Xilinx的片上系统（SoC）_正品采购_价格信息

品牌是'Xilinx' (1945)

产品型号	品牌	数据表	库存	价格(含增值税)	数量	工厂交货时间	包装/外壳	表面安装		操作温度	包装	已出版	系列	JESD-609代码	无铅代码	零件状态	湿度敏感性等级(MSL)	终止次数	端子表面处理	附加功能	HTS代码	端子位置	终端形式	峰值回流焊温度（摄氏度）	电源电压	端子间距	频率	时间@峰值回流温度-最大值(s)	JESD-30代码	电源电压-最大值(Vsup)	电源电压-最小值(Vsup)	界面	速度	内存大小	uPs/uCs/外围ICs类型	核心处理器	周边设备	连接方式	建筑学	核心架构	边界扫描	内存(字)	主要属性	总线兼容性	座位高度(最大)	长度	宽度	RoHS状态
XCZU11EG-L1FFVC1156I	Xilinx Inc.	数据表	388 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA	YES	360	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V			未说明	R-PBGA-B1156	0.742V	0.698V		500MHz, 600MHz, 1.2GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				Zynq®UltraScale+™ FPGA, 653K+ Logic Cells					ROHS3 Compliant
XCZU11EG-2FFVC1156E	Xilinx Inc.	数据表	87 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA		360	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		yes	活跃	4 (72 Hours)				8542.31.00.01			未说明				未说明					533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				Zynq®UltraScale+™ FPGA, 653K+ Logic Cells					ROHS3 Compliant
XCZU2CG-2SFVC784I	Xilinx Inc.	数据表	630 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	784-BFBGA, FCBGA	YES	252	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)	784			8542.31.00.01	BOTTOM	BALL	未说明	0.85V			未说明	S-PBGA-B784				533MHz, 1.3GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				Zynq®UltraScale+™ FPGA, 103K+ Logic Cells					ROHS3 Compliant
XC7Z045-2FF900E	Xilinx Inc.	数据表	951 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	900-BBGA, FCBGA	YES	130	0°C~100°C TJ	Tray	2010	Zynq®-7000		no	活跃	4 (72 Hours)	900		GPIO WITH FOUR 32-BIT BANKS	8542.39.00.01	BOTTOM	BALL				800MHz		S-PBGA-B900			CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB		256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	ARM	YES	256000	Kintex™-7 FPGA, 350K Logic Cells	CAN, ETHERNET, I2C, PCI, SPI, UART, USB				Non-RoHS Compliant
XCZU9EG-1FFVC900E	Xilinx Inc.	数据表	649 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA		204	0°C~100°C TJ	Tray		Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)																500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				Zynq®UltraScale+™ FPGA, 599K+ Logic Cells					ROHS3 Compliant
XCZU15EG-L2FFVB1156E	Xilinx Inc.	数据表	227 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA	YES	328	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V			未说明	R-PBGA-B1156	0.742V	0.698V		533MHz, 600MHz, 1.3GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				Zynq®UltraScale+™ FPGA, 747K+ Logic Cells					ROHS3 Compliant
XCZU7EV-L2FBVB900E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA	YES	204	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV			活跃	4 (72 Hours)	900		ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V			未说明	R-PBGA-B900	0.742V	0.698V		533MHz, 600MHz, 1.3GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				Zynq®UltraScale+™ FPGA, 504K+ Logic Cells					ROHS3 Compliant
XCZU3CG-2SFVA625I	Xilinx Inc.	数据表	596 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	625-BFBGA, FCBGA	YES	180	-40°C~100°C TJ	Bulk	2016	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)	625			8542.31.00.01	BOTTOM	BALL	未说明	0.85V			未说明	R-PBGA-B625	0.876V	0.825V		533MHz, 1.3GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				Zynq®UltraScale+™ FPGA, 154K+ Logic Cells					ROHS3 Compliant
XCZU7CG-2FFVC1156E	Xilinx Inc.	数据表	562 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA		360	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG		yes	活跃	4 (72 Hours)				8542.31.00.01			未说明				未说明					533MHz, 1.3GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				Zynq®UltraScale+™ FPGA, 504K+ Logic Cells					ROHS3 Compliant
XAZU2EG-L1SFVA625I	Xilinx Inc.	数据表	617 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	625-BFBGA, FCBGA	YES	128	-40°C~100°C TJ	Tray		Zynq® UltraScale+™ MPSoC EG			活跃	3 (168 Hours)	625			8542.31.00.01	BOTTOM	BALL	未说明	0.72V	0.8mm		未说明	S-PBGA-B625				500MHz, 1.2GHz	1.2MB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, I2C, SPI, UART/USART, USB	MPU, FPGA				Zynq®UltraScale+™ FPGA, 103K+ Logic Cells		3.43mm	21mm	21mm	ROHS3 Compliant
XCZU2CG-2SFVA625I	Xilinx Inc.	数据表	151 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	625-BFBGA, FCBGA	YES	180	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG	e1		活跃	4 (72 Hours)	625	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		8542.31.00.01	BOTTOM	BALL	未说明	0.85V			未说明	R-PBGA-B625	0.876V	0.825V		533MHz, 1.3GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				Zynq®UltraScale+™ FPGA, 103K+ Logic Cells					ROHS3 Compliant
XCZU5EG-1FBVB900I	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA		204	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)				8542.31.00.01			未说明				未说明					500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				Zynq®UltraScale+™ FPGA, 256K+ Logic Cells					ROHS3 Compliant
