对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

表面安装

终端数量

JESD-609代码

无铅代码

ECCN 代码

端子表面处理

附加功能

HTS代码

端子位置

终端形式

峰值回流焊温度(摄氏度)

端子间距

Reach合规守则

时间@峰值回流温度-最大值(s)

引脚数量

JESD-30代码

输出的数量

资历状况

温度等级

传播延迟

建筑学

输入数量

组织结构

座位高度-最大

可编程逻辑类型

输出功能

宏细胞数

JTAG BST

专用输入数量

系统内可编程

长度

宽度

PZ3128IS12A84
PZ3128IS12A84
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

84

PLASTIC/EPOXY

QCCJ

LDCC84,1.2SQ

SQUARE

CHIP CARRIER

3.3 V

Obsolete

XILINX INC

3

85 °C

-40 °C

e0

锡铅

YES

8542.39.00.01

QUAD

J BEND

225

1.27 mm

unknown

30

S-PQCC-J84

不合格

INDUSTRIAL

14.5 ns

EE PLD

128

YES

YES

XC95576-12HQ304
XC95576-12HQ304
AMD Xilinx 数据表

857 In Stock

-

最小起订量: 1

最小包装量: 1

YES

304

5 V

FLATPACK, HEAT SINK/SLUG, FINE PITCH

SQUARE

HFQFP

PLASTIC/EPOXY

232

3

100 MHz

Obsolete

XILINX INC

QFP

HFQFP,

e0

3A991.D

锡铅

3.3 OR 5V I/O CAPABILITY

8542.39.00.01

QUAD

鸥翼

0.5 mm

compliant

304

S-PQFP-G304

不合格

232 I/O

4.5 mm

闪存 PLD

MACROCELL

40 mm

40 mm

XC9536XV-5CSG48I
XC9536XV-5CSG48I
AMD Xilinx 数据表

719 In Stock

-

最小起订量: 1

最小包装量: 1

YES

48

85 °C

-40 °C

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

2.6 V

2.4 V

2.5 V

FBGA,

BGA

XILINX INC

Obsolete

3

36

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

BOTTOM

BALL

未说明

0.8 mm

compliant

未说明

48

S-PBGA-B48

不合格

INDUSTRIAL

3.5 ns

0 DEDICATED INPUTS, 36 I/O

1.8 mm

闪存 PLD

REGISTERED

7 mm

7 mm

PZ5064-7A68-T
PZ5064-7A68-T
AMD Xilinx 数据表

497 In Stock

-

最小起订量: 1

最小包装量: 1

YES

68

QCCJ,

105 MHz

48

70 °C

PLASTIC/EPOXY

QCCJ

LDCC68,1.0SQ

SQUARE

CHIP CARRIER

5.25 V

4.75 V

5 V

Obsolete

XILINX INC

LCC

64 MACROCELLS

8542.39.00.01

QUAD

J BEND

1.27 mm

unknown

68

S-PQCC-J68

不合格

COMMERCIAL

9.5 ns

2 DEDICATED INPUTS, 48 I/O

4.57 mm

EE PLD

MACROCELL

2

24.2316 mm

24.2316 mm

XC7372-15PQ100I
XC7372-15PQ100I
AMD Xilinx 数据表

893 In Stock

-

最小起订量: 1

最小包装量: 1

YES

100

Obsolete

XILINX INC

QFP

PLASTIC, QFP-100

52.6 MHz

3

42

85 °C

-40 °C

PLASTIC/EPOXY

QFP

QFP100,.7X.9

RECTANGULAR

FLATPACK

5.5 V

4.5 V

5 V

e0

锡铅

72 MACROCELLS; CONFIGURABLE I/O OPERATION-3.3V OR 5V; 3 EXTERNAL CLOCKS; 126 FLIP-FLOPS

8542.39.00.01

QUAD

鸥翼

225

0.65 mm

not_compliant

30

100

R-PQFP-G100

不合格

INDUSTRIAL

33 ns

12 DEDICATED INPUTS, 42 I/O

3.4 mm

OT PLD

MACROCELL

72

NO

12

NO

20 mm

14 mm

PZ3064I12BC
PZ3064I12BC
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

44

85 °C

-40 °C

PLASTIC/EPOXY

QFP

TQFP44,.47SQ,32

SQUARE

FLATPACK

3.3 V

Obsolete

XILINX INC

QFP, TQFP44,.47SQ,32

3

NO

8542.39.00.01

QUAD

鸥翼

240

0.8 mm

unknown

30

S-PQFP-G44

不合格

INDUSTRIAL

14.5 ns

EE PLD

64

NO

NO

PZ5064I10A44-T
PZ5064I10A44-T
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

