品牌是'Xilinx' (10000)
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 制造商包装标识符 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 终端 | ECCN 代码 | 端子表面处理 | HTS代码 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 电源电压 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 内存大小 | 内存大小 | 时钟频率 | 传播延迟 | 接通延迟时间 | 输入数量 | 可编程逻辑类型 | 逻辑元件/单元数 | 总 RAM 位数 | 阀门数量 | LABs数量/ CLBs数量 | 逻辑块数(LABs) | 速度等级 | 宏细胞数 | 寄存器数量 | CLB-Max的组合延时 | 逻辑块数量 | 最大结点温度(Tj) | 逻辑单元数 | 环境温度范围高 | 高度 | 座位高度(最大) | 长度 | 宽度 | 辐射硬化 | 达到SVHC | RoHS状态 | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | XC6SLX9-2CSG324C | Xilinx Inc. | 数据表 | 16612 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | 表面贴装 | 324-LFBGA, CSPBGA | 324 | 200 | 0°C~85°C TJ | Tray | 1999 | Spartan®-6 LX | e1 | yes | 活跃 | 3 (168 Hours) | 324 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 1.14V~1.26V | BOTTOM | BALL | 260 | 1.2V | 0.8mm | 30 | XC6SLX9 | 324 | 200 | 不合格 | 1.2V | 72kB | 667MHz | 现场可编程门阵列 | 9152 | 589824 | 715 | 2 | 11440 | 715 | 1.5mm | 15mm | 15mm | Unknown | ROHS3 Compliant | ||||||||||||||||||||||||
![]() | XC7K160T-1FFG676I | Xilinx Inc. | 数据表 | 495 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 676-BBGA, FCBGA | YES | 400 | -40°C~100°C TJ | Tray | 2010 | Kintex®-7 | e1 | yes | 活跃 | 4 (72 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | 0.97V~1.03V | BOTTOM | BALL | 1V | 1mm | XC7K160 | 676 | S-PBGA-B676 | 400 | 11.83.3V | 1.4MB | 1098MHz | 120 ps | 400 | 现场可编程门阵列 | 162240 | 11980800 | 12675 | -1 | 202800 | 0.74 ns | 3.37mm | 27mm | 27mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||
![]() | XC6SLX9-2FTG256I | Xilinx Inc. | 数据表 | 1378 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 186 | -40°C~100°C TJ | Tray | 2008 | Spartan®-6 LX | e1 | yes | 活跃 | 3 (168 Hours) | 256 | EAR99 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 1.14V~1.26V | BOTTOM | BALL | 260 | 1.2V | 1mm | 30 | XC6SLX9 | 256 | 186 | 不合格 | 1.2V | 72kB | 667MHz | 现场可编程门阵列 | 9152 | 589824 | 715 | 1430 | 2 | 11440 | 715 | 1.55mm | 17mm | 17mm | Unknown | ROHS3 Compliant | ||||||||||||||||||||||||
![]() | XC7K410T-2FFG900I | Xilinx Inc. | 数据表 | 990 In Stock | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 900-BBGA, FCBGA | YES | 500 | -40°C~100°C TJ | Tray | 2007 | Kintex®-7 | e1 | yes | 活跃 | 4 (72 Hours) | 900 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | 0.97V~1.03V | BOTTOM | BALL | 未说明 | 1V | 1mm | 未说明 | XC7K410T | 900 | S-PBGA-B900 | 500 | 不合格 | 11.83.3V | 3.5MB | 1286MHz | 500 | 现场可编程门阵列 | 406720 | 29306880 | 31775 | -2 | 508400 | 0.61 ns | 3.35mm | 31mm | 31mm | ROHS3 Compliant | ||||||||||||||||||||||||
![]() | XC7K410T-2FFG676I | Xilinx Inc. | 数据表 | 990 In Stock | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 676-BBGA, FCBGA | YES | 400 | -40°C~100°C TJ | Tray | 2009 | Kintex®-7 | e1 | yes | 活跃 | 4 (72 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | 0.97V~1.03V | BOTTOM | BALL | 未说明 | 1V | 1mm | not_compliant | 未说明 | XC7K410T | 676 | S-PBGA-B676 | 400 | 不合格 | 11.83.3V | 3.5MB | 1286MHz | 400 | 现场可编程门阵列 | 406720 | 29306880 | 31775 | -2 | 508400 | 0.61 ns | 3.37mm | 27mm | 27mm | ROHS3 Compliant | |||||||||||||||||||||||
