Xilinx的微控制器_正品采购_价格信息

品牌是'Xilinx' (95)

产品型号	品牌	数据表	库存	价格(含增值税)	数量	表面安装	终端数量	Date Of Intro														JESD-609代码	端子表面处理	HTS代码	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	Reach合规守则	时间@峰值回流温度-最大值(s)	JESD-30代码	温度等级	uPs/uCs/外围ICs类型	座位高度-最大	总线兼容性	长度	宽度
XCZU19EG-2LFFVB1517E	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	1517	2018-03-09	XILINX INC	4	110 °C	PLASTIC/EPOXY	BGA	BGA1517,39X39,40	SQUARE	网格排列	0.85 V	有	Transferred	e1	Tin/Silver/Copper (Sn/Ag/Cu)	8542.31.00.01	BOTTOM	BALL	245	1 mm	compliant	30	S-PBGA-B1517	OTHER	PROGRAMMABLE SoC	3.51 mm	CAN, I2C, SPI, UART	40 mm	40 mm
XCZU19EG-1LFFVE1924I	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	1924	2018-03-09	Transferred	XILINX INC	4	100 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA1924,44X44,40	SQUARE	网格排列	0.85 V	有	e1	Tin/Silver/Copper (Sn/Ag/Cu)	8542.31.00.01	BOTTOM	BALL	245	1 mm	compliant	30	S-PBGA-B1924	INDUSTRIAL	PROGRAMMABLE SoC	3.71 mm	CAN, I2C, SPI, UART	45 mm	45 mm
XCZU4CG-2LFBVB900E	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	900	2018-03-09	XILINX INC	4	110 °C	PLASTIC/EPOXY	BGA	BGA900,30X30,40	SQUARE	网格排列	0.85 V	有	Transferred	e1	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	8542.31.00.01	BOTTOM	BALL		1 mm	compliant		S-PBGA-B900	OTHER	PROGRAMMABLE SoC	2.88 mm	CAN, I2C, SPI, UART	31 mm	31 mm
XCZU2EG-2LSFVC784I	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	784		有	Transferred	XILINX INC	,	4	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	BGA784,28X28,32	SQUARE	GRID ARRAY, FINE PITCH	0.85 V	e1	锡银铜	8542.31.00.01	BOTTOM	BALL	250	0.8 mm	compliant	30	S-PBGA-B784	INDUSTRIAL	PROGRAMMABLE SoC	3.32 mm	CAN, I2C, SPI, UART	23 mm	23 mm
XCZU5CG-2LSFVC784I	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	784		有	Transferred	XILINX INC	,	4	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	BGA784,28X28,32	SQUARE	GRID ARRAY, FINE PITCH	0.85 V	e1	锡银铜	8542.31.00.01	BOTTOM	BALL	250	0.8 mm	compliant	30	S-PBGA-B784	INDUSTRIAL	PROGRAMMABLE SoC	3.32 mm	CAN, I2C, SPI, UART	23 mm	23 mm
XCZU19EG-2LFFVD1760E	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	1760	2018-03-09	XILINX INC	4	110 °C	PLASTIC/EPOXY	BGA	BGA1760,42X42,40	SQUARE	网格排列	0.85 V	有	Transferred	e1	Tin/Silver/Copper (Sn/Ag/Cu)	8542.31.00.01	BOTTOM	BALL	245	1 mm	compliant	30	S-PBGA-B1760	OTHER	PROGRAMMABLE SoC	3.71 mm	CAN, I2C, SPI, UART	42.5 mm	42.5 mm
XCZU7CG-2LFFVC1156E	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	1156	2018-03-09	XILINX INC	4	110 °C	PLASTIC/EPOXY	BGA	BGA1156,34X34,40	SQUARE	网格排列	0.85 V	有	Transferred	e1	Tin/Silver/Copper (Sn/Ag/Cu)	8542.31.00.01	BOTTOM	BALL	245	1 mm	compliant	30	S-PBGA-B1156	OTHER	PROGRAMMABLE SoC	3.51 mm	CAN, I2C, SPI, UART	35 mm	35 mm
XCZU6CG-2LFFVB1156I	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	1156	有	Transferred	XILINX INC	,	100 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA1156,34X34,40	SQUARE	网格排列	0.85 V				8542.31.00.01	BOTTOM	BALL		1 mm	compliant		S-PBGA-B1156	INDUSTRIAL	PROGRAMMABLE SoC	3.42 mm	CAN, I2C, SPI, UART	35 mm	35 mm
XCZU7CG-2LFFVF1517I	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	1517	有	Transferred	XILINX INC	,	100 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA1517,39X39,40	SQUARE	网格排列	0.85 V				8542.31.00.01	BOTTOM	BALL		1 mm	compliant		S-PBGA-B1517	INDUSTRIAL	PROGRAMMABLE SoC	3.51 mm	CAN, I2C, SPI, UART	40 mm	40 mm
XCZU9CG-1LFFVB1156I	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	1156	2018-03-09	Transferred	XILINX INC	4	100 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA1156,34X34,40	SQUARE	网格排列	0.85 V	有	e1	Tin/Silver/Copper (Sn/Ag/Cu)	8542.31.00.01	BOTTOM	BALL	245	1 mm	compliant	30	S-PBGA-B1156	INDUSTRIAL	PROGRAMMABLE SoC	3.42 mm	CAN, I2C, SPI, UART	35 mm	35 mm