44

QCCJ,

77 MHz

32

85 °C

-40 °C

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

5.5 V

4.5 V

5 V

Obsolete

XILINX INC

LPCC

64 MACROCELLS

8542.39.00.01

QUAD

J BEND

1.27 mm

unknown

44

S-PQCC-J44

不合格

INDUSTRIAL

12.5 ns

2 DEDICATED INPUTS, 32 I/O

4.57 mm

EE PLD

MACROCELL

2

16.5862 mm

16.5862 mm

PZ5128IS15A84
PZ5128IS15A84
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

84

PLASTIC/EPOXY

QCCJ

LDCC84,1.2SQ

SQUARE

CHIP CARRIER

5 V

Obsolete

XILINX INC

3

85 °C

-40 °C

e0

锡铅

YES

8542.39.00.01

QUAD

J BEND

225

1.27 mm

unknown

30

S-PQCC-J84

不合格

INDUSTRIAL

17.5 ns

EE PLD

128

YES

YES

XH95288-10HQ208I
XH95288-10HQ208I
AMD Xilinx 数据表

378 In Stock

-

最小起订量: 1

最小包装量: 1

YES

208

168

PLASTIC/EPOXY

HFQFP

SQUARE

FLATPACK, HEAT SINK/SLUG, FINE PITCH

5 V

Transferred

XILINX INC

QFP

HEAT SINK, QFP-208

3

e0

锡铅

8542.39.00.01

QUAD

鸥翼

0.5 mm

compliant

208

S-PQFP-G208

不合格

0 DEDICATED INPUTS, 168 I/O

4.1 mm

MASK PLD

MACROCELL

28 mm

28 mm

XC7354-12WC44C
XC7354-12WC44C
AMD Xilinx 数据表

203 In Stock

-

最小起订量: 1

最小包装量: 1

YES

44

Obsolete

XILINX INC

LCC

WQCCJ, LDCC44,.7SQ

66.7 MHz

1

25

70 °C

CERAMIC, METAL-SEALED COFIRED

WQCCJ

LDCC44,.7SQ

SQUARE

CHIP CARRIER, WINDOW

5.25 V

4.75 V

5 V

54 MACROCELLS; CONFIGURABLE I/O OPERATION-3.3V OR 5V; 2 EXTERNAL CLOCKS; 108 FLIP-FLOPS

8542.39.00.01

QUAD

J BEND

1.27 mm

unknown

44

S-CQCC-J44

不合格

COMMERCIAL

27 ns

8 DEDICATED INPUTS, 25 I/O

4.826 mm

UV PLD

MACROCELL

54

NO

8

NO

16.51 mm

16.51 mm

PZ3032AS7BC-T
PZ3032AS7BC-T
AMD Xilinx 数据表

89 In Stock

-

最小起订量: 1

最小包装量: 1

YES

44

80 MHz

32

70 °C

PLASTIC/EPOXY

TQFP

SQUARE

FLATPACK, THIN PROFILE

3.63 V

2.97 V

3.3 V

Obsolete

XILINX INC

QFP

TQFP,

32 MACROCELLS

8542.39.00.01

QUAD

鸥翼

0.8 mm

unknown

44

S-PQFP-G44

不合格

COMMERCIAL

10 ns

2 DEDICATED INPUTS, 32 I/O

1.2 mm

EE PLD

MACROCELL

2

10 mm

10 mm

XC95144XV-4TQ100C
XC95144XV-4TQ100C
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

100

70 °C

PLASTIC/EPOXY

LFQFP

QFP100,.63SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

2.62 V

2.37 V

2.5 V

PLASTIC, TQFP-100

QFP

XILINX INC

Obsolete

3

81

e0

Tin/Lead (Sn85Pb15)

