Xilinx的片上系统（SoC）_正品采购_价格信息

品牌是'Xilinx' (1945)

产品型号	品牌	数据表	库存	价格(含增值税)	数量	工厂交货时间	触点镀层	底架	包装/外壳	表面安装	Core												操作温度	包装	已出版	系列	JESD-609代码	无铅代码	零件状态	湿度敏感性等级(MSL)	终止次数	ECCN 代码	端子表面处理	附加功能	HTS代码	终端形式	峰值回流焊温度（摄氏度）	电源电压	端子间距	Reach合规守则	频率	时间@峰值回流温度-最大值(s)	基本部件号	JESD-30代码	工作电源电压	电源电压-最大值(Vsup)	电源电压-最小值(Vsup)	界面	最大电源电压	最小电源电压	速度	内存大小	核心处理器	周边设备	时钟频率	连接方式	建筑学	数据总线宽度	核心架构	边界扫描	收发器数量	核数量
XCZU4CG-1FBVB900E	Xilinx Inc.	数据表	40 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA					204	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)					8542.31.00.01			未说明					未说明								500MHz, 1.2GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 192K+ Logic Cells						ROHS3 Compliant
XC7Z020-L1CLG484I	Xilinx Inc.	数据表	495 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	表面贴装	484-LFBGA, CSPBGA		130		-40°C~100°C TJ	Tray	2010	Zynq®-7000	e1		活跃	3 (168 Hours)	484	3A991.D	Tin/Silver/Copper (Sn/Ag/Cu)	PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY	8542.39.00.01	BOTTOM	BALL	未说明	1V	0.8mm		667MHz	未说明		S-PBGA-B484			CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	1.05V	950mV		256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA		130 ps	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		ARM	YES	256000	Artix™-7 FPGA, 85K Logic Cells	106400	CAN; ETHERNET; I2C; SPI; UART; USB	1.6mm	19mm	19mm	ROHS3 Compliant
XC7Z045-L2FFG676I	Xilinx Inc.	数据表	288 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	表面贴装	676-BBGA, FCBGA		130		-40°C~100°C TJ	Tray	2010	Zynq®-7000	e1		活跃	4 (72 Hours)	676	3A991.D	Tin/Silver/Copper (Sn/Ag/Cu)	PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY	8542.39.00.01	BOTTOM	BALL	未说明	1V	1mm		800MHz	未说明		S-PBGA-B676			CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	1.05V	950mV		256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA		100 ps	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		ARM	YES	256000	Kintex™-7 FPGA, 350K Logic Cells	437200	CAN; ETHERNET; I2C; SPI; UART; USB	3.37mm	27mm	27mm	ROHS3 Compliant
XC7Z012S-2CLG485I	Xilinx Inc.	数据表	9100 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	484-LFBGA, CSPBGA	YES		150			-40°C~100°C TJ	Tray	2016	Zynq®-7000	e3	yes	活跃	3 (168 Hours)	485		Matte Tin (Sn)		8542.31.00.01	BOTTOM	BALL	未说明	1V	0.8mm			未说明		S-PBGA-B485	1.05V	0.95V				766MHz	256KB		Single ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	800MHz		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			YES	256000	Artix™-7 FPGA, 55K Logic Cells		CAN; ETHERNET; I2C; SPI; UART; USB	1.6mm	19mm	19mm	ROHS3 Compliant
XCZU17EG-2FFVC1760E	Xilinx Inc.	数据表	N/A	-	最小起订量: 1 最小包装量: 1	11 Weeks	1760-BBGA, FCBGA					512	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG		yes	活跃	4 (72 Hours)					8542.31.00.01			未说明					未说明								533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 926K+ Logic Cells						ROHS3 Compliant
XCZU2CG-1SBVA484I	Xilinx Inc.	数据表	6220 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	484-BFBGA, FCBGA					82	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)					8542.31.00.01			未说明					未说明								500MHz, 1.2GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 103K+ Logic Cells						ROHS3 Compliant
XCZU2EG-1SBVA484E	Xilinx Inc.	数据表	955 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	484-BFBGA, FCBGA					82	0°C~100°C TJ	Tray		Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)					8542.31.00.01			未说明					未说明								500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 103K+ Logic Cells						ROHS3 Compliant
XCZU4CG-1FBVB900I	Xilinx Inc.	数据表	647 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA					204	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)					8542.31.00.01			未说明					未说明								500MHz, 1.2GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 192K+ Logic Cells						ROHS3 Compliant
