品牌是'Xilinx' (1835)

对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

表面安装

终端数量

JESD-609代码

无铅代码

ECCN 代码

端子表面处理

最高工作温度

最小工作温度

附加功能

HTS代码

端子位置

终端形式

峰值回流焊温度(摄氏度)

端子间距

Reach合规守则

引脚数量

JESD-30代码

输出的数量

资历状况

工作电源电压

电源

温度等级

内存大小

传播延迟

输入数量

组织结构

座位高度-最大

可编程逻辑类型

速度等级

输出功能

宏细胞数

CLB-Max的组合延时

逻辑块数量

JTAG BST

逻辑单元数

专用输入数量

等效门数

系统内可编程

长度

宽度

辐射硬化

XC4085XLA-09BGG352I
XC4085XLA-09BGG352I
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

352

LBGA,

5.81

227 MHz

3

PLASTIC/EPOXY

LBGA

SQUARE

GRID ARRAY, LOW PROFILE

3.6 V

3 V

3.3 V

30

XC4085XLA-09BGG352I

Obsolete

XILINX INC

BGA

e1

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

CAN ALSO USE 180000 GATES

8542.39.00.01

BOTTOM

BALL

245

1.27 mm

compliant

352

S-PBGA-B352

不合格

3136 CLBS, 55000 GATES

1.7 mm

现场可编程门阵列

1.1 ns

3136

55000

35 mm

35 mm

XC4010D-6PQ160I
XC4010D-6PQ160I
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

160

XILINX INC

QFP

PLASTIC, QFP-160

5.77

90.9 MHz

3

85 °C

-40 °C

PLASTIC/EPOXY

QFP

QFP160,1.2SQ

SQUARE

FLATPACK

5.5 V

5 V

4.5 V

XC4010D-6PQ160I

Obsolete

e0

Tin/Lead (Sn85Pb15)

1120 FLIP-FLOPS; TYP. GATES = 8000-10000

8542.39.00.01

QUAD

鸥翼

0.65 mm

not_compliant

160

S-PQFP-G160

160

不合格

5 V

INDUSTRIAL

160

400 CLBS, 8000 GATES

3.92 mm

现场可编程门阵列

6 ns

400

400

8000

28 mm

28 mm

XC4013XLA-09BGG256I
XC4013XLA-09BGG256I
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

256

BGA,

5.3

227 MHz

3

PLASTIC/EPOXY

BGA

SQUARE

网格排列

3.6 V

3.3 V

30

3 V

XC4013XLA-09BGG256I

Obsolete

XILINX INC

BGA

e1

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

CAN ALSO USE 30000 GATES

8542.39.00.01

BOTTOM

BALL

250

1.27 mm

compliant

256

S-PBGA-B256

不合格

576 CLBS, 10000 GATES

2.55 mm

现场可编程门阵列

1.1 ns

576

10000

27 mm

27 mm

XC4036XLA-07HQG240C
XC4036XLA-07HQG240C
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

240

QFP

HFQFP,

5.81

294 MHz

3

85 °C

PLASTIC/EPOXY

HFQFP

SQUARE

FLATPACK, HEAT SINK/SLUG, FINE PITCH

3.6 V

3.3 V

30

3 V

XC4036XLA-07HQG240C

Obsolete

XILINX INC

e3

哑光锡

CAN ALSO USE 65000 GATES

8542.39.00.01

QUAD

鸥翼

245

0.5 mm

compliant

240

S-PQFP-G240

不合格

OTHER

1296 CLBS, 22000 GATES

4.1 mm

现场可编程门阵列

0.9 ns

1296

22000

32 mm

32 mm

XCV100E-8PQG240C
XCV100E-8PQG240C
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

240

XILINX INC

QFP

PLASTIC, QFP-240

5.81

416 MHz

3

85 °C

PLASTIC/EPOXY

FQFP

QFP240,1.3SQ,20

SQUARE

FLATPACK, FINE PITCH

1.89 V

1.8 V

30

1.71 V

XCV100E-8PQG240C

Obsolete

e3

EAR99

Matte Tin (Sn)

8542.39.00.01

QUAD

鸥翼

245

0.5 mm

unknown

240

S-PQFP-G240

158

不合格

1.2/3.6,1.8 V

OTHER

158

600 CLBS, 32400 GATES

4.1 mm

现场可编程门阵列

0.4 ns

600

2700

32400

32 mm

32 mm

XC4020XLA-07PQG240C
XC4020XLA-07PQG240C
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