YES

8542.39.00.01

QUAD

鸥翼

225

0.5 mm

not_compliant

30

100

S-PQFP-G100

不合格

COMMERCIAL

4 ns

0 DEDICATED INPUTS, 81 I/O

1.6 mm

闪存 PLD

MACROCELL

144

YES

YES

14 mm

14 mm

XC95180-10PQ160C
XC95180-10PQ160C
AMD Xilinx 数据表

208 In Stock

-

最小起订量: 1

最小包装量: 1

YES

160

3

133

70 °C

PLASTIC/EPOXY

QFP

SQUARE

FLATPACK

5 V

Obsolete

XILINX INC

QFP

QFP,

e0

锡铅

8542.39.00.01

QUAD

鸥翼

0.65 mm

compliant

160

S-PQFP-G160

不合格

COMMERCIAL

10 ns

0 DEDICATED INPUTS, 133 I/O

4.1 mm

闪存 PLD

MACROCELL

28 mm

28 mm

PZ5128CS12BP-T
PZ5128CS12BP-T
AMD Xilinx 数据表

163 In Stock

-

最小起订量: 1

最小包装量: 1

YES

100

63 MHz

80

70 °C

PLASTIC/EPOXY

TFQFP

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

5.25 V

4.75 V

5 V

Obsolete

XILINX INC

QFP

TFQFP,

128 MACROCELLS

8542.39.00.01

QUAD

鸥翼

0.5 mm

unknown

100

S-PQFP-G100

不合格

COMMERCIAL

14.5 ns

2 DEDICATED INPUTS, 80 I/O

1.2 mm

EE PLD

MACROCELL

2

14 mm

14 mm

XC2C64-4PCG44C
XC2C64-4PCG44C
AMD Xilinx 数据表

939 In Stock

-

最小起订量: 1

最小包装量: 1

YES

44

XILINX INC

LCC

16.50 X 16.50 MM, 1.27 MM PITCH, PLASTIC, LCC-44

213 MHz

3

33

70 °C

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

1.9 V

1.7 V

1.8 V

Transferred

e3

哑光锡

FAST ZERO POWER DESIGN TECHNOLOGY

8542.39.00.01

QUAD

J BEND

245

1.27 mm

compliant

30

44

S-PQCC-J44

33

不合格

COMMERCIAL

4 ns

PLA-TYPE

33

0 DEDICATED INPUTS, 33 I/O

4.57 mm

闪存 PLD

MACROCELL

64

16.5862 mm

16.5862 mm

XH95144-10PQG100I
XH95144-10PQG100I
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

100

PLASTIC, QFP-100

83.3 MHz

3

81

PLASTIC/EPOXY

QFP

QFP100,.7X.9

RECTANGULAR

FLATPACK

5 V

Transferred

XILINX INC

QFP

e3

哑光锡

8542.39.00.01

QUAD

鸥翼

0.65 mm

compliant

100

R-PQFP-G100

81

不合格

10 ns

81

0 DEDICATED INPUTS, 81 I/O

2.87 mm

MASK PLD

MACROCELL

20 mm

14 mm

XC95288XL-6BG352C
XC95288XL-6BG352C
AMD Xilinx 数据表

227 In Stock

-

最小起订量: 1

最小包装量: 1

YES

352

Obsolete

XILINX INC

BGA

PLASTIC, BGA-352

151.5 MHz

3

192

70 °C

PLASTIC/EPOXY

LBGA

BGA352,26X26,50

SQUARE

GRID ARRAY, LOW PROFILE

3.6 V

3 V

3.3 V

e0

Tin/Lead (Sn63Pb37)

288 MACROCELLS

8542.39.00.01

BOTTOM

BALL

225

1.27 mm

not_compliant

30

352

S-PBGA-B352

不合格

COMMERCIAL

6 ns

0 DEDICATED INPUTS, 192 I/O

1.7 mm

闪存 PLD

MACROCELL

288

YES

YES

35 mm

35 mm

XH95216-10HQ208I
XH95216-10HQ208I
AMD Xilinx 数据表

351 In Stock

-

最小起订量: 1

最小包装量: 1

YES

208

168

PLASTIC/EPOXY

HFQFP

SQUARE

FLATPACK, HEAT SINK/SLUG, FINE PITCH

5 V

Transferred

XILINX INC

QFP

HEAT SINK, QFP-208

3

e0

锡铅

8542.39.00.01

QUAD

鸥翼

0.5 mm

compliant

208

S-PQFP-G208

不合格

0 DEDICATED INPUTS, 168 I/O

4.1 mm

MASK PLD

MACROCELL

28 mm

28 mm

XCR3256XL-12PQG208Q
XCR3256XL-12PQG208Q
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

208

XILINX INC

QFP

FQFP,

3

164

125 °C

-40 °C

PLASTIC/EPOXY

FQFP

SQUARE

FLATPACK, FINE PITCH

3.6 V

3 V

3.3 V

Obsolete

e3

Matte Tin (Sn)

8542.39.00.01

QUAD

鸥翼

245

0.5 mm

compliant

30

208

S-PQFP-G208

不合格

AUTOMOTIVE

12 ns

0 DEDICATED INPUTS, 164 I/O

4.1 mm

EE PLD

MACROCELL

28 mm

28 mm

XC95108F-15PQG100I
XC95108F-15PQG100I
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

