Xilinx的片上系统（SoC）_正品采购_价格信息

品牌是'Xilinx' (1945)

产品型号	品牌	数据表	库存	价格(含增值税)	数量	安装类型	包装/外壳	越来越多的功能	触点形状	外壳材料	供应商器件包装	介电材料	插入材料	第一种连接器安装类型	第二个连接器安装类型													厂商						Voltage Rating AC		操作温度	系列	尺寸/尺寸	容差	终止次数	温度系数	连接器类型	类型	电阻	定位的数量	组成	应用	功率(瓦特)	电容量	紧固类型	触点类型	电压 - 供电	方向	屏蔽/屏蔽	入口保护	样式	频率	频率稳定性	输出量	外壳完成	外壳尺寸-插入	功能	基本谐振器	最大电流源	房屋颜色	工作电源电压	失败率	引线间距	电流 - 电源（禁用）（最大值）	注意	速度	内存大小	外壳尺寸，MIL	引线样式	核心处理器	周边设备	扩频带宽	连接方式	重置	建筑学	电压 - 阈值	监测的电压数量	重置超时	第一个连接器
XCZU47DR-1FFVE1156E	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	面板安装	面板安装	50 Ohms	Q-1T04E0	Bulkhead - Front Side Nut	活跃	Female	11 GHz	Bulkhead - Front Side Nut	RG-174	366		Amphenol Custom Cable						Female		Bag	-	-										Black								-	N-Type to TNC														500MHz, 1.2GHz	256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA						N-Type Jack	TNC 插孔		Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-	Shielded	18.00 (457.20mm)
XCZU46DR-2FFVH1760E	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BBGA, FCBGA	1760-FCBGA (42.5x42.5)						Molex	Bulk	120086	活跃	574					0°C ~ 100°C (TJ)	*																																	533MHz, 1.333GHz	256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA									Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-
XCZU49DR-L2FFVF1760I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	表面贴装	6-SMD, No Lead	1760-FCBGA (42.5x42.5)				Strip	Skyworks Solutions Inc.	531AA	活跃	622						-40°C ~ 85°C	Si531	0.276 L x 0.197 W (7.00mm x 5.00mm)						XO (Standard)										3.3V				250 MHz	±50ppm	LVPECL		Enable/Disable	Crystal	121mA				75mA		533MHz, 1.333GHz	256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe	-	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA								-	Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-			0.071 (1.80mm)				-
XCZU49DR-L2FSVF1760I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Surface Mount, MLCC	1206 (3216 Metric)	1760-FCBGA (42.5x42.5)				Tape & Reel (TR)	Vishay Vitramon	Obsolete	50V	622						-55°C ~ 150°C	GA	0.126 L x 0.063 W (3.20mm x 1.60mm)	±0.5pF			C0G, NP0						汽车		1.2 pF																-	-			533MHz, 1.333GHz	256KB		-	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA									Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-	Epoxy Mountable, High Temperature		-		0.067 (1.70mm)		AEC-Q200
XCZU48DR-2FSVE1156I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	0805 (2012 Metric)	0805						KOA Speer Electronics, Inc.	Tape & Reel (TR)	RN732A	Obsolete	366					-55°C ~ 155°C	RN73	0.079 L x 0.049 W (2.00mm x 1.25mm)	±0.1%	2		±5ppm/°C			76.8 kOhms		Thin Film		0.1W, 1/10W																					533MHz, 1.333GHz	256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA									Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-	Moisture Resistant		0.024 (0.60mm)
XCZU48DR-2FSVG1517E	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	表面贴装	10-TFSOP, 10-MSOP (0.118, 3.00mm Width)	10-uMAX/uSOP				Tape & Reel (TR)	Analog Devices Inc./Maxim Integrated	MAX16055	活跃	561						-40°C ~ 125°C (TA)	-							Multi-Voltage Supervisor																开路漏极或开路集电极										533MHz, 1.333GHz	256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	低电平有效	MCU, FPGA	6 Selectable Threshold Combinations	6	140ms Minimum						Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-
XCZU49DR-2FFVF1760E	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1206 (3216 Metric)	1206						Vishay Dale 薄膜	Tray	D55342	活跃	622					-55°C ~ 150°C	Military, MIL-PRF-55342, RM1206	0.126 L x 0.063 W (3.20mm x 1.60mm)	±1%	2		±100ppm/°C			178 Ohms		Thin Film		0.25W, 1/4W																	P (0.1%)				533MHz, 1.333GHz	256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA									Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-	Military, Non-Inductive		0.033 (0.84mm)
XCZU48DR-L1FFVG1517I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)						Molex	Bulk	090635	活跃	561					-40°C ~ 100°C (TJ)	*																																	500MHz, 1.2GHz	256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA									Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-
XCZU49DR-1FSVF1760I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BBGA, FCBGA	1760-FCBGA (42.5x42.5)						Analog Devices Inc./Maxim Integrated	Tape & Reel (TR)	MAX198	Obsolete	622					-40°C ~ 100°C (TJ)	*																																	500MHz, 1.2GHz	256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA									Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-
XCZU43DR-2FFVE1156E	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)				Bulk	Panduit Corp	Obsolete	366							0°C ~ 100°C (TJ)	-																																	533MHz, 1.333GHz	256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA									Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-
