Xilinx的片上系统（SoC）_正品采购_价格信息

品牌是'Xilinx' (1945)

产品型号	品牌	数据表	库存	价格(含增值税)	数量	工厂交货时间	包装/外壳	表面安装		操作温度	包装	已出版	系列	无铅代码	零件状态	湿度敏感性等级(MSL)	终止次数	附加功能	HTS代码	端子位置	终端形式	峰值回流焊温度（摄氏度）	电源电压	频率	时间@峰值回流温度-最大值(s)	JESD-30代码	电源电压-最大值(Vsup)	电源电压-最小值(Vsup)	界面	速度	内存大小	uPs/uCs/外围ICs类型	核心处理器	周边设备	连接方式	建筑学	数据总线宽度	核心架构	边界扫描	内存(字)	主要属性	总线兼容性	辐射硬化	RoHS状态
XCZU5EG-L1SFVC784I	Xilinx Inc.	数据表	945 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	784-BFBGA, FCBGA	YES	252	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)	784	ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V		未说明	R-PBGA-B784	0.742V	0.698V		500MHz, 600MHz, 1.2GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 256K+ Logic Cells			ROHS3 Compliant
XCZU5EG-3SFVC784E	Xilinx Inc.	数据表	961 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	784-BFBGA, FCBGA		252	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)			8542.31.00.01			未说明			未说明					600MHz, 1.5GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 256K+ Logic Cells			ROHS3 Compliant
XCZU11EG-3FFVC1156E	Xilinx Inc.	数据表	890 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA		360	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)			8542.31.00.01			未说明			未说明					600MHz, 667MHz, 1.5GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 653K+ Logic Cells			ROHS3 Compliant
XCZU3EG-1SBVA484I	Xilinx Inc.	数据表	946 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	484-BFBGA, FCBGA		82	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)			8542.31.00.01			未说明			未说明					500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 154K+ Logic Cells			ROHS3 Compliant
XCZU5EV-2FBVB900I	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA		204	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV		活跃	4 (72 Hours)			8542.31.00.01			未说明			未说明					533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 256K+ Logic Cells			ROHS3 Compliant
XCZU7EV-3FFVF1517E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1517-BBGA, FCBGA		464	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV		活跃	4 (72 Hours)			8542.31.00.01			未说明			未说明					600MHz, 1.5GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 504K+ Logic Cells			ROHS3 Compliant
XCZU17EG-1FFVB1517I	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1517-BBGA, FCBGA		644	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)			8542.31.00.01			未说明			未说明					500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 926K+ Logic Cells			ROHS3 Compliant
XCZU5EV-L1SFVC784I	Xilinx Inc.	数据表	901 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	784-BFBGA, FCBGA	YES	252	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV		活跃	4 (72 Hours)	784	ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V		未说明	R-PBGA-B784	0.742V	0.698V		500MHz, 600MHz, 1.2GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 256K+ Logic Cells			ROHS3 Compliant
XCZU7EG-2FFVC1156E	Xilinx Inc.	数据表	379 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA		360	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG	yes	活跃	4 (72 Hours)			8542.31.00.01			未说明			未说明					533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 504K+ Logic Cells			ROHS3 Compliant
XCZU3CG-2SFVC784I	Xilinx Inc.	数据表	257 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	784-BFBGA, FCBGA	YES	252	-40°C~100°C TJ	Bulk	2016	Zynq® UltraScale+™ MPSoC CG		活跃	4 (72 Hours)	784		8542.31.00.01	BOTTOM	BALL	未说明	0.85V		未说明	S-PBGA-B784				533MHz, 1.3GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 154K+ Logic Cells			ROHS3 Compliant
XCZU6EG-1FFVC900I	Xilinx Inc.	数据表	22 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA		204	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)			8542.31.00.01			未说明			未说明					500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 469K+ Logic Cells			ROHS3 Compliant
XCZU9CG-1FFVB1156E	Xilinx Inc.	数据表	228 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA		328	0°C~100°C TJ	Tray	2013	Zynq® UltraScale+™ MPSoC CG		活跃	4 (72 Hours)			8542.31.00.01			未说明			未说明					500MHz, 1.2GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 599K+ Logic Cells			ROHS3 Compliant
XCZU7EV-L1FFVC1156I	Xilinx Inc.	数据表	662 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA	YES	360	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV		活跃	4 (72 Hours)		ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V		未说明	R-PBGA-B1156	0.742V	0.698V		500MHz, 600MHz, 1.2GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 504K+ Logic Cells			ROHS3 Compliant
