Xilinx的微控制器_正品采购_价格信息

品牌是'Xilinx' (95)

产品型号	品牌	数据表	库存	价格(含增值税)	数量	表面安装	终端数量	Date Of Intro				厂商														操作温度	系列	尺寸/尺寸	JESD-609代码	连接器类型	端子表面处理	HTS代码	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	Reach合规守则	时间@峰值回流温度-最大值(s)	JESD-30代码	温度等级	速度	内存大小	uPs/uCs/外围ICs类型	核心架构	总线兼容性	模块/板式	闪光大小
SM-K26-XCL2GC	Xilinx	数据表	2034 In Stock	1: ¥3,009.718776 10: ¥2,839.357337 100: ¥2,678.638994 500: ¥2,527.017923 查看所有的价格 -	最小起订量: 1 最小包装量: 1	AMD 赛灵思	活跃				Silicon Power Cube	Kria SOM Carrier Card	Box	0°C ~ 85°C (TJ)	Zynq® UltraScale+™ Kria™	3.030 L x 2.360 W (77.00mm x 60.00mm)		2 x 240 Pin										533MHz, 1.333GHz	4GB		ARM® Cortex®-A53		ARM		FPGA核心	16GB eMMC, 64MB QSPI	Kria K26 System-on-Module XCK26-SFVC784-2LV-C	Arm® Cortex®-R5F
XCZU4CG-2LFBVB900I	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	900		,	4	100 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA900,30X30,40	SQUARE	网格排列	0.85 V		有	Transferred	XILINX INC			e1		Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	8542.31.00.01	BOTTOM	BALL	245	1 mm	compliant	30	S-PBGA-B900	INDUSTRIAL			PROGRAMMABLE SoC		2.88 mm		CAN, I2C, SPI, UART			31 mm	31 mm
XCZU17EG-2LFFVE1924E	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	1924	2018-03-09	PLASTIC/EPOXY	BGA	BGA1924,44X44,40	SQUARE	网格排列	0.85 V	有	Transferred	XILINX INC		4	110 °C			e1		Tin/Silver/Copper (Sn/Ag/Cu)	8542.31.00.01	BOTTOM	BALL	245	1 mm	compliant	30	S-PBGA-B1924	OTHER			PROGRAMMABLE SoC		3.71 mm		CAN, I2C, SPI, UART			45 mm	45 mm
XCZU7CG-1LFBVB900I	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	900	2018-03-09	100 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA900,30X30,40	SQUARE	网格排列	0.85 V	有	Transferred	XILINX INC		4			e1		Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	8542.31.00.01	BOTTOM	BALL		1 mm	compliant		S-PBGA-B900	INDUSTRIAL			PROGRAMMABLE SoC		2.88 mm		CAN, I2C, SPI, UART			31 mm	31 mm
XCZU19EG-2LFFVE1924E	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	1924	2018-03-09	PLASTIC/EPOXY	BGA	BGA1924,44X44,40	SQUARE	网格排列	0.85 V	有	Transferred	XILINX INC		4	110 °C			e1		Tin/Silver/Copper (Sn/Ag/Cu)	8542.31.00.01	BOTTOM	BALL	245	1 mm	compliant	30	S-PBGA-B1924	OTHER			PROGRAMMABLE SoC		3.71 mm		CAN, I2C, SPI, UART			45 mm	45 mm
XCZU2EG-2LSBVA484E	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	484	2018-03-09	PLASTIC/EPOXY	FBGA	BGA484,22X22,32	SQUARE	GRID ARRAY, FINE PITCH	0.85 V	有	Transferred	XILINX INC		4	110 °C			e1		Tin/Silver/Copper (Sn/Ag/Cu)	8542.31.00.01	BOTTOM	BALL	250	0.8 mm	compliant	30	S-PBGA-B484	OTHER			PROGRAMMABLE SoC		2.61 mm		CAN, I2C, SPI, UART			19 mm	19 mm
XCZU7EG-1LFFVC1156I	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	1156	2018-03-09	100 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA1156,34X34,40	SQUARE	网格排列	0.85 V	有	Transferred	XILINX INC		4			e1		Tin/Silver/Copper (Sn/Ag/Cu)	8542.31.00.01	BOTTOM	BALL	245	1 mm	compliant	30	S-PBGA-B1156	INDUSTRIAL			PROGRAMMABLE SoC		3.51 mm		CAN, I2C, SPI, UART			35 mm	35 mm
XCZU7EV-2LFFVC1156E	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	1156	2018-03-09	PLASTIC/EPOXY	BGA	BGA1156,34X34,40	SQUARE	网格排列	0.85 V	有	Transferred	XILINX INC		4	110 °C			e1		Tin/Silver/Copper (Sn/Ag/Cu)	8542.31.00.01	BOTTOM	BALL	245	1 mm	compliant	30	S-PBGA-B1156	OTHER			PROGRAMMABLE SoC		3.51 mm		CAN, I2C, SPI, UART			35 mm	35 mm