![]() | XC6SLX9-2CSG225C | Xilinx Inc. | 数据表 | 2525 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 225-LFBGA, CSPBGA | 225 | 160 | 0°C~85°C TJ | Tray | 2008 | Spartan®-6 LX | e1 | yes | 活跃 | 3 (168 Hours) | 225 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 1.14V~1.26V | BOTTOM | BALL | 260 | 1.2V | 0.8mm | 30 | XC6SLX9 | 225 | 160 | 不合格 | 1.2V | 72kB | 667MHz | 现场可编程门阵列 | 9152 | 589824 | 715 | 2 | 11440 | 715 | 1.4mm | 13mm | 13mm | ROHS3 Compliant | ||||||||||||||||||||||||||
![]() | XC7A200T-2FBG676C | Xilinx Inc. | 数据表 | 495 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | 676-BBGA, FCBGA | YES | 676 | DDR3 | 400 | 0°C~85°C TJ | Tray | 2009 | Artix-7 | e1 | yes | 活跃 | 4 (72 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | 0.95V~1.05V | BOTTOM | BALL | 未说明 | 1V | 1mm | 未说明 | XC7A200T | 676 | 400 | 不合格 | 1V | 1GB | 1.6MB | 1286MHz | 现场可编程门阵列 | 215360 | 13455360 | 16825 | -2 | 269200 | 1.05 ns | 2.54mm | 27mm | 27mm | ROHS3 Compliant | ||||||||||||||||||||||
![]() | XC7A35T-1FTG256C | Xilinx Inc. | 数据表 | 990 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | 256-LBGA | YES | 256 | 170 | 0°C~85°C TJ | Tray | 2001 | Artix-7 | e1 | yes | 活跃 | 3 (168 Hours) | 256 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 0.95V~1.05V | BOTTOM | BALL | 未说明 | 1V | 未说明 | 256 | 170 | 不合格 | 1V | 225kB | 1.09 ns | 1.09 ns | 现场可编程门阵列 | 33208 | 1843200 | 2600 | 1 | 33280 | ROHS3 Compliant | ||||||||||||||||||||||||||||||
![]() | XC6SLX45T-3FGG484C | Xilinx Inc. | 数据表 | 495 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 484-BBGA | 484 | XC6SLX45T-3FGG484C | 296 | RAM | 0°C~85°C TJ | Tray | 2008 | Spartan®-6 LXT | e1 | yes | 活跃 | 3 (168 Hours) | 484 | 1.14V~1.26V | BOTTOM | BALL | 250 | 1.2V | 1mm | 30 | XC6SLX45 | 484 | 296 | 不合格 | 1.2V | 261kB | 862MHz | 43661 | 2138112 | 3411 | 3 | 54576 | 0.21 ns | 125°C | 150°C | 2.6mm | ROHS3 Compliant | |||||||||||||||||||||||||||
![]() | XC7A200T-1FBG676C | Xilinx Inc. | 数据表 | 495 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | 676-BBGA, FCBGA | YES | DDR3 | 400 | 0°C~85°C TJ | Tray | 2009 | Artix-7 | e1 | yes | 活跃 | 4 (72 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | 0.95V~1.05V | BOTTOM | BALL | 未说明 | 1V | 1mm | 未说明 | XC7A200T | 676 | S-PBGA-B676 | 400 | 不合格 | 1V | 1GB | 1.6MB | 1098MHz | 400 | 现场可编程门阵列 | 215360 | 13455360 | 16825 | -1 | 269200 | 1.27 ns | 85°C | 2.54mm | 27mm | 27mm | ROHS3 Compliant | ||||||||||||||||||||
![]() | XC7A100T-2FGG484I | Xilinx Inc. | 数据表 | 990 In Stock | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 484-BBGA | YES | 484 | 285 | -40°C~100°C TJ | Tray | 2009 | Artix-7 | e1 | yes | 活跃 | 3 (168 Hours) | 484 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | 0.95V~1.05V | BOTTOM | BALL | 未说明 | 1V | 1mm | 未说明 | XC7A100T | 484 | 285 | 不合格 | 1V | 607.5kB | 1286MHz | 现场可编程门阵列 | 101440 | 4976640 | 7925 | -2 | 126800 | 1.05 ns | 2.6mm | 23mm | 23mm | ROHS3 Compliant | |||||||||||||||||||||||||
![]() | XC7K160T-2FBG676C | Xilinx Inc. | 数据表 | 495 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | 676-BBGA, FCBGA | YES | 400 | 0°C~85°C TJ | Tray | 2010 | Kintex®-7 | e1 | yes | 活跃 | 4 (72 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | 0.97V~1.03V | BOTTOM | BALL | 1V | 1mm | XC7K160 | 676 | S-PBGA-B676 | 400 | 11.83.3V | 1.4MB | 1286MHz | 100 ps | 400 | 现场可编程门阵列 | 162240 | 11980800 | 12675 | -2 | 202800 | 0.61 ns | 2.54mm | 27mm | 27mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||
