Xilinx的片上系统（SoC）_正品采购_价格信息

品牌是'Xilinx' (1945)

产品型号	品牌	数据表	库存	价格(含增值税)	数量	工厂交货时间	包装/外壳	表面安装	供应商器件包装		操作温度	包装	已出版	系列	JESD-609代码	无铅代码	零件状态	湿度敏感性等级(MSL)	终止次数	端子表面处理	附加功能	HTS代码	端子位置	终端形式	峰值回流焊温度（摄氏度）	电源电压	时间@峰值回流温度-最大值(s)	JESD-30代码	电源电压-最大值(Vsup)	电源电压-最小值(Vsup)	速度	内存大小	uPs/uCs/外围ICs类型	核心处理器	周边设备	连接方式	建筑学	主要属性	RoHS状态
XCZU19EG-2FFVE1924E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1924-BBGA, FCBGA			668	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		yes	活跃	4 (72 Hours)				8542.31.00.01			未说明		未说明				533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells	ROHS3 Compliant
XCZU11EG-3FFVF1517E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1517-BBGA, FCBGA			464	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)				8542.31.00.01			未说明		未说明				600MHz, 667MHz, 1.5GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 653K+ Logic Cells	ROHS3 Compliant
XCZU7EG-L1FFVF1517I	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1517-BBGA, FCBGA	YES		464	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V	未说明	R-PBGA-B1517	0.742V	0.698V	500MHz, 600MHz, 1.2GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 504K+ Logic Cells	ROHS3 Compliant
XCZU3CG-2SFVC784E	Xilinx Inc.	数据表	59 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	784-BFBGA, FCBGA			252	0°C~100°C TJ	Bulk	2016	Zynq® UltraScale+™ MPSoC CG		yes	活跃	4 (72 Hours)				8542.31.00.01			未说明		未说明				533MHz, 1.3GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 154K+ Logic Cells	ROHS3 Compliant
XCZU19EG-1FFVC1760E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1760-BBGA, FCBGA			512	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)				8542.31.00.01			未说明		未说明				500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells	ROHS3 Compliant
XCZU19EG-1FFVC1760I	Xilinx Inc.	数据表	189 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1760-BBGA, FCBGA			512	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)				8542.31.00.01			未说明		未说明				500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells	ROHS3 Compliant
XCZU17EG-2FFVE1924E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1924-BBGA, FCBGA			668	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		yes	活跃	4 (72 Hours)				8542.31.00.01			未说明		未说明				533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 926K+ Logic Cells	ROHS3 Compliant
XCZU2CG-1SFVA625I	Xilinx Inc.	数据表	459 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	625-BFBGA, FCBGA			180	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG	e1		活跃	4 (72 Hours)		Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		8542.31.00.01			未说明		未说明				500MHz, 1.2GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 103K+ Logic Cells	ROHS3 Compliant
XCZU6EG-1FFVB1156E	Xilinx Inc.	数据表	891 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA			328	0°C~100°C TJ	Tray		Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)				8542.31.00.01			未说明		未说明				500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 469K+ Logic Cells	ROHS3 Compliant
XCZU19EG-1FFVB1517I	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1517-BBGA, FCBGA			644	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)				8542.31.00.01			未说明		未说明				500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells	ROHS3 Compliant
XCZU3EG-L2SFVA625E	Xilinx Inc.	数据表	36 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	625-BFBGA, FCBGA	YES		180	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)	625		ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V	未说明	R-PBGA-B625	0.742V	0.698V	533MHz, 600MHz, 1.3GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 154K+ Logic Cells	ROHS3 Compliant
XCZU3EG-L2SBVA484E	Xilinx Inc.	数据表	110 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	484-BFBGA, FCBGA	YES		82	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)	484		ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V	未说明	R-PBGA-B484	0.742V	0.698V	533MHz, 600MHz, 1.3GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 154K+ Logic Cells	ROHS3 Compliant
XCZU7CG-L2FFVC1156E	Xilinx Inc.	数据表	172 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA	YES		360	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)			ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V	未说明	R-PBGA-B1156	0.742V	0.698V	533MHz, 1.3GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 504K+ Logic Cells	ROHS3 Compliant
XCZU5EG-2FBVB900E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA			204	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		yes	活跃	4 (72 Hours)				8542.31.00.01			未说明		未说明				533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 256K+ Logic Cells	ROHS3 Compliant
XCZU5EG-L1FBVB900I	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA	YES		204	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)	900		ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V	未说明	R-PBGA-B900	0.742V	0.698V	500MHz, 600MHz, 1.2GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 256K+ Logic Cells	ROHS3 Compliant
XCZU7EV-2FFVF1517E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1517-BBGA, FCBGA			464	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV		yes	活跃	4 (72 Hours)				8542.31.00.01			未说明		未说明				533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 504K+ Logic Cells	ROHS3 Compliant
XCZU9CG-1FFVC900E	Xilinx Inc.	数据表	532 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA			204	0°C~100°C TJ	Tray		Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)				8542.31.00.01			未说明		未说明				500MHz, 1.2GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 599K+ Logic Cells	ROHS3 Compliant
XCZU7EG-1FBVB900E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA			204	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)				8542.31.00.01			未说明		未说明				500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 504K+ Logic Cells	ROHS3 Compliant
XCZU7EV-1FFVF1517I	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1517-BBGA, FCBGA		1517-FCBGA (40x40)	464	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV			活跃	4 (72 Hours)													500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 504K+ Logic Cells	ROHS3 Compliant
XCZU7EG-L2FBVB900E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA	YES		204	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)	900		ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V	未说明	R-PBGA-B900	0.742V	0.698V	533MHz, 600MHz, 1.3GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 504K+ Logic Cells	ROHS3 Compliant
XCZU5EG-3FBVB900E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA			204	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)				8542.31.00.01			未说明		未说明				600MHz, 1.5GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 256K+ Logic Cells	ROHS3 Compliant
XCZU19EG-2FFVD1760E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1760-BBGA, FCBGA			308	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		yes	活跃	4 (72 Hours)				8542.31.00.01			未说明		未说明				533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells	ROHS3 Compliant
XCZU15EG-1FFVC900E	Xilinx Inc.	数据表	444 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA			204	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)				8542.31.00.01			未说明		未说明				500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 747K+ Logic Cells	ROHS3 Compliant
XCZU7EV-L1FBVB900I	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA	YES		204	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV			活跃	4 (72 Hours)	900		ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V	未说明	R-PBGA-B900	0.742V	0.698V	500MHz, 600MHz, 1.2GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 504K+ Logic Cells	ROHS3 Compliant
XCZU4EG-L2FBVB900E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA	YES		204	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)	900		ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V	未说明	R-PBGA-B900	0.742V	0.698V	533MHz, 600MHz, 1.3GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 192K+ Logic Cells	ROHS3 Compliant