XCZU6EG-1LFFVC900I	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	900	2018-03-09	BGA	PLASTIC/EPOXY	-40 °C	100 °C	4	XILINX INC	Transferred	有	0.85 V	网格排列	SQUARE		BGA900,30X30,40			e1		Tin/Silver/Copper (Sn/Ag/Cu)	8542.31.00.01	BOTTOM	BALL	245	1 mm	compliant	30	S-PBGA-B900	INDUSTRIAL			PROGRAMMABLE SoC		3.42 mm		CAN, I2C, SPI, UART			31 mm	31 mm
XCZU4EV-1LFBVB900I	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	900	2018-03-09	100 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA900,30X30,40	SQUARE	网格排列	0.85 V	有	Transferred	XILINX INC		4			e1		Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	8542.31.00.01	BOTTOM	BALL		1 mm	compliant		S-PBGA-B900	INDUSTRIAL			PROGRAMMABLE SoC		2.88 mm		CAN, I2C, SPI, UART			31 mm	31 mm
XCZU3EG-1LSFVA625I	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	625	2018-03-09	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	BGA625,25X25,32	SQUARE	GRID ARRAY, FINE PITCH	0.85 V	有	Transferred	XILINX INC		4			e1		Tin/Silver/Copper (Sn/Ag/Cu)	8542.31.00.01	BOTTOM	BALL	250	0.8 mm	compliant	30	S-PBGA-B625	INDUSTRIAL			PROGRAMMABLE SoC		3.43 mm		CAN, I2C, SPI, UART			21 mm	21 mm
XCZU9CG-1LFFVC900I	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	900	2018-03-09	100 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA900,30X30,40	SQUARE	网格排列	0.85 V	有	Transferred	XILINX INC		4			e1		Tin/Silver/Copper (Sn/Ag/Cu)	8542.31.00.01	BOTTOM	BALL	245	1 mm	compliant	30	S-PBGA-B900	INDUSTRIAL			PROGRAMMABLE SoC		3.42 mm		CAN, I2C, SPI, UART			31 mm	31 mm
XCZU2CG-1LSFVA625I	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	625	2018-03-09	FBGA	PLASTIC/EPOXY	-40 °C	100 °C	4	XILINX INC	Transferred	有	0.85 V	GRID ARRAY, FINE PITCH	SQUARE		BGA625,25X25,32			e1		Tin/Silver/Copper (Sn/Ag/Cu)	8542.31.00.01	BOTTOM	BALL	250	0.8 mm	compliant	30	S-PBGA-B625	INDUSTRIAL			PROGRAMMABLE SoC		3.43 mm		CAN, I2C, SPI, UART			21 mm	21 mm
XCZU3EG-2LSFVC784E	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	784	2018-03-09	PLASTIC/EPOXY	FBGA	BGA784,28X28,32	SQUARE	GRID ARRAY, FINE PITCH	0.85 V	有	Transferred	XILINX INC		4	110 °C			e1		锡银铜	8542.31.00.01	BOTTOM	BALL	250	0.8 mm	compliant	30	S-PBGA-B784	OTHER			PROGRAMMABLE SoC		3.32 mm		CAN, I2C, SPI, UART			23 mm	23 mm
XCZU7CG-2LFBVB900I	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	900		,	4	100 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA900,30X30,40	SQUARE	网格排列	0.85 V		有	Transferred	XILINX INC			e1		Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	8542.31.00.01	BOTTOM	BALL	245	1 mm	compliant	30	S-PBGA-B900	INDUSTRIAL			PROGRAMMABLE SoC		2.88 mm		CAN, I2C, SPI, UART			31 mm	31 mm
XCZU17EG-1LFFVE1924I	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	1924	2018-03-09	100 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA1924,44X44,40	SQUARE	网格排列	0.85 V	有	Transferred	XILINX INC		4			e1		Tin/Silver/Copper (Sn/Ag/Cu)	8542.31.00.01	BOTTOM	BALL	245	1 mm	compliant	30	S-PBGA-B1924	INDUSTRIAL			PROGRAMMABLE SoC		3.71 mm		CAN, I2C, SPI, UART			45 mm	45 mm
