Lead (Sn/Pb)		8542.32.00.71	DUAL	THROUGH-HOLE		2.54 mm	unknown		R-XDIP-T24	不合格		COMMERCIAL				512X8	3-STATE		8		4096 bit	COMMON
M36DR232A120ZA6C	STMicroelectronics	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	66	Transferred	STMICROELECTRONICS	BGA	0.80 MM PITCH, STACK, LFBGA-66	120 ns	2097152 words	2000000	85 °C	-40 °C	PLASTIC/EPOXY	LFBGA	BGA66,8X12,32	RECTANGULAR	GRID ARRAY, LOW PROFILE, FINE PITCH	无	e0	EAR99	锡铅	THE DEVICE ALSO CONTAINS A 2 MBIT (128K X16) SRAM	8542.32.00.71	BOTTOM	BALL	1	0.8 mm	not_compliant	66	R-PBGA-B66	不合格	2.2 V	INDUSTRIAL	1.65 V	ASYNCHRONOUS	0.04 mA	2MX16		1.4 mm	16	0.000025 A	33554432 bit		存储器电路	FLASH+SRAM	12 mm	8 mm