![]() | XC3S50A-4TQG144C | Xilinx Inc. | 数据表 | 1000 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | Tin | 表面贴装 | 表面贴装 | 144-LQFP | 144 | RAM | 108 | 0°C~85°C TJ | Tray | 2007 | Spartan®-3A | e3 | yes | 活跃 | 3 (168 Hours) | 144 | SMD/SMT | EAR99 | 1.14V~1.26V | QUAD | 鸥翼 | 260 | 1.2V | 0.5mm | 250MHz | 30 | XC3S50A | 144 | 101 | 不合格 | 1.2V | 1.22.5/3.3V | 6.8kB | 55296 | 50000 | 176 | 4 | 1584 | 0.71 ns | 176 | 125°C | 1.6mm | 20mm | 20mm | Unknown | ROHS3 Compliant | |||||||||||||||||||||
![]() | XC7K70T-2FBG484I | Xilinx Inc. | 数据表 | 495 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | 484-BBGA, FCBGA | YES | 484 | 285 | -40°C~100°C TJ | Tray | 2010 | Kintex®-7 | e1 | yes | 活跃 | 4 (72 Hours) | 484 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | 0.97V~1.03V | BOTTOM | BALL | 未说明 | 1V | 1mm | not_compliant | 未说明 | XC7K70T | 484 | 285 | 不合格 | 11.83.3V | 607.5kB | 1286MHz | 现场可编程门阵列 | 65600 | 4976640 | 5125 | -2 | 82000 | 0.61 ns | 2.54mm | 23mm | 23mm | ROHS3 Compliant | |||||||||||||||||||||||
![]() | XC3S700AN-4FGG484C | Xilinx Inc. | 数据表 | 189 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 484-BBGA | 484 | 372 | 0°C~85°C TJ | Tray | 1999 | Spartan®-3AN | e1 | yes | 活跃 | 3 (168 Hours) | 484 | SMD/SMT | 3A991.D | 1.14V~1.26V | BOTTOM | BALL | 250 | 1.2V | 1mm | 667MHz | 30 | XC3S700AN | 484 | 288 | 不合格 | 1.2V | 1.21.2/3.33.3V | 45kB | 现场可编程门阵列 | 13248 | 368640 | 700000 | 1472 | 4 | 0.71 ns | 1.7mm | 23mm | 23mm | Unknown | ROHS3 Compliant | ||||||||||||||||||||||||
![]() | XC3S200AN-4FTG256I | Xilinx Inc. | 数据表 | 50 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 256-LBGA | 256 | 195 | -40°C~100°C TJ | Tray | 2007 | Spartan®-3AN | e1 | yes | 活跃 | 3 (168 Hours) | 256 | SMD/SMT | EAR99 | 1.14V~1.26V | BOTTOM | BALL | 260 | 1.2V | 1mm | 667MHz | 30 | XC3S200AN | 256 | 160 | 不合格 | 1.2V | 1.21.2/3.33.3V | 36kB | 现场可编程门阵列 | 4032 | 294912 | 200000 | 448 | 4 | 0.71 ns | 448 | 1.55mm | 17mm | 17mm | 无SVHC | ROHS3 Compliant | |||||||||||||||||||||||
![]() | XC7A200T-2FBG676I | Xilinx Inc. | 数据表 | 495 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | 676-BBGA, FCBGA | YES | 676 | DDR3 | 400 | -40°C~100°C TJ | Tray | 2009 | Artix-7 | e1 | yes | 活跃 | 4 (72 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | 0.95V~1.05V | BOTTOM | BALL | 未说明 | 1V | 1mm | 未说明 | XC7A200T | 676 | 400 | 不合格 | 1V | 1GB | 1.6MB | 1286MHz | 现场可编程门阵列 | 215360 | 13455360 | 16825 | -2 | 269200 | 1.05 ns | 2.54mm | 27mm | 27mm | ROHS3 Compliant | ||||||||||||||||||||||
![]() | XC6SLX75-2FGG484I | Xilinx Inc. | 数据表 | 990 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | 表面贴装 | 484-BBGA | 484 | 280 | -40°C~100°C TJ | Tray | 2008 | Spartan®-6 LX | e1 | yes | 活跃 | 3 (168 Hours) | 484 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 1.14V~1.26V | BOTTOM | BALL | 250 | 1.2V | 1mm | 30 | XC6SLX75 | 484 | 280 | 不合格 | 1.2V | 387kB | 667MHz | 现场可编程门阵列 | 74637 | 3170304 | 5831 | 2 | 93296 | Unknown | ROHS3 Compliant | ||||||||||||||||||||||||||||
