Xilinx的片上系统（SoC）_正品采购_价格信息

品牌是'Xilinx' (1945)

产品型号	品牌	数据表	库存	价格(含增值税)	数量	工厂交货时间	触点镀层	底架	包装/外壳	表面安装	引脚数				操作温度	包装	已出版	系列	JESD-609代码	无铅代码	零件状态	湿度敏感性等级(MSL)	终止次数	ECCN 代码	端子表面处理	附加功能	HTS代码	端子位置	终端形式	峰值回流焊温度（摄氏度）	电源电压	端子间距	频率	时间@峰值回流温度-最大值(s)	基本部件号	引脚数量	JESD-30代码	资历状况	工作电源电压	电源电压-最大值(Vsup)	电源	电源电压-最小值(Vsup)	界面	最大电源电压	最小电源电压	速度	内存大小	uPs/uCs/外围ICs类型	核心处理器	周边设备	时钟频率	传播延迟	连接方式	建筑学	数据总线宽度	逻辑元件/单元数	核心架构	边界扫描	速度等级	内存(字)	主要属性	寄存器数量	总线兼容性	可擦除紫外线	座位高度(最大)	长度	宽度	辐射硬化
XA7Z020-1CLG484Q	Xilinx Inc.	数据表	395 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	表面贴装	484-LFBGA, CSPBGA	484	130	Automotive grade		-40°C~125°C TJ	Tray	2009	Automotive, AEC-Q100, Zynq®-7000 XA	e1		活跃	3 (168 Hours)	484	3A991.D	锡银铜		8542.39.00.01	BOTTOM	BALL	未说明		0.8mm	667MHz	未说明				不合格	1V		11.8V		CAN, EBI/EMI, Ethernet, GPIO, I2C, MMC, SD, SDIO, SPI, UART, USART, USB				256KB	微处理器电路	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b		ARM				Artix™-7 FPGA, 85K Logic Cells			N	1.6mm	19mm			ROHS3 Compliant
XC7Z007S-2CLG400I	Xilinx Inc.	数据表	960 In Stock	1: ¥201.823087 10: ¥190.399138 100: ¥179.621828 500: ¥169.454555 查看所有的价格 -	最小起订量: 1 最小包装量: 1	10 Weeks	400-LFBGA, CSPBGA	YES		100			-40°C~100°C TJ	Tray	2016	Zynq®-7000	e3	yes	活跃	3 (168 Hours)	400		Matte Tin (Sn)		8542.31.00.01	BOTTOM	BALL	未说明	1V	0.8mm		未说明			S-PBGA-B400			1.05V		0.95V				766MHz	256KB		Single ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	800MHz		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				YES		256000	Artix™-7 FPGA, 23K Logic Cells		CAN; ETHERNET; I2C; SPI; UART; USB		1.6mm	17mm	17mm		ROHS3 Compliant
XC7Z100-1FFG900I	Xilinx Inc.	数据表	980 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	900-BBGA, FCBGA	YES		212			-40°C~100°C TJ	Tube	2010	Zynq®-7000	e1		活跃	4 (72 Hours)	900	3A991.D	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		8542.39.00.01	BOTTOM	BALL	245	1V	1mm	667MHz	30	XC7Z100		S-PBGA-B900			1.05V		0.95V	CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB				256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			ARM	YES		256000	Kintex™-7 FPGA, 444K Logic Cells		CAN; ETHERNET; I2C; SPI; UART; USB		3.35mm	31mm	31mm	无	ROHS3 Compliant
XC7Z035-1FBG676I	Xilinx Inc.	数据表	990 In Stock	1: ¥5,630.870025 10: ¥5,445.715691 25: ¥5,407.860666 50: ¥5,370.268785 查看所有的价格 -	最小起订量: 1 最小包装量: 1	10 Weeks	676-BBGA, FCBGA	YES		130			-40°C~100°C TJ	Tray	2010	Zynq®-7000	e1		活跃	3 (168 Hours)	676	3A991.D	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY	8542.39.00.01	BOTTOM	BALL	未说明	1V	1mm	667MHz	未说明			S-PBGA-B676			1.05V		0.95V	CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB				256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			ARM	YES		256000	Kintex™-7 FPGA, 275K Logic Cells		CAN; ETHERNET; I2C; SPI; UART; USB		2.54mm	27mm	27mm		ROHS3 Compliant
XC7Z035-1FBG676C	Xilinx Inc.	数据表	990 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	表面贴装	676-BBGA, FCBGA	130			0°C~85°C TJ	Tray	2010	Zynq®-7000	e1		活跃	3 (168 Hours)	676		Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)			BOTTOM	BALL	未说明	1V		667MHz	未说明			S-PBGA-B676						CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	1.05V	950mV		256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA		120 ps	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			ARM	YES	1	256000	Kintex™-7 FPGA, 275K Logic Cells	343800	CAN; ETHERNET; I2C; SPI; UART; USB		2.54mm	27mm	27mm		ROHS3 Compliant
XC7Z030-2FBG676E	Xilinx Inc.	数据表	94 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	676-BBGA, FCBGA	YES	676		130	0°C~100°C TJ	Tray	2009	Zynq®-7000	e1		活跃	4 (72 Hours)	676	3A991.D	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		8542.39.00.01	BOTTOM	BALL	245	1V	1mm	800MHz	30	XC7Z030				1V	1.05V			CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB				256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b		ARM	YES	-2	256000	Kintex™-7 FPGA, 125K Logic Cells		CAN; ETHERNET; I2C; SPI; UART; USB		2.54mm	27mm		无	ROHS3 Compliant
