Xilinx的片上系统（SoC）_正品采购_价格信息

品牌是'Xilinx' (1945)

产品型号	品牌	数据表	库存	价格(含增值税)	数量	安装类型	包装/外壳	越来越多的功能	引脚数	触点形状	外壳材料	供应商器件包装	介电材料	插入材料													厂商													Voltage Rating AC			操作温度	包装	系列	尺寸/尺寸	容差	零件状态	终端	温度系数	连接器类型	类型	定位的数量	组成	应用	功率(瓦特)	电容量	紧固类型	子类别	额定功率	触点类型	技术	方向	屏蔽/屏蔽	入口保护	深度	额定电流	频率	频率稳定性	输出量	外壳完成	外壳尺寸-插入	终端样式	房屋颜色	工作电源电压	电介质	失败率	引线间距	注意	电感,电感	负载电容	速度	内存大小	外壳尺寸，MIL	引线样式	核心处理器	电阻数	周边设备	连接方式	重置	建筑学	电压 - 阈值	监测的电压数量	重置超时	驱动电平	电路型态	产品类别	工作温度范围	等效串联电阻	包括
XCZU49DR-2FFVF1760E	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1206 (3216 Metric)	1206	Vishay Dale 薄膜								Tray	D55342		活跃	622	-55°C ~ 150°C		Military, MIL-PRF-55342, RM1206	0.126 L x 0.063 W (3.20mm x 1.60mm)	±1%		2		±100ppm/°C			178 Ohms		Thin Film		0.25W, 1/4W																			P (0.1%)					533MHz, 1.333GHz	256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™		DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA											Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-		Military, Non-Inductive				0.033 (0.84mm)
XCZU48DR-L1FFVG1517I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)	Molex								Bulk	090635		活跃	561	-40°C ~ 100°C (TJ)		*																																					500MHz, 1.2GHz	256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™		DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA											Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-
XCZU49DR-1FSVF1760I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BBGA, FCBGA	1760-FCBGA (42.5x42.5)	Analog Devices Inc./Maxim Integrated								Tape & Reel (TR)	MAX198		Obsolete	622	-40°C ~ 100°C (TJ)		*																																					500MHz, 1.2GHz	256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™		DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA											Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-
XCZU43DR-2FFVE1156E	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	Panduit Corp					Bulk	Obsolete	366					0°C ~ 100°C (TJ)		-																																					533MHz, 1.333GHz	256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™		DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA											Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-
XCZU43DR-2FSVE1156I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Radial	-	Vishay Foil Resistors (Division of Vishay Precision Group)					Bulk	活跃	366					-55°C ~ 125°C		S	0.300 L x 0.105 W (7.62mm x 2.67mm)	±0.01%		2		±2ppm/°C			1.09244 kOhms		金属箔		0.6W																			-					533MHz, 1.333GHz	256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™		DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA											Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-		Moisture Resistant, Non-Inductive				0.336 (8.53mm)
XCZU43DR-L1FSVG1517I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	表面贴装	10-WFDFN	10-uDFN (2x2)	Analog Devices Inc./Maxim Integrated					Tape & Reel (TR)	MAX16034	Obsolete	561				-40°C ~ 85°C		-								备用电池电路																		Push-Pull, Totem Pole											500MHz, 1.2GHz	256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™		DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	低电平有效	MCU, FPGA	2.63V	1	140ms Minimum								Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-
XCZU43DR-2FSVG1517E	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	通孔	Radial	1517-FCBGA (40x40)	Polyester, Polyethylene Terephthalate (PET), Metallized - Stacked	EPCOS - TDK Electronics		Bulk	Obsolete	63V	561			40V			-55°C ~ 125°C		SilverCap™ B32561	0.453 L x 0.177 W (11.50mm x 4.50mm)	±20%			PC引脚							通用型		1 µF																			0.394 (10.00mm)				533MHz, 1.333GHz	256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™		DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA											Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-						0.272 (6.90mm)