240

QFP

FQFP,

5.79

294 MHz

3

85 °C

PLASTIC/EPOXY

FQFP

SQUARE

FLATPACK, FINE PITCH

3.6 V

3.3 V

40

3 V

XC4020XLA-07PQG240C

Obsolete

XILINX INC

e3

Matte Tin (Sn)

CAN ALSO USE 40000 GATES

8542.39.00.01

QUAD

鸥翼

245

0.5 mm

compliant

240

S-PQFP-G240

不合格

OTHER

784 CLBS, 13000 GATES

4.1 mm

现场可编程门阵列

0.9 ns

784

13000

32 mm

32 mm

XC3190A-1PG175C
XC3190A-1PG175C
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

175

PGA

SQUARE

网格排列

5.25 V

5 V

4.75 V

XC3190A-1PG175C

接触制造商

ROCHESTER ELECTRONICS LLC

PGA,

5.78

323 MHz

85 °C

CERAMIC, METAL-SEALED COFIRED

MAX USABLE 6000 LOGIC GATES

8542.39.00.01

PERPENDICULAR

PIN/PEG

2.54 mm

unknown

S-CPGA-P175

OTHER

320 CLBS, 5000 GATES

4.318 mm

现场可编程门阵列

1.75 ns

320

5000

42.164 mm

42.164 mm

XC3190A-2TQ144I
XC3190A-2TQ144I
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

144

FLATPACK, LOW PROFILE, FINE PITCH

5.5 V

5 V

4.5 V

XC3190A-2TQ144I

接触制造商

ROCHESTER ELECTRONICS LLC

LFQFP,

5.78

323 MHz

PLASTIC/EPOXY

LFQFP

SQUARE

e0

锡铅

MAX USABLE 6000 LOGIC GATES

8542.39.00.01

QUAD

鸥翼

0.5 mm

unknown

S-PQFP-G144

320 CLBS, 5000 GATES

1.6 mm

现场可编程门阵列

2.2 ns

320

5000

20 mm

20 mm

XC7336Q-10PQ44C
XC7336Q-10PQ44C
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

44

XILINX INC

QFP

PLASTIC, QFP-44

5.86

100 MHz

3

32

70 °C

PLASTIC/EPOXY

QFP

QFP44,.5SQ,32

SQUARE

FLATPACK

5.25 V

5 V

4.75 V

XC7336Q-10PQ44C

Obsolete

e0

EAR99

Tin/Lead (Sn85Pb15)

36 MACROCELLS; CONFIGURABLE I/O OPERATION-3.3V OR 5V; 2 EXTERNAL CLOCKS; 36 FLIP-FLOPS

8542.39.00.01

QUAD

鸥翼

0.8 mm

not_compliant

44

S-PQFP-G44

不合格

3.3/5,5 V

COMMERCIAL

15 ns

2 DEDICATED INPUTS, 32 I/O

2.35 mm

OT PLD

MACROCELL

36

NO

2

NO

10 mm

10 mm

XC5VLX220T-3FF1738I
XC5VLX220T-3FF1738I
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

4

5.86

XILINX INC

活跃

XC5VLX220T-3FF1738I

e0

Tin/Lead (Sn63Pb37)

not_compliant

XC73108-20WC84C
XC73108-20WC84C
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

84

Obsolete

XILINX INC

LCC

WQCCJ, LDCC84,1.2SQ

5.85

35.7 MHz

1

37

70 °C

CERAMIC, METAL-SEALED COFIRED

WQCCJ

LDCC84,1.2SQ

SQUARE

CHIP CARRIER, WINDOW

5.25 V

5 V

未说明

4.75 V

XC73108-20WC84C

EAR99

108 MACROCELLS; CONFIGURABLE I/O OPERATION-3.3V OR 5V; 3 EXTERNAL CLOCKS; 198 FLIP-FLOPS

8542.39.00.01

QUAD

J BEND

225

1.27 mm

unknown

84

S-CQCC-J84

不合格

3.3/5,5 V

COMMERCIAL

45 ns

12 DEDICATED INPUTS, 37 I/O

4.826 mm

UV PLD

MACROCELL

108

NO

12

NO

29.21 mm

29.21 mm

XC4036XLA-09HQG160I
XC4036XLA-09HQG160I
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