XC7Z010-3CLG225E	Xilinx Inc.	数据表	259 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	225-LFBGA, CSPBGA	YES	225	86			0°C~100°C TJ	Tray	2010	Zynq®-7000	e1		活跃	3 (168 Hours)	225	EAR99	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		8542.39.00.01	BOTTOM	BALL	260	1V	0.8mm	866MHz	30	XC7Z010					1.05V		0.95V	CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB				256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b		ARM	YES	-3	256000	Artix™-7 FPGA, 28K Logic Cells		CAN; ETHERNET; I2C; SPI; UART; USB		1.5mm	13mm		无	ROHS3 Compliant
XC7Z020-3CLG484E	Xilinx Inc.	数据表	495 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	484-LFBGA, CSPBGA	YES	484		130	0°C~100°C TJ	Tray	2009	Zynq®-7000	e1		活跃	3 (168 Hours)	484	3A991.D	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		8542.39.00.01	BOTTOM	BALL	260	1V	0.8mm	866MHz	30	XC7Z020				1V	1.05V			CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB				256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b		ARM	YES	-3	256000	Artix™-7 FPGA, 85K Logic Cells		CAN; ETHERNET; I2C; SPI; UART; USB		1.6mm	19mm		无	ROHS3 Compliant
XC7Z035-2FFG900E	Xilinx Inc.	数据表	20 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	表面贴装	900-BBGA, FCBGA	130			0°C~100°C TJ	Tray	2010	Zynq®-7000	e1		活跃	4 (72 Hours)	900	3A991.D	Tin/Silver/Copper (Sn/Ag/Cu)	PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY		BOTTOM	BALL	245	1V	1mm	800MHz	30			S-PBGA-B900						CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	1.05V	950mV		256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA		100 ps	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			ARM	YES	2		Kintex™-7 FPGA, 275K Logic Cells	343800			3.35mm	31mm	31mm		ROHS3 Compliant
XC7Z010-3CLG400E	Xilinx Inc.	数据表	495 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	400-LFBGA, CSPBGA	YES	400		130	0°C~100°C TJ	Tray	2010	Zynq®-7000	e1		活跃	3 (168 Hours)	400	EAR99	Tin/Silver/Copper (Sn/Ag/Cu)		8542.39.00.01	BOTTOM	BALL	260	1V	0.8mm	866MHz	30	XC7Z010				1V	1.05V			CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB				256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b		ARM	YES	-3	256000	Artix™-7 FPGA, 28K Logic Cells		CAN; ETHERNET; I2C; SPI; UART; USB		1.6mm	17mm		无	ROHS3 Compliant
XC7Z035-2FFG676E	Xilinx Inc.	数据表	19 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	表面贴装	676-BBGA, FCBGA	130			0°C~100°C TJ	Tray	2010	Zynq®-7000	e1		活跃	4 (72 Hours)	676	3A991.D	Tin/Silver/Copper (Sn/Ag/Cu)	PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY		BOTTOM	BALL	未说明	1V	1mm	800MHz	未说明			S-PBGA-B676						CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	1.05V	950mV		256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA		110 ps	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			ARM	YES	2		Kintex™-7 FPGA, 275K Logic Cells	343800			3.37mm				ROHS3 Compliant
XC7Z030-3FBG484E	Xilinx Inc.	数据表	990 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	484-BBGA, FCBGA	YES	484		130	0°C~100°C TJ	Tray	2009	Zynq®-7000	e1		活跃	3 (168 Hours)	484	EAR99	Tin/Silver/Copper (Sn/Ag/Cu)		8542.39.00.01	BOTTOM	BALL	250	1V	1mm	1GHz	30	XC7Z030				1V	1.05V			CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB				256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b		ARM	YES	-3	256000	Kintex™-7 FPGA, 125K Logic Cells		CAN; ETHERNET; I2C; SPI; UART; USB		2.54mm	23mm		无	ROHS3 Compliant