XCZU43DR-L2FSVE1156I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	面板安装	1156-BBGA, FCBGA	Bulkhead - Front Side Nut	Circular	Composite	1156-FCBGA (35x35)	Plastic	TE Connectivity Deutsch 连接器			Bulk	D38999/24MA	20		活跃	366	-65°C ~ 200°C		Military, MIL-DTL-38999 Series III, ACT							插座外壳	用于内螺纹插座		3					Threaded			Crimp		B	Shielded	抗环境干扰					化学镍	9-98	Silver					不包括触点			533MHz, 1.333GHz	256KB	A		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™		DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA									-		Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-		-								-
XCZU43DR-1FFVG1517I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Surface Mount, MLCC	0402 (1005 Metric)	1517-FCBGA (40x40)	Vishay Vitramon					Bulk	Obsolete	100V	561				-55°C ~ 150°C		VJ	0.039 L x 0.020 W (1.00mm x 0.50mm)	±10%				C0G, NP0						汽车		18 pF																		-	-				500MHz, 1.2GHz	256KB		-	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™		DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA											Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-		-				-			0.024 (0.60mm)		AEC-Q200
XCZU48DR-1FSVG1517I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)	Molex								Bulk	093090		活跃	561	-40°C ~ 100°C (TJ)		*																																					500MHz, 1.2GHz	256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™		DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA											Zynq®UltraScale+™ FPGA, 930K+ Logic Cells	-
XCVC1802-1MSIVSVD1760	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BFBGA, FCBGA	1760-FCBGA (40x40)	AMD 赛灵思					692	Tray	活跃					-40°C ~ 100°C (TJ)		Versal™ AI Core																																					600MHz, 1.3GHz	256KB			Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™		DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA											Versal™ AI Core FPGA, 1.5M Logic Cells	-
XCVC1802-1MLIVSVD1760	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BFBGA, FCBGA	1760-FCBGA (40x40)	Panduit Corp					Bulk	Obsolete	692					-40°C ~ 100°C (TJ)		*																																					600MHz, 1.3GHz	256KB			Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™		DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA											Versal™ AI Core FPGA, 1.5M Logic Cells	-
XCZU29DR-1FFVF1760E	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	ITT Cannon, LLC	活跃											Bulk	KJG6T		Tray	*			活跃
XCVM1302-2LLEVSVD1760	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	7 mm x 5 mm	1760-FCBGA (40x40)	CTS电子元件	Details	402	Tray	活跃	AMD 赛灵思								55 %	+ 70 C	2.62 V	- 20 C	1000		2.37 V	CTS	0°C ~ 100°C (TJ)	Reel	637																Oscillators						55 mA	155.52 MHz	25 PPM				SMD/SMT		700 mV							450MHz, 1.08GHz	-			Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™		DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA						标准振荡器				LVPECL	Versal™ Prime FPGA, 70k Logic Cells	-			标准时钟振荡器		2 mm		7 mm	5 mm
XCVM1402-2LLEVSVD1760	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BFBGA, FCBGA	1760-FCBGA (40x40)			AMD 赛灵思					1	110704-0148	ITT Cannon	ITT Cannon	+ 110 C	0 C	726	Tray		活跃		0°C ~ 100°C (TJ)		KPT																D-Sub Connectors														700 mV							450MHz, 1.08GHz	-			Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™		DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA						D-Sub Connectors - Standard Density					Versal™ Prime FPGA, 1.2M Logic Cells	-			D-Sub Standard Connectors
