Xilinx的片上系统（SoC）_正品采购_价格信息

品牌是'Xilinx' (1945)

产品型号	品牌	数据表	库存	价格(含增值税)	数量	工厂交货时间	包装/外壳	表面安装		操作温度	包装	已出版	系列	无铅代码	零件状态	湿度敏感性等级(MSL)	终止次数	附加功能	HTS代码	端子位置	终端形式	峰值回流焊温度（摄氏度）	电源电压	端子间距	时间@峰值回流温度-最大值(s)	JESD-30代码	电源电压-最大值(Vsup)	电源电压-最小值(Vsup)	速度	内存大小	uPs/uCs/外围ICs类型	核心处理器	周边设备	连接方式	建筑学	主要属性	座位高度(最大)	长度	宽度	RoHS状态
XCZU11EG-1FFVB1517I	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1517-BBGA, FCBGA		488	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)			8542.31.00.01			未说明			未说明				500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 653K+ Logic Cells				ROHS3 Compliant
XAZU3EG-1SFVC784I	Xilinx Inc.	数据表	133 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	784-BFBGA, FCBGA	YES	128	-40°C~100°C TJ	Tray		Zynq® UltraScale+™ MPSoC EG		活跃	3 (168 Hours)	784		8542.31.00.01	BOTTOM	BALL	未说明	0.85V	0.8mm	未说明	S-PBGA-B784			500MHz, 1.2GHz	1.8MB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, I2C, SPI, UART/USART, USB	MPU, FPGA	Zynq®UltraScale+™ FPGA, 154K+ Logic Cells	3.32mm	23mm	23mm	ROHS3 Compliant
XCZU11EG-L1FFVB1517I	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1517-BBGA, FCBGA	YES	488	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)		ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V		未说明	R-PBGA-B1517	0.742V	0.698V	500MHz, 600MHz, 1.2GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 653K+ Logic Cells				ROHS3 Compliant
XCZU2CG-L1SBVA484I	Xilinx Inc.	数据表	469 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	484-BFBGA, FCBGA	YES	82	-40°C~100°C TJ	Tray		Zynq® UltraScale+™ MPSoC CG		活跃	4 (72 Hours)	484	ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V		未说明	R-PBGA-B484	0.742V	0.698V	500MHz, 1.2GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 103K+ Logic Cells				ROHS3 Compliant
XCZU17EG-L2FFVD1760E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1760-BBGA, FCBGA	YES	308	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)		ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V		未说明	R-PBGA-B1760	0.742V	0.698V	533MHz, 600MHz, 1.3GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 926K+ Logic Cells				ROHS3 Compliant
XCZU17EG-L1FFVE1924I	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1924-BBGA, FCBGA	YES	668	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)		ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V		未说明	R-PBGA-B1924	0.742V	0.698V	500MHz, 600MHz, 1.2GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 926K+ Logic Cells				ROHS3 Compliant
XCZU19EG-2FFVD1760I	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1760-BBGA, FCBGA		308	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)			8542.31.00.01			未说明			未说明				533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells				ROHS3 Compliant
XAZU3EG-L1SFVA625I	Xilinx Inc.	数据表	962 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	625-BFBGA, FCBGA	YES	128	-40°C~100°C TJ	Tray		Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)	625		8542.31.00.01	BOTTOM	BALL	未说明	0.72V	0.8mm	未说明	S-PBGA-B625			500MHz, 1.2GHz	1.8MB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, I2C, SPI, UART/USART, USB	MPU, FPGA	Zynq®UltraScale+™ FPGA, 154K+ Logic Cells	3.43mm	21mm	21mm	ROHS3 Compliant
XCZU11EG-1FFVB1517E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1517-BBGA, FCBGA		488	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)			8542.31.00.01			未说明			未说明				500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 653K+ Logic Cells				ROHS3 Compliant
XCZU19EG-1FFVB1517E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1517-BBGA, FCBGA		644	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)			8542.31.00.01			未说明			未说明				500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells				ROHS3 Compliant
XCZU3CG-2SBVA484E	Xilinx Inc.	数据表	872 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	484-BFBGA, FCBGA		82	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG	yes	活跃	4 (72 Hours)			8542.31.00.01			未说明			未说明				533MHz, 1.3GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 154K+ Logic Cells				ROHS3 Compliant
XCZU7CG-2FFVF1517I	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1517-BBGA, FCBGA	YES	464	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG		活跃	4 (72 Hours)			8542.31.00.01	BOTTOM	BALL	未说明	0.85V		未说明	R-PBGA-B1517	0.876V	0.825V	533MHz, 1.3GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 504K+ Logic Cells				ROHS3 Compliant
XCZU19EG-3FFVC1760E	Xilinx Inc.	数据表	781 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1760-BBGA, FCBGA		512	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)			8542.31.00.01			未说明			未说明				600MHz, 667MHz, 1.5GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells				ROHS3 Compliant