XC7Z045-1FFG676I	Xilinx Inc.	数据表	361 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	676-BBGA, FCBGA	YES		ROMless	130		-40°C~100°C TJ	Tray	2009	Zynq®-7000	e1	yes	活跃	4 (72 Hours)	676	3A991.D	Tin/Silver/Copper (Sn/Ag/Cu)		8542.39.00.01	BOTTOM	BALL	245	1V	1mm	667MHz	30	XC7Z045	676	S-PBGA-B676		1V	1.05V	11.8V		CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB				256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b		ARM	YES	-1	256000	Kintex™-7 FPGA, 350K Logic Cells		CAN; ETHERNET; I2C; SPI; UART; USB	N	3.37mm	27mm		无	ROHS3 Compliant
XC7Z035-L2FBG676I	Xilinx Inc.	数据表	990 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	676-BBGA, FCBGA	YES		130			-40°C~100°C TJ	Tray	2010	Zynq®-7000	e1		活跃	3 (168 Hours)	676	3A991.D	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY	8542.39.00.01	BOTTOM	BALL	未说明	1V	1mm	800MHz	未说明			S-PBGA-B676			1.05V		0.95V	CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB				256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			ARM	YES		256000	Kintex™-7 FPGA, 275K Logic Cells		CAN; ETHERNET; I2C; SPI; UART; USB		2.54mm	27mm	27mm		ROHS3 Compliant
XC7Z045-1FFG900C	Xilinx Inc.	数据表	990 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	900-BBGA, FCBGA	YES	900	ROMless	130		0°C~85°C TJ	Tray	2009	Zynq®-7000	e1		活跃	4 (72 Hours)	900	3A991.D	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		8542.39.00.01	BOTTOM	BALL	245	1V	1mm	667MHz	30	XC7Z045								CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	3.3V	1.2V		256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b	190000	ARM	YES	-1	256000	Kintex™-7 FPGA, 350K Logic Cells		CAN; ETHERNET; I2C; SPI; UART; USB		3.35mm	31mm		无	ROHS3 Compliant
XC7Z035-3FFG676E	Xilinx Inc.	数据表	326 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	676-BBGA, FCBGA	YES		130			0°C~100°C TJ	Tray	2010	Zynq®-7000	e1		活跃	4 (72 Hours)	676	3A991.D	Tin/Silver/Copper (Sn/Ag/Cu)	PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY	8542.39.00.01	BOTTOM	BALL	未说明	1V	1mm	800MHz	未说明			S-PBGA-B676			1.05V		0.95V	CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB				256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			ARM	YES		256000	Kintex™-7 FPGA, 275K Logic Cells		CAN; ETHERNET; I2C; SPI; UART; USB		3.37mm	27mm	27mm		ROHS3 Compliant
XC7Z030-1FFG676C	Xilinx Inc.	数据表	490 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	676-BBGA, FCBGA	YES	676		130	0°C~85°C TJ	Tray	2009	Zynq®-7000	e1		活跃	4 (72 Hours)	676	3A991.D	Tin/Silver/Copper (Sn/Ag/Cu)		8542.39.00.01	BOTTOM	BALL	245	1V	1mm	667MHz	30	XC7Z030				1V	1.05V			CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB				256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b		ARM	YES	-1	256000	Kintex™-7 FPGA, 125K Logic Cells		CAN; ETHERNET; I2C; SPI; UART; USB		3.24mm	27mm		无	ROHS3 Compliant
XC7Z015-2CLG485E	Xilinx Inc.	数据表	495 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	表面贴装	484-LFBGA, CSPBGA	485		130	0°C~100°C TJ	Tray	2010	Zynq®-7000	e1		活跃	3 (168 Hours)	485	EAR99	Tin/Silver/Copper (Sn/Ag/Cu)	PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY	8542.39.00.01	BOTTOM	BALL	未说明	1V	0.8mm	766MHz	未说明				不合格		1.05V	11.8V	0.95V	CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB				256KB	微处理器电路	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b		ARM	YES		256000	Artix™-7 FPGA, 74K Logic Cells		CAN; ETHERNET; I2C; SPI; UART; USB	N	1.6mm	19mm			ROHS3 Compliant
XC7Z045-1FBG676I	Xilinx Inc.	数据表	597 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	676-BBGA, FCBGA	YES		ROMless	130		-40°C~100°C TJ	Tray	2009	Zynq®-7000	e1		活跃	3 (168 Hours)	676	3A991.D	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		8542.39.00.01	BOTTOM	BALL	245	1V	1mm	667MHz	30	XC7Z045		S-PBGA-B676		1V	1.05V			CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB				256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b		ARM	YES	-1	256000	Kintex™-7 FPGA, 350K Logic Cells		CAN; ETHERNET; I2C; SPI; UART; USB		2.54mm	27mm		无	ROHS3 Compliant