![]() | XC7A200T-1SBG484C | Xilinx Inc. | 数据表 | 990 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | 484-FBGA, FCBGA | YES | DDR3 | 285 | 0°C~85°C TJ | Tray | 2009 | Artix-7 | e1 | yes | 活跃 | 4 (72 Hours) | 484 | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 0.95V~1.05V | BOTTOM | BALL | 1V | 0.8mm | XC7A200T | 484 | S-PBGA-B484 | 285 | 1V | 1GB | 1.6MB | 1098MHz | 130 ps | 130 ps | 285 | 现场可编程门阵列 | 215360 | 13455360 | 16825 | -1 | 269200 | 1.27 ns | 2.44mm | 19mm | 19mm | 无 | ROHS3 Compliant | |||||||||||||||||||||
![]() | XC7K160T-2FBG484C | Xilinx Inc. | 数据表 | 990 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | 484-BBGA, FCBGA | YES | 285 | 0°C~85°C TJ | Tray | 2010 | Kintex®-7 | e1 | yes | 活跃 | 4 (72 Hours) | 484 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | 0.97V~1.03V | BOTTOM | BALL | 1V | 1mm | XC7K160 | 484 | S-PBGA-B484 | 285 | 11.83.3V | 1.4MB | 1286MHz | 100 ps | 285 | 现场可编程门阵列 | 162240 | 11980800 | 12675 | -2 | 202800 | 0.61 ns | 2.54mm | 23mm | 23mm | 无 | ROHS3 Compliant | ||||||||||||||||||||||||
![]() | XC6SLX4-2TQG144I | Xilinx Inc. | 数据表 | 657 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | Tin | 表面贴装 | 表面贴装 | 144-LQFP | 144 | 102 | -40°C~100°C TJ | Tray | 2008 | Spartan®-6 LX | e3 | yes | 活跃 | 3 (168 Hours) | 144 | EAR99 | 1.14V~1.26V | QUAD | 鸥翼 | 260 | 1.2V | 0.5mm | 30 | XC6SLX4 | 144 | 100 | 不合格 | 1.2V | 27kB | 667MHz | 现场可编程门阵列 | 3840 | 221184 | 300 | 600 | 2 | 4800 | 300 | 1.6mm | 无SVHC | ROHS3 Compliant | ||||||||||||||||||||||||||
![]() | XC6SLX45T-3FGG484I | Xilinx Inc. | 数据表 | 149 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 484-BBGA | 484 | 296 | -40°C~100°C TJ | Tray | 2008 | Spartan®-6 LXT | e1 | yes | 活跃 | 3 (168 Hours) | 484 | 1.14V~1.26V | BOTTOM | BALL | 250 | 1.2V | 1mm | 30 | XC6SLX45 | 484 | 296 | 不合格 | 1.2V | 261kB | 862MHz | 现场可编程门阵列 | 43661 | 2138112 | 3411 | 3 | 54576 | 0.21 ns | 2.6mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||
![]() | XC7K325T-1FBG676C | Xilinx Inc. | 数据表 | 970 In Stock | - | 最小起订量: 1 最小包装量: 1 | 11 Weeks | Copper, Silver, Tin | 表面贴装 | 676-BBGA, FCBGA | YES | 676 | DDR3 | 400 | 0°C~85°C TJ | Tray | 2009 | Kintex®-7 | e1 | yes | 活跃 | 4 (72 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | 0.97V~1.03V | BOTTOM | BALL | 未说明 | 1V | 1mm | 未说明 | XC7K325T | 676 | 400 | 不合格 | 11.83.3V | 1GB | 2MB | 1098MHz | 现场可编程门阵列 | 326080 | 16404480 | 25475 | -1 | 407600 | 0.74 ns | 2.54mm | 27mm | 27mm | ROHS3 Compliant | ||||||||||||||||||||||
![]() | XC7A100T-2FGG484C | Xilinx Inc. | 数据表 | 7340 In Stock | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 表面贴装 | 484-BBGA | YES | 484 | 285 | 0°C~85°C TJ | Tray | 2009 | Artix-7 | e1 | yes | 活跃 | 3 (168 Hours) | 484 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | 0.95V~1.05V | BOTTOM | BALL | 未说明 | 1V | 1mm | 未说明 | XC7A100T | 484 | 285 | 不合格 | 1V | 607.5kB | 1286MHz | 现场可编程门阵列 | 101440 | 4976640 | 7925 | -2 | 126800 | 1.05 ns | 2.6mm | 23mm | 23mm | ROHS3 Compliant | |||||||||||||||||||||||||
![]() | XC6SLX25T-2CSG324I | Xilinx Inc. | 数据表 | 3780 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | 表面贴装 | 324-LFBGA, CSPBGA | 324 | 190 | -40°C~100°C TJ | Tray | 2008 | Spartan®-6 LXT | e1 | yes | 活跃 | 3 (168 Hours) | 324 | EAR99 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 1.14V~1.26V | BOTTOM | BALL | 260 | 1.2V | 0.8mm | 30 | XC6SLX25 | 324 | 190 | 不合格 | 1.2V | 117kB | 667MHz | 现场可编程门阵列 | 24051 | 958464 | 1879 | 2 | 30064 | 1.5mm | 15mm | 15mm | ROHS3 Compliant |
XC6SLX9-2CSG324C
Xilinx Inc.