160

227 MHz

PLASTIC/EPOXY

HQFP

SQUARE

FLATPACK, HEAT SINK/SLUG

3.6 V

3.3 V

3 V

XC4036XLA-09HQG160I

Obsolete

XILINX INC

QFP

HQFP,

5.81

CAN ALSO USE 65000 GATES

8542.39.00.01

QUAD

鸥翼

0.65 mm

compliant

160

S-PQFP-G160

不合格

1296 CLBS, 22000 GATES

4.1 mm

现场可编程门阵列

1.1 ns

1296

22000

28 mm

28 mm

XC4044XLA-08HQG240C
XC4044XLA-08HQG240C
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

240

85 °C

PLASTIC/EPOXY

HFQFP

SQUARE

FLATPACK, HEAT SINK/SLUG, FINE PITCH

3.6 V

3.3 V

3 V

XC4044XLA-08HQG240C

Obsolete

XILINX INC

QFP

HFQFP,

5.81

263 MHz

CAN ALSO USE 80000 GATES

8542.39.00.01

QUAD

鸥翼

0.5 mm

unknown

240

S-PQFP-G240

不合格

OTHER

1600 CLBS, 27000 GATES

4.1 mm

现场可编程门阵列

1 ns

1600

27000

32 mm

32 mm

XC7VX330T-2FFV1157I
XC7VX330T-2FFV1157I
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

1157

SQUARE

网格排列

1.03 V

1 V

未说明

0.97 V

XC7VX330T-2FFV1157I

活跃

XILINX INC

BGA,

5.79

PLASTIC/EPOXY

BGA

e1

3A991.D

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1157

25500 CLBS

3.35 mm

现场可编程门阵列

0.61 ns

25500

35 mm

35 mm

XCR3032XL-5CS48I
XCR3032XL-5CS48I
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

48

活跃

XILINX INC

BGA

FBGA,

5.15

200 MHz

3

32

85 °C

-40 °C

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

3.6 V

3.3 V

30

2.7 V

XCR3032XL-5CS48I

e0

锡铅

8542.39.00.01

BOTTOM

BALL

240

0.8 mm

compliant

48

S-PBGA-B48

不合格

INDUSTRIAL

5 ns

32 I/O

1.8 mm

EE PLD

MACROCELL

7 mm

7 mm

XCV405E-6FGG676C
XCV405E-6FGG676C
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

676

BGA

BGA,

5.8

357 MHz

3

70 °C

PLASTIC/EPOXY

BGA

SQUARE

网格排列

1.89 V

1.8 V

30

1.71 V

XCV405E-6FGG676C

Obsolete

XILINX INC

e1

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

8542.39.00.01

BOTTOM

BALL

250

1 mm

compliant

676

S-PBGA-B676

不合格

COMMERCIAL

2400 CLBS, 129600 GATES

2.6 mm

现场可编程门阵列

0.47 ns

2400

129600

27 mm

27 mm

XCV300E-6BGG352I
XCV300E-6BGG352I
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

352

XILINX INC

BGA

BGA-352

5.8

357 MHz

3

PLASTIC/EPOXY

LBGA

BGA352,26X26,50

SQUARE

GRID ARRAY, LOW PROFILE

1.89 V

1.8 V

30

Compliant

1.71 V

XCV300E-6BGG352I

Obsolete

e1

EAR99

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

100 °C

-40 °C

8542.39.00.01

BOTTOM

BALL

260

1.27 mm

unknown

352

S-PBGA-B352

260

不合格

1.8 V

1.2/3.6,1.8 V

16 kB

260

1536 CLBS, 82944 GATES

1.7 mm

现场可编程门阵列

6

0.47 ns

1536

6912

82944

35 mm

35 mm

XCV400E-6BGG560I
XCV400E-6BGG560I
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

560

XILINX INC

BGA

BGA-560

5.79

357 MHz

3

PLASTIC/EPOXY

LBGA

BGA560,33X33,50

SQUARE

GRID ARRAY, LOW PROFILE

1.89 V

1.8 V

30

Compliant

1.71 V

XCV400E-6BGG560I

Obsolete

e1

3A991.D

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

100 °C

-40 °C

8542.39.00.01

BOTTOM

BALL

260

1.27 mm

unknown

560

S-PBGA-B560

404

不合格

1.8 V

1.2/3.6,1.8 V

20 kB

404

2400 CLBS, 129600 GATES

1.7 mm

现场可编程门阵列

6

0.47 ns

2400

10800

129600

42.5 mm

42.5 mm

XC4062XLA-08BGG432C
XC4062XLA-08BGG432C
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

