Xilinx的片上系统（SoC）_正品采购_价格信息

品牌是'Xilinx' (1945)

产品型号	品牌	数据表	库存	价格(含增值税)	数量	工厂交货时间	触点镀层	底架	包装/外壳	引脚数	供应商器件包装			操作温度	包装	已出版	系列	JESD-609代码	无铅代码	零件状态	湿度敏感性等级(MSL)	终止次数	ECCN 代码	端子表面处理	最高工作温度	最小工作温度	附加功能	HTS代码	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	Reach合规守则	频率	时间@峰值回流温度-最大值(s)	基本部件号	资历状况	工作电源电压	电源	电源电压-最小值(Vsup)	界面	速度	内存大小	uPs/uCs/外围ICs类型	核心处理器	周边设备	时钟频率	连接方式	建筑学	数据总线宽度	核心架构	边界扫描	内存(字)	主要属性	可擦除紫外线	座位高度(最大)	长度	RoHS状态
XCZU7EG-2FFVC1156I	Xilinx Inc.	数据表	162 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		1156-BBGA, FCBGA			360		-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)							8542.31.00.01			未说明				未说明							533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 504K+ Logic Cells				ROHS3 Compliant
XCZU11EG-1FFVC1760E	Xilinx Inc.	数据表	686 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		1760-BBGA, FCBGA			512		0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)							8542.31.00.01			未说明				未说明							500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 653K+ Logic Cells				ROHS3 Compliant
XCZU3EG-L1SFVC784I	Xilinx Inc.	数据表	662 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		784-BFBGA, FCBGA	YES		252		-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)	784					ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V			未说明		R-PBGA-B784		0.742V	0.698V		500MHz, 600MHz, 1.2GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 154K+ Logic Cells				ROHS3 Compliant
XCZU4EG-2SFVC784I	Xilinx Inc.	数据表	957 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		784-BFBGA, FCBGA			252		-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)							8542.31.00.01			未说明				未说明							533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 192K+ Logic Cells				ROHS3 Compliant
XCZU6EG-2FFVB1156I	Xilinx Inc.	数据表	551 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		1156-BBGA, FCBGA			328		-40°C~100°C TJ	Tray		Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)							8542.31.00.01			未说明				未说明							533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 469K+ Logic Cells				ROHS3 Compliant
XCZU5CG-1SFVC784E	Xilinx Inc.	数据表	404 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		784-BFBGA, FCBGA			252		0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)							8542.31.00.01			未说明				未说明							500MHz, 1.2GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 256K+ Logic Cells				ROHS3 Compliant
XCZU4CG-2SFVC784I	Xilinx Inc.	数据表	257 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		784-BFBGA, FCBGA	YES		252		-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)	784						8542.31.00.01	BOTTOM	BALL	未说明	0.85V			未说明		S-PBGA-B784					533MHz, 1.3GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 192K+ Logic Cells				ROHS3 Compliant
XCZU3CG-1SBVA484I	Xilinx Inc.	数据表	5 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		484-BFBGA, FCBGA			82		-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)							8542.31.00.01			未说明				未说明							500MHz, 1.2GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 154K+ Logic Cells				ROHS3 Compliant
XCZU6EG-L1FFVB1156I	Xilinx Inc.	数据表	569 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		1156-BBGA, FCBGA	YES		328		-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)						ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V			未说明		R-PBGA-B1156		0.742V	0.698V		500MHz, 600MHz, 1.2GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 469K+ Logic Cells				ROHS3 Compliant
XCZU2EG-L1SBVA484I	Xilinx Inc.	数据表	841 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		484-BFBGA, FCBGA	YES		82		-40°C~100°C TJ	Tray		Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)	484					ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V			未说明		R-PBGA-B484		0.742V	0.698V		500MHz, 600MHz, 1.2GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 103K+ Logic Cells				ROHS3 Compliant
XCZU4CG-2FBVB900E	Xilinx Inc.	数据表	928 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		900-BBGA, FCBGA			204		0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG		yes	活跃	4 (72 Hours)							8542.31.00.01			未说明				未说明							533MHz, 1.3GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 192K+ Logic Cells				ROHS3 Compliant
XCZU5CG-2SFVC784I	Xilinx Inc.	数据表	4 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		784-BFBGA, FCBGA	YES		252		-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)	784						8542.31.00.01	BOTTOM	BALL	未说明	0.85V			未说明		S-PBGA-B784					533MHz, 1.3GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 256K+ Logic Cells				ROHS3 Compliant
XCZU7EV-3FBVB900E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks		900-BBGA, FCBGA			204		0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV			活跃	4 (72 Hours)							8542.31.00.01			未说明				未说明							600MHz, 1.5GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 504K+ Logic Cells				ROHS3 Compliant