XCZU43DR-2FSVE1156I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Radial	-				Bulk	Vishay Foil Resistors (Division of Vishay Precision Group)	活跃	366							-55°C ~ 125°C	S	0.300 L x 0.105 W (7.62mm x 2.67mm)	±0.01%	2		±2ppm/°C			1.09244 kOhms		金属箔		0.6W																	-				533MHz, 1.333GHz	256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA									Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-	Moisture Resistant, Non-Inductive		0.336 (8.53mm)
XCZU43DR-L1FSVG1517I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	表面贴装	10-WFDFN	10-uDFN (2x2)				Tape & Reel (TR)	Analog Devices Inc./Maxim Integrated	MAX16034	Obsolete	561						-40°C ~ 85°C	-							备用电池电路																Push-Pull, Totem Pole										500MHz, 1.2GHz	256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	低电平有效	MCU, FPGA	2.63V	1	140ms Minimum						Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-
XCZU43DR-2FSVG1517E	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	通孔	Radial	1517-FCBGA (40x40)	Polyester, Polyethylene Terephthalate (PET), Metallized - Stacked		Bulk	Obsolete	EPCOS - TDK Electronics	63V	561					40V		-55°C ~ 125°C	SilverCap™ B32561	0.453 L x 0.177 W (11.50mm x 4.50mm)	±20%		PC引脚							通用型		1 µF																	0.394 (10.00mm)			533MHz, 1.333GHz	256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA									Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-			0.272 (6.90mm)
XCZU43DR-L2FSVE1156I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	面板安装	1156-BBGA, FCBGA	Bulkhead - Front Side Nut	Circular	Composite	1156-FCBGA (35x35)	Plastic	活跃	TE Connectivity Deutsch 连接器	366				Bulk	D38999/24MA		20	-65°C ~ 200°C	Military, MIL-DTL-38999 Series III, ACT						插座外壳	用于内螺纹插座		3					Threaded		Crimp	B	Shielded	抗环境干扰				化学镍	9-98			Silver					不包括触点	533MHz, 1.333GHz	256KB	A		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA					-				Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-	-					-
XCZU43DR-1FFVG1517I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Surface Mount, MLCC	0402 (1005 Metric)	1517-FCBGA (40x40)				Bulk	Vishay Vitramon	Obsolete	100V	561						-55°C ~ 150°C	VJ	0.039 L x 0.020 W (1.00mm x 0.50mm)	±10%			C0G, NP0						汽车		18 pF																-	-			500MHz, 1.2GHz	256KB		-	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA									Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-	-		-		0.024 (0.60mm)		AEC-Q200
XCZU48DR-1FSVG1517I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)						Molex	Bulk	093090	活跃	561					-40°C ~ 100°C (TJ)	*																																	500MHz, 1.2GHz	256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA									Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-
XCVC1902-2HSIVSVD1760	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	0805 (2012 Metric)	0805						KOA Speer Electronics, Inc.	Tape & Reel (TR)	RN732A	Obsolete	726					-55°C ~ 155°C	RN73	0.079 L x 0.049 W (2.00mm x 1.25mm)	±0.1%	2		±50ppm/°C			48.1 kOhms		Thin Film		0.1W, 1/10W																					800MHz, 1.65GHz	256KB			Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA									Versal™ AI Core FPGA, 1.9M Logic Cells	-	Moisture Resistant		0.024 (0.60mm)
XCVC1802-1MLIVSVD1760	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BFBGA, FCBGA	1760-FCBGA (40x40)				Bulk	Panduit Corp	Obsolete	692							-40°C ~ 100°C (TJ)	*																																	600MHz, 1.3GHz	256KB			Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA									Versal™ AI Core FPGA, 1.5M Logic Cells	-
XCVM1402-2MSIVSVF1369	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1											+ 110 C	- 40 C	Xilinx	Xilinx																			SOC - Systems on a Chip													800 mV																		System-On-Modules - SOM								SoC FPGA
XQZU59DR-L1FSRF1760I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1									Xilinx	Xilinx	1																					SOC - Systems on a Chip																																						SoC FPGA
XQZU58DR-1FFQE1156I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1									1	Xilinx	Xilinx																					SOC - Systems on a Chip																																						SoC FPGA
XQVP1202-2MLIVSQA2785	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	+ 110 C												Xilinx	Xilinx	1		- 40 C																	SOC - Systems on a Chip													800 mV																		System-On-Modules - SOM								SoC FPGA
XCVE2302-2MSESFVA784	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	+ 110 C												Xilinx	Xilinx	1		0 C																	SOC - Systems on a Chip													800 mV																		System-On-Modules - SOM								SoC FPGA
XCVE2002-2MLESFVA784	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Xilinx												+ 110 C	0 C	1		Xilinx																	SOC - Systems on a Chip													800 mV																		System-On-Modules - SOM								SoC FPGA
XQVC1902-1LSIVSQA2197	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Xilinx												+ 110 C	- 40 C	1		Xilinx																	SOC - Systems on a Chip													700 mV																		System-On-Modules - SOM								SoC FPGA