432

BGA

LBGA,

5.81

263 MHz

3

85 °C

PLASTIC/EPOXY

LBGA

SQUARE

GRID ARRAY, LOW PROFILE

3.6 V

3.3 V

40

3 V

XC4062XLA-08BGG432C

Obsolete

XILINX INC

e1

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

CAN ALSO USE 130000 GATES

8542.39.00.01

BOTTOM

BALL

260

1.27 mm

compliant

432

S-PBGA-B432

不合格

OTHER

2304 CLBS, 40000 GATES

1.7 mm

现场可编程门阵列

1 ns

2304

40000

40 mm

40 mm

XC7VX415T-3FFG1158I
XC7VX415T-3FFG1158I
Xilinx 数据表

677 In Stock

-

最小起订量: 1

最小包装量: 1

活跃

XILINX INC

,

5.77

4

30

XC7VX415T-3FFG1158I

e1

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

245

compliant

现场可编程门阵列

XCV300E-7BGG352I
XCV300E-7BGG352I
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

352

BGA

BGA-352

5.81

400 MHz

3

PLASTIC/EPOXY

LBGA

BGA352,26X26,50

SQUARE

GRID ARRAY, LOW PROFILE

1.89 V

1.71 V

1.8 V

30

XCV300E-7BGG352I

Obsolete

XILINX INC

e1

EAR99

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

8542.39.00.01

BOTTOM

BALL

260

1.27 mm

unknown

352

S-PBGA-B352

260

不合格

1.2/3.6,1.8 V

260

1536 CLBS, 82944 GATES

1.7 mm

现场可编程门阵列

0.42 ns

1536

6912

82944

35 mm

35 mm

XC2C128-4CP132C
XC2C128-4CP132C
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

132

XILINX INC

BGA

8 X 8 MM, 0.50 MM PITCH, CSP-132

5.73

3

100

70 °C

PLASTIC/EPOXY

TFBGA

BGA132,14X14,20

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

1.9 V

1.8 V

30

1.7 V

XC2C128-4CP132C

Obsolete

e0

Tin/Lead (Sn63Pb37)

YES

8542.39.00.01

BOTTOM

BALL

225

0.5 mm

not_compliant

132

S-PBGA-B132

不合格

1.5/3.3,1.8 V

COMMERCIAL

4.5 ns

0 DEDICATED INPUTS, 100 I/O

1.1 mm

闪存 PLD

MACROCELL

128

YES

YES

8 mm

8 mm

XC4VFX140-12FF1760C
XC4VFX140-12FF1760C
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

1760

XILINX INC

BGA

42.50 X 42.50 MM, 1 MM PITCH, MS-034-AAV-1, FBGA-1760

5.28

1181 MHz

4

85 °C

PLASTIC/EPOXY

BGA

BGA1760,42X42,40

SQUARE

网格排列

1.26 V

1.2 V

30

1.14 V

XC4VFX140-12FF1760C

活跃

e0

Tin/Lead (Sn63Pb37)

BOTTOM

BALL

225

1 mm

not_compliant

1760

S-PBGA-B1760

896

不合格

1.2,1.2/3.3,2.5 V

OTHER

896

15792 CLBS

3.5 mm

现场可编程门阵列

15792

142128

42.5 mm

42.5 mm

XCV400E-8BGG432I
XCV400E-8BGG432I
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

432

5.8

416 MHz

3

PLASTIC/EPOXY

LBGA

BGA432,31X31,50

SQUARE

GRID ARRAY, LOW PROFILE

1.89 V

XCV400E-8BGG432I

1.8 V

30

1.71 V

Obsolete

XILINX INC

BGA

LBGA, BGA432,31X31,50

e1

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

8542.39.00.01

BOTTOM

BALL

260

1.27 mm

compliant

432

S-PBGA-B432

316

不合格

1.2/3.6,1.8 V

316

2400 CLBS, 129600 GATES

1.7 mm

现场可编程门阵列

0.4 ns

2400

10800

129600

40 mm

40 mm

XCR3064A-10PC44C
XCR3064A-10PC44C
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

44

XILINX INC

LCC

PLASTIC, LCC-44

5.68

83 MHz

3

32

70 °C

PLASTIC/EPOXY

QCCJ

LDCC44,.7SQ

SQUARE

CHIP CARRIER

3.6 V

3.3 V

3 V

XCR3064A-10PC44C

Obsolete

e0

Tin/Lead (Sn85Pb15)

YES

8542.39.00.01

QUAD

J BEND

1.27 mm

not_compliant

44

S-PQCC-J44

不合格

3.3 V

COMMERCIAL

10 ns

2 DEDICATED INPUTS, 32 I/O

4.57 mm

EE PLD

MACROCELL

64

YES

2

YES

16.5862 mm

16.5862 mm