XC7Z045-2FF900I	Xilinx Inc.	数据表	553 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks		900-BBGA, FCBGA	YES		130		-40°C~100°C TJ	Tray	2016	Zynq®-7000			活跃	4 (72 Hours)	900					GPIO WITH FOUR 32-BIT BANKS	8542.39.00.01	BOTTOM	BALL			compliant				S-PBGA-B900					800MHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	800MHz	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			YES	256000	Kintex™-7 FPGA, 350K Logic Cells	CAN, ETHERNET, I2C, PCI, SPI, UART, USB			Non-RoHS Compliant
XCZU5EV-2SFVC784I	Xilinx Inc.	数据表	568 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		784-BFBGA, FCBGA			252		-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV			活跃	4 (72 Hours)							8542.31.00.01			未说明				未说明							533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 256K+ Logic Cells				ROHS3 Compliant
XCZU7EV-3FFVC1156E	Xilinx Inc.	数据表	347 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		1156-BBGA, FCBGA			360		0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV			活跃	4 (72 Hours)							8542.31.00.01			未说明				未说明							600MHz, 1.5GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 504K+ Logic Cells				ROHS3 Compliant
XA7Z010-1CLG225Q	Xilinx Inc.	数据表	275 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	表面贴装	225-LFBGA, CSPBGA	225		86	Automotive grade	-40°C~125°C TJ	Tray	2010	Automotive, AEC-Q100, Zynq®-7000 XA	e1		活跃	3 (168 Hours)	225	EAR99	锡银铜				8542.39.00.01	BOTTOM	BALL	未说明	0.8mm		667MHz	未说明		不合格	1V	11.8V		CAN, EBI/EMI, Ethernet, GPIO, I2C, MMC, SD, SDIO, SPI, UART, USART, USB		256KB	微处理器电路	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b	ARM			Artix™-7 FPGA, 28K Logic Cells	N	1.5mm	13mm	ROHS3 Compliant
XCZU3EG-L2SFVC784E	Xilinx Inc.	数据表	33 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		784-BFBGA, FCBGA	YES		252		0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)	784					ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V			未说明		R-PBGA-B784		0.742V	0.698V		533MHz, 600MHz, 1.3GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 154K+ Logic Cells				ROHS3 Compliant
XCZU4EG-3SFVC784E	Xilinx Inc.	数据表	287 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		784-BFBGA, FCBGA			252		0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)							8542.31.00.01			未说明				未说明							600MHz, 1.5GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 192K+ Logic Cells				ROHS3 Compliant
XCZU3EG-2SBVA484I	Xilinx Inc.	数据表	367 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		484-BFBGA, FCBGA		484-FCBGA (19x19)	82		-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)																					533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 154K+ Logic Cells				ROHS3 Compliant
XCZU9CG-2FFVC900E	Xilinx Inc.	数据表	770 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		900-BBGA, FCBGA			204		0°C~100°C TJ	Tray	2013	Zynq® UltraScale+™ MPSoC CG		yes	活跃	4 (72 Hours)							8542.31.00.01			未说明				未说明							533MHz, 1.3GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 599K+ Logic Cells				ROHS3 Compliant
XC7Z020-1CLG400CES	Xilinx Inc.	数据表	523 In Stock	-	最小起订量: 1 最小包装量: 1	7 Weeks		400-LFBGA, CSPBGA		400-CSPBGA (17x17)	130		0°C~85°C TJ	Tray	2010	Zynq®-7000			Obsolete	3 (168 Hours)				85°C	0°C								667MHz		XC7Z020					CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	667MHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		ARM			Artix™-7 FPGA, 85K Logic Cells				符合RoHS标准
XCZU6EG-2FFVB1156E	Xilinx Inc.	数据表	118 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		1156-BBGA, FCBGA			328		0°C~100°C TJ	Tray	2013	Zynq® UltraScale+™ MPSoC EG		yes	活跃	4 (72 Hours)							8542.31.00.01			未说明				未说明							533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 469K+ Logic Cells				ROHS3 Compliant
XCZU9EG-L2FFVB1156E	Xilinx Inc.	数据表	517 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		1156-BBGA, FCBGA	YES		328		0°C~100°C TJ	Bulk	2013	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)						ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V			未说明		R-PBGA-B1156		0.742V	0.698V		533MHz, 600MHz, 1.3GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 599K+ Logic Cells				ROHS3 Compliant
XCZU9EG-L1FFVC900I	Xilinx Inc.	数据表	153 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks		900-BBGA, FCBGA	YES		204		-40°C~100°C TJ	Tray	2013	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)	900					ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V			未说明		R-PBGA-B900		0.742V	0.698V		500MHz, 600MHz, 1.2GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 599K+ Logic Cells				ROHS3 Compliant