分类:Embedded - FPGAs (Field Programmable Gate Array)
XC7K160T-1FFG676I
Xilinx Inc.
分类:Embedded - FPGAs (Field Programmable Gate Array)
XC6SLX9-2FTG256I
Xilinx Inc.
分类:Embedded - FPGAs (Field Programmable Gate Array)
XC7K410T-2FFG900I
Xilinx Inc.
分类:Embedded - FPGAs (Field Programmable Gate Array)
XC7K410T-2FFG676I
Xilinx Inc.
分类:Embedded - FPGAs (Field Programmable Gate Array)
XC6SLX9-2CSG225C
Xilinx Inc.
分类:Embedded - FPGAs (Field Programmable Gate Array)
XC7A200T-2FBG676C
Xilinx Inc.
分类:Embedded - FPGAs (Field Programmable Gate Array)
XC7A35T-1FTG256C
Xilinx Inc.
分类:Embedded - FPGAs (Field Programmable Gate Array)
XC6SLX45T-3FGG484C
Xilinx Inc.
分类:Embedded - FPGAs (Field Programmable Gate Array)
XC7A200T-1FBG676C
Xilinx Inc.
分类:Embedded - FPGAs (Field Programmable Gate Array)
XC7A100T-2FGG484I
Xilinx Inc.
分类:Embedded - FPGAs (Field Programmable Gate Array)
XC7K160T-2FBG676C
Xilinx Inc.
分类:Embedded - FPGAs (Field Programmable Gate Array)
XC3S50A-4TQG144C
Xilinx Inc.
分类:Embedded - FPGAs (Field Programmable Gate Array)
XC7K70T-2FBG484I
Xilinx Inc.
分类:Embedded - FPGAs (Field Programmable Gate Array)
XC3S700AN-4FGG484C
Xilinx Inc.
分类:Embedded - FPGAs (Field Programmable Gate Array)
XC3S200AN-4FTG256I
Xilinx Inc.
分类:Embedded - FPGAs (Field Programmable Gate Array)
XC7A200T-2FBG676I
Xilinx Inc.
分类:Embedded - FPGAs (Field Programmable Gate Array)
XC6SLX75-2FGG484I
Xilinx Inc.
分类:Embedded - FPGAs (Field Programmable Gate Array)
XC7A200T-1SBG484C
Xilinx Inc.
分类:Embedded - FPGAs (Field Programmable Gate Array)
XC7K160T-2FBG484C
Xilinx Inc.
分类:Embedded - FPGAs (Field Programmable Gate Array)
XC6SLX4-2TQG144I
Xilinx Inc.
分类:Embedded - FPGAs (Field Programmable Gate Array)
XC6SLX45T-3FGG484I
Xilinx Inc.
分类:Embedded - FPGAs (Field Programmable Gate Array)
XC7K325T-1FBG676C
Xilinx Inc.
分类:Embedded - FPGAs (Field Programmable Gate Array)
XC7A100T-2FGG484C
Xilinx Inc.
分类:Embedded - FPGAs (Field Programmable Gate Array)
XC6SLX25T-2CSG324I
Xilinx Inc.
分类:Embedded - FPGAs (Field Programmable Gate Array)