XC7Z045-3FFG676E	Xilinx Inc.	数据表	368 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	676-BBGA, FCBGA	YES		ROMless	130		0°C~100°C TJ	Tray	2009	Zynq®-7000	e1		活跃	4 (72 Hours)	676	3A991.D	Tin/Silver/Copper (Sn/Ag/Cu)		8542.39.00.01	BOTTOM	BALL	245	1V	1mm	1GHz	30	XC7Z045		S-PBGA-B676		1V	1.05V			CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB				256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b		ARM	YES	-3	256000	Kintex™-7 FPGA, 350K Logic Cells		CAN; ETHERNET; I2C; SPI; UART; USB		3.37mm	27mm		无	ROHS3 Compliant
XC7Z007S-1CLG400I	Xilinx Inc.	数据表	2970 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	400-LFBGA, CSPBGA	YES		100			-40°C~100°C TJ	Tray	2016	Zynq®-7000	e3	yes	活跃	3 (168 Hours)	400		Matte Tin (Sn)		8542.31.00.01	BOTTOM	BALL	未说明	1V	0.8mm		未说明			S-PBGA-B400			1.05V		0.95V				667MHz	256KB		Single ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	667MHz		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				YES		256000	Artix™-7 FPGA, 23K Logic Cells		CAN; ETHERNET; I2C; SPI; UART; USB		1.6mm	17mm	17mm		ROHS3 Compliant
XC7Z012S-2CLG485E	Xilinx Inc.	数据表	980 In Stock	1: ¥1,110.356756 10: ¥1,047.506374 100: ¥988.213560 500: ¥932.276943 查看所有的价格 -	最小起订量: 1 最小包装量: 1	10 Weeks	484-LFBGA, CSPBGA	YES		150			0°C~100°C TJ	Tray	2016	Zynq®-7000	e3	yes	活跃	3 (168 Hours)	485		Matte Tin (Sn)		8542.31.00.01	BOTTOM	BALL	未说明	1V	0.8mm		未说明			S-PBGA-B485			1.05V		0.95V				766MHz	256KB		Single ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	800MHz		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				YES		256000	Artix™-7 FPGA, 55K Logic Cells		CAN; ETHERNET; I2C; SPI; UART; USB		1.6mm	19mm	19mm		ROHS3 Compliant
XC7Z007S-1CLG225I	Xilinx Inc.	数据表	1980 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	225-LFBGA, CSPBGA	YES		54			-40°C~100°C TJ	Tray	2016	Zynq®-7000	e1	yes	活跃	3 (168 Hours)	225		Tin/Silver/Copper (Sn/Ag/Cu)			BOTTOM	BALL	260	1V	0.8mm		30			S-PBGA-B225			1.05V		0.95V				667MHz	256KB		Single ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	667MHz		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA				YES		256000	Artix™-7 FPGA, 23K Logic Cells		CAN; ETHERNET; I2C; SPI; UART; USB		1.5mm	13mm	13mm		ROHS3 Compliant
XC7Z015-1CLG485I	Xilinx Inc.	数据表	990 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	表面贴装	484-LFBGA, CSPBGA	485		130	-40°C~100°C TJ	Tray	2010	Zynq®-7000	e1		活跃	3 (168 Hours)	485	EAR99	Tin/Silver/Copper (Sn/Ag/Cu)	PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY	8542.39.00.01	BOTTOM	BALL	未说明	1V	0.8mm	667MHz	未说明				不合格		1.05V	11.8V	0.95V	CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB				256KB	微处理器电路	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b		ARM	YES		256000	Artix™-7 FPGA, 74K Logic Cells		CAN; ETHERNET; I2C; SPI; UART; USB	N	1.6mm	19mm			ROHS3 Compliant
XC7Z030-L2FBG676I	Xilinx Inc.	数据表	421 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	表面贴装	676-BBGA, FCBGA	130			-40°C~100°C TJ	Tray	2010	Zynq®-7000	e1		活跃	3 (168 Hours)	676	3A991.D	Tin/Silver/Copper (Sn/Ag/Cu)	PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY	8542.39.00.01	BOTTOM	BALL	未说明	1V	1mm	800MHz	未说明			S-PBGA-B676						CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	1.05V	950mV		256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			ARM	YES		256000	Kintex™-7 FPGA, 125K Logic Cells	157200	CAN; ETHERNET; I2C; SPI; UART; USB		2.54mm	27mm	27mm		ROHS3 Compliant