XC7Z012S-1CLG485I	Xilinx Inc.	数据表	990 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	484-LFBGA, CSPBGA	YES		150			-40°C~100°C TJ	Tray	2016	Zynq®-7000	e3	yes	活跃	3 (168 Hours)	485		Matte Tin (Sn)		8542.31.00.01	BOTTOM	BALL	未说明	1V	0.8mm			未说明		S-PBGA-B485	1.05V	0.95V				667MHz	256KB		Single ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	667MHz		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			YES	256000	Artix™-7 FPGA, 55K Logic Cells		CAN; ETHERNET; I2C; SPI; UART; USB	1.6mm	19mm	19mm	ROHS3 Compliant
XCZU6CG-1FFVC900E	Xilinx Inc.	数据表	666 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA					204	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)					8542.31.00.01			未说明					未说明								500MHz, 1.2GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 469K+ Logic Cells						ROHS3 Compliant
XCZU27DR-2FFVG1517I5180	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1				FBGA-1517		ARM Cortex A53, ARM Cortex R5F	SMD/SMT	2 x 32 kB, 2 x 32 kB	2 x 32 kB, 2 x 32 kB	256 kB	930300 LE	597 I/O	- 40 C	+ 100 C	13 Mb	53160 LAB	1																							850 mV																16 Transceiver	6 Core
XC7Z030-L2SBG485I	Xilinx Inc.	数据表	990 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	Copper, Silver, Tin	表面贴装	484-FBGA, FCBGA		130		-40°C~100°C TJ	Tray	2010	Zynq®-7000	e1		活跃	3 (168 Hours)	485	EAR99	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY	8542.39.00.01	BOTTOM	BALL	未说明	1V	0.8mm		800MHz	未说明		S-PBGA-B485			CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	1.05V	950mV		256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA		100 ps	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		ARM	YES	256000	Kintex™-7 FPGA, 125K Logic Cells	157200	CAN; ETHERNET; I2C; SPI; UART; USB	2.44mm	19mm	19mm	ROHS3 Compliant
XC7Z030-L2FBG484I	Xilinx Inc.	数据表	638 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	484-BBGA, FCBGA	YES		130			-40°C~100°C TJ	Tray	2010	Zynq®-7000	e1		活跃	3 (168 Hours)	484	EAR99	Tin/Silver/Copper (Sn/Ag/Cu)	PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY	8542.39.00.01	BOTTOM	BALL	250	1V	1mm	not_compliant	800MHz	30		S-PBGA-B484	1.05V	0.95V	CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB				256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		ARM	YES	256000	Kintex™-7 FPGA, 125K Logic Cells		CAN; ETHERNET; I2C; SPI; UART; USB	2.54mm	23mm	23mm	ROHS3 Compliant
XCZU7EV-1FFVC1156I	Xilinx Inc.	数据表	327 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA					360	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV			活跃	4 (72 Hours)					8542.31.00.01			未说明					未说明								500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 504K+ Logic Cells						ROHS3 Compliant
XCZU4CG-L1SFVC784I	Xilinx Inc.	数据表	353 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	784-BFBGA, FCBGA	YES		252			-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)	784			IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)	8542.31.00.01	BOTTOM	BALL	未说明	0.72V				未说明		S-PBGA-B784						500MHz, 1.2GHz	256KB	微处理器电路	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 192K+ Logic Cells						ROHS3 Compliant
XCZU9EG-2FFVC900E	Xilinx Inc.	数据表	569 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	900-BBGA, FCBGA					204	0°C~100°C TJ	Tray	2013	Zynq® UltraScale+™ MPSoC EG		yes	活跃	4 (72 Hours)					8542.31.00.01			未说明					未说明								533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 599K+ Logic Cells						ROHS3 Compliant