XCZU2CG-2LSBVA484I	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	484	Transferred	XILINX INC	,	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	BGA484,22X22,32	SQUARE		GRID ARRAY, FINE PITCH	0.85 V	有							8542.31.00.01	BOTTOM	BALL		0.8 mm	compliant		S-PBGA-B484	INDUSTRIAL			PROGRAMMABLE SoC		2.61 mm		CAN, I2C, SPI, UART			19 mm	19 mm
XCZU5CG-2LFBVB900E	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	900	2018-03-09	PLASTIC/EPOXY	BGA	BGA900,30X30,40	SQUARE	网格排列	0.85 V	有	Transferred	XILINX INC		4	110 °C			e1		Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	8542.31.00.01	BOTTOM	BALL		1 mm	compliant		S-PBGA-B900	OTHER			PROGRAMMABLE SoC		2.88 mm		CAN, I2C, SPI, UART			31 mm	31 mm
XCZU4CG-1LSFVC784I	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	784	2018-03-09	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	BGA784,28X28,32	SQUARE	GRID ARRAY, FINE PITCH	0.85 V	有	Transferred	XILINX INC		4			e1		锡银铜	8542.31.00.01	BOTTOM	BALL	250	0.8 mm	compliant	30	S-PBGA-B784	INDUSTRIAL			PROGRAMMABLE SoC		3.32 mm		CAN, I2C, SPI, UART			23 mm	23 mm
XCZU11EG-1LFFVC1156I	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	1156	2018-03-09	100 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA1156,34X34,40	SQUARE	网格排列	0.85 V	有	Transferred	XILINX INC		4			e1		Tin/Silver/Copper (Sn/Ag/Cu)	8542.31.00.01	BOTTOM	BALL	245	1 mm	compliant	30	S-PBGA-B1156	INDUSTRIAL			PROGRAMMABLE SoC		3.51 mm		CAN, I2C, SPI, UART			35 mm	35 mm
XCZU3CG-2LSFVA625E	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	625	2018-03-09	PLASTIC/EPOXY	FBGA	BGA625,25X25,32	SQUARE	GRID ARRAY, FINE PITCH	0.85 V	有	Transferred	XILINX INC		4	110 °C			e1		Tin/Silver/Copper (Sn/Ag/Cu)	8542.31.00.01	BOTTOM	BALL	250	0.8 mm	compliant	30	S-PBGA-B625	OTHER			PROGRAMMABLE SoC		3.43 mm		CAN, I2C, SPI, UART			21 mm	21 mm
XCZU15EG-2LFFVC900E	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	900	2018-03-09	PLASTIC/EPOXY	BGA	BGA900,30X30,40	SQUARE	网格排列	0.85 V	有	Transferred	XILINX INC		4	110 °C			e1		Tin/Silver/Copper (Sn/Ag/Cu)	8542.31.00.01	BOTTOM	BALL	245	1 mm	compliant	30	S-PBGA-B900	OTHER			PROGRAMMABLE SoC		3.42 mm		CAN, I2C, SPI, UART			31 mm	31 mm
XCZU5EG-2LFBVB900E	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	900	2018-03-09	PLASTIC/EPOXY	BGA	BGA900,30X30,40	SQUARE	网格排列	0.85 V	有	Transferred	XILINX INC		4	110 °C			e1		Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	8542.31.00.01	BOTTOM	BALL		1 mm	compliant		S-PBGA-B900	OTHER			PROGRAMMABLE SoC		2.88 mm		CAN, I2C, SPI, UART			31 mm	31 mm
XCZU9CG-2LFFVB1156I	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	1156	,	100 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA1156,34X34,40	SQUARE	网格排列	0.85 V		有	Transferred	XILINX INC							8542.31.00.01	BOTTOM	BALL		1 mm	compliant		S-PBGA-B1156	INDUSTRIAL			PROGRAMMABLE SoC		3.42 mm		CAN, I2C, SPI, UART			35 mm	35 mm
XCZU2EG-2LSFVA625E	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	625	2018-03-09	PLASTIC/EPOXY	FBGA	BGA625,25X25,32	SQUARE	GRID ARRAY, FINE PITCH	0.85 V	有	Transferred	XILINX INC		4	110 °C			e1		Tin/Silver/Copper (Sn/Ag/Cu)	8542.31.00.01	BOTTOM	BALL	250	0.8 mm	compliant	30	S-PBGA-B625	OTHER			PROGRAMMABLE SoC		3.43 mm		CAN, I2C, SPI, UART			21 mm	21 mm