XCVM1302-1LSIVSVD1760	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BFBGA, FCBGA	1760-FCBGA (40x40)	0.000225 oz	- 55 C	5000	PCB 安装	5-1614959-1	TE Connectivity	TE Connectivity / Holsworthy	Details	AMD 赛灵思	402	Tray	活跃								100 V	0805		2012	+ 155 C	-40°C ~ 100°C (TJ)	MouseReel	CPF		0.1 %				25 PPM / C		High Stability Thin Film Precision Resistor	1.37 MOhms						Resistors	100 mW (1/10 W)		Thin Film										SMD/SMT		700 mV							400MHz, 1GHz	-			Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™		DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA						薄膜电阻器					Versal™ Prime FPGA, 70k Logic Cells	-	精密薄膜贴片电阻器	-	Thin Film Resistors - SMD		0.55 mm		2 mm	1.25 mm
XCVM1302-1LLIVSVD1760	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BFBGA, FCBGA	1760-FCBGA (40x40)		AMD 赛灵思				Glenair	Glenair	+ 110 C	- 40 C	1	402	Tray	活跃					-40°C ~ 100°C (TJ)		928																Power														700 mV							400MHz, 1GHz	-			Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™		DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA						照明连接器					Versal™ Prime FPGA, 70k Logic Cells	-			照明连接器
XCVC1902-1LLIVSVA2197-5098	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1						Compliant	+ 110 C	- 40 C	1	Xilinx	Xilinx											40 %														SOC - Systems on a Chip							7.5 mm							700 mV					5.8 µH																	System-On-Modules - SOM									SoC FPGA		7.5 mm		9.4 mm	6.5 mm
XCZU67DR-1FSVE1156IES9919	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1.6 mm x 1.2 mm				+ 70 C	- 20 C	3000	CTS	CTS电子元件	Details									Reel	416		15 PPM														Crystals								50 MHz	15 PPM			SMD/SMT								18 pF																Crystals		100 Ohms							Crystals				1.6 mm	1.2 mm
XCVM2202-1MSEVSVC2197	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	0402 (1005 metric)	8						82 kOhms	+ 125 C	0.000023 oz	- 55 C	10000	CTS	CTS电子元件	Details						MouseReel	74x		5 %				200 PPM / C										Resistors												SMD/SMT		800 mV												4									Isolated	Resistor Networks & Arrays	- 55 C to + 125 C						Arrays		Resistor Networks & Arrays		0.4 mm		2 mm	1 mm
XCVM2202-1LLIVSVC2197	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	HC-49/US						+ 70 C	- 20 C	200	通孔	ABRACON	ABRACON	Details							Bulk	ABL		10 PPM						微处理器晶体								Crystals								18.432 MHz	10 PPM			Radial		700 mV						18 pF														100 uW		Crystals		40 Ohms							Crystals	-	3.5 mm		11.5 mm	5 mm
XCVE1752-2MLIVSVA1596	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1								+ 155 C	- 55 C	60	PCB 安装	Xicon	Xicon	Details						Bulk	PRM-RC		5 %				350 PPM / C		水泥功率电阻器	180 Ohms							Resistors	10 W		Wirewound									Radial		800 mV			5 mm																			绕线电阻	- 55 C to + 155 C						绕线水泥瓷盒功率电阻器	-	Wirewound Resistors - Through Hole		50 mm		12.5 mm	9 mm
XCVC1702-2LSEVSVA2197	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	5 mm x 3.2 mm	2197-FCBGA (45x45)	608	Tray	活跃		AMD 赛灵思							+ 70 C	0.001764 oz	- 20 C	1000	SMD/SMT	CTS		CTS电子元件	Details	0°C ~ 100°C (TJ)	MouseReel	445		30 PPM						SMD石英								Crystals							25 MHz	20 PPM				SMD/SMT		700 mV						8 pF	450MHz, 1.08GHz	-			Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™		DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MPU, FPGA				100 uW		Crystals		40 Ohms			Versal™ AI Core FPGA, 1M Logic Cells	-			Crystals		1.35 mm		5 mm	3.2 mm
XCVC1702-1LSIVSVG1369	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1.6 mm x 1.2 mm				+ 60 C	- 10 C	3000	CTS	CTS电子元件	Details									Reel	416		30 PPM														Crystals								40 MHz	50 PPM			SMD/SMT		700 mV						18 pF																Crystals		100 Ohms							Crystals				1.6 mm	1.2 mm
XCVE2202-2LLESFVA784	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1206 (3216 metric)	- 55 C	15000	0.0012 uF	Vishay	50 VDC	Vishay / Vitramon	Details		Class 1									1206	3216	1.2 nF		+ 125 C	0.000952 oz		Reel	VJ W1BC Basic Comm		10 %			Flexible (Soft)									1200 pF		Capacitors												SMD/SMT		700 mV	C0G (NP0)																					陶瓷电容器							通用型MLCC		Multilayer Ceramic Capacitors MLCC - SMD/SMT		0.8 mm		3.2 mm	1.6 mm