XCZU2CG-1SBVA484E	Xilinx Inc.	数据表	24 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	484-BFBGA, FCBGA					82	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)					8542.31.00.01			未说明					未说明								500MHz, 1.2GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 103K+ Logic Cells						ROHS3 Compliant
XC7Z014S-1CLG400C	Xilinx Inc.	数据表	899 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	400-LFBGA, CSPBGA	YES		125			0°C~85°C TJ	Tray	2016	Zynq®-7000	e3	yes	活跃	3 (168 Hours)	400		Matte Tin (Sn)		8542.31.00.01	BOTTOM	BALL	未说明	1V	0.8mm			未说明		S-PBGA-B400	1.05V	0.95V				667MHz	256KB		Single ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	667MHz		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			YES	256000	Artix™-7 FPGA, 65K Logic Cells		CAN; ETHERNET; I2C; SPI; UART; USB	1.6mm	17mm	17mm	ROHS3 Compliant
XCZU3EG-1SFVA625E	Xilinx Inc.	数据表	676 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	625-BFBGA, FCBGA					180	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)					8542.31.00.01			未说明					未说明								500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 154K+ Logic Cells						ROHS3 Compliant
XC7Z030-2FF676I	Xilinx Inc.	数据表	304 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	676-BBGA, FCBGA	YES		130			-40°C~100°C TJ	Tray	2009	Zynq®-7000			活跃	4 (72 Hours)	676				8542.39.00.01	BOTTOM	BALL					800MHz		XC7Z030	S-PBGA-B676			CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB				256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b	ARM	YES	256000	Kintex™-7 FPGA, 125K Logic Cells		CAN, ETHERNET, I2C, PCI, SPI, UART, USB				Non-RoHS Compliant
XCZU7EV-2FFVC1156E	Xilinx Inc.	数据表	868 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA					360	0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV		yes	活跃	4 (72 Hours)					8542.31.00.01			未说明					未说明								533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 504K+ Logic Cells						ROHS3 Compliant
XC7Z014S-1CLG400I	Xilinx Inc.	数据表	464 In Stock	-	最小起订量: 1 最小包装量: 1	10 Weeks	400-LFBGA, CSPBGA	YES		125			-40°C~100°C TJ	Tray	2016	Zynq®-7000	e3	yes	活跃	3 (168 Hours)	400		Matte Tin (Sn)		8542.31.00.01	BOTTOM	BALL	未说明	1V	0.8mm			未说明		S-PBGA-B400	1.05V	0.95V				667MHz	256KB		Single ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	667MHz		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			YES	256000	Artix™-7 FPGA, 65K Logic Cells		CAN; ETHERNET; I2C; SPI; UART; USB	1.6mm	17mm	17mm	ROHS3 Compliant
XC7Z035-L2FFG676I	Xilinx Inc.	数据表	990 In Stock	1: ¥1,163.724626 10: ¥1,097.853421 100: ¥1,035.710774 500: ¥977.085636 查看所有的价格 -	最小起订量: 1 最小包装量: 1	10 Weeks	676-BBGA, FCBGA	YES		130			-40°C~100°C TJ	Tray	2010	Zynq®-7000	e1		活跃	4 (72 Hours)	676	3A991.D	Tin/Silver/Copper (Sn/Ag/Cu)	PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY	8542.39.00.01	BOTTOM	BALL	未说明	1V	1mm			未说明		S-PBGA-B676	1.05V	0.95V				800MHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	800MHz		CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA			YES	256000	Kintex™-7 FPGA, 275K Logic Cells		CAN; ETHERNET; I2C; SPI; UART; USB	3.37mm	27mm	27mm	ROHS3 Compliant
XCZU15EG-1FFVB1156I	Xilinx Inc.	数据表	338 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	1156-BBGA, FCBGA					328	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			活跃	4 (72 Hours)					8542.31.00.01			未说明					未说明								500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 747K+ Logic Cells						ROHS3 Compliant
XCZU2CG-1SFVC784I	Xilinx Inc.	数据表	824 In Stock	-	最小起订量: 1 最小包装量: 1	11 Weeks	784-BFBGA, FCBGA					252	-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG			活跃	4 (72 Hours)					8542.31.00.01			未说明					未说明								500MHz, 1.2GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					Zynq®UltraScale+™ FPGA, 103K+ Logic Cells						ROHS3 Compliant