XCZU9CG-2FFVB1156E	Xilinx Inc.	数据表	533 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA		328	0°C~100°C TJ	Tray	2013	Zynq® UltraScale+™ MPSoC CG	yes	活跃	4 (72 Hours)			8542.31.00.01			未说明			未说明					533MHz, 1.3GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 599K+ Logic Cells			ROHS3 Compliant
XC7Z030-2FB484I	Xilinx Inc.	数据表	253 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	484-BBGA, FCBGA	YES	130	-40°C~100°C TJ	Tray	2009	Zynq®-7000	no	活跃	3 (168 Hours)	484		8542.39.00.01	BOTTOM	BALL			800MHz		S-PBGA-B484			CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB		256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b	ARM	YES	256000	Kintex™-7 FPGA, 125K Logic Cells	CAN, ETHERNET, I2C, PCI, SPI, UART, USB	无	ROHS3 Compliant
XCZU2EG-L2SFVC784E	Xilinx Inc.	数据表	886 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	784-BFBGA, FCBGA	YES	252	0°C~100°C TJ	Tray	2013	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)	784	ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V		未说明	R-PBGA-B784	0.742V	0.698V		533MHz, 600MHz, 1.3GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 103K+ Logic Cells			ROHS3 Compliant
XCZU5EG-1SFVC784E	Xilinx Inc.	数据表	401 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	784-BFBGA, FCBGA		252	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)			8542.31.00.01			未说明			未说明					500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 256K+ Logic Cells			ROHS3 Compliant
XCZU3EG-L1SBVA484I	Xilinx Inc.	数据表	154 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	484-BFBGA, FCBGA	YES	82	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)	484	ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V		未说明	R-PBGA-B484	0.742V	0.698V		500MHz, 600MHz, 1.2GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 154K+ Logic Cells			ROHS3 Compliant
XCZU2EG-L1SFVA625I	Xilinx Inc.	数据表	66 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	625-BFBGA, FCBGA	YES	180	-40°C~100°C TJ	Tray		Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)	625	ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V		未说明	R-PBGA-B625	0.742V	0.698V		500MHz, 600MHz, 1.2GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 103K+ Logic Cells			ROHS3 Compliant
XCZU7EV-L2FFVC1156E	Xilinx Inc.	数据表	647 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA	YES	360	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV		活跃	4 (72 Hours)		ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V		未说明	R-PBGA-B1156	0.742V	0.698V		533MHz, 600MHz, 1.3GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 504K+ Logic Cells			ROHS3 Compliant
XCZU7EG-L1FFVC1156I	Xilinx Inc.	数据表	331 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA	YES	360	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)		ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V		未说明	R-PBGA-B1156	0.742V	0.698V		500MHz, 600MHz, 1.2GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 504K+ Logic Cells			ROHS3 Compliant
XCZU7EV-1FFVC1156E	Xilinx Inc.	数据表	258 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA		360	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV		活跃	4 (72 Hours)			8542.31.00.01			未说明			未说明					500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 504K+ Logic Cells			ROHS3 Compliant
XCZU6CG-L1FFVC900I	Xilinx Inc.	数据表	863 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA	YES	204	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG		活跃	4 (72 Hours)	900	ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V		未说明	R-PBGA-B900	0.742V	0.698V		500MHz, 1.2GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 469K+ Logic Cells			ROHS3 Compliant
XCZU7CG-1FFVC1156E	Xilinx Inc.	数据表	7 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA		360	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG		活跃	4 (72 Hours)			8542.31.00.01			未说明			未说明					500MHz, 1.2GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 504K+ Logic Cells			ROHS3 Compliant
XCZU2EG-1SFVC784I	Xilinx Inc.	数据表	890 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	784-BFBGA, FCBGA		252	-40°C~100°C TJ	Tray	2013	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)			8542.31.00.01			未说明			未说明					500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 103K+ Logic Cells			ROHS3 Compliant