XCZU6CG-1LFFVC900I	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	900	2018-03-09	Transferred	XILINX INC	4	100 °C	-40 °C	PLASTIC/EPOXY	BGA	BGA900,30X30,40	SQUARE	网格排列	0.85 V	有	e1	Tin/Silver/Copper (Sn/Ag/Cu)	8542.31.00.01	BOTTOM	BALL	245	1 mm	compliant	30	S-PBGA-B900	INDUSTRIAL	PROGRAMMABLE SoC	3.42 mm	CAN, I2C, SPI, UART	31 mm	31 mm
XCZU3CG-2LSBVA484E	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	484	2018-03-09	XILINX INC	4	110 °C	PLASTIC/EPOXY	FBGA	BGA484,22X22,32	SQUARE	GRID ARRAY, FINE PITCH	0.85 V	有	Transferred	e1	Tin/Silver/Copper (Sn/Ag/Cu)	8542.31.00.01	BOTTOM	BALL	250	0.8 mm	compliant	30	S-PBGA-B484	OTHER	PROGRAMMABLE SoC	2.61 mm	CAN, I2C, SPI, UART	19 mm	19 mm
XCZU6CG-2LFFVC900E	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	900	2018-03-09	XILINX INC	4	110 °C	PLASTIC/EPOXY	BGA	BGA900,30X30,40	SQUARE	网格排列	0.85 V	有	Transferred	e1	Tin/Silver/Copper (Sn/Ag/Cu)	8542.31.00.01	BOTTOM	BALL	245	1 mm	compliant	30	S-PBGA-B900	OTHER	PROGRAMMABLE SoC	3.42 mm	CAN, I2C, SPI, UART	31 mm	31 mm
XCZU3EG-2LSFVC784I	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	784		有	Transferred	XILINX INC	,	4	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	BGA784,28X28,32	SQUARE	GRID ARRAY, FINE PITCH	0.85 V	e1	锡银铜	8542.31.00.01	BOTTOM	BALL	250	0.8 mm	compliant	30	S-PBGA-B784	INDUSTRIAL	PROGRAMMABLE SoC	3.32 mm	CAN, I2C, SPI, UART	23 mm	23 mm
XCZU2EG-1LSBVA484I	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	484	2018-03-09	Transferred	XILINX INC	4	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	BGA484,22X22,32	SQUARE	GRID ARRAY, FINE PITCH	0.85 V	有	e1	Tin/Silver/Copper (Sn/Ag/Cu)	8542.31.00.01	BOTTOM	BALL	250	0.8 mm	compliant	30	S-PBGA-B484	INDUSTRIAL	PROGRAMMABLE SoC	2.61 mm	CAN, I2C, SPI, UART	19 mm	19 mm
XCZU6EG-2LFFVB1156E	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	1156	2018-03-09	XILINX INC	4	110 °C	PLASTIC/EPOXY	BGA	BGA1156,34X34,40	SQUARE	网格排列	0.85 V	有	Transferred	e1	Tin/Silver/Copper (Sn/Ag/Cu)	8542.31.00.01	BOTTOM	BALL	245	1 mm	compliant	30	S-PBGA-B1156	OTHER	PROGRAMMABLE SoC	3.42 mm	CAN, I2C, SPI, UART	35 mm	35 mm
XCZU9CG-2LFFVC900E	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	900	2018-03-09	XILINX INC	4	110 °C	PLASTIC/EPOXY	BGA	BGA900,30X30,40	SQUARE	网格排列	0.85 V	有	Transferred	e1	Tin/Silver/Copper (Sn/Ag/Cu)	8542.31.00.01	BOTTOM	BALL	245	1 mm	compliant	30	S-PBGA-B900	OTHER	PROGRAMMABLE SoC	3.42 mm	CAN, I2C, SPI, UART	31 mm	31 mm
XCZU3EG-1LSBVA484I	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	484	2018-03-09	Transferred	XILINX INC	4	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	BGA484,22X22,32	SQUARE	GRID ARRAY, FINE PITCH	0.85 V	有	e1	Tin/Silver/Copper (Sn/Ag/Cu)	8542.31.00.01	BOTTOM	BALL	250	0.8 mm	compliant	30	S-PBGA-B484	INDUSTRIAL	PROGRAMMABLE SoC	2.61 mm	CAN, I2C, SPI, UART	19 mm	19 mm
XCZU2CG-2LSFVC784I	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	784		有	Transferred	XILINX INC	,	4	100 °C	-40 °C	PLASTIC/EPOXY	FBGA	BGA784,28X28,32	SQUARE	GRID ARRAY, FINE PITCH	0.85 V	e1	锡银铜	8542.31.00.01	BOTTOM	BALL	250	0.8 mm	compliant	30	S-PBGA-B784	INDUSTRIAL	PROGRAMMABLE SoC	3.32 mm	CAN, I2C, SPI, UART	23 mm	23 mm
XCZU7EG-2LFFVC1156E	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	1156	2018-03-09	XILINX INC	4	110 °C	PLASTIC/EPOXY	BGA	BGA1156,34X34,40	SQUARE	网格排列	0.85 V	有	Transferred	e1	Tin/Silver/Copper (Sn/Ag/Cu)	8542.31.00.01	BOTTOM	BALL	245	1 mm	compliant	30	S-PBGA-B1156	OTHER	PROGRAMMABLE SoC	3.51 mm	CAN, I2C, SPI, UART	35 mm	35 mm