XCZU4EV-2FBVB900I	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA		204	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV			活跃	4 (72 Hours)				8542.31.00.01			未说明				未说明					533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				Zynq®UltraScale+™ FPGA, 192K+ Logic Cells					ROHS3 Compliant
XCZU7EG-1FFVC1156I	Xilinx Inc.	数据表	815 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA		360	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)				8542.31.00.01			未说明				未说明					500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				Zynq®UltraScale+™ FPGA, 504K+ Logic Cells					ROHS3 Compliant
XAZU2EG-1SFVC784I	Xilinx Inc.	数据表	384 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	784-BFBGA, FCBGA	YES	128	-40°C~100°C TJ	Tray		Zynq® UltraScale+™ MPSoC EG			活跃	3 (168 Hours)	784			8542.31.00.01	BOTTOM	BALL	未说明	0.85V	0.8mm		未说明	S-PBGA-B784				500MHz, 1.2GHz	1.2MB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, I2C, SPI, UART/USART, USB	MPU, FPGA				Zynq®UltraScale+™ FPGA, 103K+ Logic Cells		3.32mm	23mm	23mm	ROHS3 Compliant
XCZU2CG-L1SFVC784I	Xilinx Inc.	数据表	303 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	784-BFBGA, FCBGA	YES	252	-40°C~100°C TJ	Tray		Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)	784		IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)	8542.31.00.01	BOTTOM	BALL	未说明	0.72V			未说明	S-PBGA-B784				500MHz, 1.2GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				Zynq®UltraScale+™ FPGA, 103K+ Logic Cells					ROHS3 Compliant
XCZU2CG-L1SFVA625I	Xilinx Inc.	数据表	724 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	625-BFBGA, FCBGA	YES	180	-40°C~100°C TJ	Tray		Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)	625		ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V			未说明	R-PBGA-B625	0.742V	0.698V		500MHz, 1.2GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				Zynq®UltraScale+™ FPGA, 103K+ Logic Cells					ROHS3 Compliant
XCZU9CG-L1FFVB1156I	Xilinx Inc.	数据表	418 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA	YES	328	-40°C~100°C TJ	Bulk	2016	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V			未说明	R-PBGA-B1156	0.742V	0.698V		500MHz, 1.2GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				Zynq®UltraScale+™ FPGA, 599K+ Logic Cells					ROHS3 Compliant
XCZU5EV-1FBVB900I	Xilinx Inc.	数据表	860 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA		204	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV			活跃	4 (72 Hours)				8542.31.00.01			未说明				未说明					500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				Zynq®UltraScale+™ FPGA, 256K+ Logic Cells					ROHS3 Compliant
XCZU4CG-2FBVB900I	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA	YES	204	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)	900			8542.31.00.01	BOTTOM	BALL	未说明	0.85V			未说明	R-PBGA-B900	0.876V	0.825V		533MHz, 1.3GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				Zynq®UltraScale+™ FPGA, 192K+ Logic Cells					ROHS3 Compliant
XAZU3EG-1SFVA625Q	Xilinx Inc.	数据表	755 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	625-BFBGA, FCBGA	YES	128	-40°C~125°C TJ	Tray		Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)	625			8542.31.00.01	BOTTOM	BALL	未说明	0.85V	0.8mm		未说明	S-PBGA-B625				500MHz, 1.2GHz	1.8MB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, I2C, SPI, UART/USART, USB	MPU, FPGA				Zynq®UltraScale+™ FPGA, 154K+ Logic Cells		3.43mm	21mm	21mm	ROHS3 Compliant
XCZU11EG-1FFVC1760I	Xilinx Inc.	数据表	8 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1760-BBGA, FCBGA		512	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)				8542.31.00.01			未说明				未说明					500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				Zynq®UltraScale+™ FPGA, 653K+ Logic Cells					ROHS3 Compliant
XCZU19EG-L2FFVB1517E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1517-BBGA, FCBGA	YES	644	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V			未说明	R-PBGA-B1517	0.742V	0.698V		533MHz, 600MHz, 1.3GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells					ROHS3 Compliant
XCZU19EG-1FFVD1760I	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1760-BBGA, FCBGA		308	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)				8542.31.00.01			未说明				未说明					500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells					ROHS3 Compliant
XCZU3CG-1SFVA625I	Xilinx Inc.	数据表	990 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	625-BFBGA, FCBGA		180	-40°C~100°C TJ	Bulk	2016	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)				8542.31.00.01			未说明				未说明					500MHz, 1.2GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				Zynq®UltraScale+™ FPGA, 154K+ Logic Cells					ROHS3 Compliant