100

Obsolete

XILINX INC

QFP

QFP,

56 MHz

3

81

85 °C

-40 °C

PLASTIC/EPOXY

QFP

RECTANGULAR

FLATPACK

5.5 V

4.5 V

5 V

e3

哑光锡

8542.39.00.01

QUAD

鸥翼

0.65 mm

compliant

100

R-PQFP-G100

不合格

INDUSTRIAL

15 ns

0 DEDICATED INPUTS, 81 I/O

3.4 mm

闪存 PLD

MACROCELL

20 mm

14 mm

P5Z22V10IDA-T
P5Z22V10IDA-T
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

28

QCCJ,

74 MHz

10

85 °C

-40 °C

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

5.5 V

4.5 V

5 V

Obsolete

XILINX INC

LCC

PROGRAMMABLE OUTPUT POLARITY; SYNCHRONOUS PRESET; ASYNCHRONOUS RESET

8542.39.00.01

QUAD

J BEND

1.27 mm

unknown

28

S-PQCC-J28

不合格

INDUSTRIAL

10 ns

11 DEDICATED INPUTS, 10 I/O

4.57 mm

EE PLD

MACROCELL

11

11.5062 mm

11.5062 mm

XCR5064-12VQ44I
XCR5064-12VQ44I
AMD Xilinx 数据表

824 In Stock

-

最小起订量: 1

最小包装量: 1

YES

44

Obsolete

XILINX INC

QFP

TQFP, TQFP44,.47SQ,32

67 MHz

3

32

85 °C

-40 °C

PLASTIC/EPOXY

TQFP

TQFP44,.47SQ,32

SQUARE

FLATPACK, THIN PROFILE

5.5 V

4.5 V

5 V

e0

锡铅

NO

8542.39.00.01

QUAD

鸥翼

240

0.8 mm

not_compliant

30

44

S-PQFP-G44

不合格

INDUSTRIAL

12 ns

2 DEDICATED INPUTS, 32 I/O

1.2 mm

EE PLD

MACROCELL

64

NO

2

NO

10 mm

10 mm

XCR3128-10PQ100C
XCR3128-10PQ100C
AMD Xilinx 数据表

559 In Stock

-

最小起订量: 1

最小包装量: 1

YES

100

Obsolete

XILINX INC

QFP

PLASTIC, QFP-100

77 MHz

3

80

70 °C

PLASTIC/EPOXY

QFP

QFP100,.7X.9

RECTANGULAR

FLATPACK

3.63 V

2.97 V

3.3 V

e0

锡铅

YES

8542.39.00.01

QUAD

鸥翼

225

0.65 mm

not_compliant

30

100

R-PQFP-G100

不合格

COMMERCIAL

10 ns

2 DEDICATED INPUTS, 80 I/O

3.4 mm

EE PLD

MACROCELL

128

YES

2

YES

20 mm

14 mm

XH95180-7HQG208I
XH95180-7HQG208I
AMD Xilinx 数据表

758 In Stock

-

最小起订量: 1

最小包装量: 1

YES

208

168

PLASTIC/EPOXY

HFQFP

SQUARE

FLATPACK, HEAT SINK/SLUG, FINE PITCH

5 V

Transferred

XILINX INC

QFP

HEAT SINK, QFP-208

3

e3

哑光锡

8542.39.00.01

QUAD

鸥翼

0.5 mm

compliant

208

S-PQFP-G208

不合格

0 DEDICATED INPUTS, 168 I/O

4.1 mm

MASK PLD

MACROCELL

28 mm

28 mm

XC7236A-20WC44M
XC7236A-20WC44M
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

44

Obsolete

XILINX INC

QFJ

WQCCJ, LDCC44,.7SQ

40 MHz

1

30

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

WQCCJ

LDCC44,.7SQ

SQUARE

CHIP CARRIER, WINDOW

5.5 V

4.5 V

5 V

3A001.A.2.C

PAL BLOCKS INTERCONNECTED BY PIA; 36 MACROCELLS; CONFIGURABLE I/O OPERATION-3.3V OR 5V

8542.39.00.01

QUAD

J BEND

1.27 mm

unknown

44

S-CQCC-J44

不合格

MILITARY

32 ns

2 DEDICATED INPUTS, 30 I/O

4.826 mm

UV PLD

MACROCELL

36

NO

2

NO

16.51 mm

16.51 mm