Xilinx的片上系统（SoC）_正品采购_价格信息

品牌是'Xilinx' (1945)

产品型号	品牌	数据表	库存	价格(含增值税)	数量	工厂交货时间	包装/外壳	表面安装	供应商器件包装		操作温度	包装	已出版	系列	无铅代码	零件状态	湿度敏感性等级(MSL)	终止次数	附加功能	HTS代码	端子位置	终端形式	峰值回流焊温度（摄氏度）	电源电压	时间@峰值回流温度-最大值(s)	JESD-30代码	电源电压-最大值(Vsup)	电源电压-最小值(Vsup)	速度	内存大小	uPs/uCs/外围ICs类型	核心处理器	周边设备	连接方式	建筑学	主要属性	RoHS状态
XCZU4EG-2FBVB900I	Xilinx Inc.	数据表	345 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA			204	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)			8542.31.00.01			未说明		未说明				533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 192K+ Logic Cells	ROHS3 Compliant
XCZU9EG-3FFVC900E	Xilinx Inc.	数据表	444 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA			204	0°C~100°C TJ	Tray	2013	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)			8542.31.00.01			未说明		未说明				600MHz, 1.5GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 599K+ Logic Cells	ROHS3 Compliant
XCZU4EV-L2SFVC784E	Xilinx Inc.	数据表	11 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	784-BFBGA, FCBGA		784-FCBGA (23x23)	252	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV		活跃	4 (72 Hours)												533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 192K+ Logic Cells	ROHS3 Compliant
XCZU4EV-3SFVC784E	Xilinx Inc.	数据表	526 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	784-BFBGA, FCBGA			252	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV		活跃	4 (72 Hours)			8542.31.00.01			未说明		未说明				600MHz, 1.5GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 192K+ Logic Cells	ROHS3 Compliant
XCZU7EG-1FFVC1156E	Xilinx Inc.	数据表	500 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA			360	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)			8542.31.00.01			未说明		未说明				500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 504K+ Logic Cells	ROHS3 Compliant
XCZU11EG-L2FFVC1156E	Xilinx Inc.	数据表	895 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA	YES		360	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)		ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V	未说明	R-PBGA-B1156	0.742V	0.698V	533MHz, 600MHz, 1.3GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 653K+ Logic Cells	ROHS3 Compliant
XCZU5CG-1SFVC784I	Xilinx Inc.	数据表	276 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	784-BFBGA, FCBGA			252	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG		活跃	4 (72 Hours)			8542.31.00.01			未说明		未说明				500MHz, 1.2GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 256K+ Logic Cells	ROHS3 Compliant
XCZU6CG-2FFVB1156I	Xilinx Inc.	数据表	116 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA	YES		328	-40°C~100°C TJ	Bulk	2016	Zynq® UltraScale+™ MPSoC CG		活跃	4 (72 Hours)			8542.31.00.01	BOTTOM	BALL	未说明	0.85V	未说明	R-PBGA-B1156	0.876V	0.825V	533MHz, 1.3GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 469K+ Logic Cells	ROHS3 Compliant
XCZU4EV-L2FBVB900E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA	YES		204	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV		活跃	4 (72 Hours)	900	ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V	未说明	R-PBGA-B900	0.742V	0.698V	533MHz, 600MHz, 1.3GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 192K+ Logic Cells	ROHS3 Compliant
XCZU2EG-2SBVA484I	Xilinx Inc.	数据表	335 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	484-BFBGA, FCBGA	YES		82	-40°C~100°C TJ	Tray	2013	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)	484		8542.31.00.01	BOTTOM	BALL	未说明	0.85V	未说明	R-PBGA-B484	0.876V		533MHz, 600MHz, 1.3GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 103K+ Logic Cells	ROHS3 Compliant
XCZU3CG-2SBVA484I	Xilinx Inc.	数据表	203 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	484-BFBGA, FCBGA	YES		82	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG		活跃	4 (72 Hours)	484		8542.31.00.01	BOTTOM	BALL	未说明	0.85V	未说明	R-PBGA-B484	0.876V		533MHz, 1.3GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 154K+ Logic Cells	ROHS3 Compliant
XCZU11EG-L1FFVF1517I	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1517-BBGA, FCBGA	YES		464	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)		ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V	未说明	R-PBGA-B1517	0.742V	0.698V	500MHz, 600MHz, 1.2GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 653K+ Logic Cells	ROHS3 Compliant
XCZU19EG-1FFVE1924E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1924-BBGA, FCBGA			668	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)			8542.31.00.01			未说明		未说明				500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells	ROHS3 Compliant
XCZU15EG-2FFVC900E	Xilinx Inc.	数据表	422 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA			204	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG	yes	活跃	4 (72 Hours)			8542.31.00.01			未说明		未说明				533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 747K+ Logic Cells	ROHS3 Compliant
XCZU11EG-2FFVC1760E	Xilinx Inc.	数据表	759 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1760-BBGA, FCBGA			512	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG	yes	活跃	4 (72 Hours)			8542.31.00.01			未说明		未说明				533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 653K+ Logic Cells	ROHS3 Compliant
XCZU17EG-2FFVB1517I	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1517-BBGA, FCBGA			644	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)			8542.31.00.01			未说明		未说明				533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 926K+ Logic Cells	ROHS3 Compliant
XCZU11EG-1FFVF1517I	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1517-BBGA, FCBGA			464	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)			8542.31.00.01			未说明		未说明				500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 653K+ Logic Cells	ROHS3 Compliant
XCZU6EG-1FFVC900E	Xilinx Inc.	数据表	185 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA			204	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)			8542.31.00.01			未说明		未说明				500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 469K+ Logic Cells	ROHS3 Compliant
XCZU17EG-1FFVC1760E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1760-BBGA, FCBGA			512	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)			8542.31.00.01			未说明		未说明				500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 926K+ Logic Cells	ROHS3 Compliant
XCZU6CG-L2FFVC900E	Xilinx Inc.	数据表	327 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA	YES		204	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG		活跃	4 (72 Hours)	900	ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V	未说明	R-PBGA-B900	0.742V	0.698V	533MHz, 1.3GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 469K+ Logic Cells	ROHS3 Compliant
XCZU7CG-2FFVC1156I	Xilinx Inc.	数据表	556 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA	YES		360	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG		活跃	4 (72 Hours)			8542.31.00.01	BOTTOM	BALL	未说明	0.85V	未说明	R-PBGA-B1156	0.876V	0.825V	533MHz, 1.3GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 504K+ Logic Cells	ROHS3 Compliant
XCZU9CG-L2FFVC900E	Xilinx Inc.	数据表	874 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA	YES		204	0°C~100°C TJ	Bulk	2016	Zynq® UltraScale+™ MPSoC CG		活跃	4 (72 Hours)	900	ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V	未说明	R-PBGA-B900	0.742V	0.698V	533MHz, 1.3GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 599K+ Logic Cells	ROHS3 Compliant
XCZU4EG-1FBVB900I	Xilinx Inc.	数据表	260 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA			204	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)			8542.31.00.01			未说明		未说明				500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 192K+ Logic Cells	ROHS3 Compliant
XCZU4EG-3FBVB900E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA			204	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)			8542.31.00.01			未说明		未说明				600MHz, 1.5GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 192K+ Logic Cells	ROHS3 Compliant
XCZU7CG-2FBVB900I	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA	YES		204	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG		活跃	4 (72 Hours)	900		8542.31.00.01	BOTTOM	BALL	未说明	0.85V	未说明	R-PBGA-B900	0.876V	0.825V	533MHz, 1.3GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 504K+ Logic Cells	ROHS3 Compliant