XCZU2CG-L2SFVC784E	Xilinx Inc.	数据表	212 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	784-BFBGA, FCBGA	YES	252	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG		活跃	4 (72 Hours)	784	IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)	8542.31.00.01	BOTTOM	BALL	未说明	0.72V		未说明	S-PBGA-B784			533MHz, 1.3GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 103K+ Logic Cells				ROHS3 Compliant
XCZU17EG-L1FFVD1760I	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1760-BBGA, FCBGA	YES	308	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)		ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V		未说明	R-PBGA-B1760	0.742V	0.698V	500MHz, 600MHz, 1.2GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 926K+ Logic Cells				ROHS3 Compliant
XCZU3CG-L2SBVA484E	Xilinx Inc.	数据表	665 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	484-BFBGA, FCBGA	YES	82	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG		活跃	4 (72 Hours)	484	ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V		未说明	R-PBGA-B484	0.742V	0.698V	533MHz, 1.3GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 154K+ Logic Cells				ROHS3 Compliant
XCZU17EG-2FFVB1517E	Xilinx Inc.	数据表	40 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1517-BBGA, FCBGA		644	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG	yes	活跃	4 (72 Hours)			8542.31.00.01			未说明			未说明				533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 926K+ Logic Cells				ROHS3 Compliant
XCZU11EG-L2FFVB1517E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1517-BBGA, FCBGA	YES	488	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)		ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V		未说明	R-PBGA-B1517	0.742V	0.698V	533MHz, 600MHz, 1.3GHz	256KB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 653K+ Logic Cells				ROHS3 Compliant
XAZU2EG-L1SFVC784I	Xilinx Inc.	数据表	952 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	784-BFBGA, FCBGA	YES	128	-40°C~100°C TJ	Tray		Zynq® UltraScale+™ MPSoC EG		活跃	3 (168 Hours)	784		8542.31.00.01	BOTTOM	BALL	未说明	0.72V	0.8mm	未说明	S-PBGA-B784			500MHz, 1.2GHz	1.2MB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, I2C, SPI, UART/USART, USB	MPU, FPGA	Zynq®UltraScale+™ FPGA, 154K+ Logic Cells	3.32mm	23mm	23mm	ROHS3 Compliant
XAZU2EG-1SFVA625Q	Xilinx Inc.	数据表	94 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	625-BFBGA, FCBGA	YES	128	-40°C~125°C TJ	Tray		Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)	625		8542.31.00.01	BOTTOM	BALL	未说明	0.85V	0.8mm	未说明	S-PBGA-B625			500MHz, 1.2GHz	1.2MB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, I2C, SPI, UART/USART, USB	MPU, FPGA	Zynq®UltraScale+™ FPGA, 103K+ Logic Cells	3.43mm	21mm	21mm	ROHS3 Compliant
XCZU3CG-L2SFVC784E	Xilinx Inc.	数据表	118 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	784-BFBGA, FCBGA	YES	252	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG		活跃	4 (72 Hours)	784	IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)	8542.31.00.01	BOTTOM	BALL	未说明	0.72V		未说明	S-PBGA-B784			533MHz, 1.3GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 154K+ Logic Cells				ROHS3 Compliant
XCZU5CG-L1FBVB900I	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA	YES	204	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG		活跃	4 (72 Hours)	900	ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY	8542.31.00.01	BOTTOM	BALL	未说明	0.72V		未说明	R-PBGA-B900	0.742V	0.698V	500MHz, 1.2GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 256K+ Logic Cells				ROHS3 Compliant
XCZU7EV-1FFVF1517E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1517-BBGA, FCBGA		464	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV		活跃	4 (72 Hours)			8542.31.00.01			未说明			未说明				500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 504K+ Logic Cells				ROHS3 Compliant
XCZU17EG-1FFVB1517E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1517-BBGA, FCBGA		644	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		活跃	4 (72 Hours)			8542.31.00.01			未说明			未说明				500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	Zynq®UltraScale+™ FPGA, 926K+ Logic Cells				ROHS3 Compliant
XAZU3EG-L1SFVC784I	Xilinx Inc.	数据表	175 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	784-BFBGA, FCBGA	YES	128	-40°C~100°C TJ	Tray		Zynq® UltraScale+™ MPSoC EG		活跃	3 (168 Hours)	784		8542.31.00.01	BOTTOM	BALL	未说明	0.72V	0.8mm	未说明	S-PBGA-B784			500MHz, 1.2GHz	1.8MB	微处理器电路	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT	CANbus, I2C, SPI, UART/USART, USB	MPU, FPGA	Zynq®UltraScale+™ FPGA, 154K+ Logic Cells	3.32mm	23mm	23mm	ROHS3 Compliant